2015 International Conference on ElectronicV Packaging and...

IEEE Catalog Number: ISBN:

CFP1589U-POD 978-1-4799-1953-6

2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC 2015)

Kyoto, Japan 14-17 April 2015

TABLE of CONTENTS Global Business Council 10:30-12:40 Tuesday, April 14

Introduction Yasumitsu Orii, IBM Japan -

Innovations across Technology & Business - Heterogeneous Integration & SiP

Integration Schemes for Wearable and IoT Applications

William T. Chen, ASE Group - Thomas Uhrmann, EVGroup -

Latest CMOS Image Sensor Technology Tetsuo Nomoto, Sony

Integrated Sensor Systems and Its Potential for Intelligence

Naotsugu Ueda, Omron Corporation

13:50-15:50 Tuesday, April 14

Intelligent Edge Device Technologies in Medicine Maki Sugimoto, Kobe University -

Future Drive Assist System Using Stereo Vision Keiji Saneyoshi, Tokyo Institute of Technology

Real-World Applications of Wearable Sensing Tsutomu Terada, Kobe University -

IAAC Special Session 16:05-17:50 Tuesday, April 14

Japan Jisso Technology and Business Trend in Japan

USA Approaches for RF Performance Optimization in Wafer Scale 3-D Packaging

Yasumitsu Orii, IBM Japan - Susan C. Trulli, Raytheon -

Europe Status and Trends of Microelectronics and Packaging in Europe

Jens Müller, Ilmenau University of - Technology

China Advanced Packaging and New Industrial Climate in China

Korea 2.5D TSV Interposer - Technology goes into the Integrated Passive Devices

Malaysia Technical Trends & Business Issues of Electronic Packaging in Malaysia

Taiwan 3D Packaging: Present and Future

Zhu Wenhui, Central South University -

Gusung Kim, Kangnam University -

Shaw Fong Wong, Intel Technology -

Shen-Li Fu, I-Shou University

9:45-11:00 Wednesday, April 15WA1: 3DIC Packaging-1

WA1-1 <Session Invited>

WA1-2

WA1-3

Scaling Down of Wireless Sensor Nodes for Ubiquitous Applications

3D IC Process Development for Enabling Chip-on-Chip and Chip on Wafer Multi-Stacking at Assembly

Reliability Studies on Micro- joints for 3D Stacked Chip

Jian Lu, Serizawa Kouichi, Lan Zhang, Hironao Okada, Toshihiro Itoh, Ryutaro Maeda, National Institute of Advanced Industrial Science and Technology / Japan

Robert Daily1, Giovanni Capuz1, Teng Wang1, Pieter Bex1, Herbert Struyf1, Eric Sleeckx1, Caroline Demeurisse1, Alastair Attard2, Walter Eberharter2, Hannes Klingler2, 1Imec / Belgium, 2Besi Austria / Austria

Shinji Tadaki, Toshiya Akamatu, Kazutoshi Yamazaki, Seiki Sakuyama, Fujitsu / Japan

-

56

61

WA2: 3DIC Packaging-2 11:15-12:30 Wednesday, April 15

WA2-1

WA2-2

WA2-3

Combined Surface Activated Bonding (SAB) Approach for SiO2 Direct Wafer Bonding in Vacuum

Advantage of Direct Etching Method and Process Integration for TSV Reliability

Evaluation of Plasma Process Damage during TSV Formation and Damage Reduction Method

Ran He1, Masahisa Fujino1, Akira Yamauchi2, Tadatomo Suga1, 1The University of Tokyo, 2Bondtech / Japan

Toshiyuki Sakuishi, Takahiro Murayama, Yasuhiro Morikawa, ULVAC / Japan

Takatoshi Igarashi1, Kazuaki Kojima1, Kazuya Matsumoto1, Noriyuki Fujimori1,2, Tsutomu Nakamura1, 1Olympus, 2Shinshu University / Japan

65

69

74

Keynote Lectures 14:10-15:10 Wednesday, April 15

Cognitive Computing, a Realization of Smart Machines

Advanced Packaging Technologies to Enable System Scaling in Data Centers

Molecular Diagnostics of Cancer Using Next- Generation Sequencing

Norishige Morimoto, IBM Japan -

16:00-17:00 Wednesday, April 15

Jie Xue, Cisco Systems -

17:00-18:00 Wednesday, April 15

Seishi Ogawa, Kyoto University -

9:45-11:00 Wednesday, April 15WB1: Advanced Packaging-1

WB1-1

WB1-2

WB1-3

A Study of Chip-last Embeded FCCSP

Comb-Drive XYZ- Microstage Based on Assembling Technology for Low Temperature Measurement Systems

The Room Temperature Bonding Method of Al2O3 Barrier Layers Deposited Using Atomic Layer Deposition

Shin-Hua Chao1,2, Chih-Ping Hung1, Yishao Lai1, Colin Liu1, Emma Hsieh1, Ding-Bang Luh2, 1ASE Group, 2National Cheng-Kung University / Taiwan

Gaopeng Xue, Masaya Toda, Takahito Ono, Tohoku University / Japan

Takashi Matsumae1, Masahisa Fujino1, 2 2 Kai Zhang , Helmut Baumgart ,

Tadatomo Suga1, 1The University of Tokyo / Japan, 2Old Dominion University / USA

78

83

89

WB2: Interconnection-1 11:15-12:30 Wednesday, April 15

WB2-1

WB2-2

WB2-3

Effect of Silver Alloy Bonding Wire Properties on Bond Strengths and Reliability

Ag Alloy Wire Bonding under Electromigration Test

3D Analysis of Flip Chip Interconnection using FIB-SEM Slice and View

Jun Cao1,2, JunLing Fan1, ZhiQiang Liu1, YueMin Zhang1, 1HeNanPloytechnicUniverstiy, 2HeNan YOUK Electronic Material, 3Jiaozuo University / China

Tzu-Yu Hsu1, Jing-Yao Chang2, Fang- Jun Leu2, Hsiao-Min Chang3, Fan- Yi Ouyang1, 1National Tsing Hua University, 2Industrial Technology Research Institute, 3Win-House Electronic / Taiwan

Mototaka Ito, Jun Kato, Toshihisa Nonaka, Toray Research Center / Japan

93

98

102

WC1: Medical Devices-1 9:45-11:00 Wednesday, April 15

WC1-1 <Session Invited>

WC1-2 <Session Invited>

WC1-3

Optoelectronic Devices for Biomedical Applications

Cavitas Sensors for Bio/Chemical Monitoring: No Wearable, No Implantable Approach

Development of Nanocavity Sealing Process for MEMS Optical Interferometric Biosensor

Jun Ohta, Nara Institute of Science and Technology / Japan

Kohji Mitsubayashi, Tokyo Medical and Dental University / Japan

Kazuhiro Takahashi1,2, Yoshihiro Masuya1, Ryo Ozawa1, Makoto Ishida1, Kazuaki Sawada1,2, 1Toyohashi University of Technology, 2Japan Science and Technology Agency / Japan

-

120

11:15-12:30 Wednesday, April 15WC2: Medical Devices-2

WC2-1

WC2-2

Effect of User’s Posture and Device’s Position on Human Body Communication with Multiple Devices

Efficacy Evaluation of Candle-Like Micro-Needle Electrode for EEG Measurement on Hairy Scalp

Dairoku Muramatsu1, Fukuro Koshiji2, Kohji Koshiji2, Ken Sasaki1, 1The University of Tokyo, 2Tokyo University of Science / Japan

Miyako Arai1, Norihisa Miki1,2, 1Keio University, 2JST RPESTO / Japan

124

128

WD1: Thermal Management-1 9:45-11:00 Wednesday, April 15

WD1-1

WD1-2

WD1-3

Compact Thermal Model for Microprocessor Package Based on One-Dimensional Thermal Network with Average Temperature Nodes

Thermal Properties of Power Si MOSFET by Considering Electron- Phonon Scattering using Monte Carlo Simulation

Effect of Current Heating on Accurate Measurements of AC Shunt Resistors

Koji Nishi1, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Masaru Ishizuka2, 1AMD Japan, 2Toyama Prefectural University / Japan

Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, Masaru Ishizuka, Toyama Prefectural University / Japan

Seitaro Kon, Tatsuji Yamada, National Institute of Advanced Industrial Science and Technology / Japan

132

138

144

WD2: Biomimetics 11:15-12:30 Wednesday, April 15

WD2-1

WD2-2

WD2-3

The Influence of Surface Wettability on the Ladybird BeetlesAttachment to Solid Surfaces

Biomimetic Self-Resilience Materials Design for Tactile Devices

Self-Linking Mechanism of Micro Solder Particles Dispersion in Liquidus Polymer

Mari Nakamoto1,2, Chihiro Urata3, Atsushi Hozumi3, Tadatomo Suga2, Naoe Hosoda1,2, 1National Institute for Materials Science, 2The University of Tokyo, 3National Institute of Advanced Industrial Science and Technology / Japan

Kiyokazu Yasuda, Osaka University / Japan

Kiyokazu Yasuda, Mizuki Ishida, Osaka University / Japan

149

153

157

9:45-11:00 Wednesday, April 15WE1: Substrates and Interposers-1

WE1-1

WE1-2

WE1-3

HAST Failure Investigation on Ultra-High Density Lines for 2.1D Packages

Ultra-thin Line Embedded Substrate Manufacturing for 2.1D/2.5D SiP Application

Fine Trace Substrate with 2μm Fine Line for Advanced Package

Hirokazu Noma, Keishi Okamoto, Kazushige Toriyama, Hiroyuki Mori, IBM Japan / Japan

Yu-Hua Chen, Shyh-Lian Cheng, Dyi-Chung Hu, Tzvy-Jang Tseng, Unimicron Technology / Taiwan

Dyi-Chung Hu, Puru Lin, Yu Hua Chen, Unimicron Technology / Taiwan

161

166

170

WE2: Substrates and Interposers-2 11:15-12:30 Wednesday, April 15

WE2-1

WE2-2

WE2-3

Through Cavity Core Device- Embedded Substrate for Ultra- Fine-Pitch Si Bare Chips - fabrication feasibility and residual stress evaluation

Evaluation of Through-Silicon -Via Process using Scanning Laser Beam Induced Current (SLBIC) System

Mechanical Design and Analysis of Direct Plated Copper Film on AlN Substrates for Thermal Reliability in High Power Module Applications

Young-Gun Han1, Osamu Horiuchi1, Shigehiro Hayashi2, Kanta Nogita2, Yoshihisa Katoh1, Hajime Tomokage1,2, 1Fukuoka University 2Research Center for Three Dimensional Semiconductors / Japan

Woon Choi, Takahiro Ishimoto, Hajime Tomokage, Fukuoka University / Japan

C. H. Lin1, P. S. Huang1, M. Y. Tsai1, C. T. Wu2, S. C. Hu2, 1Chang Gung University, 2Chung-Shan Institute of Science and Technology / Taiwan

174

180

185

9:30-10:15 Thursday, April 16Keynote Lectures

Nanotechnology in Electronics Packaging, Interconnect, and Assembly: Becomes a Reality?

Charles E. Bauer, TechLead - Corporation

TA1: Technology Challenges for “Killer Devices” in the IoT World-1 10:25-12:30 Thursday, April 16

TA1-1 <Session Invited>





Introduction and Perspective on Future Collaboration of Chip/ Package/System Research Societies

Quantum Computation and Quantum Annealing : Recent Progress and Future Trends

Human Interface Devices for Effective Cognitive Computing Systems

More Moore Landscape for IoT World - ITRS2.0 Requirement

CMOS -MEMS -New Frontier of Multilevel Interconnect Technology-

Yasmitsu Orii, IBM Japan / Japan

Shiro Kawabata, National Institute of Advanced Industrial Science and Technology / Japan

Takeo Yasuda, IBM Japan / Japan

Yuzo Fukuzaki1, Mustafa Badaroglu2, 1Sony, 2Qualcomm Technologies / Japan

Katsuyuki Machida1,2,4 , Toshifumi Konishi1, Daisuke Yamane2,4, Hiroshi Toshiyoshi3,4, Kazuya Masu2,4, 1NTT Advanced Technology, 2Tokyo Institute of Technology, 3The University of Tokyo, 4CREST, JST / Japan

-

-

-

201

TA2: Technology Challenges of “Killer Devices” in the IoT World-2 13:40-15:45 Thursday, April 16



TA2-3


TA2-5

3D Integration Technology and Its Impact on Implantable Biomedical Integrated Devices

Interfacial Reactions wity Low Solder Volume for 3D IC Packaging

Impact of Through-Silicon Via Technology on Energy Consumption of 3D-Integrated Solid-State Drive Systems

Excimer Laser Stepper for Next Generation 2.5D Organic Interposer

Panel Discussion

Tetsu Tanaka, Tohoku University / Japan

C Robert Kao, National Taiwan University / Taiwan

Takahiro Onagi, Chao Sun, Ken Takeuchi, Chuo University / Japan

Habib Hichri, SUSS MicroTec Photonic System / USA

Panel discussion will be held to discuss future collaboration of chip/ package/system research societies.

