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Transcript of 400G and Beyond: The Role of Silicon Photonics in High ... · ... The Role of Silicon Photonics in...
© Finisar Corporation Confidential 1
Tony Pearson
Sr. Dir. Business Development
400G and Beyond: The Role of Silicon Photonics
in High-Speed Optics
© Finisar Corporation Confidential 2
Finisar Corporation
Key Messages
Message 1
Message 2
Message 3
Key Messages
Message 1
Message 2
Message 3
World’s Largest Supplier of Fiber Optic Components
and Subsystems
• Optics industry leader with $1.4B+ in annual revenue
• Founded in 1988
• IPO in 1999 (NASDAQ: FNSR)
• 14,000 employees
• Best-in-class broad product line
• Vertically integrated with low cost manufacturing
• Significant focus on R&D and capacity expansion
• ~30% market share
• Experienced management team
• 1300+ Issued U.S. patents
Corporate Headquarters: Sunnyvale, CA USA
© Finisar Corporation Confidential 3
CFPSFP+SFP
X2/XENPAKActive Optical Cables
QSFP/QSFP28
CXPOptical Engine
(BOA) XFP
CFP2/ CFP4
Broad Product Portfolio and Customer Base
Key MessagesKey MessagesDATACOM TELECOM
PR
OD
UC
TS
CU
ST
OM
ER
S
PR
OD
UC
TS
CU
ST
OM
ER
S
XFP
ROADM line card
Tunable laser
SFP
PON
WSS
SFP+
CATV
WDM Passives
Coherent Transponder
High speed components
Amplifiers
CFP2-ACO
© Finisar Corporation Confidential 4
Finisar is the Leader in High-Volume and Low Cost Manufacturing
640k sq ft facility with 200k sq ft clean room
Ipoh manufactured products High-volume transceivers / transponders
CATV products
22.2M units shipped FY 2016
Ipoh, Malaysia
Two multi-floor buildings providing 800k sq ft
on 550k sq ft land
Wuxi manufactured products Passive components
Parallel products
WSS modules / ROADM linecards
TOSAs / ROSAs
ISO 9001 certified
Wuxi, China
ISO 9001
and 14001
certified
ISO 9001
and 14001
certified
Ipoh, Malaysia
High-volume, high mix production of
transceivers/ transponders
640,000 sq ft facility with 240,000 sq ft clean
room on 20 acres of land
22.8 million transceivers produced in FY2016
ISO9001 QMS and IS014001 EMS Certified by
DQS
6,000 employees
Wuxi, China
Production of multi-channel TOSAs/ROSAs,
transceivers and WSS/ROADM products
Significant capacity for advanced packaging
and testing
Approximate ~800,000 sq ft facility
ISO 9001 and 14001 certified
6,000 employees
© Finisar Corporation Confidential 5
Finisar is vertically Integrated
Technology Toolbox:
Multimode VCSEL
Singlemode InP lasers
Photo Detectors
Integrated InP MZ
Si-Ge IC design
Silicon Photonics Optical IC design
Optical packaging
Transceiver Integration
TOP VIEW
BOTTOM VIEW
detector
amplifier
IC (TIA)
laser
TOSAcontroller
IC
laser driver post
amplifier IC
DESIGNED BY FINISAR
Optical Chips (lasers, detectors)
Optical Packaging
Integrated Circuits
ROSA
monitor
photodiode
optical
isolator
© Finisar Corporation Confidential 6
28Gb/s 40Gb/s
51Gb/s 56Gb/s
Silicon Photonics is Predictable, Deterministic and Repeatable
© Finisar Corporation Confidential 7
Finisar is Technology Agnostic; We Use the Best Tool for the Job
VCSEL,
multimode
Silicon
Photonics
DML (Directly
Modulated Lasers)
EML (Electro-
absorption
Modulated Lasers)
PIN photodiode
APD (Avalanche
Photodiodes)
Stacking,
Packaging,
Alignment
IC/Gearbox
© Finisar Corporation Confidential 8
The data center application space for 10G and 100 G today
Today’s application space is divided by fiber type and reach:
0-100 m MM MM VCSEL today
0-300 m MM MM VCSEL (10 G today, 100 G soon)
500m-2 km SM DML,Si Photonics (New space)
2km-10 km SM EML, DML
Average Optical Link Length Distributions Moving
to Longer Lengths… and then to Shorter
0m 10 km500m100m 300m 1000m
2016?
Distribution0m 1000m500m100m 300m
4% links
25%
links
3m
60% links
Optics take over intra-rack
10-15% links
2014
Distribution0m 1000m500m100m 300m
70-80% links
Data centers get larger
<5% links10-20% links
2018?
