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Transient Liquid Phase (TLP) Bonding of 321 Stainless Steel Matthew N. Cavalli, University of North Dakota Main Campus, DMR 0907616 Stainless steel alloys are widely used in industrial processes for both their high temperature properties and their chemical resistance. Alloy 321 was selected as a representative iron- based high temperature alloy for the current work. It exhibits good strength and resistance to sensitization up to about 900C. Diffusion bonding of 321SS with Au-12Ge foil showed a dependence of the joint strength on bonding temperature, bonding time, the bonding atmosphere (argon versus vacuum), and the cooling rate after bonding. The best The figure above shows 321 Stainless Steel diffusion bonded at 1050C for 20 hours in an argon atmosphere using a foil of Au-12Ge and a) cooled in air or b) water quenched. Void formation and the distribution of second phase particles are significantly impacted by the cooling rate. The tensile strength of b) was 50 µm 50 µm a b

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Transient Liquid Phase (TLP) Bonding of 321 Stainless Steel Matthew N. Cavalli , University of North Dakota Main Campus, DMR 0907616. - PowerPoint PPT Presentation

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Transient Liquid Phase (TLP) Bonding of 321 Stainless SteelMatthew N. Cavalli, University of North Dakota Main Campus, DMR 0907616

Stainless steel alloys are widely used in industrial processes for both their high temperature properties and their chemical resistance. Alloy 321 was selected as a representative iron-based high temperature alloy for the current work. It exhibits good strength and resistance to sensitization up to about 900C.

Diffusion bonding of 321SS with Au-12Ge foil showed a dependence of the joint strength on bonding temperature, bonding time, the bonding atmosphere (argon versus vacuum), and the cooling rate after bonding. The best strength results were obtained after bonding at 1050C for 20 hours in an argon atmosphere and quenching the joint in water.

The figure above shows 321 Stainless Steel diffusion bonded at 1050C for 20 hours in an argon atmosphere using a foil of Au-12Ge and a) cooled in air or b) water quenched. Void formation and the distribution of second phase particles are significantly impacted by the cooling rate. The tensile strength of b) was approximately 3X higher.

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Engineering OutreachMatthew N. Cavalli, University of North Dakota Main Campus, DMR 0907616

Due to a lack of interest by high school students in attending the ‘Experience Engineering’ summer program this year, the camp had to be cancelled (only 2 students had registered by mid-June). Instead, the PI and his graduate students spent a significant amount of time helping organize events for the Young Scientists and Engineers academy for grades 1-8. Each group of about 30 students (grades 1-4 and grades 5-8) spends four half-days on various science and engineering topics. Activities this year included air pressure, friction, aerodynamics, global positioning, chemical reactions, electronics and motors, and medicine.

As part of the Access for American Indian Students into Engineering Education program in December 2011, the PI led a discussion with Native American high school students about what engineers do and how their work affects our lives.

An student volunteer helps participants in the Young Scientists and Engineers Academy assemble robots that ‘walk’ with the help of mass asymmetry on a rotating motor.


Combined Raman imaging and O tracer analysis for …...Optical microscopy of the low temperature oxide Radial cross section Outer-side Inner-side 50 µm 50 µm Axial cracks in the

Combined Raman imaging and O tracer analysis for …...Optical microscopy of the low temperature oxide Radial cross section Outer-side Inner-side 50 µm 50 µm Axial cracks in the

Les Principes de Filtration | Présentation I.C.V. · 2016-07-01 · Le spectre de filtration Microfiltration Ultrafiltration 70 µm/50 µm/20 µm 8 µm/5 µm/3 µm 1 µm/0.8 µm/0.65

Les Principes de Filtration | Présentation I.C.V. · 2016-07-01 · Le spectre de filtration Microfiltration Ultrafiltration 70 µm/50 µm/20 µm 8 µm/5 µm/3 µm 1 µm/0.8 µm/0.65

Merkel Omegat OMK-E - seal-directSliding surface 0,05 … 0,3 µm ≤2,5 µm Groove base ≤1,6 µm ≤6,3 µm Groove flanks ≤3,0 µm ≤15,0 µm Percentage contact area M r >50%

Merkel Omegat OMK-E - seal-directSliding surface 0,05 … 0,3 µm ≤2,5 µm Groove base ≤1,6 µm ≤6,3 µm Groove flanks ≤3,0 µm ≤15,0 µm Percentage contact area M r >50%