-

215

-

-

16:25-18:30 Thursday, April 16TA3: iNEMI Session



TA3-3

TA3-4

Technology Roadmap Overviews and Future Direction through Technology Gaps

MEMS and Sensors for Wearable Electronics: Packaging and Assembly Considerations

Assessment of Reliability Standards for Implantable Medical Devices

Recent Trend of Package WarpageCharacteristic

Bill Bader1, Chuck Richardson1, Masahiro Tsuriya2, 1International Electronics Manufacturing Initiative / USA, 2International Electronics Manufacturing Initiative / Japan

E. Jan Vardaman, TechSearch International / USA

John C. McNulty1, Kevin Knadle2, Hans-Peter Klein3, Torsten Harnisch4, Enrico Dona5, Werner Meskens6, Maaike Op de Beeck7, Jason Coder8, 1Exponent, 2i3 Electronics / USA, 3Dyconex / Switzerland, 4Biotronik / Germany, 5MED EL / Austria, 6Cochlear, 7imec / Belgium, 8National Institute of Standards and Technology / USA

Wei Keat Loh1, Ron Kulterman2, Tim Purdie3, Haley Fu4, Masahiro Tsuriya4, 1Intel / Malaysia, 2Flextronics, 3Akrometrix / USA, 4International Electronics Manufacturing Initiative / China, Japan

219

233

TB1: Material and Process-1 10:25-12:30 Thursday, April 16

TB1-1

TB1-2

TB1-3

TB1-4

TB1-5

Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding at Low Temperature and Atmospheric Pressure

Development of a Curable Conductive Copper Paste in Air

The Application of Cu-Ag Submicron Composite Particles in Microelectronic Bonding

Conduction Path Development in Electrically Conductive Adhesives Composed of an Epoxy-based Binder

Thermal Conductivity of Epoxy Composites with Controlled High Loading of Ceramic Particles

Akitsu Shigetou1, Jun Mizuno2, Shuichi Shoji2, 1National Institute for Materials Science, 2Waseda University / Japan

Masashi Kajita, Tomoyuki Takahashi, Toshiyuki Sato, Namics / Japan

Ching-Huan Hsiao1, Jia-Shin Wu1, Chi-Hang Tsai2 , Shih-Yun Chen2, Jenn-Ming Song1, 1National Chung Hsing University, 2National Taiwan University of Science and Technology / Taiwan

Yoshiaki Sakaniwa, Masaki Iida, Yasunori Tada, Masahiro Inoue, Gunma University / Japan

Ying-Nan Chan, Shu-Chen Huang, Hsun-Tien Li, Industrial Technology Research Institute / Taiwan

239

243

248

252

258

13:40-15:45 Thursday, April 16TB2: Korea Session-1

TB2-1 <Session Invited>





Interfacial Adhesion and Reliability Issues in Printed Ag Film on Polyimide Systems

Mechanical Reliability of AdvancedThin Films

Maskless Screen Printing Technology using Solder Bump Maker (SBM) for Flexible Electronics

Prognostics of Solder Joint Reliability Based on Impedance Analysis and Particle Filtering

Effects of Complexing Reagents on Electrotroless Nickel-Iron Alloy Plating for Diffusion Barrier of UBM

Young-Bae Park, Byung-Hyun Bae, Hyeon-Chul Lee, Min-Su Jeong, Kirak Son, Gyu-Tae Park, Andong National University / Korea

Taek-Soo Kim, KAIST / Korea

Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom, Jin Ho Lee, ETRI / Korea

Daeil Kwon, Ulsan National Institute of Science and Technology / Korea

Ja-Kyung Koo, Jae-Ho Lee, Hongik University / Korea

300

TB3: Korea Session-2 16:25-18:30 Thursday, April 16






Analyses on PBGA Reliability under Vibrations

Surface Design using Functional Gradient Nanostructure

Preparation and Characterization of Organic Light Emitting Devices Using Hybrid Encapsulation Materials - properties of OLED using hybrid encapuslaton materials

Interconnection Process for Stretchable Electronic Packaging of Wearable Devices

Foldable Metal-grid Transparent Electrode using Electrohydrodynamic (EHD) Jet Printing

Yeong K. Kim, Inha University / Korea

Sohee Kim, Doo-In Kim, Myung Yung Jeong, Pusan National University / Korea

Ho Jung Chang, Byung Min Park, Sang Hee Lee, Yang Geun Jo, Ji Mook Kim, Jae Jin Jung, Jaeho Pyee, Dankook University / Korea

Jung-Yeol Choi, Dae-Woong Park, Tae Sung Oh, Hongik University / Korea

Kyoungtae Eun1, Young Seok Ahn1, Junghoon Lee1, Min- Woo Chon2, Doyoung Byun3, Sung-Hoon Choa1, 1Seoul National University of Science and Technology, 2Kookmin University, 3SungKyunKwan University / Korea

314

-

10:25-12:30 Thursday, April 16TC1: Printed Electronics-1

TC1-1 <Session Invited> 50min.


TC1-3 <Session Invited>

Nano-Rheology Printing: a Printing Method for Oxide Devices with High Precision

Sub-micron Printing Technology using Seamless Roller Mold (SRM)

Ultrathin and Ultraflexible Electronics Will Hack Our Way Beyond Wearable

Tatsuya Shimoda, Japan Advanced Institute of Science and Technology / Japan

Masayuki Abe, Asahi Kasei / Japan

Ichiro Amimori1,2, Masao Nakajima1,2, Yuta Aikawa1,2, Naoji Matsuhisa1,2, Hanbit Jin1,2, Hiroaki Sakamoto1,2, Sunghoon Lee1,2, Sungwon Lee1,2, Tomoyuki Yokota1,2, Tsuyoshi Sekitani2,3, Hiroshi Onodera1, Takao Someya1,2, 1The University of Tokyo, 2JST ERATO, 3Osaka University / Japan

-

TC2: Printed Electronics-2 13:40-15:45 Thursday, April 16





Future Scaling of Electronics through Printing

The 3D Inkjet Printing System for the 3D Micro Circuit Module Manufacturing

Design Software for 3D Micro Circuit Module Manufacturing by 3D Inkjet Printing System

Automatic Dispensing System Capable of Line-width 5µm

Steven E, Ready, Gregory Whiting, Ng Tse Nga, Veres Janos, Palo Alto Research Center / USA

Masatoshi Fujita, FUJI Machine MFG. / Japan

Koji Yamamoto, YDC / Japan

Yoshiyuki Kato, Masanori Maruno, NIHON DENSHI SEIKI / Japan

-

TC3: Printed Electronics-3 16:25-18:30 Thursday, April 16


TC3-2

TC3-3

Materials, Processes and Designs for Flexible Electronics

Room Temperature Direct Bonding and Debonding of Polyimide Film on Glass Wafer using Si Intermediate Layer

Fine-pitch Copper Wiring Formed in a Platingless Process Using Ultra-fine Inkjet and Oxygen Pump

Manabu Yoshdia, National Institute of Advanced Industrial Science and Technology / Japan

Kai Takeuchi, Masahisa Fujino, Tadatomo Suga, Mari Koizumi, Takao Someya, the University of Tokyo / Japan

Naoki Shirakawa1, Kouichi Kajihara2, Yukiyasu Kashiwagi3, Kazuhiro Murata4, 1National Institute of Advanced Industrial Science and Technology, 2IOX, 3Osaka Municipal Technical Research Institute, 4SIJTechnology / Japan

