2012 Defense Guide (Rev. A)

Defense Guide

Analog

Digital Signal Processors (DSPs)

First-In First-Out (FIFOs)

Logic

www.ti.com/defense 2012

2High Reliability Guide Texas Instruments 2010

➔

HiRel Guide

Introduction and Contents

IntroductionThe Texas Instruments (TI) High Reliability (HiRel) division focuses on increasing system-level reliability in applications subjected to unusually demanding and harsh conditions, offering an extended range of temperature characterization, special packaging and special qualification options.

Devices designed into challenging applications must be able to perform seamlessly. Beyond offering products that can withstand extreme temperatures, TI’s HiRel group also offers features in its radiation-tolerant products (for example) that can improve performance, such as limiting total irradiated dosage to lower leakage currents.

Radiation tolerance is necessary not only for space and aircraft but for today’s medical applications. Now that images are captured electronically rather than stored on photographic film, circuits and data converters in dental and medical X-ray diagnostic equipment must be able to withstand low doses of radiation daily.

The benefits of HiRel devices include:• Increased long-term reliability• Lower maintenance, repair and

replacement costs• Fewer incoming inspection/testing

criteria and fewer system-level shielding requirements

Among TI’s broad device portfolio, products in the HiRel family include:• Amplifiers• Data converters

Power management integrated circuits

• Advanced CMOS (AC) logic devices

• DSPs

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Enhanced Products (EP)Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Analog-to-Digital Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Digital Isolators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Digital Media Systems-on-Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Selection Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

SpaceOverview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Data Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

Digital Signal Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

Selection Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

High TemperatureOverview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Featured Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Selection Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

Die/Wafer Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

DefenseOverview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

Featured Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

Analog Family. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42

Digital Signal Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

First-In, First-Out Memory (FIFOs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51

Logic Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

CD4000 Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57

Process Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

Symbolization. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59

Resources

Worldwide Technical Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60

➔


HiRel Guide

Introduction

The HiRel products found in this guide are organized into five segments:

Enhanced Products (EP). These products have the benefits of a controlled production baseline (one assembly/test site, one fabrication site), extended product change notification and a qualification pedigree in industry-standard packaging. TI guarantees that EP products will perform in environments with temperatures from -55°C to 125°C.

The EP line is certified to the Aerospace Qualified Electronic Component standard, which the aerospace and semiconductor industries developed for components used in military, avionic, aerospace and medical applications. In fact, TI is focusing on the emerging medical market for EP.

Space. Products in this segment are designed to be tolerant to the extreme radiation levels found beyond the Earth’s atmosphere. TI’s military performance (MIL-PRF)-38535 Qualified Manufacturer List (QML) Class V (space) products can be placed into satellite systems, space stations, launch vehicles, exploration vehicles and planetary robots.

High Temperature (HT). Designed for such applications as downhole drilling, geothermal drilling, aerospace, heavy industrial, and automotive, HT products are operable in temperatures from -55°C to 210°C for 1,000 hours. The components in this portfolio span a complete signal chain roadmap and are able to accommodate the unique requirements of signal conditioning, data capture and processing in both surface-mount ceramic or known good die packaging options.

Die/Wafer Solutions. This segment meets demand for bare die – also known as unpackaged integrated circuits – as well as known good die and wafers for automotive, computing, communication, medical, defense and entertainment applications. In addition to meeting customer requests for specific test platforms, end applications and packaging options, TI specializes in value-added processes like hybrid circuits, multichip modules, chips on board, flip chips and bumping.

Defense. This is the HiRel division’s original segment and remains its broadest. Like the Space portfolio, these products are QML-certified, qualified to MIL-PRF-38535, but also compliant with MIL-STD-883; ISO 9001; and Classes B, Q and V, with extended temperature and radiation-tolerant operating ranges.

HiRel parts support specific requirements where reliability, qualification, vendor item drawings, standard microcircuit drawings and baseline control are critical.

For more information, visit www.ti.com/hirel


➔

Enhanced Products (EP))

Overview

TI’s Enhanced Product (EP) line offers design flexibility while still meeting HiRel and Medical standards for operating environments where high reliability and long service life are a requirement. The EP line offering can benefit avionic, defense, aerospace, medical, and industrial designers. In addition, designers in other rugged operating environments and long service life application fields can benefit from the EP line.

TI’s Enhanced Product line is a commercial of-the-shelf (COTS) solution with the following key benefits:

• Fabricationandassembly controlled baseline

• Extendedproductchange notification (PCN)

• Extendedtemperatureperformance(typically -55°C to +125°C)

• Standalonedatasheet

• Qualificationpedigree

• Producttraceability

• Longlifecycles

TI’s EP line offers an additional benefit which is the availability of TI’s High Reliability Group to work with our designers to offer capabilities that surpass TI’s standard catalog offering, among them:

• SnPdsolderballpackageoptionsDifferent choice of packages from our TI standard catalog offering.

• Enhancedtestingcoveragefordevices.

TI HiRel group can work with the customer to understand their requirements to release EP devices with the features specified above. Examples of devices released under this program are as follow:

• TheMSP430F2618-EPaBGASnPdsolder ball release for implantable medical applications.

• TheADS1258-EPaQFPpackagerelease for an avionic application.

TI’s EP products are guaranteed to perform to data sheet specifications in environments that require extended temperatures (typically -55°C to +125°C).

To ensure that a device exhibits the highest quality and reliability possible for targeted applications, TI performs the following qualification procedures before the device is released:

• AllEPdevicesundergoextensiverequalification

• Qualificationdataisreviewedand audited for accuracy and compliance

• Reliabilityandelectromigrationmonitoring is performed at maximum recommended operating conditions in the targeted package.

• Certifiedtestprogramsandtesthardware

• Electricalcharacterizationisperformed across specified temperature range

• Packageperformanceisconfirmedover extended temperatures (some mold compounds are not suitable for extended temperatures).

• Nickel/palladium/gold/leadfinisheliminates “tin whisker” reliability issues

EP versus upscreening:TI’s EP portfolio offers an alternative to third party upscreening for designers who believe that an enhanced product is suitable for their particular application. Although our EP products receive additional testing and process verification over and above their commercial counterparts, they may still not be suitable for all environments, so TI strongly suggests that OEMs qualify devices for their applications. For designers with applications requiring a

ceramic/hermetic packaged integrated circuit, TI has an expansive product line to meet their needs.

TI’s EP line eliminates:• Yieldlossanddamagecausedby

electrical overstress and handling.

• Mechanicaldamage,whichcausesmoisture issues.

• Burn-in,whichcancauseleadfinishdegradation.

• LackofsupportbyICmanufacturers.

• Fewupscreeningtestfacilitieshavethe ability to test complex parts.

• NoaccesstoTI’swaferprocessinghistory by third parties.

Additional value that can be expected from TI’s EP line:• Qualificationsummaryreport

• Accesstoleading-edgecommercialtechnology

• CommitmenttotheIndustrial,Medical, Avionic and Defense markets

• Customer-drivenportfolio

• Enhancedobsolescencemanagement

In addition to the active EP products listed in this guide and on our website, TI will evaluate the release of other TI’s catalog devices in an EP versions based on customer requirements.

Please contact TI’s Product Information Center to discuss your needs. (Contact information on back cover.)

➔


Enhanced Products (EP)

Analog-to-Digital ConvertersADS6445-EP

Get samples, datasheets and evaluation modules at www.ti.com/sc/device/ADS6445-EP

The ADS6445-EP high-performance, 14-bit, quad-channel analog-to-digital converter operates at a 125-MSPS sample rate. Serial LVDS outputs reduce the number of interface lines, allowing for a 64-pin QFN package and thus high system integration density. The device includes 3.5-dB coarse gain and 1-dB to 6-dB programmable fine gain options for SFDR/SNR trade-off.

Key Features• -55°C to 125°C operating junction

temperature range• 3.3-V analog and digital supply• 1680-mW power consumption (typ)•Simultaneous sample and hold

Applications•Base-station IF receivers•Diversity receivers•Medical imaging•Radar systems•Test equipment

ADS1258-EP

Get samples, datasheets and evaluation modules at www.ti.com/sc/device/ADS1258-EP

The ADS1258-EP 16-channel 24-bit analog-to-digital converter provides single-cycle settled data at channel scan rates from 1.8 to 23.7 kSPS per channel. A flexible input multiplexer accepts combinations of eight differential or 16 single-ended inputs with a full-scale differential range of 5 V or true bipolar range of ±2.5 V when operating with a 5-V reference. The fourth-order delta-sigma modulator is followed by a fifth-order sinc digital filter optimized for low-noise performance.

The differential output of the multiplexer is accessible to allow signal conditioning before the input of the ADC. Internal system monitor registers provide supply voltage, temperature, reference voltage, gain and offset data.

Key Features•Fixed- or automatic-channel scan• 125 kSPS fixed-channel data rate or

23.7 kSPS/channel auto-scan data rate

• 42-mW power consumption (typ)• 48-pin HTQFP or VQFN package• 16 single-ended or 8 differential

inputs

Applications•Medical, avionics and process

control•Machine and system monitoring•Fast scan multichannel

instrumentation• Industrial systems•Test and measurement systems

AIN0

AVDDMux

Access VREFN GPIO(7:0) DVDD

PDWN

VREFP

AVSS

AIN1AIN2AIN3AIN4AIN5AIN6AIN7AIN8AIN9

AIN10AIN11AIN12AIN13AIN14AIN15

AINCOM

Flex Muxand

Temp Monitor

andVDD

Monitorand

SensorDetect

∆ΣModulator

ProgrammableDigitalFilter

RESETCS

STARTDRDYDINDOUT

DGNDPLLCAPCLKSEL CLKIN/CLKOUT

XTAL1XTAL2

SerialInterface

General-PurposeI/O

Clock Generator and 32 kHz PLL

➔



Digital IsolatorsISO721-EP

Get samples, datasheets and evaluation modules at www.ti.com/sc/device/ISO721M-EP

The ISO721-EP digital isolator has a logic input and output buffer separated by a silicon dioxide (SiO2) insulation barrier. This barrier provides galvanic isolation of up to 400 V. Used in conjunction with isolated power supplies, these devices prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry.

Key Features• 4000-V(peak) Isolation, 560-Vpeak

VIORM • UL 1577, IEC 60747-5-2 (VDE

0884, Rev. 2)• IEC 61010-1, IEC 60950-1 and

CSA approved• 50-kV/µs transient immunity (typ)

• 0- to 150-Mbps signaling rate• Low-power sleep mode•High electromagnetic immunity• Low input-current requirement•Failsafe output

Applications• Industrial fieldbus

• Modbus• Profitbus• DeviceNet data buses• Smart Distributed Systems

•Computer peripheral interface•Servo control interface•Data acquisition

Data120 Ω

CAN

Amp Amp

ISO ISO

DSPSensor

DSP

ISO ISO

CAN

120 Ω

2xISO721M

SN65HVD233

Fan

SN65HVD233

2xISO721M

TMP101

SM320F2812 DSPwith CAN controller

M

SM320DM355-EP

Get samples, datasheets and evaluation modules at www.ti.com/sc/device/SM320DM355-EP

The SM320DM355-EP combines high-performance MPEG-4 HD (720p) codecs and JPEG codecs (up to 50 megapixels per second) with low-power consumption. The DM355 also enables a seamless interface to most additional external devices required for a complete digital camera implementation. The interface is flexible enough to support various types of CCD and CMOS sensors.

Key Features•ARM926EJ-S core•ARM9 memory architecture•MPEG4/JPEG coprocessor•Video processing subsystem•Temperature range -55oC to +125oC

Applications•Digital still cameras•Digital photo frames• IP security cameras•Four-channel digital video recorders•Video doorbells•Portable digital video applications

➔ Digital Media System-on-Chip

Peripherals

JTAG(optional)

CCD/CMOSModule

CLOCKPLLPLLs

JTAJTAGI/F

Clocks

ARM

z )

ARM926EJ-S_Z8

I-cach

e16 K

B

l-cache16KBB

RA

M32 K

B

RAM32KBB

D-cache8K

D-cache8KB

RO

M8KROM8KB

CCDC

3AH3A

DDR

MH

z )

DDRcontroller

DLDLL/PHY

CCDCIPIPE

VPBE

Vide

oEncod

er

VideoEncoder

10bDAC OS

D

OSD

erc

ARM

Enhanced

channels3PCC /TC(100 MHz

Nand /Nand/SM/

(AEMIF)

USB 2.0

Speakermicrophone

ASP (2x)

cig

VPSS

UART (x3)

I2C

Timer/

GIO

RTO

VPFE

Enhanced

channels3PCC /TC(100 MHz

MPEG4/JPEGCoprocessor

➔



Microcontrollers

MSP430F2274-EP

Get samples, datasheets and evaluation modules at www.ti.com/sc/device/MSP430F2274-EP

The MSP430F2274-EP is the first extended temperature mixed-signal microcontroller from Texas Instruments designed specifically for ultra-low-power applications. A flexible clocking system, multiple operation modes and zero-power, always-on, brown-out reset (BOR) can reduce power consumption and dramatically extend battery life. The MSP430 BOR function is always active, even in low-power modes, to ensure the most reliable performance possible.

The MSP430 CPU architecture, with 16 registers and 16-bit data and address buses, minimizes power-consuming fetches to memory, while a fast vectored-interrupt structure reduces the need for wasteful CPU software flagpolling. Intelligent hardware peripheral features were also designed to allow tasks to be completed more efficiently and independently of the CPU.

Key Features•Two 16-bit timers with three

capture/compare registers•Universal serial communication

interface• 10-bit 200-kSPS A/D converter with

integrated reference and data transfer controller

• 32 I/O pins• 40-pin QFN package

Applications •Handheld defense devices requiring

low power •Avionics • Industrial •Control and monitoring equipment •High-temperature electronics •Metering equipment

Flash ClockSystem

Watchdog

RISC CPU16-Bit

JTAG

/Deb

ug

ACLK

SMCLK

MAB

MDB

AnalogPeripheral

DigitalPeripheral

MCLK

ACLK

SMCLK

RAM Port

MSP430F249-EP

Get samples, datasheets and evaluation modules at www.ti.com/sc/device/MSP430F249-EP

The MSP430F249-EP microcontroller has two built-in 16-bit timers, a fast 12-bit A/D converter, a comparator, four universal serial communication interface modules and as many as 48 I/O pins. A calibrated digitally controlled oscillator facilitates ultra-fast >1µs wakeup from standby mode.

Like other devices in the MSP430™ microcontroller family, the MSP430F249-EP features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.

Key Features• 1.8-V to 3.6-V range•Temperature range -55oC to +125oC

• 64-pin LQFP package

Applications•Control systems•Sensor systems• Industrial control applications•Handheld meters•High temperature electronics

XIN/XOUTXT2IN XT2OUT

2 2

DVCC DVSS AVCC AVSS P1X/P2.XP3.X/P4.XP5.X/P6.X

2xB 4xB

OscillatorsBase Clock

System+

ACLK

SMCLK

Flash

60 kB56 kB48 kB32 kB

RAM

2 kB4 kB4 kB4 kB

ADC 1212-Bit

8 Channels

PortsP1/P2

2x8 I/Ointerruptcapability

PortsP3/P4P5/Pg

4x8 I/O

USCI A1UART/

LIN,IrDA, SPI

USCI B1SPI, I2C

USCI A0UART/

LIN,IrDA, SPI

USCI B0SPI, I2C

Comp_A+

Timer_B7

7 CCRegisters,Shadow

Reg

Timer_A3

3CCRegisters

WatchdogWDT+

15/16-Bit

HardwareMultiplier

MPY,MPYS,MAC,MACS

BORSVS/SVM

RST/NMI

JTAGInterface

Emulation

MDB

MAB16 MhzCPU

Incl. 16Registers

MCLK

➔



Selection Tables

Operational Amplifiers

Device Description

Iq Per Channel

(Max) (mA)

Number of

Channels

VIO (25 deg C) (Max) (mV)

Slew Rate

(typ) (V/µs)

Total Supply Voltage (V) (Max) (+5 V = 5, +/-5 V

= 10) Pin/

Package(s)

INA159-EP Precision gain of 0.2 level translation difference amplifier 2 1 1.45 15 5.5 8MSOP

INA193A-EP Current shunt monitor: -16 V to +80 V common-mode range 1.3 1 2 1 18 5SOT-23

LM258A-EP Dual operational amplifier 0.6 2 7 0.3 32 8SOIC

LM2902-EP Quad operational amplifier 0.3 4 7 0.5 26 14TSSOP

LT1014D-EP Quad precision operational amplifier 0.55 4 7 0.5 32 16SOIC

MC33078-EP Dual high-speed, low-noise operational amplifier 2.5 2 3 7 10 8SOIC

OPA2333A-EP 1.8-V micropower CMOS operational amplifier, zero-drift series 0.025 2 0.01 0.16 5.5 8SOIC

OPA333A-EP 1.8-V micropower CMOS operational amplifier, zero-drift series 0.025 1 0.01 0.16 5.5 5SC70, 5SOT-23

OPA336-EP Single-supply micropower CMOS MicroAmplifier™ operational amplifier in miniature packages 0.035 1 0.5 0.03 5.5 5SOT-23

OPA340-EP Single-supply rail-to-rail MicroAmplifier operational amplifier in miniature packages 0.95 1 0.5 6 5.5 5SOT-23

THS3201-EP 1.8-GHz, low-distortion current, feedback amplifier 22 1 4 10500 15 8MSOP PowerPAD™

THS4503-EP Wideband, low-distortion, fully differential amplifier 28 1 7 1300 15 8MSOP PowerPAD

TLC2252A-EP Advanced LinCMOS™ technology-based rail-to-rail very low-power operational amplifier 0.063 2 0.85 0.12 16 8SOIC

TLC2252-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier 0.063 2 1.5 0.12 16 8SOIC

TLC2254A-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier 0.063 4 0.85 0.12 16 14SOIC

TLC2254-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier 0.063 4 1.5 0.12 16 14SOIC

TLC2272A-EP Advanced LinCMOS technology-based rail-to-rail dual operational amplifier 1.5 2 0.95 3.6 4.4 8SOIC

TLC2274A-EP Advanced LinCMOS technology-based rail-to-rail operational amplifier 1.5 4 0.95 3.6 16 14SOIC, 14TSSOP

TLC2274-EP Advanced LinCMOS technology-based rail-to-rail operational amplifier 1.5 4 2.5 3.6 16 14SOIC, 14TSSOP

TLE2021A-EP Excalibur™ high-speed, low-power precision operational amplifier 0.3 1 0.4 0.5 40 8SOIC

TLE2021-EP Excalibur high-speed, low-power precision operational amplifier 0.3 1 0.6 0.5 40 8SOIC

TLE2022A-EP Excalibur high-speed, low-power precision operational amplifier 0.3 2 0.4 0.5 40 8SOIC


TLE2024A-EP Excalibur high-speed, low-power precision operational amplifier 0.3 4 0.85 0.5 40 16SOIC


Comparators

Device Description

Iq Per Channel

(Max) (mA)

Number of

Channels


Total Supply Voltage (V)

(Max) (+5 V = 5, +/-5 V = 10)

Single Supply Pin/Package(s)

LM211-EP Differential comparator with strobes 6 1 3 30 8SOIC

LM239A-EP Quad differential comparator 0.5 4 2.5 30 14SOIC, 14TSSOP

LM293-EP Dual differential comparator 0.5 2 5 30 8SOIC

TLC3702-EP Micropower LinCMOS™ technology-based voltage comparator 0.02 2 5 16 Yes 8SOIC

TLC372-EP LinCMOS dual differential comparator, nanopower 0.15 2 5 16 8SOIC

TLV3011-EP 1.8-V, SOT-23 comparator with voltage reference 0.005 1 12 5.5 Yes 6SOT-23

TLV3492A-EP Nanopower, push-pull output comparator 0.002 2 15 5.5 Yes 8SOIC

TLV3701-EP Nanopower, push-pull output comparator 0.001 1 5 16 Yes 5SOT-23

➔



Selection Tables


Device Description

Iq Per Channel

(Max) (mA)

Number of

Channels


Slew Rate

(typ) (V/µs)

Total Supply Voltage (V) (Max) (+5 V = 5, +/-5 V

= 10) Pin/

Package(s)

TLE2027-EP Excalibur™, low-noise, high-speed, precision operational amplifier 5.3 1 0.1 2.8 38 8SOIC

TLE2141-EP Excalibur low-noise high-speed precision operational amplifier 4.4 1 1.4 45 44 8SOIC

TLE2144-EP Excalibur low-noise, high-speed precision quad operational amplifier 4.4 4 1.4 45 44 16SOIC

TLV2252A-EP Advanced LinCMOS™ technology-based rail-to-rail very low-power operational amplifier 0.15 2 0.85 0.1 16 8SOIC

TLV2252-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier 0.15 2 1.5 0.1 16 8SOIC

TLV2254-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier — 4 1.5 0.1 16 14SOIC

TLV2254A-EP Advanced LinCMOS technology-based rail-to-rail very low-power operational amplifier — 4 0.85 0.1 16 14SOIC

TLV2371-EP 550-µA/ch, 3-MHz, rail-to-rail input/output operational amplifier 0.56 1 4.5 2 16 5SOT-23

TLV2374-EP 550-µA/ch, 3-MHz, rail-to-rail input/output operational amplifier 0.56 4 4.5 2 16 14SOIC

TLV2462A-EP Low-power, rail-to-rail input/output operational amplifier with shutdown 0.575 2 1.5 1.6 6 8SOIC

TLV2464A-EP Low-power, rail-to-rail, input/output operational amplifier with shutdown 0.9 1 1.5 1.6 6 14SOIC, 14TSSOP

TLV2772A-EP 2.7-V high-slew-rate rail-to-rail output operational amplifier with shutdown 2 2 1.6 6, 9 6 8SOIC

TLV2774A-EP 2.7-V, high slew rate rail-to-rail output operational amplifier with shutdown 2 4 2.1 6 5.5 14SOIC

TLV2774-EP 2.7-V, high slew rate rail-to-rail output operational amplifier with shutdown 2 4 2.7 6 5.5 14SOIC

TLV4113-EP Dual high-output drive operational amplifier with shutdown 1 2 3.5 1.57 6 10MSOP PowerPAD

High-Speed Operational Amplifiers

THS4032-EP 100-MHz low-noise high-speed amplifier 11 2 100 90 100 8MSOP-PowerPAD™

THS4271-EP Low-noise, high slew rate, unity gain, stable voltage feedback amplifier 24 1 400 160 1000 8MSOP-PowerPAD

Instrumentation Amplifier

Device Description Gain (V/V)

CMRR (Min) (dB)

Non-Linearity

(+/-) (Max) (%)

Output Offset (+/-) (Max) (uV)

Bandwidth at G=100 (Min)

(kHz)Pin/

Package(s)

INA129-EP Precision, low-power instrumentation amplifier 1 to 10000 120 0.002 500/G 200 8SOIC

Special FunctionsDevice Description Pin/Package(s)

OPA4872-EP 4:1 high-speed multiplexer 14SOIC

TL441-EP Logarithmic amplifier 16SO

Clocks

Device Description VCC (V) No. of

Outputs Output Drive

(mA) Input Level

Output Level

Static Current (mA)

Pin/Package(s)

CDC2351-EP 1- to 10-line clock driver with three state outputs 3.3 10 -12/12 LVTTL LVTTL 15 24SSOP

CDCP1803-EP 1:3 LVPECL clock buffer with programmable divider 3.3 3 — multiple LVPECL — 24VQFN

(continued)

➔



Selection Tables

Interface Isolators

Device Description

Supply Voltage(s)

(V) Footprint# of

Channels

Insulation Rating (VRMS)

Thermal Shutdown

Input Threshold

Data Rate (MBPS)

Channel Conf.

Prop. Delay (Max) (ns)

Input Noise Filter

Pin/Package

ISO721M-EP Single 150 MBSPS digital isolator 3.3, 5 ADuM1100 1 1500 No CMOS 150 1/0 16 None 8SOIC

ISO7241A-EP 1-MBPS quad ch, 3/1 digital isolator 3.3, 5 ADuM1401 4 2500 No TTL 1 3/1 80 Yes 16SOIC

Analog-to-Digital Converters

Device DescriptionRes. (bits)

Sample Rate

(MSPS)

No. of Input

Channels Architecture SINAD (dB)

SNR (dB)

SFDR (dB)

DNL +/-LSB

INL +/-LSB

Supply Voltage

(V) Power (mW)

Pin/Package(s)

ADS1258-EP 16-channel, 24-bit analog-to-digital converter 24 0.13 16 Delta-Sigma — — — 1 — 4.75,

5.25 42 48QFN, 48QFP

ADS5440-EP 13-bit, 210-MSPS analog-to-digital converter 13 210 1 Pipeline 68 68 80 0.95 1.5 4.75,

5.25 2250 80HTQFP

ADS5444-EP 13-bit, 250-MSPS analog-to-digital converter 13 250 1 Pipeline 68 69 73 — — 4.75,

5.25 2250 80HTQFP

ADS5463-EP 12-bit, 500-MSPS analog-to-digital converter 12 500 1 Pipeline 65.1 65.2 84 0.95 1.5 4.75,

