3D Stacked Memory Patent Landscape Analysis
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Transcript of 3D Stacked Memory Patent Landscape Analysis
3D STACKED MEMORY
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© LexInnova 2015 www.lex-innova.com
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The worldwide 3D IC market is expected to develop from US$2.21 billionin 2011 to US$6.55 billion in 2015 at a CAGR of 16.9% from 2011 to 2015.
020172016201520142013201220112010
50
10%
9%
8%
7%
6%
5%
4%
3%
2%
1%
0%
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150
200
250
300
350
400
450
500
Total 3D TSV devices(B$) 3D TSV Penetration rate
Mar
ket v
alue
(BS)
3D T
SV P
enet
ratio
n ra
te(%
)
Total semi value(B$)
excluding 2.50 interposer substrate value
SanDisk793
MatrixSemiconductor
36
AMD31
UnitySemiconductor
30
Hitachi29
III HOLDINGS LLC24
HP24
Sharp Corp19
MicronTechnology
219Samsung
194 Macronix95
Intel Corp90
Guobiao Zhang57
Toshiba47
IBM39
Con
tact
For
mat
ion+
Stru
ctur
al F
eatu
res
Ass
embl
y/Pa
ckin
g+St
ruct
ural
Fea
ture
s
Dev
ice
Form
atio
nSt
ruct
ural
Fea
ture
s
Stac
king
+St
ruct
ural
Fea
ture
s InterconnectsFormation+Structural Feature
Other_FEOL+StructuralFeature
WaterDevelopment+StructuralFeatures
Testing+StructuralFeatures
Other-BEOL+Model
ParametersLithography+StructuralFeatures
Other_BEOL+Structural Features
Etching+Structural Features
Stacking+ModelParameters
Contact Formation + Operating Speed
Contact Formation+ Model Parameters
3D Stacked Memory is an integrated circuit manufactured by stacking silicon wafers and interconnecting them vertically using through-silicon vias (TSVs). These stacked wafers behave as a single device and achieve higher performance at reduced power as compared to conventional two-dimensional devices.
SanDisk, Micron, and Samsung are the top threeassignees in terms of patent holdings. The number of patents/patent applications owned by top the three assignees comprise around 52% of the total patents/patent applicationsfiled in the domain. Guobiao Zhang, an individual inventor has filed 57patents/patent applications.
MERGERS AND ACQUISITIONS
Intel and its partner company, Micron, announced a 3D NAND solution that enables chips with 384Gbits (48GBs) of capacity which is three times that of existing 3D NAND chips.
AMD has reported that it would be mutually working with memory device manufacturer SK Hynix in the development of cutting edge, high-bandwidth, 3D stacked memory items and arrangements.
Market Projections
TOP ASSIGNEES
LICENSING HEAT MAP
Model parameters & Operating Speed related to Contact Formation (FEOL) and Structural Features related to Assembly/Packaging are red in color which reflects a very distributed portfolio with no monopoly of any assignee in these domains, hence have higher chances of licensing activity. While on the other hand, domains like Stacking and Etching combined with the structural features fall in the lighter shades reflecting that the patent portfolio in these domains is predominantly held by some top players. Sandisk, Samsung and Micron are the prominent assignees in most of the technology domains.