4.EMI-Couplng Interactn Ok
Transcript of 4.EMI-Couplng Interactn Ok
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ElectromagneticInteraction & Couplings
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The Electromagnetic EnvironmentThe Electromagnetic Environment
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EMI Categories
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Interference Fully opposed
Fully opposed signal
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Interference Partially opposed
Partially opposed signal
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EM Interaction & Coupling
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EM Interaction & Coupling
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EM Interaction Process
External Interaction - The EM wave couples with thesurface of the structure and causes electrical charge to flow
on the surface.
Resulting in a surface current density, and a charge
density which correspond to tangential H field andnormal E fields respectively.
Internal Interaction - The energy penetrates
(into)through the shell or envelope of the structure.
The penetration occurs because of apertures, antennas,exposed cables or other conductors, seams and joints in thepanels, or diffusion through the skin of the structure.
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EM Interaction Process
Internal Propagation - Once the energy
penetrates into the interior, it will be propagated
most efficiently by the internal cables, which form
multiconductor transmission lines along which
energy is transported.
This energy is ultimately carried to the components, which
can be either temporarily upset or permanently damaged.
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EM Interaction Process
Current and Charge at
the Device
Internal Charge &
Current responses
Internal E & H Field
Responses
Barrier Penetration
External Charge &
Current Responses
Conducted
ResponsesE & H
Field Response
External E & H FieldsExternal Source
External
Coupling
Conductive
Penetration
Aperture
Penetration
Diffusive
(spread)
Penetration
Interior
Fields
Internal
Coupling
Component Responses
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The Interaction Process
Cur r ent I nject ionCoupling t oConduct ors
Conduct orPenet r at ion
Aper t urePenet r at ion
Dif fusivePenet r at ion
Pulse PowerPr oduct ion
Wavef or mShaping
I nt er nalEquipmentExcita t ion
EM FieldRadiat ion f r om
Ant enna
EM I nt er actionwit h Syst em
Ext er ior
EM FieldCoupling t o
I nt er nal Conduct or s
I nt er nalConduct or
Pr opagat ion
PENE
RE
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LRDE
EM Interaction Depends on
Characteristics of Wave
Characteristics of System
Characteristics of propagating media
Structures in the vicinity of the system
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Mechanisms of interaction of
electromagnetic radiation with materials
Reflection
Absorption
Multiple reflection
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2003 Brooks/Cole, a division of Thomson Learning, Inc. Thomson Learning
is a trademark used herein under license.
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The attenuation in decibels (dB) is defined as
Attenuation (dB) = 20 log10 (Ei/E),
where Ei is the incident field and E is the
transmitted or reflected field. Note that Ei > E.
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ReflectionMainly due to interaction of
electromagnetic radiation with the
electrons in the solid
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Skin EffectPhenomenon in which high frequency
electromagnetic radiation interacts
with only the near surface region ofan electrical conductor
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,
1
f
where f= frequency,
= magnetic permeability = 0r,
r= relative magnetic permeability,0 = 4 x 10
-7 H/m, and
= electrical conductivity in -1m-1.
Skin depth ()
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Absorption
Due to interaction of electromagneticradiation with the electric/magnetic
dipoles, electrons and phonons in the
solid
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EM COUPLING
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EM Coupling
Radiative,
Conductive,
Inductive
Capacitive
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LRDE
Distant EMI Source
E & H Field on Structure
Capacitive
Coupling
Inductive
Coupling
Radiative
Coupling
Conductive
Coupling
Induced Current & Charge
External Coupling ProcessExternal Coupling Process
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Methods of Coupling
Transfer Mechanism
Conductive
Electromagnetic
Magnetic Field
Electric Field
Coupling Direct radiation From Source to
Receptor
Radiated From Source &transferred to AC/Signal/control
cables
RF energy radiated by Cables
RF energy conducted by common
electrical supply
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Coupling Mechanism (system level)
System
A
System
BSystem
A
SystemB
Galvanic Coupling
(conductive Coupling)Capacitive Coupling
(E-Field Coupling)System
A
System
B
Mutual inductance
Mutual inductance
(Magnetic Coupling)
Stray cap
System
ASystem
B
Radiation
Radiation Coupling
Supply
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Trace to trace coupling within a PCB Structure
EMI Ch t i ti
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EMI Characterization
EMISSION:
It is a phenomenonthrough which a
system gives away
EM energy to its
environment
SUSCEPTIBILITY:
It is the phenomenonthrough which a
system gets in EM
energy from its
environment
SYSTEM
EMITTER
SUSCEPTOR
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Elements of an EMI Situation
Source "Culprit"
Coupling method "Path"
Sensitive device "Victim"
SOURCE PATH
VICTIM
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How Does EMI Affect Electronics?