BACK-CONTACTED AND SMALL FORM FACTOR GaAs ......1.6 µm GaAs p 50 nm GaAs p++ 1 µm GaInP 50 nm AlAs Buffer layer GaAs wafer 100 nm GaAs n 25 nm GaInP Figure 4. Scanning electron microscope

BACK-CONTACTED AND SMALL FORM FACTOR GaAs ......1.6 µm GaAs p 50 nm GaAs p++ 1 µm GaInP 50 nm AlAs Buffer layer GaAs wafer 100 nm GaAs n 25 nm GaInP Figure 4. Scanning electron microscope

Flexibly Your Laser Partner - Convergent Photonics...Pulsing Frequency 0 -5 kHz Wavelength 1070nm 1080nm Polarization Random Feeding fiber core diameter 20 µm or 50 µm Beam Parameter

Flexibly Your Laser Partner - Convergent Photonics...Pulsing Frequency 0 -5 kHz Wavelength 1070nm 1080nm Polarization Random Feeding fiber core diameter 20 µm or 50 µm Beam Parameter

custom solutions - Sati · SATI has been taking care of some of the most important Italian and International companies ... 2000 ÷ 50 µm ACQUASPEED 400 ÷ 50 µm AUTOJET 2000 ÷

custom solutions - Sati · SATI has been taking care of some of the most important Italian and International companies ... 2000 ÷ 50 µm ACQUASPEED 400 ÷ 50 µm AUTOJET 2000 ÷

Glass · Basaltic Glass Gel-palagonite 500 µm Alteration Layers 50 µm Glass 0.5 µm Gel Phyl Phyl 0.9 nm Phyl 1 µm Phyl Gel Gel Fe Kr Mg Kr Ti Kr Ti-Rich Fe-Rich Mg-Rich Mg + Fe-Rich

Glass · Basaltic Glass Gel-palagonite 500 µm Alteration Layers 50 µm Glass 0.5 µm Gel Phyl Phyl 0.9 nm Phyl 1 µm Phyl Gel Gel Fe Kr Mg Kr Ti Kr Ti-Rich Fe-Rich Mg-Rich Mg + Fe-Rich

Electrochemical Characterization of Implantable Biochips ...d Hexagonal closed packed W.E. a=100 µm, d=50 µm Design of MDEA 5037 Electrochemical Cell chip. Radial vs. Semi-infinite

Electrochemical Characterization of Implantable Biochips ...d Hexagonal closed packed W.E. a=100 µm, d=50 µm Design of MDEA 5037 Electrochemical Cell chip. Radial vs. Semi-infinite

ETALON HP High precision comparators DIN 879-1 Dimen ... · Total deviation spanl 9 µm 17 µm Repeatability limit 3 µm 3 µm Max. hysteresis 3 µm 3 µm Measuring force – Models

ETALON HP High precision comparators DIN 879-1 Dimen ... · Total deviation spanl 9 µm 17 µm Repeatability limit 3 µm 3 µm Max. hysteresis 3 µm 3 µm Measuring force – Models

TECHNICAL CATALOGUE Y STRAINERStvtvietnam.com/upload/download/948499798227_taptin.pdf · (equivalent to DIN EN ISO 228 and BS EN ISO 228). 500 µm 300 µm 50 µm. TEC OVERALL DIMENSIONS

TECHNICAL CATALOGUE Y STRAINERStvtvietnam.com/upload/download/948499798227_taptin.pdf · (equivalent to DIN EN ISO 228 and BS EN ISO 228). 500 µm 300 µm 50 µm. TEC OVERALL DIMENSIONS

Agilent 6820300dpi).pdf · 1 . ASTM!"#$%& ASTM!" D2306 C8 !"#$% Carbowax 50 m 0.25 mm 0.25 µm D2360 !"#$%&'()*+,- Carbowax 60 m 0.32 mm 0.32 µm D3760 !"#$%& Carbowax 50 m 0.32 mm

Agilent 6820300dpi).pdf · 1 . ASTM!"#$%& ASTM!" D2306 C8 !"#$% Carbowax 50 m 0.25 mm 0.25 µm D2360 !"#$%&'()*+,- Carbowax 60 m 0.32 mm 0.32 µm D3760 !"#$%& Carbowax 50 m 0.32 mm

