2013 8th International Microsystems, Packaging, Assembly...

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IEEE Catalog Number: ISBN: CFP1359B-POD 978-1-4799-0666-6 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2013) Taipei, Taiwan 22-25 October 2013

Transcript of 2013 8th International Microsystems, Packaging, Assembly...

  • IEEE Catalog Number: ISBN:

    CFP1359B-POD 978-1-4799-0666-6

    2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2013)

    Taipei, Taiwan 22-25 October 2013

  • SESSION 3: Advanced Packaging IChair: Shih-kang Lin (National Cheng Kung University)Co-Chair: Cheng-En Ho (Yuan Ze University )

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    EU083-1 �������������������������������������������������������������������

    ����������������������������� 31

    Rami Haidar

    �!"#$�% Heat-Resistance Study of Thermal Release Tape 35 Chieh-Yuan Chi

    INDEX

    Sessions

    978-1-4799-0666-6/13 $31.00 © 2013 IEEE 15

  • ����&'��$*������������������������������Chair: T.M. Lee (ITRI)Co-Chair: Jenn-Ming Song (National Chung Hsing University)

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    AS052-1 A Novel and Green Electroless Copper 39 Andy Chow

    AS050-1 The Evolution of organic solderability preservative process in printed circuit board application 43

    Kti Ho Tong

    TW087-1 �������������+��������������������������,��/���������'������&����6�����Applications 47

    Tao-Chi Liu

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  • SESSION 7: 3D Integration IChair: Shin Hua Chao (ASE)Co-Chair: Tao-Chih Chang (ITRI)

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    AS081-1 300 mm Wafer 3D Integration Technology using Hybrid Wafer Bonding 51 Kazuyuki Hozawa

    TW028-1 �����������'������������������;���������&���;�����/�������������

  • SESSION 8: Thermal Management IChair: Chien-Yuh Yang (National Central University)Co-Chair: Shung-Wen Kang (Tamkang University)

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  • SESSION 9: Modeling, Simulation & Design IChair: M. Y. Tsai (Chang Gung University)Co-Chair: Yu-Po Wang (SPIL)

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  • SESSION 10: Green Materials & ProcessQ��*�}��������~��;�Co-Chair: LC Chen (DuPont Taiwan Co., Ltd)

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    �!%$^�% +�����x��������`����������������]��+�����������F�������������;�]�Dielectric Properties 109

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    TW098-1 ��&��;���F&��{;����Q+����'F�V;�&'���'F���Q+&�/�'&�&Q�F���F����

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  • SESSION 12: Advanced Packaging IIChair: Hsiang-Chen Hsu (I-Shou University)Co-Chair: K. M. Chen (UMC)

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    AS058-1 �����������������{����������������������������{�����;��������6������`���������Element Analysis 120

    Nobuhiro Anzai

    TW036-1 /����F���������������������������`�������������������� 124 Cheng Kai Chung

    TW109-1 ����Q�&

  • SESSION 13: Interconnections & NanotechnologyChair: De-Shin Liu (Nationnal Chung Cheng University)Co-Chair: Chih Chen (National Chiao Tung Univ)

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    AS008-1 Effects of Wire Type and Mold Compound on Wearout Reliability of Semiconductor ������������{/������� 144

    Gan Chong Leong

    �!"%$�% �������������������������������������&������������� 149 CHIA YEN LEE

    TW127-1 �����������������������������������!���{����������������&/{� 152 Huang-Kang Tseng

    TW132-2 An Investigation on Nanoscale Bondability between Cu-Al Intermetallic Compound 158 HSIANG-CHEN HSU

    TW152-1 +������������������������!��������+�����x������&Q�������� 162 Hsing-Hua TSAI

    978-1-4799-0666-6/13 $31.00 © 2013 IEEE 22

  • ����&'��%$*�������������������������&&Chair: Tz-Cheng Chiu (National Cheng Kung University)Co-Chair: Yu-Jung Huang ( I-Shou University)

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    TW132-3 ���������������������������������F�$��Q{��������]��Q��`��+�����������

  • SESSION 15: Test & QualityChair: Jeffrey Lee (IST-Integrated Service Technology Inc.)Co-Chair: Jerry Huang (Tripod Technology Co.)

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    AS070-1 F��������Q�������������������������Q�66���Q�����;����������������}������;x���Using Permanent Magnet 186

    Naoya Tada

    978-1-4799-0666-6/13 $31.00 © 2013 IEEE 24

  • SESSION 17: 3D Integration IIChair: R. S. LEE (ITRI)Co-Chair: Chang-Chun Lee (Chung Yuan Christian University)

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    �V"?$�% �{F&Q�&'���;�Q�F&Q;�Q+FQ��F&>�&'�����F�;&{&;&����V��'���F�&;;��;�Q�F'�;�������F���Q'���F��+F'V/+��&;&Q'��

  • SESSION 18: LED & Thermal ManagementChair: Jen-Dong Hwang (TTMA) Co-Chair: Chien-Yuh Yang (National Central University)

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    AS101-1 ����������+����6������6������������]������'�����]������������������������ 211 Risako Kibushi

    �!""$�% The Analysis of the Thermal Resistance Structure of LEDs by Measuring Its Transient ���6��������

  • SESSION 19: Modeling, Simulation & Design IIIChair: Tz-Cheng Chiu (National Cheng Kung University)Co-Chair: Ben-Je Lwo (National Defense University)

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  • SESSION 20: HDI & EmbeddedChair: Eric Hsu (Nan Ya PCB Corp)Co-Chair: Anderson Cheng (ITEQ)

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    V�"$q�% &��������������������������������+���������&���������������������������Additive processing 241

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    TW157-1 �����������Q�66����������6������������������+�&��������������66������ 245 Ming-Yao Yen

    978-1-4799-0666-6/13 $31.00 © 2013 IEEE 28

  • POSTER (PCB)

  • POSTER (PACKAGING)

    Venue: 5F, Taipei Nangang Exhibition Center, Taipei, Taiwan

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    TW006-1 Thermal Stability of Hydrogen Annealed Aluminum Doped Zinc Oxide Films Investigated by Thermal Desorption Spectroscopy

    Shang-Chou Chang

    TW009-1 Nugget Shape Control in Resistance Spot Welding P. S. Wei

    TW011-1 WiFi SiP Module Using IPD Rx Balun Applications Hin-Han Chuang

    TW031-1 Novel Assembly Framework of Bi-Layered Molding Materials for 3D-ICs Packaging Lee Chang-Chun

    TW042-1 Electrical Model Analysis and Measurement of TSV to TSV Coupling Capacitance Yang Shiuan-hau

    TW061-1 CU WIRE HAST FAIL MECHANISM INVESTIGATION FOR BGA PACKAGE Chih Hung Chang

    TW062-1 Cu wire Development for Thin QFN Package using Die Attach Film (DAF) Ho-Chin Hsieh

    TW069-1 Film Over Wire (FOW) Selection for Copper Wire Application Ming-Wei Lee

    TW078-1 Molded Underfill for Flip Chip Package Chen Yu-Kai

    TW079-1 Study on thermal conductive BN/VGCF/polyimide resin composites Chin Si-Yi

    TW095-1 Effects of Annealing on Sn Whisker Formation: Role of Cu Alloy Seed Layer Wahyu Diyatmika

    TW097-1 TSV-less BSI-CIS Wafer-Level Package and Stacked CIS Module Zhi-Cheng Hsiao

    TW107-1 UNDERFILL ADHESION ENHANCEMENT VIA OPTIMIZATION OF PLASMA TREATMENT FOR 3DIC

    Chi Tung Yeh

    TW115-1 Fabrication of Robust Polyaniline Thin Film Electrodes on the Surface of Elastomeric Poly(dimethylsiloxane) for Polymeric MEMS Applications

    Kuan-Hsun Li

    TW115-2 Investigating the Influence of Various Organosilanized Substrates and Dopant Species on the Properties of Transparent Polypyrrole Thin Films Deposited on Glass Surfaces

    Kuan-Hsun Li

    TW144-1 High Thermal Conductivity Underfill study for fine pitch Cu pillar bump Huang Huei-Nuan

    TW084-1 Cu Pillar Bump-on-Trace (BoT) Design for Ultra Low-K Packaging Harold Wu

    TW084-2 Bill of Material and Geometry on FCBGA Packaging Warpage Impacts Harold Wu

    TW158-1 The Improvement of Thermoelectric Element and People’s Livelihood Applications Kuen-Shan Jaw

    AS051-1 Characterization and performance study of packaged micropump for drug delivery Vinaya kumar K.B

    AS073-1 Packaging of Polyvinylidene fluoride nasal sensor for biomedical applications Roopa Manjunatha

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