5.25 2250 80HTQFP

ADS5500-EP 14-bit, 125-MSPS analog-to-digital converter 14 125 1 Pipeline 70 71 84 1.1 8 3, 3.6 780 64HTQFP

ADS6445-EP Quad-channel, 14-bit, 125-/105-/80-/65-MSPS ADC with serial LVDS outputs

14 125 4 Pipeline 72.3 73.2 83 2.5 5 3, 3.6 1680 64VQFN

THS1206-EP 12-bit, 6-MSPS, ADC quad-channel (config.), DSP/up if, integrated 16x FIFO

12 6 4 Pipeline 65 68 71 1 1.8 4.75, 5.25 186 32TSSOP

THS1401-EP 14-bit, 1-MSPS, DSP-compatible analog-to-digital converter 14 1 1 Pipeline 70 72 80 1 5 3, 3.6 270 48HTQFP



TLC1543-EP 10-bit analog-to-digital converters with serial control and 11 analog inputs

10 .038 11 SAR — — — 1 1 — 4 20SOIC

TLC2543-EP 12-bit ADC with serial control and 11 analog inputs 12-bit 200-kSPS ADC ser.

12 .066 11 SAR — — — 1 1 4.5, 5.5 5 20SOIC, 20SSOP

TLV1548-EP Low-voltage 10-bit ADC with serial control and 8 analog inputs 10 .085 8 SAR — — — 1 1 2.7, 5.5 — 20SSOP

TLV2548-EP

12-bit, 200-kSPS ADC serial output, auto powerdown (software and hardware), low power with 8x FIFO with 8 channels

12 0.2 8 SAR 65 — 75 1.2 1.2 3, 5.5 1375 —

TLV2556-EP 12-bit, 200-kSPS, 11-channel, low-power serial ADC with internal reference

12 0.2 11 SAR — — — 1 1 2.7, 5.5 — 20TSSSOP

➔



Selection Tables

Audio Analog-to-Digital Converters

Device Description

Supply Voltage(s)

(V) No. of Inputs

No. of Outputs

Control interface

Pd (typ) (mW)

Resolution (bits)

Additional Features

Sampling Rate (Max)

(kHz) Pin/

Package(s)

PCM4202-EP 118-dB SNR stereo audio analog-to-digital converter (extended qualification)

3.3 V digital, 5 V

analog 2 0 H/W 300 24 Int. PLL 216 28SSOP

Digital-to-Analog Converters

Device Description Res. (bits)

Sample/Update

Rate (MSPS)

Setting Time (μs)

DAC Channels Architecture

SNR (dB)

SFDR (dB)

DNL +/- LSB

INL +/- LSB

Supply Voltage

(V)Power (mW)

Pin/Package(s)

DAC5652-EP 10-bit, 275-MSPS, dual digital-to-analog converter 10 275 0.02 2 I-steering 63 80 1 0.5 3, 3.6 290 48TQFP

DAC5662-EP Dual 12-bit, 200-MSPS 12 275 0.02 2 l-steering 73 81 2 2 3, 3.6 330 48TQFP

DAC5672-EP Dual 14-bit, 200-MSPS 14 275 0.02 2 l-steering 77 84 3 4 3, 3.6 330 48TQFP

DAC5675-EP 14-bit, 400-MSPS 14 400 0.012 1 l-steering — 77 2 4 315, 3.6 820 48HTQFP

DAC5687-EP 16-bit, 500-MSPS, 2x-8x interpolating dual-channel DAC 16 500 0.012 2 l-steering 75 80 3 6 3, 3.6 — 100HTQFP

DAC8830-EP 16-bit, ultra-low-power voltage output 16 1 1 1 R-2R — — 1 1 2.7, 5.5 0.015 8SOIC

DAC8831-EP 16-bit, ultra-low-power voltage output 16 2 1 1 R-2R — — 1 1 2.7, 5.5 0.015 14SOIC

TLV5614-EPQuad, serial-in, programmable settling time, low power, hardware or software powerdown

12 0.102 3 4 String 74 70 1 4 2.7, 5.5 3.6 16TSSOP

TLV5618A-EP Digital-to-analog converter with power down 12 0.093 3 2 String 76 72 1 4 2.7, 5.5 1.8 8SOIC

TLV5619-EP 12-bit, single-channel DAC, parallel, voltage out, low power 12 1 1 1 String 78 72 1 4 2.7, 5.5 4.3 20SOIC

