20140211 critical-electronics-for-aircraft

CISEC 2014 Conferences – Critical Embedded Systems

Electronics for Aircraft – Avionics

Feb. 11, 2014

Fbruary 2014 CISEC 2014 Conferences / Critical Embedded Systems / Electronics for Aircraft - Avioncs

Presented by: Philippe PONS

Airbus Avionics & Simulation Products

Electronics Senior Expert

© AIRBUS Operations S.A.S. All rights reserved. Confidential and proprietary document.

Electronics for Aircraft – Avionics Summary

• Introduction

• Context

• Some significant aeronautical constraints / requirements – Impacts on

electronics and avionics equipments development

• Design and development processes

• Conclusion



Introduction



Introduction – Overview of Avionics & Simulation Products


A330/340

A300/310 A319/20/21

A380

Design of 10 to 15% of Aircraft Electronics to acquire

expertise and support Programmes, Procurement, Engineering regarding the

other 85 to 90%

Focus on domains which are difficult, and/or sensitive & critical, innovative

• Flight Control

• Warnings

• Maintenance

• Communication

6000

equipments /

year

• Avionics & Simulation Products (EYY): AIRBUS Centre of Competences

for on-board Electronics and Software in real time applications

Cover the whole life cycle: development, production, sales & customer support

Avionics

simul

ation


Context (1/5)


Embedded electronics: high growth since 20 years

Electronics overruns the Aircraft and brings intelligence, control precision,

performance, flexibility, reliability…

Cockpit

commands Flight

computers

Actuators

Aircraft

sensors

Examples: Fly-by-Wire, Cockpit


Context (2/5)


• Nevertheless, low percentage of the worldwide electronics industry

o Dominated and ruled by high volume and low cost oriented applications (ex.

consumers, telecom)

Note:

- Aerospace: below 1% of global component market, almost stable

- Automotive: ~8%, growing

oCharacterized by rapide changes (ex. electronic components technologies, component

manufacturers buyout…)

• But high level of contraints & requirements for on-board applications

A300 A340 A380


Context (3/5)

• Markets have drastically different characteristics



Context (4/5)


- Enabling new functions, allowing higher performance and integration with reduced cost

• But

- Often implemented on commercial applications, high volume, low constraints, and not initially adapted to needs & requirements of on-board systems

- Sometimes, limited access for European Actors (growth in US, Asia, access / export limitation)

- Adding higher complexity (IS; EMC; hot spot,...), PCB, assembly vs.comp. packages, certification, maintenance / investigations), obsolescence, potential counterfeiting issues, reliability risks,...

How to proceed to remain competive in development / production of on-

board electronics & equipments?

Adapt to the technologies, components, … market trends & use

appropriate processes

Grasp opportunities offered by advanced & emerging technologies and

propose innovative solutions to keep a competitive advantage

© Freescale Semiconductor, Inc. 2008

Satisfy specific constraints / requirements of Avionics


Context (5/5)


Major drivers:

• Use of COTS components and widely ‘shared’ technologies (avoid “niches”)

• High performances (electrical; functional ex. processing, power efficiency with

increase of the frequency, …; less energy; …)

• High integration for smaller

• size & volume and smaller weight

• High reliability and safety in compliance with the requirements for embedded

electronics

• Performance & compliance with environmental constraints (thermal, EMC,

cosmic radiation,…)

• Regulations: certifications, environmental directives (ex. RoHS, Reach)

• Complexity and development cycles mastering – design maturity

(model based techniques, modeling & simulation , verification,…)

• High industrial maturity (Entry in Service)

• Long term availability High life time (~15 years to > 30 years)

• Lowest costs

• Low and medium manufacturing volume / mass-production



• Introduction

• Context




• Conclusion



Some significant aeronautical constraints / requirements – Impacts on electronics and avionics equipments development


Service life o Electronic components (as example)

Environmental conditions (thermal, mechanical… EMC, atmospheric

radiation, …)