Radiated and conducted interference
A. Conducted Interference Enters and Exits Equipment through
Wiring and Cabling
B. Radiated Interference Enters and Exits Equipment through
Wiring and Enclosure Penetration
Radiated Susceptibility Radiated Emissions
Conducted Susceptibility Conducted Emissions
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Radiated Coupling Field to Cable
Patient Monitor
Loop AreaInduced Current
Electromagnetic WaveRadio
VCM
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Interference to TV Reception
Two Interfering Signals Injected into TV
No Interference
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Transients
Electrostatic Discharge & Transient Pulses
ESD can induce glitches in circuits, leading to false triggering,
errors in address & data lines and latch-up of devices
Upset Damage
Degradation leading to future failure(s)
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PERSONAL COMPUTERS & PERIPHERALS,
RADIO RECEIVERS
Method #1Test at Approved Laboratory
Test Product at
approved
Laboratory
Report with
Technical
Information
Declaration of
ConformitySell Product
Declaration of Conformity. Does not go to the FCC
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RADIO TRANSMITTERS
ExamplesCordless Phones, Radio Transmitters, CB Radios, Wireless Products
CERTIFICATION:
Test ProductReport with
Technical
Information
Send Report and
Application to
FCC or TCB
FCC GRANT
with FCC ID Number
Sell Product
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CONDUCTED EMISSIONS TESTING
Measure Noise on Power Line
Spectrum Analyzer
Product
PowerCord
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RADIATED EMISSIONS TESTING
Test Site: Measure Radiated
Noise from Equipment Case
and Cables
Measuring Antenna
Product
3 m or 10 m
SpectrumAnalyzer
Open Area Test Site
Turntable
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RADIATED EMISSIONS TESTING
Test Site: Measure Radiated
Noise from Equipment Case
and Cables
Measuring Antenna
Product
3 m or 10 m
Photos: EMC Test System, Austin, TX emctest.com
SpectrumAnalyzer
Open Area Test Site
Turntable
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Typical Ambient Profile
Switching noise
Cell phone
FM Radio
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Immunity Test Requirements 1000-4 Series
IEC 61000-4-1: Introduction
IEC 61000-4- 2: Electrostatic Discharge Requirements
IEC 61000-4- 3: Radiated Immunity
IEC 61000-4- 4: Electrical Fast Transient IEC 61000-4- 5: Surge
IEC 61000-4- 6: Conducted RF Immunity
IEC 61000-4-7: Interharmonics
IEC 61000-4-8 & 9: Magnetic field immunity
IEC 61000-4-10: Damped Oscillatory pulsed field immunity
IEC 61000-4-11: Dips & Interrupts (power quality)
IEC 61000-4-12: Damped Oscillatory (surge)
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ESD Testing
ESD Simulator
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Anechoic Chamber
www.emctest.com
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Surge Coupling
Lightning and pulse sources cause high-
energy transients into power and data cables
IndirectDirect
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Voltage Dips & Interrupts
IEC 1000-4-11 Simulates brownouts and blackouts on equipment
operation
Voltage Dip:
Voltage Interrupt: