From Technologies to Market

3D TSV and 2.5D Business Update:

Market and Technology Trends 2017

Source: http://www.nexdatacenter.com

Sample

May 2017

•

2

SCOPE OF THE REPORT (1/2)

• The hopes and the wait of semiconductor industry were rewarded 2 years ago when 3D stacked ICs entered the market throughgaming applications; since then this type of architecture based on 3D TSV and 2.5D interconnections has kept growing.

• We observe a wider adoption of 3D stacked technology for several types of TSV based products (memory cube, logic, sensors)for a wide range of applications like imaging, computing, sensing, connecting… The diversity of applications currently benefitingfrom the most advanced packaging platform are somehow quite different and do not follow the same drivers.

• There is no « killer app » that drives 3D TSV and 2.5D business but a succession of high-value applications which benefit fromseveral drivers.

• This diversification has encouraged Yole to split the 3D TSV and 2.5D interconnect business around two main big trends drivenby different requirements.

The first and the main area driving 3D TSV integration are the high-performance applications where high-end devices require large bandwidth,large numbers of I/Os to exchange large amount of data with a low latency

The second one is correlated to a wide range of low-end and middle-end commercial products for imaging, sensing, connecting and lightingapplications relying on heterogeneous integration technology mainly for consumer’s business

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

3

SCOPE OF THE REPORT (2/2)

• Through this report, Yole has considered the following technologies

• 3D TSV (via middle and via last)

• 3D hybrid bonding

• 2.5D interposer

• 3D System On a Chip

• Driven by an important need in computing, these technologies enable solutions and find their place in commercial products forcloud computing, networking, machine intelligence through deep learning

• 3D TSV and 2.5D is not another type of package, it is a set of technology, IP, know-how and in some cases unique solutions todeliver high performance devices. This integration is taken into account from the component design step until its final assemblyincluding the software coding. This specificity makes the ecosystem, the supply chain and the value chain of TSV manufacturingunique, that’s why a study is done on how the supply chain set up and will continue to consolidate to make TSV manufacturingprofitable and affordable.

• This report will show how 3D interconnections offer solutions for ICT, security, consumers, medical, automotive markets.Beyond tradionnal market segments, new needs are coming from emerging computing and graphics applications such asaugmented, virtual and mixed reality but also cloud computing and deep learning.

• A focus is done on the hardware requirements for fulfilling the deep learning requirements.

• An analysis is done around the several possibilities used to « package 3D IC » (CoWoS, FC BGA, FO WLP…)

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

4

REPORT METHODOLOGY

Market segmentation methodology

Market forecast methodology

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

5

REPORT METHODOLOGY

Technology analysis methodology Information collection

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

6

TABLE OF CONTENTS (1/2)

Part 1: 3D and 2.5D technology for high performance applications

• What’s new since our last report? - 4

• Companies cited in the report - 7

• Executive summary - 8

• Introduction - 58

• PART 1: 3D and 2.5D technology for high performance applications

• Introduction - 72

• Market trends - 74

• 3D and 2.5D market and applications matrix

• Driving applications review

• Cloud computing

• AI and deep learning

• Supercomputing

• AR/VR and gaming

• Silicon photonics

• High-performance market forecasts 2016-2022 - 117

• Breakdown by 3D stacked devices

• In units, in wafer start, in revenues

• Breakdown by market segments

• In units, in wafer start, in revenues

• Ecosystems and players - 128

• Ecosystems moves

• Review of key players strategy: investments & partnerships

• Supply chain and commercialized products - 146

• Technology roadmap - 172

• Technology and device review

• 3D stacked memories

• Interposer

• Die partitionning

• 3D System-on-Chip

• Challenges

• Thermal management

• Current 3D packaging trends

• Review of alternative packaging solutions

• Conclusions and next steps - 228

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

7

TABLE OF CONTENTS (2/2)