Safety

Reliability

Maintainability and Testability

Certification


Service life


Service life of equipment is the time at which it is no longer physically feasible

or economically considered as rentable to repair or overhaul the equipment

to acceptable standards

Example: 150 000 flight hours, 30 000 cycles or 25 years

High impacts on:

- Electronic components and technologies (ex. manufacturing technologies) selection

- Electronic providers selection and follow-up

- Manufacturing & test means (industrialization)

- Documentation set volume to preserve product knowledge

201x + 5

EIS

200X + 30

Equipment End of Service Life

200X

Equipment

design

Kick-off

EIS: Entrance In Service


Service life – Electronic components management


• Context:

Electronic components is the “raw material” for an electronic equipment: “to make

a good dish, good ingredients are needed”

Ensure >25 years life cycle (service life)

Design

Raw

materials Final product




• Need to manage electronic components to ensure:

Right component for the right function: market trends, durability,

reliability (e.g. failure mechanisms vs. new technologies), sensitivity to

atmospheric radiation…

Continuously supply A/C for 25 years: expertise and audit of components

suppliers and manufacturers, obsolescence management and durability

control of components (if stocks), counterfeiting avoidance (supply through

approved network highly recommended)

International Specification IEC/TS 62239-1 “Process management for avionics

– Management plan – Part 1: Preparation and maintenance of an electronic

management plan” defines requirements for selecting and managing

electronic components (COTS and specific) in compliance with the end

application

COTS: Commercial Off-The-Shelf




PREVENT DETECT SOLVE

Obsolescence management

PREVENT Obsolescence

- Select Electronic Components among “golden rules”

- Manage selection for design with a Preferred Parts List

- Define design margin in order to allow easier parts replacements

- Perform BOM analysis in order to validate components choices

- ...

DETECT Obsolescence - Perform technical components suppliers survey : meetings, visits, audits, ...

- Identify availability information within the components database,

- Conduct yearly obsolescence analysis and plan for each product

SOLVE Obsolescence

- Identify replacement solutions & impacts on design (qualification level)

- Decide the mitigation solutions : short / mid / long – term redesign, stock,

- Update obsolescence plan

- ...


Environmental conditions: Mechanical & climatic requirements


Requirement’s magnitude and applicability depend on equipment category

Temperature & Vibration are main constraints for on-board electronic equipments

requiring:

• Cooling analysis & solution (vs. for ex. acceptable components Tj)

• Mechanical analysis & assembly solution

• Performance margin definition

• Component selection & sort

!! Impact on weight

•Temperature (ex. E-bay) o Storage: -55°C / +85°C

o Operation: -40°C / +70°C

ambiant, air forced

o Loss of cooling: 30mn @

+55°C ambiant; 8h @ +40

or +45°C

• Temperature Variation

• Altitude/Pressure (if required)

• Humidity

•Shocks (ex. E-bay) o 6g

• Vibration o Random vibr. 1,68gRms /

10 – 400Hz

• Constant Acceleration •10g

•Fluids

•Sand and Dust

•Fungus Resistance

•Salt Spray

•Icing

•Flammability/Smoke/Toxicity

Typical examples


Environmental conditions: Transients and Electromagnetic (EMC) requirements


• Transients

• Lightning strike attachments to the aircraft surface

• On aircraft switching of electrical loads and electrostatic discharges

• Radio Frequency Energy

• Those generated externally (example: high intensity radiated fields and

aircraft on-board transmitters)

• Those generated internally (example: emissions from neighbouring

systems and electronic equipments)

High impact on equipment design:

- Input/Output protections

- Specific filters design

- Strict packaging and electronic design rules/guidelines (vs. EMC

emission, immunity)

EMC: Electro-Magnetic Compatibility


Environmental conditions: EMC Emission and Immunity (Susceptibility)


• Electronic boards are the central issue of the avionic EMC

• Components may be both perturbing (guilty) and perturbed elements

(victim)