369

373

10:25-12:30 Thursday, April 16TD1: Thermal Management-2

TD1-1

TD1-2

TD1-3

TD1-4

TD1-5

Experimental Study for Method to Measure Terminal Part Temperature of Micro- Electronic Devices Using Infrared Thermograph and Image Processing

Measurement of Surface Roughness Dependence of Thermal Contact Resistance under Low Pressure Condition

Mission Profile Driven Component Design for Adjusting Product Lifetime on System Level

Variations of Temperature Sensitivity Measurements of Several Packages under Different Environments

Thermal Imaging Characterization for High Frequency and High Power Devices

Koichi Hirasawa1, Yoshinori Aruga1, Yasushi Ohhashi1, Toshio Tomimura2, 1KOA, 2KumamotoUniversity / Japan

Kuniya Azuma, Tomoyuki Hatakeyama, Shinji Nakagawa, Toyama Prefectural University / Japan

Attila Szel1, Zoltan Sarkany1, Marton Bein1, Robin Bornoff2, Andras Vass- Varnai1, Marta Rencz1, 1Mentor Graphics / Hungary, 2Mentor Graphics / UK

Tomoaki Hara, Wasanthamala Badalawa, Yafei Luo, Mentor Graphics Japan / Japan

Kazuaki Yazawa1,2, Dustin Kendig1, Ali Shakouri2, 1Microsanj, 2Purdue University / USA

377

381

385

390

395

TD2: N-MEMS-2 13:40-15:45 Thursday, April 16

TD2-1

TD2-2

TD2-3 <Session Invited>

TD2-4

TD2-5

Development of a Cylindrical Tactile Sensor with a Tooth-Like Mechanism

Pen-shaped Pressure Sensor for Endoscopic Palpation

Piezoelectric Touch Sensors Based on Soft Packaged PZT- MEMS Devices

Miniature Stiffness Tunable Device with Magnetorheological Fluid

Development of Mountable Pulse- Type Hardware Neuron Model Integrated Circuit on MEMS Microrobot

Nurul Adni Ahmad Ridzuan1, Norihisa Miki1,2, 1Keio University, 2JST PRESTO / Japan

Takuro Nakadegawa1, Hiroki Ishizuka1, Norihisa Miki1,2, 1Keio University, 2JST PRESTO / Japan

Takeshi Kobayashi, Seiichi Takamatsu, Yasuhiro Suzuki, Natsumi Makimoto, Toshihiro Itoh, National Institute of Advanced Industrial Science and Technology / Japan

Hiroki Ishizuka, Takuro Nakadegawa, Norihisa Miki, Keio University / Japan

Minami Takato, Yuka Naito, Kazuaki Maezumi, Yuki Ishihara, Yuki Okane, Hirozumi Oku, Masaki Tatani, Ken Saito, Fumio Uchikoba, Nihon University / Japan

401

405

-

409

413

16:25-18:30 Thursday, April 16TD3: N-MEMS-3

TD3-1

TD3-2

TD3-3

TD3-4

TD3-5

Lifetime Prolongation of Release Agent on Antireflection Structure Molds by Means of Partial-filling Ultraviolet Nanoimprint Lithography

Transfer Properties of Moth-eye Structure Film by RTR UV-NIL

Light Trapping of Organic Solar Cells by Nanotextured Surfaces

Application of Gold Nanoparticle Self-Assemblies to Unclonable Anti- Counterfeiting Technology

Fabrication and Evaluation of Dihedral Corner Reflector Array for Floating Image Manufactured by Synchrotron Radiation

Nurhafizah Binti Abu Talip[a]Yusof1,2, Tatsuya Hayashi1, Jun Taniguchi1, Shin Hiwasa3, 1Tokyo University of Science / Japan, 2Universiti Malaysia Pahang / Malaysia, 3Autex / Japan

Tomoya Uchida1, Masatoshi Moro1, Shin Hiwasa2, Jun Taniguchi1, 1Tokyo University of Science, 2Autex / Japan

Shigeru Kubota1, Kensaku Kanomata1, Bashir Ahmmad1, Jun Mizuno2, Fumihiko Hirose1, 1Yamagata University, 2Waseda University / Japan

Takao Fukuoka1, Akinobu Yamaguchi1, Ryohei Hara1, Takeshi Matsumoto1, Yuichi Utsumi1, Yasushige Mori2, 1University of Hyogo, 2Doshisha University / Japan

Tomohisa Yamane1, Satoshi Maekawa2, Yuichi Utsumi1, Ikuo Okada3, Akinobu Yamaguchi1, 1University of Hyogo, 2Parity Innovations, 3Nagoya University / Japan

418

422

428

432

436

TE1: N-MEMS-1 10:25-12:30 Thursday, April 16

TE1-1 <Session Invited>

TE1-2

TE1-3

TE1-4 <Session Invited>

TE1-5

Low/Room Temperature Wafer Bonding Technologies for Three- Dimensional Integration

Fabrication of a Hermetic Sealing Device Using Low Temperature Intrinsic-Silicon/Glass Bonding

Influence of Air Exposure Time on Bonding Strength in Au-Au Surface Activated Wafer Bonding

Room-Temperature Bonding for Hermetic Sealing Using Electroplated Au Seal Rings with Ultra-Smooth Surface

New MEMS Sensor Process by TSV Technology for Smaller Packaging

Masaya Kawano, EV Group Japan / Japan

Kazuya Nomura1, Jun Mizuno1, Akiko Okada1, Shuichi Shoji1, Toshinori Ogashiwa2, 1Waseda University, 2Tanaka Kikinzoku Kogyo / Japan

Ken Okumura1, Eiji Higurashi1, Tadatomo Suga1, Kei Hagiwara2, 1The University of Tokyo, 2NHK Science and Technology Research Laboratories / Japan

Yuichi Kurashima, Atsuhiko Maeda, Hideki Takagi, National Institute of Advanced Industrial Science and Technology / Japan

Ikuo Hirama, STMicroelectronics / Japan

440

444

448

452

456

13:40-15:45 Thursday, April 16TE2: Interconnection-2

TE2-1

TE2-2

TE2-3

TE2-4

TE2-5

Process Parameters for Formic Acid Treatment with Pt Catalyst for Cu Direct Bonding

A Low Temperature Cu-Cu Direct Bonding Method with VUV and HCOOH Treatment for 3D Integration

Cu-Cu Direct Bonding Technology Using Ultrasonic Vibration for Flip- chip Interconnection

Improved Low Temperature Gold- Gold Bonding Using Nanoporous Powder Bump Using Vacuum Ultraviolet Irradiation Pre-treatment

Effects of Ion Species for the Surface Activated Bonding of GaAs Wafers on the Characteristics of the Bonded Interfaces

