2SJ412
Transcript of 2SJ412
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2SJ412
2006-11-162
Electrical Characteristics (Ta = 25C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Gate leakage current IGSS VGS = 16 V, VDS = 0 V 10 A
Drain cut-off current IDSS VDS = 100 V, VGS = 0 V 100 A
Drain-source breakdown voltage V (BR) DSS ID = 10 mA, VGS = 0 V 100 V
Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 0.8 2.0 V
VGS = 4 V, ID = 6 A 0.25 0.32Gate-source ON resistance RDS (ON)
VGS = 10 V, ID = 6 A 0.15 0.21
Forward transfer admittance |Yfs| VDS = 10 V, ID = 6 A 4.5 7.7 S
Input capacitance Ciss 1100 pF
Reverse transfer capacitance Crss 210 pF
Output capacitance Coss
VDS = 10 V, VGS = 0 V, f = 1 MHz
440 pF
Rise time tr 18
Turn-on time ton 30
Fall time tf 18
Switching time
Turn-off time toffDuty 1%, tw = 10 s
65
ns
Total gate charge
(gate-source plus gate-drain)Qg 48 nC
Gate-source charge Qgs 29 nC
Gate-drain (miller) charge Qgd
VDD80 V, VGS = 10 V, ID = 16 A
19 nC
Source-Drain Rating and Characteristics (Ta = 25C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Continuous drain reverse current
(Note 1)IDR 16 A
Pulse drain reverse current
(Note 1)IDRP 64 A
Forward voltage (diode) VDSF IDR = 16 A, VGS = 0 V 1.7 V
Reverse recovery time trr 160 ns
Reverse recovery charge Qrr
IDR = 16 A, VGS = 0 V
dIDR/dt = 50 A/s 0.5 C
Marking
10 V
0VVGS
RL=6.2
5
VDD50 V
ID = 8AVOUT
50
Lot No.
A line indicateslead (Pb)-free package orlead (Pb)-free finish.
J412 Part No. (or abbreviation code)
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Drain-source voltage VDS (V)
ID VDS
DraincurrentID
(A) 10
00
2
5
2.0
1
3
4
Common source
Tc = 25CPulse test
0.4 1.2 1.6
VGS = 2 V
2.5
34
6
8
0.8
Drain-source voltage VDS (V)
ID VDS
DraincurrentID
(A)
10
00
8
20
104
4
12
16
Common source
Tc = 25C
Pulse test
2 6 8
2.5
3
4.0
6
8
VGS = 2 V
3.5
Gate-source voltage VGS (V)
ID VGS
Draincurrent
ID
(A)
6
00 1 2 3 5 64
2
4
8
10
25
100
Tc = 55C
Common source
VDS = 10 V
Pulse test
Forwardtransferadmittance
|Yfs|
(S)
Drain current ID (A)
|Yfs| ID
Tc = 55C
10025
10.3 2031.0 10
30
10
3
Common source
VDS = 10 V
Pulse test
5
Drain current ID (A)
RDS (ON) ID
Drain-sourceonresistance
RDS(ON)()
0.030.1 201.00.3 10
Common source
Tc = 25C
Pulse test
2.0
1.0
0.1
0.3
3
VGS = 4 V
10
0.05
0.5
Drain-sourcevoltage
VDS
(V)
Gate-source voltage VGS (V)
VDS VGS
00
1.6
0.8
3.2
2.4
4 8 12 16 20
ID = 8 A
4
2
Common source
Tc = 25C
Pulse test
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Gatethresholdvoltage
Vth
(V)
Case temperature Tc (C)
Vth Tc
4
080 1608040 40
1
3
0 120
Common source
VDS = 10 V
ID = 1 mA
Pulse test
2
Gate-sourcevoltage
VGS
(V)
Total gate charge Qg (nC)
Dynamic Input/Output Characteristic
Drain-sourcevoltag
e
VDS
(V)
00
40
100
10040
20
60
80
20 60 80
VDS
VGS
20 V
VDD = 80 V
40 V
0
8
20
4
12
16
Common sourceID = 16 ATc = 25CPulse test
Case temperature Tc (C)
RDS (ON) Tc
Drain-sourceonresistance
RDS(ON)
()
Drain-source voltage VDS
(V)
Capacitance VDS
Capacitance
C
(pF)
Drain-source voltage VDS (V)
IDR VDS
Drainreversecurrent
IDR
(A)
0.30 1.00.80.2
Common source
Tc = 25C
Pulse test
0, 11
VGS = 10 V
0.6
1.0
3
10
30
0.4
23
50.5
5
Drainpowerdissipation
PD
(W)
Case temperature Tc (C)
PD Tc
00 40 80 120 160
20
40
60
80
8
080 1604040 80 120
Common source
Pulse test ID = 8 A
2, 4
2
4
VGS = 4 V
VGS = 10 V
0
0.1
0.2
0.3
0.5
0.4
300.1 100100.3
Crss
3
100
300
3000
1
Coss
Ciss
30
Common source
VGS = 0 V
f = 1 MHz
Tc = 25C
1000
5000
50
500
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TEST CIRCUIT WAVE FORM
IAR
BVDSS
VDD VDS
RG = 25
VDD = 25 V, L = 1.84 mH
=
VB
BLI
2
1
DDVDSS
VDSS2
AS
15V
15V
Avalancheenergy
EAS
(mJ)
Channel temperature Tch (C)
EAS Tch
025
200
500
15075
100
300
400
50 100 125
Drain-source voltage VDS (V)
Safe Operating Area
Draincurrent
ID
(A)
0.11 3 10 30 100 300
0.3
0.5
1
3
5
10
30
50
100
300
0.3
IC max (pulsed)*
*: Single nonrepetitive pulse
Tc = 25C
Curves must be derated
linearly with increase in
temperature.
ID max (continuous)
VDSS max
1 ms*
10 ms*
100 s*
DC operation
Tc = 25C
rth tw
Pulse width tw (s)
Normalizedtransientthermalimpedance
rth(t)/Rth
(ch-c)
100 m10 m0.01
1
1 10
0.3
3
0.03
0.5
0.05
0.1
10 100 1 m
T
PDM
t
Duty = t/T
Rth (ch-c) = 2.08C/W
Duty = 0.5
0.02
0.2
0.1
0.05
Single pulse0.01
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