Organic Interposer Advanced BuildAdvanced Build -Up ...meptec.org/Resources/9 - Kyocera.pdfFCA pitch 120 µm FCA pad dia. 50 µm Via land dia. 50 µm Line width 10 µm min. space 10

Organic Interposer Advanced BuildAdvanced Build -Up ...meptec.org/Resources/9 - Kyocera.pdfFCA pitch 120 µm FCA pad dia. 50 µm Via land dia. 50 µm Line width 10 µm min. space 10

180919 stoba Vertreterpräsentation ENFilter sizes 1. Stage 2. Stage Chamber 1 10 µm --Chamber 2 10 µm --Chamber 3 1 µm 5 µm Chamber 4 1 µm 5 µm Filter unit Absolute filter ...

180919 stoba Vertreterpräsentation ENFilter sizes 1. Stage 2. Stage Chamber 1 10 µm --Chamber 2 10 µm --Chamber 3 1 µm 5 µm Chamber 4 1 µm 5 µm Filter unit Absolute filter ...

Strombidium acutum (Leegaard, 1915) Kahl, 1932zooplankton.cn/ciliate/Datasheets/s_acut/s_acut.pdf · Cell truncate to conical, 40 (20-55) µm long and 40 (20-50) µm wide; posterior

Strombidium acutum (Leegaard, 1915) Kahl, 1932zooplankton.cn/ciliate/Datasheets/s_acut/s_acut.pdf · Cell truncate to conical, 40 (20-55) µm long and 40 (20-50) µm wide; posterior

Strip & Wire - electronica...8-13 µm Outstanding solderability SR 2-13 µm Dull/even surface, low flaking at stamping, good laser weldability HDT 10/50/100 2-13 µm High hardness,

Strip & Wire - electronica...8-13 µm Outstanding solderability SR 2-13 µm Dull/even surface, low flaking at stamping, good laser weldability HDT 10/50/100 2-13 µm High hardness,

Dr. Joel Adrián Hernández Escamilla · Introduction 2 (SKC Gulf Coast Inc., 2001; EPA, 2009; EIA, 2010;) 2µm 50µm 2000µm PM 2.5 PM 10 TSP Particles 2 µm 50 µm 200 µm

Dr. Joel Adrián Hernández Escamilla · Introduction 2 (SKC Gulf Coast Inc., 2001; EPA, 2009; EIA, 2010;) 2µm 50µm 2000µm PM 2.5 PM 10 TSP Particles 2 µm 50 µm 200 µm

Features - KF Technology: life science tools...MED-P530A 10 mm 50 x 50 µm 300 µm 9.2 mm MED-P5455 5 mm 50 x 50 µm 450 µm 10.2 mm MED-P545A 10 mm 50 x 50 µm 450 µm 10.2 mm Close-up

Features - KF Technology: life science tools...MED-P530A 10 mm 50 x 50 µm 300 µm 9.2 mm MED-P5455 5 mm 50 x 50 µm 450 µm 10.2 mm MED-P545A 10 mm 50 x 50 µm 450 µm 10.2 mm Close-up

Advanced 2.5D and 3D IC Systems Enabled by Mechanically ... · TSV dimension: 13 µm in diameter, 300 µm in height (AR = ~23:1), 100 / 200 µm in pitch Silicon pillars : 50 µm in

Advanced 2.5D and 3D IC Systems Enabled by Mechanically ... · TSV dimension: 13 µm in diameter, 300 µm in height (AR = ~23:1), 100 / 200 µm in pitch Silicon pillars : 50 µm in

FLASH - TTC-Report 2009-01, Oct. 2009 ANALYSIS OF RF ...€¦ · Final EP of (40 – 50) µm and final Flash BCP of 10 µm. Few cavities got an additional (5 – 10) µm after the

FLASH - TTC-Report 2009-01, Oct. 2009 ANALYSIS OF RF ...€¦ · Final EP of (40 – 50) µm and final Flash BCP of 10 µm. Few cavities got an additional (5 – 10) µm after the

Portable Surface Texture Measuring Instruments · Tip radius 5 µm Tip radius 2 µm Tip radius 5 µm Tip radius 2 µm Tip radius 5 µm Measurement range Z direction-210 to +160 µm

Portable Surface Texture Measuring Instruments · Tip radius 5 µm Tip radius 2 µm Tip radius 5 µm Tip radius 2 µm Tip radius 5 µm Measurement range Z direction-210 to +160 µm