Naoya Matsuoka, Masahisa Fujino, Masatake Akaike, Tadatomo Suga, The University of Tokyo / Japan

Taiji Sakai, Nobuhiro Imaizumi, Seiki Sakuyama, Fujitsu Laboratories / Japan

Yoshiyuki Arai1, Masatsugu Nimura1, Hajime Tomokage2, 1Toray Engineering, 2Fukuoka University / Japan

Tatsushi Kaneda1, Jun Mizuno1, Akiko Okada1, Kaori Matsunaga2, Shuichi Shoji1, Mikiko Saito1, Hiroshi Nishikawa2, 1Waseda University, 2Osaka University / Japan

Genki Kono, Masahisa Fujino, Daiji Yamashita, Kentaroh Watanabe, Masakazu Sugiyama, Yoshiaki Nakano, Tadatomo Suga, The University of Tokyo / Japan

460

464

468

473

478

TE3: Interconnection-3 16:25-18:30 Thursday, April 16

TE3-1

TE3-2

TE3-3

TE3-4

TE3-5

Nano-Function Paste for Power Semiconductors

Effect of Sn Orientation on Cu Diffusion for Pb-Free Solders under a Temperature Gradient

Silver Paste Pressureless Sintering on Bare Copper Substrates for Large Area Chip Bonding in High Power Electronic Packaging

Direct Transfer of Graphehe onto Transparent Substrates with Self- Assembly Monolayer

Internal Patterning of the Glass Backlight Module for LCD Panel by Laser

Hiroaki Ikeda1,2, Shigenobu Sekine1, Ryuji Kimura1, Koichi Shimokawa1, Keiji Okada1, Hiroaki Shindo1, Tatsuya Ooi1, Makoto Nagata2, 1Napra, 2Kobe University / Japan

Fan-Yi Ouyang, Wei-Neng Hsu, Yi-Shan Yang, National Tsing Hua University / Taiwan

Su-Yan Zhao1, Xin Li1, Yun-Hui Mei1, Guo-Quan Lu1,2, 1Tianjin University / China, 2Virginia Tech / USA

Masahisa Fujino, Kentaro Abe, Tadatomo Suga, The University of Tokyo / Japan

Shih-Jeh Wu, Hsiang-Chen Hsu, Pin- Chieh Wang, Shen-Li Fu, I-Shou University / Taiwan

482

486

491

495

499

9:30-10:45 Friday, April 17FA1: Taiwan Session-1

FA1-1 <Session Invited>

FA1-2

FA1-3

FOWLP and Bio CSP Development Development of Simulation- Approach for 3D Chip Stacking with Fine-Pitch Array-Type Microbumps

Fabrication of Arrays of (100) Cu Under-bump-metallization for 3D IC Packaging

James Lin, Powertech Technology / Taiwan

Chang-Chun Lee, Tzai-Liang Tzeng, Pei-Chen Huan, Chung Yuan Christian University / Taiwan

Wei-lan Chiu1, Chia-Ling Lu1, Han- Wen Lin1, Chien-Min Liu1, Yi-Sa Huang1, Tien-Lin Lu1, Tao-Chi Liu1, Hsiang-Yao Hsiao1, Chih Chen1, Jui- Chao Kuo2, King-Ning Tu3, 1National Chiao Tung University, 2National Cheng Kung University / Taiwan, 3University of California at Los Angeles / USA

514

518

FA2: Taiwan Session-2 11:00-12:15 Friday, April 17

FA2-1

FA2-2

FA2-3

Low-Temperature and Low Pressure Copper-to-Copper Direct Bonding Enabled by Creep on Highly (111)-Oriented Cu Surfaces

Mechanical and Electrical Properties Investigation of Micro- size Single Metal-coated Polymer Particle

On the Thermal Performance Analysis of Three-dimensional Chip Stacking Electronic Packaging with Through Silicon Vias

Chih-Han Tseng1, Chien-Min Liu1, Han-wen Lin1, Yi-Cheng Chu1, Chih Chen1, Dian- Rong Lyu1, Kuan-Neng Chen1, King-Ning Tu2, 1National Chiao Tung University / Taiwan, 2University of California at Los Angeles / USA

Che-Hao Shih, Kai-Chi Chen, Hsun- Tien Li, Industrial Technology Research Institute / Taiwan

Hsuan-Chi Hu1, Hsien-Chie Cheng2, Tzu-Chin Huang1, Wen- Hwa Chen1, Shen-Tsai Wu3, Wei-Chung Lo3, 1National Tsing Hua University, 2Feng Chia University, 3Industrial Technology Research Institute / Taiwan

523

527

532

13:25-15:05 Friday, April 17FA3: Power Electronics Integration-1


FA3-2

FA3-3

FA3-4

Opportunities in Packaging and Integration for Wide-Bandgap Power Electronics

Wafer Bonding of SiC-SiC and SiC- Si by Modified Surface Activated Bonding Method

Utilization of Zn Alloy for the Manufacture of Automotive Power Device Modules

Heat Resistant Bi-Ag-X Solders for Power IC Die Attachment

Khai Doan The Ngo, Virginia Polytechnic Institute and State University / USA

Fengwen Mu1, Masahisa Fujino1, Tadatomo Suga1, Yoshikazu Takahashi2, Haruo Nakazawa2, Kennichi Iguchi2, 1The University of Tokyo, 2Fuji Electric / Japan

Kuo-Shu Kao, Su-Ching Chung, Chia- Wen Fan, Jing-Yao Chang, and Tao- Chih Chang, Industrial Technology Research Institute / Taiwan

Jenn-Ming Song, Zhang-Hong Chang, National Chung Hsing University / Taiwan

542

546

550

FA4: Power Electronics Integration-2 15:20-17:00 Friday, April 17


FA4-2

FA4-3

Silver Sintering for Power Electronics Integration

Relationship between Transient Thermal Impedance and Shear Strength of Pressureless Sintered Silver as Die Attachment for Power Devices

Effect of Heating Rate on Bonding Strength of Pressure-free Sintered Nanosilver Joint

Cyril Buttay1, Bruno Allard1, Raphaël Riva2, 1Université de Lyon, 2IRT Saint Exupéry / France

Meiyun Wang1, Yunhui Mei1, Xin Li1, Guo-Quan Lu1,2, 1Tianjin University / China, 2Virginia Polytechnic Institute and State University / USA

Kewei Xiao1, Guangyin Lei2, Khai D.T. Ngo1, Guo-Quan Lu1, 1Virginia Polytechnic Institute and State University, 2Ford Motor / USA

554

559

565

FB1: Advanced Packaging-2 9:30-10:45 Friday, April 17

FB1-1

FB1-2

FB1-3

Copper-filled Anodized Aluminum Oxide -a potential material for low temperature bonding for 3D packaging

High-Volume-Manufacturing (HVM) of BVA Enabled Advanced Package-on- Package (PoP)