Part 2: Heterogeneous integration for imaging, connecting, sensing and lighting

PART 2: heterogeneous integration for imaging,connecting, sensing and lighting

• Introduction - 231

• Market trends - 233

• Connecting

• Sensing

• Imaging

• Lighting

• Heterogeneous integration market forecasts 2016-2022 - 248

• Breakdown by type of components

• In units, in wafer start, in revenues

• Breakdown by market segments

• In units, in wafer start, in revenues

• Ecosystems and players - 259

• Supply chain and commercialized products - 270

• Supply chain by market segments

• Technology roadmap - 290

• Technical roadmap by devices

• TSV roadmap

• Challenges

• Review of alternative packaging solutions

• Conclusions and next steps - 300

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

8

Biography & contact

ABOUT THE AUTHOR

Emilie Jolivet

Emilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développementthe "More than Moore" market research and strategy consulting company. She holds a master’s degree Applied Physics specialized inMicroelectronics from INSA Toulouse. After an internship in failure analysis in Freescale, she took the position of R&D engineer for 7 yearsin photovoltaic business and co-authored several scientific articles. Strong for this experience, she graduated from a master in BusinessAdministration at IAE Lyon and then joined EV Group as a business development manager in 3D & Advanced Packaging before joining YoleDéveloppement in 2016.

Contact: Jolivet@yole.fr

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

PART 1: 3D TSV and 2.5D technology for high

performance applications

Courtesy of System Plus Consulting

10

HIGH PERFORMANCE 3D TSV COMMERCIAL PRODUCTS LAUNCH

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

11

HIGH PERFORMANCE MARKET AND APPLICATIONS

Where 3D stacked components make the point

* 3D System On Chip consists in logic-on-logic and memory-on-logic stacked 3D IC

** memory cube includes HBM, HMC, MCDRAM, 3DS and DiRAM

3D stacked IC find theirplace in

performance demandingapplications

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

12

DEEP LEARNING HARDWARE

3D and 2.5D packages have

enabledperformance hardware for deep learningapplications

Training and Inference have two different missions so different requirements in terms of hardware.

Hardware for training require large bandwidth, 3D-based products offer solutions. Inference require less bandwidth butlow latency. Interposer could come as a solution because of its modularity and its capacity to integrate more than 4chips.

Main players offer clear different product lines as solutions for both steps.

TRAINING INFERENCE

3D-based solutions

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

13©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

HPC & DEEP LEARNING: VALUE CHAIN IN MOTION

14©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

HIGH PERFORMANCE FORECASTS 2016-2022

Wafer start per year (12 ’’ eq)

will amost reach4.5 million in

2022

In the report,

breakdown by

market segments

and by 3D stacked

devices are

available

15

BUSINESS MODELS & SUPPLY CHAIN

in development

designing

manufacturing/operating

* commercialization

*Commercialization

indicates from what type

of product/service is

commercialized and so

where revenues are

coming from

** Systems are servers,

routers, switch, computer,

headset,…

non-exhaustive list

Complete chart

available in the report

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

PART 2: Heterogeneousintegration for imaging, sensing, connecting and

lighting

Courtesy of System Plus Consulting

17

DETAILED SUPPLY CHAIN DEVICE BY DEVICE

In the report, detailed supply chain from design to end-customers including manufacturing locations

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

18

FORECASTS TSV IN MEMS & SENSORS 2016 - 2022

TSV in MEMS and sensorsto reach more than 700 000 wafers per year

• In 2016, introduction ofvia-middle in fingerprintsensor in Applesmartphones

• In 2017, introduction ofvia-last in fingerprintsensors designed by FPCin smartphones

©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

19©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

RELATED REPORTS

The semiconductor industry’s hopes and patience were rewarded a few years ago when 3D stacked devices entered the market via the “back door” – in other words, for gaming products. Since their introduction, TSVs have held designers’ attention. The main reason: the performance potential offered by this technology is unequalled by any other packaging platform today. If in the past high-performance was synonymous with limited volume and reserved for data analytics and defense applications, this is no longer the case. High-end applications like deep learning, datacenter networking, AR/VR, and autonomous driving are becoming real, thereby pushing the limits of other current packaging platforms. So much so that last

year we saw datacenters receiving networking processing units and memory cubes packaged on an interposer.

Fueled by increasing bandwidth needs for moving data in cloud-computing and supercomputing applications, performance-driven markets have adopted 3D stacked technologies in a row. Imaging, as the first market adopter of 3D integration, is propelling the market with an increasing number of sensors in smartphones and tablets, including 3D imaging.

In the report, we provide a detailed analysis of the applications in order to get a calendar of the ones available on the market.

3D TSV AND 2.5D BUSINESS UPDATE - MARKET AND TECHNOLOGY TRENDS 2017Market & Technology report - May 2017

HOW ARE DATACENTERS AND ARTIFICIAL INTELLIGENCE DRIVING 3D TSV AND HETEROGENEOUS INTEGRATION GROWTH?

3D integration, a leading-edge technology supporting high-performance applications - From imaging to artificial intelligence, an entire ecosystem in motion.

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Latest 3D and 2.5D technology trends• Deep analysis of high-performance

market dynamics • Wafer start, units, and revenue

for high-performance applications - breakdown by product (stacked

memory, 3D SoC, interposer) - breakdown by market segment (datacenters, HPC, AR/VR, automotive)

• Wafer start, units, and revenue for low and middle-end applications - breakdown by market segment (imaging, RF connecting, sensing, and lighting)

• Ecosystems, business models, and supply chain: key players’ strategic moves, and detailed activity by player

WHAT’S NEW• This report is split into two parts:

one dedicated to high-performance products (high-end), the other to products requiring heterogeneous integration (low and middle-end): imaging, sensing, connecting, and lighting

• Detailed analysis of markets requiring 3D and 2.5 integration (datacenters, high-performance computing, AR/VR, automotive, etc.)

• Focus on deep-learning applications and key players’ deep-learning strategies

• Updated list of commercial and future products

• Ecosystem and supply chain moves’ analysis, from design to end-customers

• Forecast of 3D system-on-chip-based products (wafer start, units, and revenue)

• Review of the different business models present in the current supply chain, along with updated player activity

(Yole Développement, May 2017)

High-performance markets and applications

TSV-BASED PRODUCTS - BUSINESS UPDATE AND MARKET FORECASTS

TSV-based products can be classified in three ranges: low, middle, and high-end. In this report, we see that middle and high-end product markets like CMOS image sensor, memory cube, and interposer are based on a via-middle process. In low-end products, we can also find TSV based on via-middle (i.e. in Apple’s fingerprint sensor), but for cost reasons the MEMS industry is using essentially a via-last process, which is cheaper than a via-middle process.

More than 600,000 TSV-based wafers will be processed in 2022 for high-end products, a

rather limited volume that nevertheless generates high revenue because of high wafer value. High Bandwidth Memory (HBM) is becoming a standard for large bandwidth applications, even though there are only two manufacturers: Samsung and SK Hynix, both based in Korea.

In this report, we also highlight the production of 3D SoC to enable low-latency computing for consumer devices. Due to the growing number of imaging sensors in smartphones, and the growing needs in computing, the number of 12” equivalent wafers will increase at a CAGR of 20% over the

Where 3D stacked components make the point

* 3D System On Chip consists in logic-on-logic and memory-on-logic stacked 3D IC

ICT & networking

High performance computing

for data analytics

Consumercomputing

(gaming + AR/VR)

Aerospace and defense

Automotive computing

Medical computing

Memory cube x x x x Silicon

interposer x x x x x x

3D System On Chip *

x x

Silicon photonics

x x x x

3D TSV AND 2.5D BUSINESS UPDATE - MARKET AND TECHNOLOGY TRENDS 2017

(Yole Développement, May 2017)

3D TSV and 2.5D market forecasts for 2016 - 2022, by end-application

HOW IS THE 3D INTEGRATION ECOSYSTEM PROGRESSING? NEW PLAYERS ENTERING THE GAME

(Yole Développement, May 2017)

High Performance Computing (HPC) & deep learning: value chainin motion

Looking at high-end wafer volume in production (around 170,000 units of 12-inch wafers in 2017), one can ask why big players like TSMC, GlobalFoundries, and Samsung, all of which are used to trading in high-volume wafers, are present in the high-performance 3D TSV business. One reason is the number of issues attached to 3D integration for high-performance applications. Being present in datacenters and the high-performance computing business is key: first because this is a way for these companies to maintain

their leading technology position, and second because giant web companies are looking to move their activity from service providers to IC designers and develop their own brand-labelled chips, leaving manufacturing to the foundries. In developing customized, home-designed dies, web companies grasp the business of chip sellers. Die design is key in machine-learning because of the need for custom solutions to enable and secure applications like connected things, voice recognition, and autonomous driving. In developing custom, in-house dies for inference, web companies are taking part of the chip sellers’ business, and are positioning to win the race towards autonomous driving, IoT, and AR/VR.

No semiconductor player is inclined to miss the next killer app, so they are adjusting their strategy accordingly. While web companies are positioning downstream in the supply chain to gain better control over outsourcing IC manufacturing and assembly, as well as gain higher shares in the value chain, “traditional” chip makers are moving upwards, like Nvidia, which launched a server product based on its GPU tesla P100 for deep-learning applications. Also, in 2016 Intel released several products – specifically, processors and accelerators aimed at High Performance Computing (HPC) and deep learning. One can ask which role will be left to midsized companies.

Our report provides a review of the different business models chosen by the companies to understand the future strategic evolution of the industry.

next five years, going from 1.3M in 2016 to 4M in 2022. TSV’s penetration rate in low-end products will remain stable, with the main source of growth due to RF filters in smartphone front-end modules, which

keep increasing in order to support the different frequency bands used in 5G mobile communications protocol.

-

0,5

1

1,5

2

2,5

3

3,5

4

4,5

5

2016 2017 2018 2019 2020 2021 2022

Waf

er s

tart

per

yea

r in

mill

ion

units

RF filter - MEMS - FPS …

CIS and ToF

Stacked memory 3D SoC Interposer Silicon photonics

CAGR=29%*

CAGR=20%*

CAGR=36%*

High-End

Middle-End

Low-End 5G

*From 2016 to 2022

End-products & services

Systems & software

Need of customed chips: own brand design

Internal

design

Card / Processor

Manufacturing

Design

Find more details about

this report here:

MARKET & TECHNOLOGY REPORT

Executive summary 8

PART 1: 3D and 2.5D technology for high performance applications 72

Market trends 74> 3D and 2.5D market and applications matrix> Driving applications review

High-performance market forecasts 2016-2022 117

> Breakdown by 3D stacked devices> Breakdown by market segments

Ecosystems and players 128> Ecosystems moves> Review of key players strategy: investments

& partnerships

Supply chain and commercialized products 146> Technology and device review> Challenges > Current 3D packaging trends> Review of alternative packaging solutions

Conclusions and next steps 228

PART 2: heterogeneous integration for imaging, connecting, sensing and lighting 231

Market trends 233> Connecting> Sensing> Imaging> Lighting

Heterogeneous integration market forecasts 2016-2022 248

> Breakdown by type of components> Breakdown by market segments

Ecosystems and players 259Supply chain and commercialized products 270

> Supply chain by market segments

Technology roadmap 290> Technical roadmap by devices > TSV roadmap > Challenges> Review of alternative packaging solutions

Conclusions and next steps 300

TABLE OF CONTENTS (complete content on i-Micronews.com)

COMPANIES CITED IN THE REPORT (non exhaustive list)Alibaba, ALLVIA, Altera (now part of Intel), Amazon, AMD, Amkor, ams AG, Analog Devices, Apple, ASE, ASET, Atos, Audi, Avago Technologies (now a Broadcom Limited company), Baidu, Besi, Boeing R&T, Bosch, Broadcom, Broadpak, Cadence, CEA-Leti, Cisco Systems, Cray, Dell, Dongbu HiTek, EPWorks, eSilicon, Facebook, FLIR, Forza, Fraunhofer, Freescale, Fujitsu, GalaxyCore, GlobalFoundries, Google, G-MEMS, HANA Micron, HD MicroSystems, Henkel, Hitachi Chemical, HPE, Huawei, SK Hynix, Ibiden, Inotera, IBM, IMEC, IME, Infineon, Intel, IPDIA, ITRI, InvenSense, JCAP, Juniper Networks, KAIST, Lenovo, LSI Corporation, Luxtera, mCube, MediaTek, Medtronic, Mercedes-Benz, Micron, Microsoft, Mitsubisho Materials, Mobileye, Movidius, Murata, NCAP, NEPES, Netspeed Systems, Northrop Grumman, Novati Technologies, NVidia, NXP, Omnivision, Oracle, poLight, PTI, Q-Tech, Qualcomm, Rambus, Raytheon, Renesas, Robert Bosch GmbH, Rudolph Technologies, Samsung, Sematech, Sensonor, Shinko Electric, Silex Microsystems, SiTime, Sony, SPIL, SPTS, STATSChipPAC (a JCET company), STMicroelectronics, SMIC, Synopsys, Tencent, Texas Instruments, Tezzaron, Toshiba, Tower Jazz, TSMC, Ultratech, UMC, UTAC, X-Fab, Xiaomi, Xintec, Xilinx, Xperi, ZF Friedrichshafen, and more…