Environmental conditions: EMC activities within equipment development


Environmental & Functional

HW assembly Specification

Preliminary Design

Phase 1 Integration / Verification

Qualification Changes

Management

packaging Specifications

Preliminary Design

Packaging Design

implementation Verification

Environmental & Functional Board

Specifications Preliminary Design

Electrical Diagram Design, physical

design, place and route

Implementation (board prototyping)

Verification

Functional FPGA

Specifications

Preliminary Design

Detailed Design, coding,

synthesis, place and route

Implementation (programming)

Verification

System level

Equipment level

Packaging level

Board level

FPGA ASIC level

HW Planning and development

Modification / Configuration management

Certification liaison (airborne HW)

V&V HW process and quality

assurance

Integral processes (applicable at each level)

- Electrical grounding network drawing -Lightning protection and BCI filtering architecture - Mechanical design requirements

- Architecture

and

technological

choices

- EMC Mock-

ups

- Signal

intergrity

Simulations

- Schematic

diagram checks

(Analysis

report)

- Signal

intergrity

Simulations

- PCB Design

checks

- CAD

Contraints

Notes

- Board checks

(signal integrtiy,

...)

- Equipment

checks

(robustness

tests)


Environmental conditions: EMC compliance (example)


EMC compliance in a functional objective

Comply with the EMC standards

Functional improvement at design level


Environmental conditions: Atmospheric radiation


Atmospheric Radiation Requirements

ALTITUDE

1. 106 Ft (330 Kms) Orbit of the space shuttle

~ 39 000 Ft (12 000 m) Aircraft Altitude

INTERACTION WITH ATMOSPHERIC ATOMS

(Oxygen + Nitrogen)

RADIATIVE ENVIRONMENT

AT THE FLIGHT ALTITUDE

PRIMARY PARTICLES ISSSUE FROM

COSMIC RAY

(protons : 87% - helium atoms : 12% - Heavy

Ions : 1%)

For highly integrated electronic, consequences of the radiation impacts may be modifications to

logic states SEU/MBU in memory cells or registers : Safety-Reliability-Availability impacts

Order of Magnitude to consider: with 200MBytes embedded memory, 1 Upset by flight hour

Impact on equipment design:

• Architecture

• Component selection

• Mitigation techniques

Filter (Terrestrial Magnetic Field + Solar Wind)

SEU: Single Event Upset

MBU: Multiple Bit Upsets


Environmental conditions: Atmospheric radiation effects


Neutron

Collisions in

atmosphere

High energy particles

SEU (Single Event Upset) are

concerning sequential logic

(RAM cells and Flip-Flops)

Where bit flip can occur and

remain “stored”

SEU sensitivity depends on many

parameters:

Technology(CMOS, Particle energy,

particule flux (function of altitude,

latitude), type of cell (RAM, flip-flop),

cell design, ...

Sensitive volume: nuclear reaction parasitic currents

SEU cross section:

• Intrinsic parameter of a chip/circuit that specifies its response to a particle species

(e.g. neutron, proton, pion, heavy ion, etc.)

• Measured using a beam of particles produced at an accelerator. The SEU cross-

section depends on the particle type and particle energy


Environmental conditions: Atmospheric radiation management and mitigations


• Atmospheric Radiation effects Risk analysis (part of safety risk analysis)

International Standard IEC 62396-1 “Process management for avionics – Atmospheric radiation effects – Part 1: Accommodation of atmospheric radiation effects via single event effects within avionics electronic equipment” provides a general view of the subject to help designers to assess the impact of cosmic radiation on electronic: SEU/MBU Risk Analysis

• Mitigations Techniques : Examples at component / equipment level

• Hardware protections

• Insensible components (ROM) or with a very low sensitivity

• Parity checks on Memory allow detection of SEU. The computer can generate an auto-reset or can

fail itself => impact on the availability

• Error Correction Code (Hamming Code, Reed Solomon…) : allows the detection and the correction

of the SEU => no impact on the availability (to be analyzed for MBU)

