2SJ412

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    2SJ412

    2006-11-162

    Electrical Characteristics (Ta = 25C)

    Characteristics Symbol Test Condition Min Typ. Max Unit

    Gate leakage current IGSS VGS = 16 V, VDS = 0 V 10 A

    Drain cut-off current IDSS VDS = 100 V, VGS = 0 V 100 A

    Drain-source breakdown voltage V (BR) DSS ID = 10 mA, VGS = 0 V 100 V

    Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 0.8 2.0 V

    VGS = 4 V, ID = 6 A 0.25 0.32Gate-source ON resistance RDS (ON)

    VGS = 10 V, ID = 6 A 0.15 0.21

    Forward transfer admittance |Yfs| VDS = 10 V, ID = 6 A 4.5 7.7 S

    Input capacitance Ciss 1100 pF

    Reverse transfer capacitance Crss 210 pF

    Output capacitance Coss

    VDS = 10 V, VGS = 0 V, f = 1 MHz

    440 pF

    Rise time tr 18

    Turn-on time ton 30

    Fall time tf 18

    Switching time

    Turn-off time toffDuty 1%, tw = 10 s

    65

    ns

    Total gate charge

    (gate-source plus gate-drain)Qg 48 nC

    Gate-source charge Qgs 29 nC

    Gate-drain (miller) charge Qgd

    VDD80 V, VGS = 10 V, ID = 16 A

    19 nC

    Source-Drain Rating and Characteristics (Ta = 25C)

    Characteristics Symbol Test Condition Min Typ. Max Unit

    Continuous drain reverse current

    (Note 1)IDR 16 A

    Pulse drain reverse current

    (Note 1)IDRP 64 A

    Forward voltage (diode) VDSF IDR = 16 A, VGS = 0 V 1.7 V

    Reverse recovery time trr 160 ns

    Reverse recovery charge Qrr

    IDR = 16 A, VGS = 0 V

    dIDR/dt = 50 A/s 0.5 C

    Marking

    10 V

    0VVGS

    RL=6.2

    5

    VDD50 V

    ID = 8AVOUT

    50

    Lot No.

    A line indicateslead (Pb)-free package orlead (Pb)-free finish.

    J412 Part No. (or abbreviation code)

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    Drain-source voltage VDS (V)

    ID VDS

    DraincurrentID

    (A) 10

    00

    2

    5

    2.0

    1

    3

    4

    Common source

    Tc = 25CPulse test

    0.4 1.2 1.6

    VGS = 2 V

    2.5

    34

    6

    8

    0.8

    Drain-source voltage VDS (V)

    ID VDS

    DraincurrentID

    (A)

    10

    00

    8

    20

    104

    4

    12

    16

    Common source

    Tc = 25C

    Pulse test

    2 6 8

    2.5

    3

    4.0

    6

    8

    VGS = 2 V

    3.5

    Gate-source voltage VGS (V)

    ID VGS

    Draincurrent

    ID

    (A)

    6

    00 1 2 3 5 64

    2

    4

    8

    10

    25

    100

    Tc = 55C

    Common source

    VDS = 10 V

    Pulse test

    Forwardtransferadmittance

    |Yfs|

    (S)

    Drain current ID (A)

    |Yfs| ID

    Tc = 55C

    10025

    10.3 2031.0 10

    30

    10

    3

    Common source

    VDS = 10 V

    Pulse test

    5

    Drain current ID (A)

    RDS (ON) ID

    Drain-sourceonresistance

    RDS(ON)()

    0.030.1 201.00.3 10

    Common source

    Tc = 25C

    Pulse test

    2.0

    1.0

    0.1

    0.3

    3

    VGS = 4 V

    10

    0.05

    0.5

    Drain-sourcevoltage

    VDS

    (V)

    Gate-source voltage VGS (V)

    VDS VGS

    00

    1.6

    0.8

    3.2

    2.4

    4 8 12 16 20

    ID = 8 A

    4

    2

    Common source

    Tc = 25C

    Pulse test

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    2SJ412

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    Gatethresholdvoltage

    Vth

    (V)

    Case temperature Tc (C)

    Vth Tc

    4

    080 1608040 40

    1

    3

    0 120

    Common source

    VDS = 10 V

    ID = 1 mA

    Pulse test

    2

    Gate-sourcevoltage

    VGS

    (V)

    Total gate charge Qg (nC)

    Dynamic Input/Output Characteristic

    Drain-sourcevoltag

    e

    VDS

    (V)

    00

    40

    100

    10040

    20

    60

    80

    20 60 80

    VDS

    VGS

    20 V

    VDD = 80 V

    40 V

    0

    8

    20

    4

    12

    16

    Common sourceID = 16 ATc = 25CPulse test

    Case temperature Tc (C)

    RDS (ON) Tc

    Drain-sourceonresistance

    RDS(ON)

    ()

    Drain-source voltage VDS

    (V)

    Capacitance VDS

    Capacitance

    C

    (pF)

    Drain-source voltage VDS (V)

    IDR VDS

    Drainreversecurrent

    IDR

    (A)

    0.30 1.00.80.2

    Common source

    Tc = 25C

    Pulse test

    0, 11

    VGS = 10 V

    0.6

    1.0

    3

    10

    30

    0.4

    23

    50.5

    5

    Drainpowerdissipation

    PD

    (W)

    Case temperature Tc (C)

    PD Tc

    00 40 80 120 160

    20

    40

    60

    80

    8

    080 1604040 80 120

    Common source

    Pulse test ID = 8 A

    2, 4

    2

    4

    VGS = 4 V

    VGS = 10 V

    0

    0.1

    0.2

    0.3

    0.5

    0.4

    300.1 100100.3

    Crss

    3

    100

    300

    3000

    1

    Coss

    Ciss

    30

    Common source

    VGS = 0 V

    f = 1 MHz

    Tc = 25C

    1000

    5000

    50

    500

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    TEST CIRCUIT WAVE FORM

    IAR

    BVDSS

    VDD VDS

    RG = 25

    VDD = 25 V, L = 1.84 mH

    =

    VB

    BLI

    2

    1

    DDVDSS

    VDSS2

    AS

    15V

    15V

    Avalancheenergy

    EAS

    (mJ)

    Channel temperature Tch (C)

    EAS Tch

    025

    200

    500

    15075

    100

    300

    400

    50 100 125

    Drain-source voltage VDS (V)

    Safe Operating Area

    Draincurrent

    ID

    (A)

    0.11 3 10 30 100 300

    0.3

    0.5

    1

    3

    5

    10

    30

    50

    100

    300

    0.3

    IC max (pulsed)*

    *: Single nonrepetitive pulse

    Tc = 25C

    Curves must be derated

    linearly with increase in

    temperature.

    ID max (continuous)

    VDSS max

    1 ms*

    10 ms*

    100 s*

    DC operation

    Tc = 25C

    rth tw

    Pulse width tw (s)

    Normalizedtransientthermalimpedance

    rth(t)/Rth

    (ch-c)

    100 m10 m0.01

    1

    1 10

    0.3

    3

    0.03

    0.5

    0.05

    0.1

    10 100 1 m

    T

    PDM

    t

    Duty = t/T

    Rth (ch-c) = 2.08C/W

    Duty = 0.5

    0.02

    0.2

    0.1

    0.05

    Single pulse0.01

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