• Fan-Out: Technologies & Market Trends 2016

• Silicon Photonics for Data Centers and Other Applications 2016

• Samsung 3D TSV Stacked DDR4 DRAM

• Smartphone RF Front-End Module Review

Find all our reports on www.i-micronews.com

RELATED REPORTSBenef it from our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages

AUTHOREmilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement the “More than Moore” market research and strategy consulting company. She holds a master’s degree Applied Physics specialized in Microelectronics from INSA Toulouse. After an internship in failure analysis in Freescale, she took the position of R&D engineer for 7 years in photovoltaic business and co-authored several scientific articles. Strong for this experience, she graduated from a master in Business Administration at IAE Lyon and then joined EV Group as a business development manager in 3D & Advanced Packaging before joining Yole Développement in 2016.

REPORT OBJECTIVESThis report’s objectives are to provide:• 3D and 2.5D IC packaging

technology and market trends, by application

• Demonstration of how 3D integration is fueled by high-performance applications

• 2016 - 2022 forecast for high-performance, imaging, sensing, connecting, and lighting - by wafer start, units, and revenue in $

• Commercialization status of current and future 3D IC products

• Ecosystems, business models, and supply chain: key players’ strategic moves, and detailed activity by player

• Technology roadmap for TSV applications

WHAT TECHNOLOGY CHALLENGES AND COMPETITIVE PACKAGING WILL APPEAR IN THE NEXT FIVE YEARS?

Manufacturing yield is one remaining obstacle to full volume adoption of 3D TSV integration. HBM’s 2016 shortage was not helpful, and has encouraged companies to explore alternative solutions like SK Hynix’s GDDR6 memory, which can deliver similar bandwidth.

The $1,000 silicon interposer is still seen as an obstacle to higher volume adoption, which is why some chip makers are seeking alternative technologies. In this report we take a closer look at the EMbedded Interconnect Bridge

package (EMIB) from Intel, as well as the Silicon-Less Integrated Module (SLIM) and Silicon-Less Interconnect Technology (SLIT) from SPIL, which can be found in Xilinx products as a replacement for silicon interposer. These technologies, often developed by OSATs, are arriving as challengers to 3D and 2.5D integration, but none are set up in volume production. If prices continue decreasing with volume adoption, and if the learning curve accelerates, 3D integration could become the standard advanced packaging platform for high-performance applications.

ORDER FORM3D TSV and 2.5D Business Update - Market and Technology Trends 2017

SHIPPING CONTACT

First Name:

Email:

Last Name:

Phone:

PAYMENT

BY CREDIT CARD Visa Mastercard Amex

Name of the Card Holder:

Credit Card Number:

Card Verification Value (3 digits except AMEX: 4 digits):

Expiration date:

BY BANK TRANSFERBANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code: 00170Account No: 0170 200 1565 87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587

RETURN ORDER BY • FAX: +33 (0)472 83 01 83• MAIL: YOLE DÉVELOPPEMENT, Le Quartz,

75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France

SALES CONTACTS • North America - Steve Laferriere: +13106 008 267

laferriere@yole.fr • Europe & RoW - Lizzie Levenez: + 49 15 123 544 182

levenez@yole.fr• Japan & Rest of Asia - Takashi Onozawa: +81 3 6869 6970

onozawa@yole.fr • Greater China - Mavis Wang: +886 979 336 809

wang@yole.fr• Specific inquiries: +33 472 830 180 – info@yole.fr

(1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: June 7, 2017

/

ABOUT YOLE DEVELOPPEMENT

BILL TO

Name (Mr/Ms/Dr/Pr):

Job Title:

Company:

Address:

City:

State:

Postcode/Zip:

Country*:

*VAT ID Number for EU members:

Tel:

Email:

Date:

PRODUCT ORDER - Ref YDAP17019Please enter my order for above named report: One user license*: Euro 5,490 Multi user license: Euro 6,490- The report will be ready for delivery from June 7, 2017- For price in dollars, please use the day’s exchange rate. All reports are

delivered electronically at payment reception. For French customers, add 20% for VAT

I hereby accept Yole Développement’s Terms and Conditions of Sale(1)

Signature:

*One user license means only one person at the company can use the report.

Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

MEDIA & EVENTS• i-Micronews.com, online disruptive technologies website• @Micronews, weekly e-newsletter• Communication & webcasts services• Events: Yole Seminars, Market Briefings…More information on www.i-micronews.com

CONTACTSFor more information about :• Consulting Services: Jean-Christophe Eloy (eloy@yole.fr)• Financial Services: Jean-Christophe Eloy (eloy@yole.fr)• Report Business: Fayçal Khamassi (khamassi@yole.fr)• Press relations: Sandrine Leroy (leroy@yole.fr)

CONSULTING• Market data & research, marketing analysis• Technology analysis• Reverse engineering & costing services• Strategy consulting• Patent analysisMore information on www.yole.fr

REPORTS• Collection of technology & market reports• Manufacturing cost simulation tools• Component reverse engineering & costing

analysis• Patent investigationMore information on www.i-micronews.com/reports

FINANCIAL SERVICES• Mergers & Acquisitions• Due diligence• FundraisingMore information on Jean-Christophe Eloy (eloy@yole.fr)

© 2017

From Technologies to Market

Yole Développement

FromTechnologies to Market

21©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

FIELDS OF EXPERTISE

Yole Développement’s 30 analysts operate in the following areas

MEMS & Sensors

Compound

Semi.

Imaging

Photonics

MedTech

Manufacturing

Advanced

Packaging

Batteries / Energy Management

Power Electronics

Displays

RF

Devices &

Techno.

Advanced

Substrates

Solid State

Lighting(LED, OLED, …)

22©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research, marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

www.yole.fr

o Reports

• Market & technology reports

• Patent Investigation and patent infringement risk analysis

• Teardowns & reverse costing analysis

• Cost simulation tool

www.i-Micronews.com/reports

o Financial services

• M&A (buying and selling)

• Due diligence

• Fundraising

• Maturation of companies

• IP portfolio management & optimization

www.yolefinance.com

www.bmorpho.com

o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Communication & webcast services

• Events

www.i-Micronews.com

23©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

A GROUP OF COMPANIES

Market, technology

and strategy

consulting

www.yole.fr

M&A operations

Due diligences

www.yolefinance.com

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Test & Measurement

Expertise

Research & Innovationwww.piseo.fr

24©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Yole Inc.

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Phoenix

Yole Korea

Seoul

25©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

RESEARCH PRODUCTS - CONTENT COMPARISON

Custom analysis scope is defined with

you to meet your information and

budget needs

Breadth of the analysis

Dep

th o

f th

e a

naly

sis

Custom

Analysis

Workshops

Standard Reports

26©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market

analysis, technology

evaluation, and business plan

along the entire supply

chain

Integrators and

end-users

Device

makers

Suppliers: material,

equipment, OSAT,

foundries…

Financial investors,

R&D centers

27©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

SERVING MULTIPLE INDUSTRIAL FIELDS

We are workingaccrossmultiples industries to understand the impact of More-than-Moore technologies from device to system

From A to Z…

Transportation

makers

Mobile phone

and consumer

electronics

Automotive

Medical

systemsIndustrial and

defense

Energy

28©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

REPORTS COLLECTION

o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Power electronics

• Batteries and Energy management

• Compound semiconductors

• LED

• Displays

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain

The combined team of 50+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.

In the past 18 years, we worked on more than 1 500 projects, interacting with technology professional and high level opinion makers from the main players of theindustry.

o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.

www.i-Micronews.com

29©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

OUR 2017 REPORTS PLANNING (1/2)

MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017

− MEMS Microphones, Speakers and Audio Solutions 2017

− Status of the MEMS Industry 2017

− MEMS & Sensors for Automotive 2017

− High End Inertial Sensors for Defense and Industrial Applications 2017

− Sensor Modules for Smart Building 2017

− Sensing and Display for AR/VR/MR 2017 (Vol 1)