The Model Optimized of Mini Packaging -for quantum dots photodetector readout

Kosuke Yamashita, Yoshinori Hotta, Shunji Kurooka, Hirofumi Abe, Shiro Tan, FUJIFILM / Japan

Rey Co, Rajesh Katkar, Ashok S Prabhu, Wael Zohni, Invensas / USA

H. D. Lu, B. Y. Chen, F. M. Guo, East China Normal University / China

571

575

581

11:00-12:15 Friday, April 17FB2: Materials and Processes-2

FB2-1

FB2-2

FB2-3

Massive Spalling in Pb-Free Solder on Co-Based Surface Finishes

Effect of Silver Content and Vacuum Reflow Soldering on Thermal Fatigue Life of Sn-Ag-Cu Solder

Nanotwinned Cu Thin Film with Different Twin Boundary Orientations Deposited by Unbalanced Magnetron Sputtering

Chun-Hao Huang1, Yi-Ling Tsai1, Yu Ting Chang2, Albert T. Wu1, 1National Central University, 2Taiwan Uyemura / Taiwan

Mitsuharu Yamabe, Toshiba / Japan

Hsin-Yuan Chen, Kai Hung Yang, Fan-Yi Ouyang, National Tsing Hua University / Taiwan

586

590

596

FB3: Thermal Management-3 13:25-15:05 Friday, April 17

FB3-1

FB3-2

FB3-3

FB3-4

Wettability and Evaporation Enhancement for Heat Transport Devices by High Performance Oxide Layer

Cooling Performance of Impinging Jet from Piezoelectric Micro Blower Mounted in Narrow Flow Passage

An Initial Investigation of The Thermal-Fluid Characterization of a Visualized Visualized Loop Thermosyphon

Seeking an Energy-Efficient Modular Data Center: Impact of Pressure Loss on the Server Fan Power

Kazuhisa Yuki1, Katsuki Fukushima1, Akihiro Takemura2, Koichi Suzuki1, 1Tokyo University of Science- Yamaguchi, 2Tsuyama National College of Technology / Japan

Takashi Fukue1, Koichi Hirose1, Hirotoshi Terao2, 1Iwate University, 2ALPS Electronic / Japan

Yinfeng Wang, Yuezhao Zhu, Yu Qian, Haijun Chen, Li Yang, Nanjing Tech University / China

Masanori Sato, Arihiro Matsunaga, Masaki Chiba, Akira, Shoujiguchi, Minoru Yoshikawa, NEC / Japan

601

605

611

617

FB4: Materials and Processes-3 15:20-17:00 Friday, April 17

FB4-1

FB4-2

FB4-3

FB4-4

Examining the Required Properties of Build-up Dielectric Materials for Next Generation IC Package Substrates

Advanced Plating Photoresist Development for Semiconductor Packages

Development of Lift-off Photoresists with Unique Bottom Profile

Modeling of Positional Plasma Characteristics by Inserting Body Tube of Optical Emission Spectroscopy for Plasma Assisted Atomic Layer Deposition System

Hidenobu Deguchi, Tatsushi Hayashi, Teruhisa Tanaka, Toshiaki Tanaka, Kazutaka Shirahase, Sekisui Chemical / Japan

Hirokazu Sakakibara, Hisanori Akimaru, Akito Hiro, Keiichi Sato, Koichi Fujiwara, Kenji Okamoto, Shiro Kusumoto, JSR / Japan

Hirokazu Ito, Kouichi Hasegawa, Tomohiro Matsuki, Shiro Kusumoto, JSR / Japan

In Joong Kim, Yong Hyeon Shin, Ilgu Yun, Yonsei University / Korea

623

628

633

638

9:30-10:45 Friday, April 17FC1: Optoelectronics-1

FC1-1

FC1-2

FC1-3

The Study of Thermal Cycling Performance of Enacpasulant Material in SMD LEDs Application

Higher Polarization Crosstalk of 38.5 dB and Low PDL with Silane Modified Highly Moisture Resistant Adhesives in Assembling Optical Devices

Reflection Optical Notch Filtering Behavior of Cavity- Resonator- Integrated Guided- Mode Resonance Mirror

Chih-Hao Lin, Kai-Chi Chen, Shu- Chen Huang, Hsun-Tien Li, Industrial Technology Research Institute / Taiwan

Seiko Mitachi1, Hirokazu Kageyama2, Kazushi Kimura2, Ryo Nagase3, 1Tokyo University of Technology, 2The Yokohama Rubber, 3Chiba Institute of Technology / Japan

Masahiro Nakata1, Tomohiro Kondo1, Kenji Kintaka2, Junichi Inoue1, Shogo Ura1, 1Kyoto Institute of Technology, 2National Institute of Advanced Industrial Science and Technology / Japan

642

652

FC2: Optoelectronics-2 11:00-12:15 Friday, April 17

FC2-1

FC2-2

FC2-3

Small-footprint 128-Gb/s DP- QPSK Silicon Optical Modulator in Ceramic-based Metal Package with Low Optical Coupling Loss

Opto-Electronic Hybrid Integrated Chip Packaging Technology for Silicon Photonic Platform Using Gold-Stud Bump Bonding

Influence of Atmospheric- Pressure Plasma Treatment on Surface and Electrical Properties of Photodiode Chips

Hiroki Ishihara1, Yasuhiro Mashiko1, Kazuhiro Goi1, Kensuke Ogawa1, Tsung-Yang Liow2, Xiaoguaog Tu2, Guo-Qiang Lo2, Dim-Lee Kwong2, 1Fujikura / Japan, 2A*STAR / Singapore

Mistuo Usui, Kotaro Takeda, Hirooki Hirata, Hiroshi Fukuda, Tai Tsuchizawa, Hidetaka Nishi, Rai Kou, Tatsuro Hiraki, Kentaro Honda, Masashi Nogawa, Koji Yamada, Tsuyoshi Yamamoto, NTT / Japan

So Ikeda, Eiji Higurashi, Tadatomo Suga, The University of Tokyo / Japan

656

660

666

FC3: Optoelectronics-3 13:25-15:05 Friday, April 17

FC3-1 <Session Invited>

FC3-2


FC3-4

Flip Chip, CSP or WL-PKG, the Near Future of LED Device

A Measure Against the Latest Problem of LED Package

Flip Chip LED COB Bonding Process with Low-Temperature- Curable Conductive Paste

Determination of the Junction Temperature of Gallium Nitride (GaN)-based High Power LED under Thermal with Current Loading Condition

Tetsuya Onishi, Grand Joint Technology / Hong Kong

Hirofumi Torigoe, Yoshiteru Miyawaki, SANYU REC / Japan

H. Kashitani, A.Uchida, Ohashi Engineering / Japan

Feng-Mao Hsu, Yen-Fu Su, Kuo-Ning Chiang, National Tsing Hua University / Taiwan

678

691

15:20-17:00 Friday, April 17FC4: RF

FC4-1

FC4-2

FC4-3


Impedance Balance Control for Reduction of Common Mode Noise in Full Bridge Converter

