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    ElectromagneticInteraction & Couplings

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    The Electromagnetic EnvironmentThe Electromagnetic Environment

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    EMI Categories

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    Interference Fully opposed

    Fully opposed signal

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    Interference Partially opposed

    Partially opposed signal

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    EM Interaction & Coupling

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    EM Interaction & Coupling

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    EM Interaction Process

    External Interaction - The EM wave couples with thesurface of the structure and causes electrical charge to flow

    on the surface.

    Resulting in a surface current density, and a charge

    density which correspond to tangential H field andnormal E fields respectively.

    Internal Interaction - The energy penetrates

    (into)through the shell or envelope of the structure.

    The penetration occurs because of apertures, antennas,exposed cables or other conductors, seams and joints in thepanels, or diffusion through the skin of the structure.

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    EM Interaction Process

    Internal Propagation - Once the energy

    penetrates into the interior, it will be propagated

    most efficiently by the internal cables, which form

    multiconductor transmission lines along which

    energy is transported.

    This energy is ultimately carried to the components, which

    can be either temporarily upset or permanently damaged.

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    EM Interaction Process

    Current and Charge at

    the Device

    Internal Charge &

    Current responses

    Internal E & H Field

    Responses

    Barrier Penetration

    External Charge &

    Current Responses

    Conducted

    ResponsesE & H

    Field Response

    External E & H FieldsExternal Source

    External

    Coupling

    Conductive

    Penetration

    Aperture

    Penetration

    Diffusive

    (spread)

    Penetration

    Interior

    Fields

    Internal

    Coupling

    Component Responses

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    The Interaction Process

    Cur r ent I nject ionCoupling t oConduct ors

    Conduct orPenet r at ion

    Aper t urePenet r at ion

    Dif fusivePenet r at ion

    Pulse PowerPr oduct ion

    Wavef or mShaping

    I nt er nalEquipmentExcita t ion

    EM FieldRadiat ion f r om

    Ant enna

    EM I nt er actionwit h Syst em

    Ext er ior

    EM FieldCoupling t o

    I nt er nal Conduct or s

    I nt er nalConduct or

    Pr opagat ion

    PENE

    RE

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    LRDE

    EM Interaction Depends on

    Characteristics of Wave

    Characteristics of System

    Characteristics of propagating media

    Structures in the vicinity of the system

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    Mechanisms of interaction of

    electromagnetic radiation with materials

    Reflection

    Absorption

    Multiple reflection

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    2003 Brooks/Cole, a division of Thomson Learning, Inc. Thomson Learning

    is a trademark used herein under license.

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    The attenuation in decibels (dB) is defined as

    Attenuation (dB) = 20 log10 (Ei/E),

    where Ei is the incident field and E is the

    transmitted or reflected field. Note that Ei > E.

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    ReflectionMainly due to interaction of

    electromagnetic radiation with the

    electrons in the solid

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    Skin EffectPhenomenon in which high frequency

    electromagnetic radiation interacts

    with only the near surface region ofan electrical conductor

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    ,

    1

    f

    where f= frequency,

    = magnetic permeability = 0r,

    r= relative magnetic permeability,0 = 4 x 10

    -7 H/m, and

    = electrical conductivity in -1m-1.

    Skin depth ()

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    Absorption

    Due to interaction of electromagneticradiation with the electric/magnetic

    dipoles, electrons and phonons in the

    solid

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    EM COUPLING

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    EM Coupling

    Radiative,

    Conductive,

    Inductive

    Capacitive

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    LRDE

    Distant EMI Source

    E & H Field on Structure

    Capacitive

    Coupling

    Inductive

    Coupling

    Radiative

    Coupling

    Conductive

    Coupling

    Induced Current & Charge

    External Coupling ProcessExternal Coupling Process

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    Methods of Coupling

    Transfer Mechanism

    Conductive

    Electromagnetic

    Magnetic Field

    Electric Field

    Coupling Direct radiation From Source to

    Receptor

    Radiated From Source &transferred to AC/Signal/control

    cables

    RF energy radiated by Cables

    RF energy conducted by common

    electrical supply

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    Coupling Mechanism (system level)