• Scrambling : arrangement of bits of memory to limit MBU,

• FPGA RAM Based : Internal triplication; Scrubbing : periodic refresh

• Software protections

• Many protections Up to 30% of processor load


Safety


Safety requirement for safe operation in compliance with Authorities

regulations and Customers / Airlines requirements

• Safety activity shall be done in order to keep the hazards associated with the aircraft or

with the environment to a minimum level

Analyze all potential safety hazards and associated hazardous conditions:

o Functional hazards (hazards associated with function/equipment/components)

o Intrinsic hazards (hazards intrinsic to equipment)

o Human activity hazards (maintenance, operational activities)

Example: Flight Control Computer safety requirements

• No single hardware failure shall be able to cause undetected oscillation of inputs / outputs

Failure Modes and Effects Analysis (FMEA) is a systematic method of safety analysis

o Identify potential failure modes of a

system, function, or piece part (i.e.

component)

o Determine the effects on the

respective level as well as on the next

higher levels of the design


Safety: Impacts and mitigations


Example of common safety mechanisms implemented in hardware and electronics

design

• COM/MON architecture

• Monitoring and test of each function shall be possible

• Watchdog

• Clock monitoring, Power monitoring

• ECC (error-correcting code) protection of RAM

• CRC (cyclic redundancy check) on ROM content

• Etc…

Additional features required by aeronautical

requirements

- Over current protection with filter

- High level disabling capability

- Function status feedback for monitoring

purpose

- Lock mechanism on failure (prevent from

oscillatory behaviour)

- Current inversion protection

Impact on equipment design: Functional architecture solution

Hardware and Software design solutions / techniques


Reliability


Main Quantitative specifications through:

• MTBUR (Mean Time Between Unscheduled Removals): obtained by dividing the total number of flight

hours logged by population of an equipment over a certain period of time by the number of unscheduled

removals during that same period

• MTBF (Mean Time Between Failures): obtained by dividing the total number of flight hours logged by a

population of an equipment over a certain period of time by the total number of confirmed failures occurring in

flight or on ground within the population during the same time period

• FR (Failure Rate): failures count per flight hour

• FIT (Failure in Time): failures for billion flight hours

Example: Flight Control Computer shall comply with MTBF 15 000FH & MTBUR 12 000FH

Impact on equipment design:

• All domains from architecture, components selection, design rules, thermal – vibration –

EMC … environmental solutions implementation

Probability that an item will perform a required function,

under specified conditions, without failure, for a

specified period of time


Reliability: Design for reliability and reliability prediction approach


Design for reliability based on FIDES Guide: new predictive reliability methodology based on Physic of Failure, as previous methodology and guides were based only on experience feedback analysis, did not follow the components evolutions, were very pessimistic compared with the current field return (e.g. MIL-HDBK217,… )

• Many COTS families

• Fides methodology for MTBF evaluation

http://www.fides-reliability.org/

Reliability

Technology

Process Use

Parts Electronic boards Sub-assemblies

Good correlation between FIDES

predictions and field return data


Reliability: Mission profile impact


Medium Range A/C

Computer in avionic bay

Computer in wing

Avionic Bay Wing

A/C Long Range x >>x

A/C Medium Range y >>y

A/C Short Range z >>z

Impact of the Mission Profile on MTBF

using FIDES:

Very important

to know the real

environment


Reliability: Example of reliability assessments and qualification applied to manufacturing technologies (e.g. PCB, assembly)


• How to do?

• Example: How many manufacturing process qualified for series production of this

board?