− MEMS Packaging 2017

− Magnetic Sensors Market and Technologies 2017**

− Microspectrometers Markets and Applications 2017**

o RF DEVICES AND TECHNOLOGIES

− RF Components and Modules for Cellphones 2017

− Advanced RF SiP for Cellphones 2017

− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals

2017

− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals

2017

− RF Technologies for Automotive Applications 2017

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

o IMAGING & OPTOELECTRONICS

− 3D Imaging & Sensing 2017

− Status of the CMOS Image Sensor Industry 2017

− Camera Module for Consumer and Automotive Applications 2017

− Uncooled Infrared Imaging Technology & Market Trends 2017

− Active Imaging and Lidars 2017 (vol 1)

o MEDTECH

− Status of the Microfluidics Industry 2017

− Solid State Medical Imaging 2017

− Sensors for HomeCare 2017

− Sensors for Medical Robotics 2017

− Organs-on-a Chip 2017

o ADVANCED PACKAGING

− Advanced Substrates Overview 2017

− Status of the Advanced Packaging Industry 2017

− Fan Out Packaging: Market & Technology Trends 2017

− 3D Business Update: Market & Technology Trends 2017

− Advanced QFN: Market & Technology Trends 2017**

− Inspection and Metrology for Advanced Packaging Platform 2017**

− Advanced Packaging for Memories 2017

− Embedded Die Packaging: Technologies and Markets Trends 2017

o MANUFACTURING

− Glass Substrate Manufacturing 2017

− Equipment & Materials for Fan Out Technology 2017

− Equipment & Materials for 3D T(X)V Technology 2017

− Emerging Non Volatile Memories 2017

** To be confirmed

30©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

OUR 2017 REPORTS PLANNING (2/2)

o POWER ELECTRONICS

− Status of Power Electronics Industry 2017

− Power Mosfets Market and Technology Trends 2017

− IGBT Market and Technology Trends 2017

− Power Packaging Market and Technology Trends 2017

− Power SiC 2017: Materials, Devices, and Applications

− Power GaN 2017: Materials, Devices, and Applications

− Materials Market Opportunities for Cellphone Thermal Management (Battery

Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017

− Gate Driver Market and Technology Trends in Power Electronics 2017

− Power Management ICs Market Quarterly Update 2017

− Power Electronics for Electrical Aircraft, Rail and Buses 2017

− Thermal Management for LED and Power 2017

o BATTERY AND ENERGY MANAGEMENT

− Status of Battery Industry for Stationary, Automotive and Consumer Applications

2017

o COMPOUND SEMICONDUCTORS

− Power SiC 2017: Materials, Devices, and Applications

− Power GaN 2017: Materials, Devices, and Applications

− GaN and Si LDMOS Market and Technology Trends for RF Power 2017

− Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017

o DISPLAYS

− Microdisplays and MicroLEDs 2017

− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017

− QD for Display Applications 2017

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− Emerging Display Technologies 2017**

o LED

− UV LEDs 2017 - Technology, Manufacturing and Application Trends

− Agricultural Lighting 2017 - Technology, Industry and Market Trends

− Automotive Lighting 2017 - Technology, Industry and Market Trends

− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**

− LED Lighting Module 2017 - Technology, Industry and Market Trends

− IR LEDs 2017 - Technology, Manufacturing and Application Trends

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

− CSP LED Module 2017

− LED Packaging 2017

PATENT ANALYSIS by Knowmade

− 3D Monolithic Memory: Patent Landscape Analysis

− Microfluidic Diagnostic: Patent Landscape Analysis

− GaN Technology: Top-100 IP profiles**

− Uncooled Infrared Imaging: Patent Landscape Analysis**

− MEMS Microphone: Patent Landscape Analysis**

− MEMS Microphone: Knowles' Patent Portfolio Analysis**

− MicroLEDs: Patent Landscape Analysis**

− Microbolometer: Patents used in products**

− Micropumps: Patent Landscape Analysis**

− Flexible batteries: Patent Landscape Analysis**

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be

published in 2017.

** To be confirmed

31©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

OUR 2016 PUBLISHED REPORTS LIST (1/2)

MARKET AND TECHNOLOGY REPORTS by Yole Développement

o MEMS & SENSORS

− Gas Sensors Technology and Market 2016

− Status of the MEMs Industry 2016

− Sensors for Cellphones and Tablets 2016

− Market and Technology Trends of Inkjet Printheads 2016

− Sensors for Biometry and Recognition 2016

− Silicon Photonics 2016

o IMAGING & OPTOELECTRONICS

− Status of the CMOS Image Sensor Industry 2016

− Uncooled Infrared Imaging Technology & Market Trends 2016

− Imaging Technologies for Automotive 2016

− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016

o MEDTECH

− BioMEMS 2016

− Point of Care Testing 2016: Application of Microfluidic Technologies

o ADVANCED PACKAGING

− Embedded Die Packaging: Technology and Market Trends 2017

− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016

− Fan-Out: Technologies and Market Trends 2016

− Fan-In Packaging: Business update 2016

− Status and Prospects for the Advanced Packaging Industry in China 2016

o MANUFACTURING

− Thin Wafer Processing and Dicing Equipment Market 2016

− Emerging Non Volatile Memories 2016

o COMPOUND SEMICONDUCTORS

− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− Power SiC 2016: Materials, Devices, Modules, and Applications

o LED

− UV LED Technology, Manufacturing and Applications Trends 2016

− OLED for Lighting 2016 – Technology, Industry and Market Trends

− Automotive Lighting: Technology, Industry and Market Trends 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− LED Packaging 2017: Market, Technology and Industry Landscape

o POWER ELECTRONICS

− Power Electronics for EV/HEV 2016: Market, Innovations and Trends

− Status of Power Electronics Industry 2016

− Passive Components Technologies and Market Trends for Power Electronics 2016

− Power SiC 2016: Materials, Devices, Modules, and Applications

− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends

− Inverter Technologies Trends & Market Expectations 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− GaN RF Devices Market: Applications, Players, Technology and substrates 2016

o BATTERY AND ENERGY MANAGEMENT

− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016

− Stationary Storage and Automotive Li-ion Battery Packs 2016

− Opportunities for Power Electronics in Renewable Electricity Generation 2016

32©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

OUR 2016 PUBLISHED REPORTS LIST (2/2)

PATENT ANALYSIS by Knowmade

− Microbattery Patent Landscape Analysis

− Miniaturized Gas Sensors Patent Landscape Analysis

− 3D Cell Culture Technologies Patent Landscape

− Phosphors and QDs for LED Applications Patent Landscape 2016 report

− TSV Stacked Memory Patent Landscape

− Fan-Out Wafer Level Packaging Patent Landscape Analysis

TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be

published in 2017.

MORE INFORMATION

o All the published reports from the Yole Group of Companies are available on our website

www.i-Micronews.com.

o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the

number of reports you are interested in and select the related offer. You then have up to 12

months to select the required reports from the Yole Développement, System Plus Consulting

and KnowMade offering. Pay once and receive the reports automatically (multi-user format).

Contact your sales team according to your location (see the last slide).

33©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ONLINE ONSITE INPERSON

@Micronews e-newsletter

i-Micronews.com

i-Micronewsjp.com

FreeFullPDF.com

Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

for improving your

product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

critical, there is no substitute

for meeting in-person. Events

are the best way to exchange

ideas with your customers,

partners, prospects while

increasing your brand/product

visibility.

Targeted audience

involvement equals clear,

concise perception of your

company’s message.

Webcasts are a smart,

innovative way of

communicating to a wider

targeted audience. Webcasts

create very useful, dynamic

reference material for

attendees and also for

absentees, thanks to the

recording technology.

Benefit from the i-Micronews.com

traffic generated by the 8,500+

monthly visitors, the 11,500+

weekly readers of @Micronews

e-newsletter

Seven main events planned for

2017 on different topics to

attract 140 attendees on average

Gain new leads for your business

from an average of 300

registrants per webcast

Contacts: Camille Veyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr), Marketing & Communication Project Managers.

34©2017 | www.yole.fr | 3D TSV and 2.5D Business Update: Market and Technology Trends 2017 | Sample

CONTACT INFORMATION

Follow us on

o CONSULTING AND SPECIFIC ANALYSIS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: laferriere@yole.fr – +1 31 06 008 267

• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: onozawa@yole.fr - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: wang@yole.fr - +886 979 336 809

• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail eloy@yole.fr - +33 4 72 83 01 80

o REPORT BUSINESS

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: laferriere@yole.fr – +1 31 06 008 267

• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: levenez@yole.fr - +49 15 123 544 182

• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: onozawa@yole.fr - +81 3 4405 9204

• Japan & Asia: Miho Othake, Account ManagerEmail: ohtake@yole.fr - +81 3 4405 9204

• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: wang@yole.fr - +886 979 336 809

o FINANCIAL SERVICES

• Jean-Christophe Eloy, CEO & PresidentEmail: eloy@yole.fr - +33 4 72 83 01 80

o GENERAL

• Public Relations: leroy@yole.fr - +33 4 72 83 01 89

• Email: info@yole.fr - +33 4 72 83 01 80