Distribution0m 1000m500m100m 300m
2-3% links
50%
links
3m
40% links
Optics intra-server
8% links
~ 3 dB
Reach
Loss budget ~ 3-4 dB 6.5 dB
Technology
~ 3 dB
EML DML
SMFMMF
MM VCSEL
850 nm = SW
1310nm = LW
DML, Si Photonics
© Finisar Corporation Confidential 9
The Market Demands Continuous Improvements in Bandwidth Density
Module
Type
# of
I/O
lanes
Electrical
I/O
I/O
Baud
Rate
Module
BW
Module
Width
(mm)
Module
/rack
Gb/inch
SFP+ 1 10Gb/s-
NRZ
10GB 10Gb/S 13 48 25 (/63)
QSFP+ 4 10Gb/s-
NRZ
10GB 40Gb/S 18 32 67
QSFP28 4 25Gb/s-
NRZ
25GB 100Gb/s 18 32 95
QSFP56 4 50Gb/s-
PAM4
25GB 200Gb/s 18 32 337
QSFP-
DD/
OSFP
8 50Gb/s-
PAM4
25GB 400Gb/s 18 32 674
? 8 100Gb/s-
PAM4
50GB 800Gb/s ? ? ?
© Finisar Corporation Confidential 10
Reality Check: VCSEL Beats Silicon Photonics in Cost, Power, Density
VCSEL Tx components:
High speed 850 nm VCSEL, 150um x 150um die, ~8 um diameter
Coupling optics with 10um’s tolerance
VCSEL driver, <10 mA
Non-hermetic packaging
MM Optical alignments: 1
Si photonics Tx components:
High power CW 1310nm DFB, >500 um long
Optical isolator
External modulator
Coupling optics with ~1 um tolerance
Si Photonic PIC + IC driver, several tens of mA
Hermetic box or enclosure
SM optical alignments: 2
Driver
For short reach (<100 m) links, multimode optics have better cost, power, density than silicon photonics
VCSEL
Isolator
MM FiberSM Fiber
© Finisar Corporation Confidential 11
100G-PSM4 : A Success Story for Silicon Photonics
100G-PSM4 is a key building
block for today’s networks in
need of tier-to-tier connectivity
© Finisar Corporation Confidential 12
Implementation of 100G-PSM4 With Silicon Photonics
Over 84% of the functions are integrated with high yield at wafer level in
a Si fab
SiP integrates 4 modulators, 4 pin diodes, 4 x drivers, 4 x TIAs, CDR in a 3-D
stacked self-hermetic, uncooled chip
Integrated Si photonic PIC
l1
Ge pin
Si MZ
3 D- stacked IC
TIAs, drivers, CDR
Standard grating 25 G/lane
TraditionalWith silicon photonics
© Finisar Corporation Confidential 13
Moving Up from 100G-PSM4 to 400G-PSM4
Source: T. Issenhuth, IEEE P802.3cd Sep 2016
400G-PSM4
We can expect the cost-effectiveness of Silicon Photonics to be fully leveraged for
transition from 100G-PSM4 to 400G-PSM4
© Finisar Corporation Confidential 14
Silicon Photonics in 400G-PSM4
We expect the same basic structure as 100G-PSM4
Challenges
Retimer IC also includes 8:4 gearbox function
PAM4 modulation and 2x clock frequency limits Rx sensitivity. To make up for it, Tx
Optical Modulation Amplitude (OMA) must also be higher.
This puts extra burden on silicon photonics structures
• losses must be lower
• modulation must be more efficient
• integrated photodetector must have excellent responsivity
• PAM4 error floor must be low enough for FEC to yield very low errors
At Finisar, we are confident that these challenges will be overcome
Silicon Photonics will be a major technology of choice for client-side 400G
optical modules
© Finisar Corporation Confidential 15
Silicon Photonics Still Faces Challenges to Become Mainstream
Coupling from small silicon waveguide to fiber is still a major challenge: no cost-effective, high volume method yet in production
“Separate laser” problem. The source of light is still resident in a separate III-V opto-mechanical system or chip
Still not close to CMOS economies of scale (low wafer volumes, special processes, heterogeneous integration)
PDKs are intimately tied to very specific processes and fabs, and not easily transferred or multi-sourced
‘Minimum Unit of Yield’ often is a high-cost sub-assembly, leading to high scrap and rework costs (a major driver of transceiver costs)
“Tweakability” – unlike the traditional discrete component approach, it is difficult to tweak or tune key performance parameters with a SiP designed transceiver
© Finisar Corporation Confidential 16
However Silicon Photonics becoming mainstream in 100G Deployments
100G-PSM4
and some
100G-CWDM4
© Finisar Corporation Confidential 17
Summary
Long term success in optical modules industry requires scale and vertical
integration
It’s important to maintain a holistic view of all the technology options, and
deploy silicon photonics only where it best serves the purpose
For short reach (<100 m), VCSEL-based multimode optics is still ahead of
silicon photonics in cost/power/density metrics.
Continuing demands to improve density, cost and power over discrete
singlemode optics are key drivers of adoption of silicon photonics at
intermediate and longer reaches
100G PSM4 and some other deployments have established silicon photonics
as a major contender
We expect 400G deployments to strongly leverage silicon photonics in
intermediate reach link segments (500 m - 2 km)
© Finisar Corporation Confidential 18
Thank You / Q&A