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Transcript of 32LH20R-MA
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LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91A
MODEL : 32LH20R 32LH20R-MA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM...................................................................................19
EXPLODED VIEW .................................................................................. 20
SVC. SHEET ...............................................................................................
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrumentsexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 4 -
CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500F to 600F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500F to 600F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500F to 600F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 5 -
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 6 -
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification4.1 General Specification
1. Application rangeThis spec sheet is applied to LCD TV used LP91A chassis.
2. SpecificationEach part is tested as below without special appointment.
1) Temperature : 255C (779F), CST : 405C2) Relative Humidity : 6510%3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed
each drawing and specif ication by part number inaccordance with BOM.
5) The receiver must be operated for about 5 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
- Safety: CE, IEC specification- EMC : CE, IEC
No Item Specification Measurement Remark1 Screen Size 32 wide Color Display Module Resolution: 1366*768 / 1920*10802 Aspect Ratio 16:93 LCD Module 32 TFT WXGA LCD HD4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 80 %5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %6 Input Voltage AC100-240V~, 50/60Hz
150 W 32 HD7 LDC Module HD 760 x 450 x 48 with inverter
(Maker : LGD) 0.17025 x 0.5107512 EEFL
Coating 3H
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009
No. Item Min. Typ. Max. Unit Maker Remark1. Luminance 400 500 cd/m2
(W/O PC mode)2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 103. Color Coordinates White Wx Typ 0.279 Typ LGD 32(HD)
Wy -0.03 0.292 +0.03RED Xr 0.636
Yr 0.335Green Xg 0.291
Yg 0.613Blue Xb 0.146
Yb 0.0614. Contrast ratio 800:1 1100:1 LGD 32(HD)5. Luminance Variation 1.3
- 7 - LGE Internal Use Only
5. Chroma& Brightness (Optical)5.1. LCD Module
the Color Coordinates check condition - 50cm from the surface, Full White Pattern- Picture mode Vivid
8. Component Video Input (Y, PB, PR)No Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz4 720* 480 31.47 59.94 27.000 SDTV 480P5 720* 480 31.50 60.00 27.027 SDTV 480P6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz7 1280* 720 44.96 59.94 74.176 HDTV 720P8 1280* 720 45.00 60.00 74.250 HDTV 720P9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,11 1920* 1080 33.72 59.94 74.176 HDTV 1080I12 1920* 1080 33.75 60.00 74.25 HDTV 1080I13 1920* 1080 56.25 50 148.5 HDTV 1080P14 1920* 1080 67.432 59.94 148.350 HDTV 1080P15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009- 8 - LGE Internal Use Only
No Specification RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA2 720* 400 31.469 70.09 28.32 DOS3 640* 480 31.469 59.94 25.17 VESA( VGA)4 800* 600 37.879 60.317 40 VESA( SVGA)5 1024* 768 48.363 60.004 65 VESA( XGA)6 1280* 768 47.776 59.87 79.5 VESA( WXGA)7 1360* 768 47.72 59.799 84.75 VESA( WXGA)8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
9. RGB 9.1 Analog PC, RGB- DTV NOT SUPPORT
10. HDMI Input 10.1 PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark1 640 x 480 31.469 59.94 25.17 VESA( VGA)2 800 x 600 37.879 60.317 40.00 VESA( SVGA)3 1024 x 768 48.363 60.004 65.00 VESA( XGA)4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)5 1360 x 768 47.72 59.799 84.62 VESA( WXGA) 6 1366 x 768 47.7 60.00 84.62 WXGA7 1280 x 1024 63.595 60.00 108.875 SXGA8 1920 x 1080 66.647 59.988 138.625 WUXGA
10.2 DTV Mode
No Specification RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz but display.4 720 x 480 31.47 59.94 27 SDTV 480P5 720 x 480 31.5 60.00 27.027 SDTV 480P6 720 x 576 31.25 50.00 27 SDTV 576P7 1280 x 720 44.96 59.94 74.176 HDTV 720P8 1280 x 720 45 60.00 74.25 HDTV 720P9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P16 1920 x 1080 27 24.00 74.25 HDTV 1080P17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
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1) Gap between Front Frame /Back cover and Middle Cabinet2) Gap between Front Frame /Middle Cabinet
- 9 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009
Top View
Back Cover
Front Frame
Middle Cabinet"b
"b
Gap b between Front Frame (Back cover) and Middle Cabinet-> 0 b B (Side gap)
Gap a between Front Frame and Middle Cabine-> 0 a A (Side gap)
"b
"a
Gap a between Front Frame and Middle Cabine-> 0 a A (Left/ Right gap)
3) Gap between Back Cover and Side AV
Back View Side View
Side AV
Back Cover
Gap f between Back Cover and Side AV-> 0 f 1.0Gap g between Back Cover and Side AV-> 0 g 1.0
11. Mechical spec. No Item Min Typ Max Unit 1. C/ A + B/ C top gap 0.5 1 1.5 mm2. C/ A + B/ C side gap 0.5 1 1.5 mm3. C/ A + Deco Front gap( ONE SIDE). 0.8 1 1.2 mm
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*Active area1. Active area of LCD PANEL is in bezel of cabinet2. Interval between active area and bezel
|A-B|< 2.0 mm ,|C-D|< 2.0 mmA:Interval between left of active area and bezelB:Interval between right of active area and bezelC:Interval between top of active area and bezelD:Interval between bottom of active area and beze
4)Gap between Back Cover and Side AV
- 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009
Side View "h"
Control Braket
Back Cover
Gap h between Back Cover and Control Bracket-> 0 h 0.8
C
B
D
AActive Area
Bezel
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 11 -
ADJUSTMENT INSTRUCTION1. Application Range
This specification sheet is applied to all of the LCD TV,LP91A/B/C/D chassis.
2. Specification1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of
25 5 C of temperature and 6510% of relative humidity ifthere is no specific designation.
4) The input voltage of the receiver must keep 100~220V,50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.
3. Adjustment items3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig2) Using USB Memory Stick.
(2) ADC Calibration RGB / Component(3) Input Tool-Option/Area option.(4) Check SW Version.
4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig
(1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack
(2) Download steps1) Execute ISP Tool program, the main window(Mstar ISP
utility Vx.x.x) will be opened2) Click the Connect button and confirm Dialog Box
3) Click the Config. button and Change speed I2C Speedsetting : 350Khz~400Khz
4) Read and write bin file.Click (1)Read tab, and then load downloadfile(XXXX.bin) by clicking Read.
- LH20/ LH30
1
Filexxx.bin
1
Filexxx.bin
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5) Click (2)Auto tab and set as below6) Click (3)Run.7) After downloading, you can see the (4)Pass message.
4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the ISB port.2) Automatically detect the SW Version.
-> S/W download process is executed automatically.3) Show the message Copy the file from the Memory
4) After Finished the Download, Automatically DC Off -> On
5) Check The update SW Version.
4.2. Adjust tool/area option.Adjust tool/area option refer to the BOM.
4.3. Adjust tool/area option.Adjust tool/area option refer to the BOM.
4.4. EDID D/L methodRecommend that dont connect HDMI and RGB(D-SUB) cablewhen downloading the EDID.If not possible, recommend that connect the MSPG equipment.There are two methods of downloading the edid data
4.4.1. 1st MethodEDID datas are automatically downloaded when adjusting theTool Option2.Automatically downloaded when pushing the enter key afteradjusting the tool option2.It takes about 2seconds.
4.4.2. 2nd Method* Caution :
Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not bedownloaded well.
1) Press the ADJ key2) Move to the EDID D/L and Press the right direction key(G)3) Press the right direction key(G) at Start.4) After about a few seconds, appear OK, then compele.
4.4.3. RS-232C command Method(1) Command : AE 00 10
* Caution Don t connect HDMI and RGB(D-SUB) cable whendownloading the EDID.If the cables are connected, Downloading of edid could befailed.
- 12 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009
1
Filexxx.bin
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4.4.4. EDID data(1) HD MODEL
4.5. ADC Calibration4.5.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : Component by using D/E
(CH +/-) and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
4.5.2. ADC Calibration - RGB (Using External pattern)(1) Required Equipments
- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : RGB by using D/E(CH +/-)
and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
- 13 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009
OK
OK
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4.6. Input Tool-Option, Area Option.## TOOL Option, Area Option change and AC offBefore PCBA check, you have to change the Tool option,Area option and have to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
4.6.1. Profile: Must be changed the option value because being differentwith some setting value depend on module maker, inch andmarket
4.6.2. Equipment : adjustment remote control.
4.6.3. Adjustment methodThe input methods are same as other chassis.(Use IN-STARTKey on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)* Refer to Job Expression of each main chassis ass y
(EBTxxxxxxxx) for Option value * Never push the IN-STOP KEY after completing the functioninspection.
4.7. Check SW Version(1) Method
1) Push In-star key on Adjust remote-controller.2) SW Version check
Check SW VER : V3.xx LH20
5. White Balance adjstment5.1. Overview
(1) Purpose : Adjust the color temperature to reduce thedeviation of the module color temperature.
(2) Principle : To adjust the white balance without thesaturation, Fix the one of R/G/B gain to 192 (default data)and decrease the others.
(3) Adjustment mode : Three modes Cool / Medium / Warm
5.2. Required Equipment(1) Remote controller for adjustment (2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV (ch:9)(should be used in the calibrated ch by CS-1000)
(3) Auto W/B adjustment instrument(only for Auto adjustment)
5.3. Connecting diagram of equipment formeasuring (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC Communication-WhiteBalance Mode.
(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)
(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)- Enter the white balance adjustment mode with aging
command (F3, 00, FF)* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance (for Manualadjustment)
(1) Color analyzer(CA100+, CA210) should be used in thecalibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the followingsequence.1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push Exit key.3) Change to the AV mode by remote control.4) Input external pattern (85% white pattern)5) Push the ADJ key -> Enter 0000 (Password)6) Select 3. W/B ADJUST7) Enter the W/B ADJUST Mode8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others11) When adjustment is completed, Enter COPY ALL.12) Exit adjustment mode using EXIT key on R/C.
- 14 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009
-
* CASEFirst adjust the coordinate far away from the target value(x, y).1. x, y > target
i) Decrease the R, G. 2. x, y < target
i) First decrease the B gain, ii) Decrease the one of the others.
3. x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R
4. x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment
To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)
- 15 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009
Coordinate Mode
x y Temp uv
Cool 0.2760.002 0.2830.002 11000K 0.000Medium 0.2850.002 0.2930.002 9300K 0.000Warm 0.3130.002 0.3290.002 6500K 0.003
-
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 16 -
TROUBLESHOOTING
No power(LED indicator off)
Check 24V, 12V, 5,2V of Power B/D
Check short of Main B/D or Change Power B/D
Pass
Check Output of IC1001, IC1003, IC1007
Check P307 Connector
Change LED Assy
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assy
Change IC1002,, Q1003
Pass
Check short of IC1001, IC1003, IC1007
Fail
Re-soldering or Change defectpart of IC1001, IC1003, IC1007
Fail
No Raster [B]: Process
Check LED statusOn Display Unit Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802Fail
Change Inverter ConnectorOr InverterFail
Pass
Fail
Pass
Change ModuleFail
Check LVDS Cable
Pass
Check Panel Link Cable Or Module
Change Panel Link CableOr Module
Check Inverter ConnectorOr Inverter
Pass
-
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 17 -
No Raster on PC Signal
Check Input source Cable And Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC100 Fail
Re-soldering or Change the defect part,Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/OutputOf J104 Fail
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source Cable And Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
Check The Input/OutputOf JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source Cable And Jack
Pass
Check the Input/OutputOf JK301, JK302, JK303 Fail
Re-soldering or Change the defect part
Pass
Pass
Check the Input/OutputOf JK301, JK302, JK303 Fail
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf JK301, JK302, JK303 Fail
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC300, IC301, JK302 Fail
Re-soldering or Change the defect partCheck HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
-
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 18 -
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source Cable And Jack
Pass
Check Input source Cable And Jack
Pass
Check The Input/OutputOf JK101, JK201
Pass
Re-soldering or Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
Check The Input/OutputOf TU500
Pass
Re-soldering or Change the defect part
Pass
Fail
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
No Sound
Check The Input Sourse
Check The Input/OutputOf IC600
Re-soldering or Change the defect partFail
Pass
Pass
Check The Speaker Change Speaker Fail
Check The Speaker Wire
Pass
Change The Source InputFail
-
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2009 LGE Internal Use Only- 19 -
BLOCK DIAGRAM
RG
B_
PC
PC_
Audi
o
TV (RF)
CO
MP1
HD
MI1
HD
MI2
RS2
32
TX
232C
D
rive
rST
3232
CTx
/Rx
:
15Vp
p
PC_
R/G
/B/H
S/VS
PC_
Au
dio
_L/
R :7
00m
Vrm
s
MN
T_O
UT:
1Vp
p
SID
E_V
:1Vp
p
SID
E_L/
SID
E_R
:500m
Vrm
s
DD
R2(
512M
B)
L_SP
K_O
UT
R_
SPK_
OU
T
EEPR
OM
24C
02
Com
p1_
L/R
:500m
Vrm
s
TUN
ER
AV1
_VI
N:
1Vpp
AV1
1_LI
N/R
IN :5
00m
Vrm
s
PWM
NTP
3100
L
MN
T_O
UT
MN
T_LO
UT/
RO
UT:
500m
Vrm
s
AV2
(Sid
e A
V)
MAI
N SC
ALER
TXD
/R
XD : 5
V D
igita
l
CO
MP1
_Y/
Pb/P
r: 1/
0.7V
ppC
OM
P2_
Y/Pb
/Pr: 1/
0.7V
pp
IR HD
MI_
DAT
A_1
HD
MI_
DAT
A_2
HD
MI1
_SC
L/SD
A
OU
T_E_
TX_
CLK
OU
T_E_
TX_
EO
UT_
E_TX
_D
OU
T_E_
TX_
CO
UT_
E_TX
_B
OU
T_E_
TX_
ATU
_M
AIN
S I F
CO
MP1
_Y/
Pb/P
r 1/
0.7V
pp
AV1
_VI
N
PC_
Au
dio
_L/
R
CO
MP1
_LI
N/R
IN
L_C
HR
_CH
LVDSconnector
TU_
MA
INSU
B_
SCL
SDA
EEPR
OM
24C
02
EEPR
OM
24C
02
SIF
AV1
_LI
N/R
IN
MN
T_L/
R O
UT
AV1
MN
T_O
UT
Com
p2_
L/R
:500m
Vrm
s
CO
MP2
_Y/
Pb/
:1/
0.7V
pp
CO
MP2
_LI
N/R
IN
CO
MP2
OU
T_O
_TX
_C
LK
OU
T_O
_TX
_E
OU
T_O
_TX
_D
OU
T_O
_TX
_C
OU
T_O
_TX
_B
OU
T_O
_TX
_A
PC_
R/G
/B/H
S/VS
HD
M2_
SCL/
SDA
PC_
SCL/
SDA
MN
T_VO
UT
AV2
_VI
NA
V2_
LIN
/RIN
IIS_
OU
T
USB
USB
_D
N/P
N
AUD
IOAM
P
HD
MI3
_SC
L/SD
AEE
PRO
M24
C02
HD
MI_
DAT
A_3
TMD
STM
DS
TMD
SH
DM
I3
USB
For
D/L
EEPR
OM
(256
K)
Seri
al F
las
h(8
MB
yte
)R
GB
_PC
PC_
Audi
o
TV (RF)
CO
MP1
HD
MI1
HD
MI2
RS2
32
TX
232C
D
rive
rST
3232
C
PC_
R/G
/B/H
S/VS
PC_
Au
dio
_L/
R :7
00m
Vrm
s
MN
T_O
UT:
1Vp
p
SID
E_V
:1Vp
p
SID
E_L/
SID
E_R
:500m
Vrm
s
DD
R2(
512M
B)
EEPR
OM
24C
02
Com
p1_
L/R
:500m
Vrm
s
TUN
ER
AV1
_VI
N:
1Vpp
AV1
1_LI
N/R
IN :5
00m
Vrm
s
PWM
NTP
3100
L
MN
T_O
UT
MN
T_LO
UT/
RO
UT:
500m
Vrm
s
AV2
(Sid
e A
V)
MAI
N SC
ALER
TXD
/R
XD : 5
V D
igita
l
CO
MP1
_Y/
Pb/P
r: 1/
0.7V
ppC
OM
P2_
Y/Pb
/Pr: 1/
0.7V
pp
HD
MI_
DAT
A_1
HD
MI_
DAT
A_2
_
OU
T_E_
TX_
CLK
OU
T_E_
TX_
OU
T_E_
TX_
OU
T_E_
TX_
C
OU
T_E_
TX_
B
OU
T_E_
TX_
A
TU_
MA
IN
S I F
CO
MP1
_Y/
Pb/P
:1/
0.7V
pp
AV1
_VI
N
PC_
Au
dio
_L/
R
CO
MP1
_LI
N/R
IN
L_C
HR
_CH
LVDSconnector
TU_
MA
IN/
EEPR
OM
24C
02
EEPR
OM
24C
02
SIF
AV1
_LI
N/R
IN
MN
T_L/
R O
UT
AV1
MN
T_O
UT
Com
p2_
L/R
:500m
Vrm
s
CO
MP2
_Y/
Pb/P
r1/
0.7V
pp
CO
MP2
_LI
N/R
IN
CO
MP2
OU
T_O
_TX
_C
OU
T_O
_TX
_E
OU
T_O
_TX
_D
OU
T_O
_TX
_C
OU
T_O
_TX
_B
OU
T_O
_TX
_A
PC_
R/G
/B/H
S/VS
PC_
SCL/
SDA
PC_
SCL/
SDA
MN
T_VO
UT
AV2
_VI
NA
V2_
LIN
/RIN
IIS_
OU
T
USB
USB
_D
N/P
N
AUD
IOAM
P
HD
MI3
_SC
L/SD
AH
DM
I3_
SCL/
SDA
EEPR
OM
24C
02H
DM
I_D
ATA_
3
TMD
STM
DS
TMD
SH
DM
I3
USB
For
D/L
EEPR
OM
(256
K)
Seri
al F
las
h(8
MB
yte
)
-
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 20 -
300
200
200T
200N
801
802
803
804
805
806
520
530
540
550
400
900
120
510
500
310
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
A2LV
1A1
0
-
MULT
I_PW_
SW
10R8
59
56
AR812
SUB_
SDA
HPD_MST_3
+1.8V
_DDR
COMP
2_PB
RT1C
3904
-T11
2Q8
02E
BC
DDR2
_DQM
0
100 R825
0.04
7uF
C828
KEY1
RL_ON
MX25
L640
5DMI
-12G
IC80
2
3NC
_1
2VC
C
4NC
_2
1HO
LD
6NC
_4
5NC
_3
7CS
8SO
/SIO
19
WP/AC
C
10GN
D
11NC
_5
12NC
_6
13NC
_7
14NC
_8
15SI
.SIO
016
SCLK
0.01
uFC8
64
0.1uF C882
I2S_SCK
TMDS
2_RX
2-0.
1uF
C833
I2S_MCLK
USB_DN
100
R882
MAIN
_SIF
PC_G
100 R8024
33R8
44
10 R801
HDMI3_SIDE
0.04
7uF
C830
PANEL_STATUS
TMDS
2_RX
0+
MNT_
VOUT
_T
TMDS3_RX0+
0.1u
FC8
42
SW_R
ESET
RXD
0.01
uFC8
58
TMDS
2_RX
2+
+3.3V
_MUL
TI_MS
T
0.1uF C813
12MHz
X801
10R8
74
1M
R839
4.7u
FC8
12
RL_O
N
M_SDA
DDC_SDA3
+3.3V
_MUL
TI_MS
T
+3.3V
_MST
MUTE
_LINE
EEP_
SCL
E-DIM
SIDE_
RIN
10R8
62
56AR80
5 DDR2
_DQM
1
10 R848
HDMI3_SIDE
EEP_SCL
CEC_C
10
uF
C86
6
0.01
uFC8
60
47R8
34
56
AR813
TMDS3_RX1+
SYS_RESET
SPI_CZ
I2S_SDO
0.1u
FC8
15
22K
R842TM
DS2_R
XC+
DDC_SCL1
0.04
7uF
C837
POWER_SW
47R8
32
TMDS
2_RX
C-
+5VS
T_MS
T
0.1u
FC8
48
56AR81
0
10 R841
HDMI3_SIDE
0.1u
FC8
38
+1.2V
_VDD
C_MS
T
+3.3V
_MUL
TI_MS
TJT
P-11
27W
EMSW
800
1
2 4
3
MNT_
L_AMP
0.1
uF
C81
1
MNT_
VOUT
DDR2_CASZ
PANE
L_ON
1000
pFC8
35
0.1u
FC8
49
PC_B
TMDS3_RX2+
+3.3V
_MUL
TI_MS
T
0.04
7uF
C829
DDC_SCL3
DDR2_BA1
DISP_
EN/VA
VS_O
N
DDR2_RASZ
DDR2
_D[0-
15]
TMDS3_RX0-
10R8
54
COMP
2_Y
33
AR818
0.04
7uF
C832
PC_AUD_L
PC_VS
CVBS_LIN
SPI_D
I
402
R807 R
EADY
0.1uF C883
DDR2_BA0
EEP_
SCL
10 R820
HDMI3_SIDE
0.01
uFC8
59
+3.3V
_MUL
TI_MS
T
DDR2
_DQS
0M
SIDE_
LIN
SIDE_
V0.
047u
FC8
31
0.01
uFC8
03
TMDS
2_RX
1+
+1.8V
_DDR
DDC_SDA1
SUB_
SCL
DSUB_SDA
10R8
90
100
R881
CAT2
4WC0
8W-T
IC80
3
3A
2
2A
1
4V
SS
1A
0
5SD
A
6S
CL
7W
P
8VC
C
DDR2_CKE
+12V
_AUD
IO
SPI_CLK
+3.3V
_MUL
TI_MS
T
DDR2
_DQS
1M
0.01
uFC8
07
KDS1
81D8
03USB_DP
+3.3V
_MST
100 R8025
+3.3V
_MUL
TI_MS
T
56AR80
9
I-DIM
SPI_C
Z
0.1uF C808
0.1u
FC8
04
56 R852
IR
0.01
uFC8
41
EEP_SDA
DDR2
_A[0-
12]
+3.3V
_MUL
TI_MS
T 10 R822HDMI3_SIDE
CVBS
_VIN
10R8
51
DDR2
_DQS
1P
10 R823
HDMI3_SIDE
TMDS3_RXC-
MNT_
VOUT
_T
TMDS
2_RX
0-
+3.3V
_MUL
TI_MS
T
DDR2
_DQS
0P
10 R821
HDMI3_SIDE
10R8
69
47R8
37
DDR2
_MCL
KZ
DDR2_WEZ
TXD
56AR80
6
0.04
7uF
C834
EEP_
SDA
TMDS
1_RXC
+
24LC
256-
I/SM
IC80
1
3A
2
2A
1
4V
SS
1A
0
5SD
A
6S
CL
7W
P
8VC
C
COMP2_R
M_SCL
+3.3V
_MUL
TI_MS
T
PC_HS
TMDS
1_RX
2-
0.01
uFC8
50
+3.3V
_MUL
TI_MS
T
TMDS3_RXC+
47uF
25V
C870
+3.3V
_MUL
TI_MS
T
470
R835
10R8
91
KDS1
81D8
02
TV_M
AIN
1000pF C818
COMP
2_PR
RT1C
3904
-T11
2Q8
04N
ON
19_
22"
EB
C
0.1
uF
C86
7
22K
R845
100 R8026
TMDS3_RX1-
P_24
V_SM
ALL_
15V
0.01uF C840
2.2u
FC8
61
HPD_
MST_
1
10R8
73
10R8
80
SPI_D
O
PC_AUD_R
0.01
uFC8
10
56
AR814
+1.2V
_VDD
C_MS
T
100 R8023
TMDS
2_RX
1-
DDC_SCL2
10R8
58
10R8
92
TMDS
1_RX
1+
10R8
71
TMDS
1_RX
2+
EEP_
SDA
56
AR800
10 R805
HDMI3_SIDE
KDS1
81D8
01
DDR2_ODT
TMDS
1_RX
C-
SPI_DI
I2S_WS
DDR2
_MCL
K
0.04
7uF
C826
TMDS
1_RX
0-
10R8
72
MNT_
R_AM
P
10R8
79
HPD_
MST_
2
0.1u
FC8
53
0.01
uFC8
39
DSUB_SCL
0.01
uFC8
65
COMP2_L
10uF16V C809
+1.8V
_DDR
0.01
uFC8
62
+1.2V
_VDD
C_MS
T
TMDS
1_RX
1-
4.7uF C820
100 R824
100 R829
KEY2
56
AR815
TMDS
1_RX
0+
0.01
uFC8
57
CVBS_RIN
2.2u
FC8
56
0.1u
FC8
69
+5VS
T_MS
T
0.1u
FC8
14
PC_R
SPI_C
LK
33R8
43
0.1uF C844
10R8
56
TMDS3_RX2-
0.01uF C876
DDC_SDA2
SPI_DO
P_12
V_SM
ALL_
15V
+5VS
T_MS
TPO
WER_
DET
POWER_DET
RT
1C
3904
-T11
2Q
803
E
B
C
+5VS
T_MS
T
SYS_
RESE
T
100 R8012
0.01
uFC8
770.
01uF
C878
0.01
uFC8
79
TXD
RXD
0.1uF C863
ISA1
530A
C1Q8
00E
BC
ISA1
530A
C1Q8
01
EB
C
2.2
uF
16V
C80
00R
EAD
Y
+3.3V
_MUL
TI_MS
T
0
R806
0 R870
S_VID
EO_D
ET
SIDE_
YSID
E_C
DDC_
WP
OPC_
EN
4.7K
R877
4.7K
R800
44.
7KR8
17
470
R809
47
R80
41
220
R808
68R810
0R80
0RE
ADY
0R800
1
390
R840
47R8
14
47R8
1647
R818
47R8
38
47R8
33
47R8
36
470
R803
47R8
0447
R815
47R8
9747
R802
47R8
3147
R857
47R8
30
47R8
7547
R876
100
R846
100
R847
100
R8039
HDMI3_SIDE
100
R8040
HDMI3_SIDE
4.7K
R863
4.7K
R864
10
0R
8042
1KR
8038
1KR
8018
4.7K
R865
4.7K
R866
1K R867
1K R868
100R8021
100R8022
100 R850
100 R849
100 R895
0
READY
R8017
0
READY
R8016
0 R8033
READY
0 R8034
0 R8035
10K
R80
20
10K
R800
3
0.04
7uF
C800
0.04
7uF
C801
0.04
7uF
C827
0.04
7uF
C825
0.04
7uF
C847
0.04
7uF
C845
0.04
7uF
C843
0.04
7uF
C836
0.1u
FC8
68
1000
pFC8
46
1KR884
READ
Y1KR8
89
1KR811
READ
Y1KR8
83
4.7K
R802
84.
7KR8
027
22R8
12
22R8
13
0.1u
FC8
19
0.1u
FC8
060.
1uF
C805
4.7K
Non_
Small
_FHD
R801
0-*2 4.
7KSm
all_F
HD
R801
0-*1
4.7K
Small
_HD
R896
4.7K
Apol
lo
R801
0-*3
4.7K
Small
_FHD
R896
-*1
4.7K
Non_
Small
_HD
R801
1-*1
4.7K
Non_
Small
_HD
R896
-*2
4.7K
Apol
lo
R801
1-*2
4.7K
Apol
lo
R898
-*14.7
KNo
n_Sm
all_F
HDR8
98
4.7K
100H
zR8
011-
*34.
7K10
0Hz
R898
-*2
4.7K
R801
1Sm
all_F
HD4.
7KR8
010
Small
_HD
22R8
005
22R8
006
0 R826
0 R827
4.7
uF
10V
C87
1
REA
DY
12
0-o
hm
L8
00
120-ohm
L801
12
0-o
hm
L8
02
2.2uF C823
2.2uF C824
2.2uF C821
2.2uF C873
2.2uF C822
2.2uF C874
2.2uF C802
2.2uF C875
MST9
9A88
ML(MA
TRIX B
ASIC)
IC80
0
1RX
BCKN
2RX
BCKP
3RX
B0N
4RX
B0P
5HO
TPLU
GB6
RXB1
N7
RXB1
P8
AVDD
_33_
19
RXB2
N10
RXB2
P11
RXAC
KN12
RXAC
KP13
RXA0
N14
RXA0
P15
AVDD
_33_
216
RXA1
N17
RXA1
P18
GND_
119
RXA2
N20
RXA2
P21
HOTP
LUGA
22RE
XT23
VCLAM
P24
REFP
25RE
FM26
BIN1
P27
SOGI
N128
GIN1
P29
RIN1
P30
BINM
31BI
N0P
32GIN
M33
GIN0
P34
SOGI
N035
RINM
36RI
N0P
37AV
DD_3
3_3
38GN
D_2
39BI
N2P
40GI
N2P
41SO
GIN2
42RI
N2P
43CV
BS6
44CV
BS5
45CV
BS4
46CV
BS3
47CV
BS2
48CV
BS1
49VC
OM1
50CV
BS0
51VC
OM0
52AV
DD_3
3_4
53CV
BSOU
T54
GND_
355
SIF0
P56
SIF0M
57VD
DC_1
58AU
L559
AUR5
60AU
VRM
61AU
OUTL2
62AU
OUTR
263
AUOU
TL164
AUOU
TR1
65AUL0
66AUR0
67AUL1
68AUR1
69AUL2
70AUR2
71AUL3
72AUR3
73AUCOM
74AUL4
75AUR4
76GND_4
77AUVRP
78AUVAG
79AVDD_AU
80GND_5
81VDDC_2
82DDCA_CK
83DDCA_DA
84DDCDA_CK
85DDCDA_DA
86DDCDB_CK
87DDCDB_DA
88GPIO20
89VDDP_1
90VDDC_3
91UART2_RX
92UART2_TX
93DDCDC_CK
94RXCCKN
95RXCCKP
96DDCDC_DA
97RXC0N
98RXC0P
99GND_6
100RXC1N
101RXC1P
102AVDD_DM
103RXC2N
104RXC2P
105HOTPLUGC
106USB1_DM
107USB1_DP
108SCK
109SDI
110SDO
111SCZ
112PWM0
113PWM1
114PWM2
115PWM3
116LVA4P
117LVA4M
118LVA3P
119LVA3M
120LVACKP
121LVACKM
122LVA2P
123LVA2M
124LVA1P
125LVA1M
126LVA0P
127LVA0M
128VDDP_2
129
LVB4
P13
0LV
B4M
131
LVB3
P13
2LV
B3M
133
LVBC
KP13
4LV
BCKM
135
LVB2
P13
6LV
B2M
137
LVB1
P13
8LV
B1M
139
LVB0
P14
0LV
B0M
141
AVDD
_LPL
L14
2GN
D_7
143
VDDC
_414
4GP
IO15
0/I2C
_OUT
_MUT
E14
5GP
IO15
1/I2C
_OUT
_SD2
146
GPIO
152/I
2C_O
UT_S
D314
7GN
D_8
148
GPIO
5114
9GP
IO52
150
GPIO
5315
1GP
IO54
152
GPIO
5515
3GP
IO56
154
GPIO
5715
5GP
IO58
156
VDDP
_315
7VD
DC_5
158
B_MD
ATA[4
]15
9B_
MDAT
A[3]
160
GND_
916
1B_
MDAT
A[1]
162
B_MD
ATA[6
]16
3AV
DD_D
DR_1
164
B_MD
ATA[1
1]16
5B_
MDAT
A[12]
166
GND_
1016
7B_
MDAT
A[9]
168
B_MD
ATA[1
4]16
9AV
DD_D
DR_2
170
B_DD
R2_D
QM[1]
171
B_DD
R2_D
QM[0]
172
GND_
1117
3B_
DDR2
_DQS
[0]17
4B_
DDR2
_DQS
B[0]
175
AVDD
_DDR
_317
6VD
DP_4
177
GND_
1217
8B_
DDR2
_DQS
[1]17
9B_
DDR2
_DQS
B[1]
180
AVDD
_DDR
_418
1B_
MDAT
A[15]
182
B_MD
ATA[8
]18
3GN
D_13
184
B_MD
ATA[1
0]18
5B_
MDAT
A[13]
186
AVDD
_DDR
_518
7B_
MDAT
A[7]
188
B_MD
ATA[0
]18
9B_
MDAT
A[2]
190
B_MD
ATA[5
]19
1B_
MCLK
192
B_MC
LKZ
193 GND_14
194 AVDD_MEMPLL
195 MVREF
196 A_ODT
197 A_RASZ
198 A_CASZ
199 A_MADR[0]
200 A_MADR[2]
201 A_MADR[4]
202 GND_15
203 A_MADR[6]
204 A_MADR[8]
205 A_MADR[11]
206 A_WEZ
207 A_BADR[1]
208 A_BADR[0]
209 A_MADR[1]
210 A_MADR[10]
211 AVDD_DDR_6
212 A_MADR[5]
213 A_MADR[9]
214 A_MADR[12]
215 A_MADR[7]
216 A_MADR[3]
217 A_MCLKE
218 VDDC_6
219 I2S_IN_WS/GPIO67
220 I2S_IN_BCK/GPIO68
221 I2S_IN_SD
222 I2S_OUT_MCK
223 I2S_OUT_WS
224 VDDP_5
225 GND_16
226 VDDC_7
227 I2S_OUT_BCK
228 I2S_OUT_SD
229 SPDIFO
230 UART2_RX/I2CM_SDA
231 UART2_TX/I2CM_SCK
232 UART1_RX/GPIO86
233 UART1_TX/GPIO87
234 GND_17
235 GND_18
236 USB0_DM
237 USB0_DP
238 SAR0
239 SAR1
240 SAR2
241 SAR3
242 AVDD_MPLL
243 XOUT
244 XIN
245 GPIO134
246 GPIO135
247 GPIO138
248 GPIO139
249 GPIO140
250 IRIN
251 HSYNC0
252 VSYNC0
253 HSYNC1
254 VSYNC1
255 CEC
256 HWRESET
LG
E3767A
[MS
T99A
88M
L(M
AT
RIX
ON
LY S
D D
IVX
_ N
ON
RM
) ]
IC8
00
-*1
1R
XBCK
N
2R
XBCK
P
3R
XB0N
4R
XB
0P
5H
OTP
LUG
B
6R
XB1N
7R
XB
1P
8A
VD
D_3
3_1
9R
XB2N
10
RX
B2P
11
RXAC
KN
12
RXA
CKP
13
RXA
0N
14
RX
A0P
15
AV
DD
_33_
2
16
RXA
1N
17
RX
A1P
18
GN
D_1
19
RXA
2N
20
RX
A2P
21
HO
TPLU
GA
22
REX
T
23
VCLA
MP
24
RE
FP
25
REF
M
26
BIN
1P
27
SO
GIN
1
28
GIN
1P
29
RIN
1P
30
BIN
M
31
BIN
0P
32
GIN
M
33
GIN
0P
34
SO
GIN
0
35
RIN
M
36
RIN
0P
37
AV
DD
_33_
3
38
GN
D_2
39
BIN
2P
40
GIN
2P
41
SO
GIN
2
42
RIN
2P
43
CVB
S6
44
CVB
S5
45
CVB
S4
46
CVB
S3
47
CVB
S2
48
CVB
S1
49
VCO
M1
50
CVB
S0
51
VCO
M0
52
AV
DD
_33_
4
53
CVBS
OUT
54
GN
D_3
55
SIF
0P
56
SIF
0M
57
VD
DC
_1
58
AU
L5
59
AUR
5
60
AUVR
M
61
AUO
UTL
2
62
AUO
UTR2
63
AUO
UTL
1
64
AUO
UTR1
65 AUL0
66 AUR0
67 AUL1
68 AUR1
69 AUL2
70 AUR2
71 AUL3
72 AUR3
73 AUCOM
74 AUL4
75 AUR4
76 GND_4
77 AUVRP
78 AUVAG
79 AVDD_AU
80 GND_5
81 VDDC_2
82 DDCA_CK
83 DDCA_DA
84 DDCDA_CK
85 DDCDA_DA
86 DDCDB_CK
87 DDCDB_DA
88 GPIO20
89 VDDP_1
90 VDDC_3
91 UART2_RX
92 UART2_TX
93 DDCDC_CK
94 RXCCKN
95 RXCCKP
96 DDCDC_DA
97 RXC0N
98 RXC0P
99 GND_6
100 RXC1N
101 RXC1P
102 AVDD_DM
103 RXC2N
104 RXC2P
105 HOTPLUGC
106 USB1_DM
107 USB1_DP
108 SCK
109 SDI
110 SDO
111 SCZ
112 PWM0
113 PWM1
114 PWM2
115 PWM3
116 LVA4P
117 LVA4M
118 LVA3P
119 LVA3M
120 LVACKP
121 LVACKM
122 LVA2P
123 LVA2M
124 LVA1P
125 LVA1M
126 LVA0P
127 LVA0M
128 VDDP_2
12
9LV
B4P
13
0LV
B4M
13
1LV
B3P
13
2LV
B3M
13
3LV
BCKP
13
4LV
BCKM
13
5LV
B2P
13
6LV
B2M
13
7LV
B1P
13
8LV
B1M
13
9LV
B0P
14
0LV
B0M
14
1AV
DD
_LPL
L1
42
GN
D_7
14
3V
DD
C_4
14
4G
PIO
150/
I2C
_OU
T_M
UTE
14
5G
PIO
151/
I2C
_OU
T_S
D2
14
6G
PIO
152/
I2C
_OU
T_S
D3
14
7G
ND
_81
48
GP
IO51
14
9G
PIO
521
50
GP
IO53
15
1G
PIO
541
52
GP
IO55
15
3G
PIO
561
54
GP
IO57
15
5G
PIO
581
56
VD
DP
_31
57
VD
DC
_51
58
B_M
DA
TA[4
]1
59
B_M
DA
TA[3
]1
60
GN
D_9
16
1B
_MD
ATA
[1]
16
2B
_MD
ATA
[6]
16
3AV
DD
_DD
R_1
16
4B
_MD
ATA
[11]
16
5B
_MD
ATA
[12]
16
6G
ND
_10
16
7B
_MD
ATA
[9]
16
8B
_MD
ATA
[14]
16
9AV
DD
_DD
R_2
17
0B
_DD
R2_
DQ
M[1
]1
71
B_D
DR
2_D
QM
[0]
17
2G
ND
_11
17
3B
_DD
R2_
DQ
S[0
]1
74
B_D
DR
2_D
QS
B[0
]1
75
AVD
D_D
DR
_31
76
VD
DP
_41
77
GN
D_1
21
78
B_D
DR
2_D
QS
[1]
17
9B
_DD
R2_
DQ
SB
[1]
18
0AV
DD
_DD
R_4
18
1B
_MD
ATA
[15]
18
2B
_MD
ATA
[8]
18
3G
ND
_13
18
4B
_MD
ATA
[10]
18
5B
_MD
ATA
[13]
18
6AV
DD
_DD
R_5
18
7B
_MD
ATA
[7]
18
8B
_MD
ATA
[0]
18
9B
_MD
ATA
[2]
19
0B
_MD
ATA
[5]
19
1B_
MCL
K1
92
B_M
CLKZ
193GND_14
194AVDD_MEMPLL
195MVREF
196A_ODT
197A_RASZ
198A_CASZ
199A_MADR[0]
200A_MADR[2]
201A_MADR[4]
202GND_15
203A_MADR[6]
204A_MADR[8]
205A_MADR[11]
206A_WEZ
207A_BADR[1]
208A_BADR[0]
209A_MADR[1]
210A_MADR[10]
211AVDD_DDR_6
212A_MADR[5]
213A_MADR[9]
214A_MADR[12]
215A_MADR[7]
216A_MADR[3]
217A_MCLKE
218VDDC_6
219I2S_IN_WS/GPIO67
220I2S_IN_BCK/GPIO68
221I2S_IN_SD
222I2S_OUT_MCK
223I2S_OUT_WS
224VDDP_5
225GND_16
226VDDC_7
227I2S_OUT_BCK
228I2S_OUT_SD
229SPDIFO
230UART2_RX/I2CM_SDA
231UART2_TX/I2CM_SCK
232UART1_RX/GPIO86
233UART1_TX/GPIO87
234GND_17
235GND_18
236USB0_DM
237USB0_DP
238SAR0
239SAR1
240SAR2
241SAR3
242AVDD_MPLL
243XOUT
244XIN
245GPIO134
246GPIO135
247GPIO138
248GPIO139
249GPIO140
250IRIN
251HSYNC0
252VSYNC0
253HSYNC1
254VSYNC1
255CEC
256HWRESET
3.3
KR
819
DSUB_SDA
LED_R
RT1C
3904
-T11
2Q8
05R
EAD
Y
EB
CDD
C_WP
10K
R828
REA
DY
4.7K
R878
4.7K
R893
1KR8
61
0
R80
37N
ON
19_
22"
0 R894
0 R899
2KR886
150
R885
1KR8
60
10K
R800
0
33K
R800
7N
ON
19_
22"
10K
R855
1KR853
100
R888
33K
R887
20K
R80
36
19
_2
2_
26
"
20pF C817
20pF C816
DDR2_A[2]
DDR2
_D[1]
DDR2_A[6]
GND
DDR2
_D[5]
DDR2_A[10]
DDR2
_D[0]
DDR2
_D[10
]
DDR2_A[12]
DDR2
_D[14
]
DDR2_A[0]
DDR2
_D[6]
DDR2_A[5]
DDR2
_D[3]
DDR2_A[4]
DDR2
_D[4]
DDR2
_D[12
]
DDR2_A[9]
DDR2
_D[11
]
DDR2_A[8]
DDR2
_D[8]
DDR2
_D[7]
DDR2
_D[15
]
DDR2
_D[9]
DDR2_A[3]
DDR2
_D[13
]
DDR2_A[11]
DDR2
_D[2]
DDR2_A[1]
DDR2_A[7]
TXCE
4-TX
CE4+
TXCE
3-TX
CE3+
TXCL
KE-
TXCL
KE+
TXCE
2-TX
CE2+
TXCE
1-TX
CE1+
TXCE
0-TX
CE0+
TXCO
4-TX
CO4+
TXCO
3-TX
CO3+
TXCL
KO-
TXCL
KO+
TXCO
2-TX
CO2+
TXCO
1-TX
CO1+
TXCO
0-TX
CO0+
I2S_O
UT HDM
I_3
EEPR
OM
HDMI_1
[MODE
SELE
CTION
]
HDMI_2
C804
/C80
5/C8
06:C
lose
to IC
a
s c
lose
as
poss
ible
GAIN
X 4
RESE
T
Close to IC
with width trace
Clos
e to
IC a
s cl
ose
as p
ossi
ble
HDCP
EEPR
OM
USB PART
SERI
AL FL
ASH
64M
S-V
IDE
O
4.7K
X4.7K
4.7K
X4.
7K
R801
0
X
R898
Non
Small
FHD
4.7K
X4.
7K
Small
HD
*H/
W OP
TION
4.7K
4.7K
4.7K
100H
Z
4.7K
4.7K
4.7K
Apol
lo
Non
Small
HD
R801
1
X
X
X 4.7K
X
R896 X
Smal
l FHD
(27)
4.7KX
** S
ma
ll H
D :
19
/22
/26
In
ch
** N
on
Sm
all
FH
D :
No
rma
l(non
100
Hz)
FH
D M
odel
THE
S
YMBO
L MAR
K OF
THIS
SCH
EMET
IC D
IAGR
AM IN
CORP
ORAT
ESSP
ECIA
L FEA
TURE
S IM
PORT
ANT F
OR P
ROTE
CTIO
N FR
OM X
-RAD
IATIO
N.FI
LRE
AND
ELEC
TRIC
AL S
HOCK
HAZ
ARDS
, WHE
N SE
RVIC
ING
IF IS
ES
SENT
IAL TH
AT O
NLY M
ANUF
ATUR
ES SP
ECFIE
D PA
RTS B
E USE
D FO
RTH
E CR
ITICA
L COM
PONE
NTS
IN TH
E S
YMBO
L MAR
K OF
THE
SCHE
METIC
.
SCHEMATIC DIAGRAM
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
MSTAR
-
+1.8
V_D
DR
DD
R2_A
[0-1
2]
DD
R2_
BA
0D
DR
2_B
A1
DD
R2_
MC
LKD
DR
2_M
CLK
ZD
DR
2_C
KE
DD
R2_
OD
T
DD
R2_
RA
SZ
DD
R2_
CA
SZ
DD
R2_
WE
Z
DD
R2_
DQ
S0P
DD
R2_
DQ
S1P
DD
R2_
DQ
M0
DD
R2_
DQ
M1
DD
R2_
DQ
S0M
DD
R2_
DQ
S1M
+1.8
V_D
DR
+1.8
V_D
DR
DD
R2_D
[0-1
5]
10
00
pF
C90
5
V_R
EF
56
R90
0
56
R90
1
56
R90
2 56
R90
3
56
R90
4 56
R90
5
0.0
1u
FC
904
0.0
1u
F50
V
C90
0
0.0
1u
FC
901
0.0
1u
FC
902
0.0
1u
FC
903
0.0
1u
FC
906
0.0
1u
FC
907
0.0
1u
FC
908
0.0
1u
FC
909
0.0
1u
FC
910
0.0
1u
FC
911
0.0
1u
FC
912
0.0
1u
FC
913
0.0
1u
FC
914
0.0
1u
FC
915
0.0
1u
FC
916
0.0
1u
FC
917
+1.8
V_D
DR
15
0R
906
REA
DY
THE
SYM
BOL M
ARK
OF TH
IS S
CHEM
ETIC
DIA
GRAM
INCO
RPOR
ATES
SPEC
IAL F
EATU
RES
IMPO
RTAN
T FOR
PRO
TECT
ION
FROM
X-R
ADIA
TION.
FILR
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
POWER
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