PCB: Printed Circuit Board

• PCB : 11

• Comp Assembly: 33

• Mech Assembly: 13

Potential failure modes &

mechanisms Reliability

Pass criteria

Key characteristics Monitoring

Technologies & processes

maturity


Reliability: Example of reliability assessments and qualification applied to manufacturing technologies (e.g. PCB, assembly)


• Qualification procedure according to

• Normative standards (ex. IPC)

• Experience

• Procedures and sanction criterias defined to meet Aircraft Worst Case mission

profile

• Typical qualification stress

o 1000 thermal cycles from -40°C to +100°C with ramp +5°C or 10°C/mn

oOr 2000 thermal cycles if Lead-Free technology

oVibration

And analysis

oBoard visual inspection, resistivity measurements between isolated area., continuity

measurements on daisy chained assembly, PCB micro-sections inspection with microscope

Objective: Identify potential failure modes & mechanisms (ex. at solder joints level)

influancing reliability parameters / models (cf. FIDES)


Maintenability and Testability


• Maintainability

Under dedicated use conditions, capacity of an equipment to be

maintained or restored in a state in which it is able to accomplish its

required function, when the maintenance has been accomplished

under the required conditions, using the required procedures and tools

Obtained thanks to a set of principles and directives, which have to be followed throughout the

design of the equipment

• Testability:

Property of a system or Line Replaceable Unit (LRU) allowing rapid confirmation of its own

functional integrity at the most cost effective level

oTestability at system level: prompt integrity check of an operationally critical LRU

oTestability at LRU level: prompt integrity check of an internal board, component or module

Impact on equipment design: design for test

• Electronic and functions observability

• Test coverage techniques …


Time Critical


Equipment shall meet strict Time Critical performances for a number of applications

(example: Flight Control).

Huge impact on equipment design:

• Equipment architecture to ensure determinism

• Electronic component selection to reach committed performances (ideally: cycle

accurate model)

• Specific custom component’s behavior determinism

• Software partitionning and determinism (including OS)


Certification


Equipment shall meet Airworthiness Certification standards to be integrated in

Aircraft System (Safety driven)

Need to follow strict Design Assurance Guidelines defined according to equipment

criticity level Design Assurance Levels (DAL)

DAL Description Failure Rate (Hours)

A Catastrophic < 10-9

B Hazardous < 10-7

C Major < 10-5

D Minor > 10-5

E No Effects Don't Care

Impact on equipment design process according to criticity level mainly for

complex COTS components, specific components (e.g. FPGA, ASIC)

•For example for DAL-A: requirements traceability, FPGA separated

design and verification teams…

DAL: Design Assurance Level

FPGA: Field Programmable Gate Array ASIC: Application-Specific Integrated Circuit


Typical requirements for Flight Control Computer located in Avionics Bay


• Service Life: 25 years

• MTBF : 15 000 Flight Hours

• DAL A : Catastrophic Failure rate < 10-9

• Environmental constraints compliance (vs. directives and/or normative standards)

o Operating temperature range thermal cycles) from -40°C to +70°C and loss of cooling conditions

o Vibration: (engine fan blade loss

o EMC compliance (radiated and conducted emission and immunity )

o Lightning protections

o Atmospheric radiation

o ….

• Power Supply Line (28VDC): from 18.5V to 32.5V with 46 V exceptionally

• Strict Time Critical Application

Equipment’s function looks quite simple BUT due to Avionics

constraints & requirements, Design and Verification become COMPLEX

Complex balance to meet specifications with regard to weight… and

cost targets



• Introduction

• Context




• Conclusion



Design and development processes: Product life – End to End process


Requirements (Customers) Specifications

Design

Development

Manufacturing

Test & Integration

Delivery

Support

Hardware Software

Hardware Software

Avionics

Products

Product

lifecycle


Design and development processes


• Development process: How to Master the complexity

Certification standards driven

Design and development process / cycle


Design and development processes: Civil certification standards


Part 21 : Certification of Aircraft and related Products, Parts and Appliances

CS25 : Certification Specifications for large Aeroplanes

CS25.1309 : Equipment, Systems and installations

AMC 25.1309 : system Design and analysis

Airworthiness

Standards

Set of requirements to

ensure passengers safety

Regulatory request

Acceptable Means of

compliance

Industrial answer, agreed by

consensus

ARP4754/ED79

System Development Process

DO297/ED124

Integrated Modular Avionics

(IMA)

ARP4761/ED135

Safety Assessment

DO178B/ED12B

Software Development Process

DO254/ED80

Hardware Development Process

DO160E/ED14E

Environmental conditions

and test procedures

Updated : DO178C

System / Equipment

Hardware / electronics

Software


Design and development processes: Civil certification - ARP4761, safety approach overview


• Aircraft development based on an overall safety approach

oTake into account different root causes which can affect the behaviour of a

system : random failures, events and errors

• Development errors avoidance: confidence that errors have been

sufficiently removed from a product is based on the quality level of the

development process

oDevelopment Assurance Level (DAL) “drives” the Quality of a development


Design and development processes: Civil certification – DO254 / ED80 overview


A full methodology handbook for hardware (electronics) design assurance

• No (or few) How

• No guidance about in series production

Derived Requirements

Hardware

Design

Processes

(Section 5)

S

y

s

t

e

m

P

r

o

c

e

s

s

Detailed

Design

.

Supporting Processes

· Validation and Verification Process (Section 6)

· Configuration Management (Section 7)

· Process Assurance (Section 8)

· Certification Liaison (Section 9)

Conceptual

Design

Section 5.2 .

Requirements

Capture

Section 5.1 .

ImplementationProduction

Transition

.

Planning

(Section 4)

M

a

n

u

f

a

c

t

u

r

i

n

g

P

r

o

c

e

s

s

Section 5.3 Section 5.4 Section 5.5

)

(Section

2


Design and development processes: Civil certification – DO254 / ED80 overview and content


Appendix C, D : glossary of terms, acronyms

Chapter 6 : validation and verification process

Chapter 7 : configuration management process

Chapter 8 : process assurance

Chapter 9 : certification liaison process

Chapter 10 : HW life cycle data

Supporting processes

Chapter 11 : additional considerations

Appendix A : modulation of HW life cycle data based on HW design assurance level

Appendix B : design assurance considerations for level A and B functions

Previously developed HW, COTS, tool qualification

Data vs. Design assurance level, independence definition

Additional Verification activities for DAL A &B

Chapter 5 : HW design process Design processes

Chapter 1 : introduction Scope and complexity considerations

Chapter 3 : HW life cycle

Chapter 4 : planning process

Definition of Transition criteria

Supporting process

Chapter 2 : system aspects of HW design assurance Decision making for HW design assurance strategy


Design and development processes: Complexity mastery and maturity search


Ensure electronic complexity mastery and product maturity: implementation of

structured development process as a key factor

• Hardware life cycle (V&V process)

oUsually, 2 main cycles : development prototype & industrial prototype (Note

: development prototype cycle not mandatory according to type / characteristics of the

project)

• Development Prototype

• Validate and firm-up requirements with a physical implementation

• Industrial Prototype

• Verify the requirements with a physical implementation vs. product specification

• Build the industrial dossier


Design and development processes: Development life cycle


Development Prototype Industrial Prototype

Requirements

capture

Preliminary

Design

Detailed

Design

Prototype

manufacturing

Test

HW-HW

integration tests

HW-SW

integration tests

Detailed

Design

Prototype

manufacturing

Test

HW-HW

integration tests Transition to

production

HW Qualification

HW-SW

integration tests

Delivery Works

R

A

T A A

T

T

T

T R

R R

R

R R

R

R

traceability traceability

Req capture

R

DDR

PR

PDR

CDR

LUAR

Development Life cycle : W process example

R

A

T

Review

Analysis

Test


Design and development processes: Detailled development life cycle


HW assembly level

Test

Detailed

Design

Preliminary

Design

Requirements

capture

Prototype

Implementation

Packaging level

Board level

ASIC level

HW Quality

Assurance

Planning &

Development

Modification &

Configuration

Management

Validation &

Verification

Certification

liaison

(airborne HW)

Supporting

processes

Upper level requirements

Activities at different level

PLD level

Test

Detailed

Design

Preliminary

Design

Requirements

capture

Prototype

Implementation

review

VERIFICATION

review

review

review

test

analysis

analysis

HW-HW

integration tests

review

Transition to

production

HW Qualification

Delivery Works


Design and development processes: Board development process example


Preliminary

design

Detailed

design

Prototype Verification

Board

Spec

Analysis:

- Pre-BoM

- Schematcis

- EMC

- Technology

- Safety

- Func Testability.

- Manuf Testability

- Thermal

Board Architecture Design

Board Pre-Placement

Analysis:

-EMC

-Thermal

V & V Strategy Definition

Review

Develop Board Verification SW.

Develop Enabling products

Develop Programmable component

Analysis:

- BoM

- Schematics

- EMC

- Technology

- Safety

- Func Testability.

- Documentary

- Manuf Testability

- Thermal

- JTAG

Schematic Design

Board Place & Route

Analysis:

-Packaging.

-Thermal

-Test

-Manuf Techno

Design Dossier (design

justification)

Review

Definition and

Manufacturing Dossier

Verification Procedure

Writing

Prototype Integration with

Programmable components

Complete Board

Verification

Board Verif SW Integration

Update Design and

Definition Dossier if

required

Review


Design and development processes: Multi-disciplinary


• Many specific jobs around Avionic Equipment and Electronics Development activities

working closely together

Safety &

Reliability

Environment:

• Thermal,

• Mechanical,

• EMC,

• Lightning,

• Radiation

• …

Design:

• Digital,

• Specific components (FPGA,

ASIC),

• Analog,

• Power Supply,

• PCB layout,

• Packaging

Maintenability

& Testability

Integration

Qualification

Certification

Quality

Procurement

Electronic

Components

Manufacturing

Technologies

Manufacturing

Equipment,

Electronics

Development



• Introduction

• Context




• Conclusion



Conclusion


Electronics is a major enabler for Aircraft systems

• Intelligence, performance, smart controls…

• Integration / miniaturization (more perf. in same or lower volume & weight)

• Flexibility

• …

But faced to high levels of constraints & requirements (life time, safety,

reliability, environment, certification…)

Requiring robust design and development processes, multi-diciplinary activities

for assessments, analysis, demonstration leading to safe applications

Electronics technologies are dominated and ruled

by high volume and low cost oriented

applications characterized by rapid change Requiring to survey market & trends, to adapt, to

take advantage of advanced emerging technologies

for proposing opportunities and differentiating

innovations

Requiring to prepare the future

Moore’s Law & More

More than Moore: Diversification

Mo

re M

oo

re:

Min

iatu

rizati

on

Mo

re M

oo

re:

Min

iatu

rizati

on

Combining SoC and SiP: Higher Value System

sBaseli

ne C

MO

S:

CP

U,

Mem

ory

, L

og

ic

BiochipsSensors

Actuators

HV

PowerAnalog/RF Passives

130nm

90nm

65nm

45nm

32nm

22nm...V

130nm

90nm

65nm

45nm

32nm

22nm...V

Information

Processing

Digital content

System-on-chip

(SoC)

Interacting with people

and environment

Non-digital content

System-in-package

(SiP)

Beyond CMOS



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or the disclosure of its content. This document shall not be reproduced or disclosed to a third party without the express written consent of AIRBUS Operations S.A.S. This document and its content shall not be used for any purpose other than that for which it is

supplied. The statements made herein do not constitute an offer. They are based on the mentioned assumptions and are expressed in good faith. Where the supporting grounds for these statements are not shown, AIRBUS Operations S.A.S will be pleased to

explain the basis thereof. AIRBUS, its logo, A300, A310, A318, A319, A320, A321, A330, A340, A350, A380, A400M are registered trademarks.

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