Suppression of Mode-Conversion by DNG Material Placed on Differential-Paired Lines with Bend Discontinuities

Development of Less than 100μm Thick Sheet for Noise Attenuation by Electromagnetic Induction

Development of Battery-less Integral Type Wireless Current Sensor Node

Masaaki Maeda, Tohlu Matsushima, Takashi Hisakado, Osami Wada, Kyoto University / Japan

Yoshiki Kayano1, Hiroshi Inoue2, 1Akita University, 2The Open University of Japan / Japan

Kishio Hidaka1, Toru Nihei2, Noriji Tashiro2, Atsushi Hujita2, 1Yamagata University, 2Hitachi Chemical / Japan

Hironao Okada, Toshihiro Itoh, National Institute of Advanced Industrial Science and Technology / Japan

695

700

704

FD1: DMR*-Electrical-1 9:30-10:45 Friday, April 17

FD1-1

FD1-2

FD1-3

Improved Delay-Matching Bus Routing by using Multi-layers

Method for Automatic Compensation of the Loading Effect for High-Precision Buffer Amplifiers

A Testable Design for Electrical Interconnect Tests of 3D ICs

Yang Tian, Takahiro Watanabe, Waseda University / Japan

Seitaro Kon, Tatsuji Yamada, National Institute of Advanced Industrial Science and Technology / Japan

Akihiro Odoriba1, Shoichi Umezu1, Masaki Hashizume1, Hiroyuki Yotsuyanagi1, Fara Ashikin Binti Ali2, Shyue-Kung Lu3, 1Tokushima University / Japan, 2Universiti Teknikal Malaysia Melaka / Malaysia, 3National Taiwan University of Science and Technology / Taiwan

708

714

718


FD2-1

FD2-2

Optimum Characteristic and Structural Design of PWB Radiation Detector Considering Gas Amplification Reaction

Practical Optimization Flow using aNew System Design Methodology

Kohei Ota, Motonori Oono, Tomohisa Motomura, Dai Nippon Printing / Japan

Ken Kawamura1, Hidenori Murata1, Yoshiharu Iwata1, Ryohei Satoh1, Takeshi Sakamoto2, Kazuya Okamoto1, 1Osaka University, 2GLOBALASSIST/ Japan

723

728

* DMR: Design Modeling and Reliability

13:25-15:05 Friday, April 17FD3: DMR*-Electrical-3

FD3-1

FD3-2

FD3-3

FD3-4

On-Die Intrinsic Capacitance Extraction Methodology -an alternative approach in power integrity modeling by leveraging silicon intrinsic capacitance

Characterization of On Die Capacitance and Silicon Measurement Correlation

MIM Capacitance Efficiency Study for High Speed I/O Power Integrity Network Design -MIM and MIMless high speed I/O performance characterization

Silicon Level Circuit Implementation for System-On- Chip Power Integrity Improvement

Fern Nee Tan, Intel Microelectronics / Malaysia

Li Chuang Quek, Ming Dak Chai, Heng Chuan Shu, Intel Microelectronics / Malaysia

Fern Nee Tan, Intel Microelectronics / Malaysia

Chee Hong Aw, Li Chuang Quek, Heng Chuan Shu, Intel Microelectronics / Malaysia

739

743

748


FD4-1

FD4-2

FD4-3

FD4-4

Efficient Method for Predictive Modeling of Irregular Shaped Power Distribution Network

Fundamental Phenomena of Signal Transmission in GHz Region - verification by experimental basis supported by simulation

The Study of Suppression Method for Power Radiation between GND Planes from Signal Via in MultiLayer Board

Interposer Design and Measurement with Various Capacitors for Reducing Total System PDN Impedance

Afef Bouchaala1,2, Lionel Courau1, Olivier Bonnaud1, Philippe Galy, 1STMicroelectronics, 2IETR / France

Yutaka Akiyama, Chihiro Ueda, Kanji Otsuka, Meisei University / Japan

Hiroshi Itakura, Keitaro Yamagishi, Yoshihiro Akeboshi, Mitsubishi Electric / Japan

D. Tanaka1, K. Mihara1, N. Kobayashi1, Y. Hiyama1, S. Kiyoshige2, W. Ichimura2, T. Yamaguchi2, T. Sudo2, 1Murata Manufacturing, 2Shibaura Institute of Technology / Japan

752

757

761

767

FE1: DMR*-Mechanical-1 9:30-10:45 Friday, April 17

FE1-1

FE1-2

Warpage Modeling Technique of Organic Interposer Considering Deformation by Insulator Material Shrinkage

Estimation Method of Cracking Probability of Stacked Overhang Die during Wire Bonding

Keishi Okamoto, Sayuri Kohara, Hirokazu Noma, Kazushige Toriyama and Hiroyuki Mori, IBM Japan / Japan

Kanako Sawada1, Hideo Aoki1, Eigo Matsuura1, Hideko Mukaida1, Fumiyoshi Minami2, 1Toshiba, 2Osaka University / Japan

771

776


11:00-12:15 Friday, April 17FE2: DMR*-Mechanical-2

FE2-1

FE2-2

FE2-3

Advancement in Modeling Vapor Pressure Induced Stresses in Electronic Packaging

Analysis of LED Wire Bonding Process Using Arbitrary Lagrangian-Eulerian and Equilibrium Mesh Smoothing Algorithm

High Reliability Packaging Technologies for 175deg.C Continuous Operation in IGBT Module

Loh Wei Keat, Lee Yung Hsiang, Ong Kang Eu, Chin Ian, Leong Jenn Seong, Intel Technology / Malaysia

Che-Chia Yang, Chia-Chi Tsia, Yen-Fu Su, Kuo- Ning Chiang, National Tsing Hua University / Taiwan

T. Saito, Y. Nishimura, F. Momose, A. Hirao, A. Morozumi, Y. Tamai, E. Mochizuki and Y. Takahashi, Fuji Electric / Japan

781

787

791

FE3: Interconnection-5 13:25-15:05 Friday, April 17

FE3-1

FE3-2

FE3-3

FE3-4

Evaluation of Residual Stress Caused by Flip-Chip Bonding Process using Piezo-Resistor Embedded Test Element Group Chips

Effects of Internal Stress of Electroless Ni Plating on Solder Joining Strength

The Effects of Ag Content in the Solder on Electromigration Behavior

The Beneficial Effect of Zn Additions on the Microstructure of SnCu and SnCuNi Solder Joints to Cu Substrates

Toshio Enami, Kyosuke Nanami, Osamu Horiuchi, Young-Gun Han, Hajime Tomokage, Fukuoka University / Japan

Katsumi Miyama, Kanou Yoshida, Shigeru Saitou, Toshiyuki Takashima, Hokkaido University of Science / Japan

Ying-Ta Chiu, Yu-Hsiu Shao, Ping- Feng Yang, Advanced Semiconductor Engineering / Taiwan

Wayne Ng1, Guang Zeng2, Takatoshi Nishimura1, Keith Sweatman1, Stuart D. McDonald2, Kazuhiro Nogita2, 1Nihon Superior / Japan, 2University of Queensland / Australia

795

800

804

809


Poster Session

P01

P02

P03

P04

P05

P06

P07

P08

P09

P10

Embedded Planar Power Inductor Technology for Package-level DC Power Grid

Stress and Strain Analysis using Multi-Physics Solver for Power Device Heat Dissipation Structures under Thermal Cycling Test

Heat Dissipation Characterization and Application of SiC Power Devices by Transient Thermal Measurement

Synthesis and Characterization of Polydopamine Modified Carbon Nanotube (CNT)/ Polydimethylsiloxane (PDMS) Composites

Effect of Au Nanoporous Structure on Bonding Strength

Cu/BCB Hybrid Bonding with TSV for 3D Integration by using Fly Cutting Technology

In Situ Observations of Micromechanical Behaviours of Intermetallic Compounds for Structural Applications in 3D IC Micro Joints

Effect of Ag Concentration on Ni/ Sn-xAg/Ni Micro Joints under Space Confinement

Effect of Adherend Surface Morphology on Adhesive Strength

Low Temperature Au-Au Surface- Activated Bonding Using Nitrogen Atmospheric-Pressure Plasma Treatment for Optical Microsystems

Yuta Kondo1, Yuichiro Yazaki1, Makoto Sonehara1, Toshiro Sato1, Tetsuro Watanabe2, Yuto Seino2, Nobuhiro Matsushita2, Tomoharu Fujii3, Kazutaka Kobayashi3, Hiroshi Shimizu3, Yuki Yanagisawa4, Teruki Someya4, Hiroshi Fuketa4, Makoto Takamiya4, Takayasu Sakurai4, 1Shinshu University, 2Tokyo Institute of Technology, 3SHINKO Electric Industries, 4The University of Tokyo / Japan

Takahiro Asai1, Masaaki Aoki1, Akihiro Mochizuki2, Takamitsu Honjo2, Hitoshi Kida2, Goro Yoshinari2, Nobuhiko Nakano1, 1Keio University, 2Alent Japan / Japan

Ryo Endoh, Junichi Watanabe, Ryuichi Sugie, Takashi Yamamoto, Toray Research Center / Japan

Chih-Feng Wang1, Pei-Kang Huang1, Pei-Rung Hung1, Chan-Chih Hsu1, Sheng-Rui Jian1, Ping-Feng Yang2, Min-Hua Chung2, 1I-Shou University, 2Advanced Semiconductor Engineering / Taiwan

Kaori Matsunaga1, Min-Su Kim1, Hiroshi Nishikawa1, Mikiko Saito2, Jun Mizuno2, 1Osaka University, 2Waseda University / Japan

Zhi-Cheng Hsiao, Cheng-Ta Ko, Hsiang-Hung Chang, Huan-Chun Fu, Chia-Wei Chiang, Chao-Kai Hsu, Wen-Wei Shen, Wei-Chung Lo, Industrial Technology Research Institute / Taiwan

Jen-Jui Yu, Jui-Yang Wu, Li-Jen Yu, C. Robert Kao, National Taiwan University / Taiwan

Jen-Jui Yu, Jui-Yang Wu, Sean Yang, C. Robert Kao, National Taiwan University / Taiwan

Yoshio Oozeki, Hiroaki Furuichi, Rika Nomura, Satoshi Arai, Hitachi / Japan

Seiya Matsuoka1, Michitaka Yamamoto1, Eiji Higurashi1, Tadatomo Suga1, Renshi Sawada2, 1The University of Tokyo, 2Kyusyu University / Japan

814

818

822

826

830

834

838

842

846

850

P11

P12

P13

P14

P15

P16

P17

P18

P19

P20

CSP LED Validation through Optical Simulations for High Irradiance UV LED Module

Surface Morphology and Optical Properties of TiO2-Carbon Nano- fiber Prepared by Electrospinning

Nano Fluorescent Fiber Prepared by Electrospinning

Fabrication of SERS Active Noble Metallic Nanostructure by Synchrotron Radiation Induced Photochemical Reaction

A Novel MEMS-Based Lab- on-a-Tube Technology and Its Application

Improvement of Surface Propertieson Microfluidic Devices by Diamond-Like Carbone Coatings

A Study of High-Density Differential Transmission Line of the Package Board Based on Crosstalk Reduction

Novel Impedance Controllable Testing Socket for High Speed/ Frequency Packages

Embedded Band-pass Filter Design in Packaging Substrate

Optimum Conifiguraiton of SI/ PI Co-Simulation using Electro- Magnetic Simulator

Hao-Xiang Lin, Chin-Chang Hsu, Cheng-Chun Liao, Chung-Min Chang, Chih-Peng Hsu, Advanced Optoelectronic Technology / Taiwan

Hsiao-Chung Chu, Cho-Liang Chung, Chih-Hao Hsu, Sheng-Li Fu, I-Shou University / Taiwan

Yu-Min Chen, Cho-Liang Chung*, Wei Chen, Yu-Hsuan Lin, Sheng-Li Fu, I-Shou University / Taiwan

Takeshi Matsumoto1, Ikuo Okada2, Ikuya Sakurai2, Yuichi Utsumi1, Akinobu Yamaguchi1, 1University of Hyogo, 2Nagoya University / Japan

Yi Zhang, Toshihiro Itoh, Ryutaro Maeda, National Institute of Advanced Industrial Science and Technology / Japan

Yuta Murayama1, Keisuke Shiba1, Yasuharu Ohgoe1, Jun Mizuno2, Shuichi Shoji2, Kazuhide Ozeki3, Keisuke Sato1, Ali Alanazi4, Kenji Hirakuri1, 1Tokyo Denki University, 2Waseda University, 3Ibaraki University / Japan, 4King Saud University / Saudi Arabia

Takashi Kuwahara1, Yoshihiro Akeboshi1, Seiichi Saito2, 1Mitsubishi Electric, 2Salesian Polytechnic / Japan

Kuan-Yi Cheng1, Sung-Mao Wu1, Lung-Shu Huang1, Chen-Chang Chen2, Yen-Tang Cheng2, 1National University of Kaohsiung, 2Ministry of Economic Affairs / Taiwan

Bo You Chen1, Sung Mao Wu1, Ming Shan Lin1, Tzu-Wen Kung2, 1Nation University of Kaohsiung, 2Ministry of Economic Affairs / Taiwan

Mitsuharu Umekawa, Keysight Technologies Japan / Japan

854

858

862

866

870

874

878

882

886

890

2015 International Conference on ElectronicV Packaging and...

Documents

Transcript of 2015 International Conference on ElectronicV Packaging and...