    System

    A

    System

    BSystem

    A

    SystemB

    Galvanic Coupling

    (conductive Coupling)Capacitive Coupling

    (E-Field Coupling)System

    A

    System

    B

    Mutual inductance

    Mutual inductance

    (Magnetic Coupling)

    Stray cap

    System

    ASystem

    B

    Radiation

    Radiation Coupling

    Supply

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    Trace to trace coupling within a PCB Structure

    EMI Ch t i ti

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    EMI Characterization

    EMISSION:

    It is a phenomenonthrough which a

    system gives away

    EM energy to its

    environment

    SUSCEPTIBILITY:

    It is the phenomenonthrough which a

    system gets in EM

    energy from its

    environment

    SYSTEM

    EMITTER

    SUSCEPTOR

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    Elements of an EMI Situation

    Source "Culprit"

    Coupling method "Path"

    Sensitive device "Victim"

    SOURCE PATH

    VICTIM

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    How Does EMI Affect Electronics?

    Radiated and conducted interference

    A. Conducted Interference Enters and Exits Equipment through

    Wiring and Cabling

    B. Radiated Interference Enters and Exits Equipment through

    Wiring and Enclosure Penetration

    Radiated Susceptibility Radiated Emissions

    Conducted Susceptibility Conducted Emissions

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    Radiated Coupling Field to Cable

    Patient Monitor

    Loop AreaInduced Current

    Electromagnetic WaveRadio

    VCM

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    Interference to TV Reception

    Two Interfering Signals Injected into TV

    No Interference

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    Transients

    Electrostatic Discharge & Transient Pulses

    ESD can induce glitches in circuits, leading to false triggering,

    errors in address & data lines and latch-up of devices

    Upset Damage

    Degradation leading to future failure(s)

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    PERSONAL COMPUTERS & PERIPHERALS,

    RADIO RECEIVERS

    Method #1Test at Approved Laboratory

    Test Product at

    approved

    Laboratory

    Report with

    Technical

    Information

    Declaration of

    ConformitySell Product

    Declaration of Conformity. Does not go to the FCC

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    RADIO TRANSMITTERS

    ExamplesCordless Phones, Radio Transmitters, CB Radios, Wireless Products

    CERTIFICATION:

    Test ProductReport with

    Technical

    Information

    Send Report and

    Application to

    FCC or TCB

    FCC GRANT

    with FCC ID Number

    Sell Product

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    CONDUCTED EMISSIONS TESTING

    Measure Noise on Power Line

    Spectrum Analyzer

    Product

    PowerCord

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    RADIATED EMISSIONS TESTING

    Test Site: Measure Radiated

    Noise from Equipment Case

    and Cables

    Measuring Antenna

    Product

    3 m or 10 m

    SpectrumAnalyzer

    Open Area Test Site

    Turntable

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    RADIATED EMISSIONS TESTING

    Test Site: Measure Radiated

    Noise from Equipment Case

    and Cables

    Measuring Antenna

    Product

    3 m or 10 m

    Photos: EMC Test System, Austin, TX emctest.com

    SpectrumAnalyzer

    Open Area Test Site

    Turntable

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    Typical Ambient Profile

    Switching noise

    Cell phone

    FM Radio

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    Immunity Test Requirements 1000-4 Series

    IEC 61000-4-1: Introduction

    IEC 61000-4- 2: Electrostatic Discharge Requirements

    IEC 61000-4- 3: Radiated Immunity

    IEC 61000-4- 4: Electrical Fast Transient IEC 61000-4- 5: Surge

    IEC 61000-4- 6: Conducted RF Immunity

    IEC 61000-4-7: Interharmonics

    IEC 61000-4-8 & 9: Magnetic field immunity

    IEC 61000-4-10: Damped Oscillatory pulsed field immunity

    IEC 61000-4-11: Dips & Interrupts (power quality)

    IEC 61000-4-12: Damped Oscillatory (surge)

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    ESD Testing

    ESD Simulator

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    Anechoic Chamber

    www.emctest.com

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    Surge Coupling

    Lightning and pulse sources cause high-

    energy transients into power and data cables

    IndirectDirect

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    Voltage Dips & Interrupts

    IEC 1000-4-11 Simulates brownouts and blackouts on equipment

    operation

    Voltage Dip:

    Voltage Interrupt: