#3-Febr. 2004

Production, Process & Test Technology for the Semiconductor Industry

#3-Febr. 2004

• 1949 Founded as Karl Süss GmbH

• 1999 IPO as SUSS MicroTec AG

• 2001 Changed Company name from Karl Süss to SUSS MicroTec

• Production Sites: 5

• Employees 2003: 720

Global Overview

#3-Febr. 2004

Global Presence

•3•0•°

Dresden

MunichSt. JeoireWaterbury

TempeYokohama

Bangkok

Over 30 Sales & Service Centers

Vaihingen

Production/Sales Service Sites Worldwide

Shanghai

SUSS MicroTec HeadquartersGarching /Munich,Germany

Hsinchu

Wokingham

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Exposure

Substrate Bonding

Spin/Spray CoatingDeveloping

Product Offerings

Inspection Wet Processing (Cleaning, Etching, Lift-off)

Device Bonding ( Flip Chip)

Testing

Hyperlinks: Click on each productimage

Nanoimprint Lithography

#3-Febr. 2004

Spin/Spray Coater /Developer

Manual / Basic

Delta SeriesCoat, Develop

Manual & Pre-Production

Respect 600/800Coat, Develop

Automated

AltaSpraySpraycoat

Back to product offerings

Fab Automation (200&300mm)

Automated

Gamma60/80Coat, Develop

ACS200/300 PlusCoat, Develop

Lithograhy Cluster

#3-Febr. 2004

Mask Aligner

Fab Automation (200&300mm)

Manual / Basic

MJB4

Manual & Pre-Production

MA/BA 6/8

Automated

MA150/200e MA200/300Plus

Lithograhy Cluster

MA1006

Back to product offerings

#3-Febr. 2004

Inspection System

Inspection tool for verifying alignment on 2“ to 8" wafers.

DSM8

Back to product offerings

#3-Febr. 2004

Substrate Bonder / Wafer Mounter

Manual & Pre-Production

SOI300CL200 SB8e Substrate Bond Cluster

Waferbonding

Surface ActivationPrealign, Clean, FB Bond, Align,Waferbonding,

Back to product offerings

Cleaning

Pre-Production Semiautomated

Fab Automation (200&300mm)

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Probe Systems

300mm Systems

Shielded environments

Fully automated systems

Customized solutions

Manual lab systems

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#3-Febr. 2004

Device Bonder

Low Cost Device BonderFC6

Automated Device BonderFC150

Production Device BonderFC250

Loading Alignment Placement Bonding Unloading

Component and Substrate in Bonded device out

FL

IP C

HIP

CY

CL

EE

QU

IPM

EN

T

Back to product offerings

Fab Automated Device BonderTRIAD 05AP

#3-Febr. 2004

Our Commitment Worldwide infrastructure for:

Service, applications Training, spare parts

Wide variety of after sales support programs to match production needs

Regional spare parts stocking options

Man-on-site option Applications support & process

development capability Detailed service training and

certification Operator/User training

#3-Febr. 2004

Customer List (extract)