TLV5638-EP 12-bit, 1-µs serial input dual DAC, programmable internal reference, settling time 12-bit, 1 or 3.5 µs

12 0.233 1 2 String 74 72 1 4 2.7, 5.5 4.5 8SOIC

Digital to Analog Audio Converters

Device Description

SNR (typ) (dB) # DAC

Sampling Rate (Max) (kHz)

Resolution (bits)

Digital Audio

InterfaceControl

Interface

Pd (Typ) (mW)

Pin/Package(s)

PCM4104-EP 118dB SNR 4-channel audio DAC 118 4 192 24 I2S TDM H/W SPI 200 48TQFP

PCM4202-EP 118dB SNR stereo audio ADC 118 2 216 24 PCM/DSD H/W 300 28SSOP

Video Decoder

Device Description

Supply Voltage

(V) Input

Format Output Format

Analog Inputs

Input Standard(s) ADC

Output Standards Pin/Package

TVP5150AM1-EP Ultra-low-power NTSC/PAL/SECAM video decoder w/robust sync detector 3.3 CVBS

S-Video8bit 4:2:2

YCbCr 2 NTSC/PAL/SECAM

9-bit 20MHz

ITU-R BT.656 32TQFP

➔



Selection Tables

LDOs

Device Description

Regulated outputs

(No.) Output voltage

options (V)

Vin (Min)

(V) Vin

(Max) (V)

Iout (Max)

(A) Iq (typ) (mA)

Pin/Package(s)

TPS70345-EP Dual-output low-dropout voltage regulators with power-up sequencing 2 1.2, 3.3 2.7 6 2.35 0.25 24HTSSOP

TPS70751-EP Dual-output low-dropout voltage regulators with power-up sequencing 2 1.8, 3.3 2.7 6 0.25 0.187 20HTSSOP

TPS71202-EP Dual, 250-mA output, ultra-low-noise, high PSRR, low-dropout linear regulator 2 Adj. — — — — 10SON

TPS71501-EP 50-mA, 24-V, 3.2-µA supply current, low-dropout linear regulator 1 Adj. 2.5 24 0.05 0.003 5SC70

TPS72118-EP Low-input voltage, cap-free, 150-mA low-dropout linear regulators 1 1.8 1.8 5.5 0.15 850 5SOT-23

TPS731xx-EP Cap-free NMOS 150-mA low-dropout regulator with reverse current protection 1 Adj., 1.5, 1.8, 2.5, 3.0,

3.2, 3.3, 5.0 1.7 5.5 0.15 0.4 5SOT-23


3.0, 3.3, 5.0 1.7 5.5 0.25 0.4 5SOT-23


3.2, 3.3 1.7 5.5 0.4 0.001 5SOT-23, 6SOT-223,

8SON

TPS75125-EP Fast transient response 1.5-A low-dropout voltage regulator with power good 1 2.5 2.7 5.5 1.5 0.075 20HTSSOP

TPS752xx-EP Fast transient response voltage regulators 1 Adj., 1.5, 1.8, 2.5, 3.3 2.7 5 2 0.075 20HTSSOP

TPS752xxM-EP Fast transient response voltage regulators 1 1.5 2.7 5 2 — 20HTSSOP

TPS753xx-EP Fast transient response 1.5-A low-dropout voltage regulator 1 Adj., 1.5, 1.5, 2.5, 3.3 2.7 5 1.5 0.075 20HTSSOP

TPS767xx-EP Fast transient response 1-A low-dropout voltage regulators 1 Adj., 1.5, 1.8, 2.5, 3.3, 5.0 2.7 10 1 0.085 20HTSSOP

TPS767D301-EP Dual-output low-dropout voltage regulators 2 Adj., 3.3 2.7 10 1 0.085 28HTSSOP

TPS768xx-EP Fast transient response 1-A low-dropout voltage regulators 1 Adj., 1.5, 1.8, 2.5, 3.3, 5.0 2.7 10 1 0.085 20HTSSOP

TPS76901-EP Ultra-low-power, 100mA low-dropout linear regulator 1 1.2 to 5.5 2.7 10 0.1 0.018 5SOT

TPS77401-EP 250-mA low-dropout voltage regulator with power-good output 1 Adj. 2.7 10 0.25 0.09 8MSOP

TPS775xx-EP Fast transient response 500-mA low-dropout voltage regulators 1 Adj., 1.5, 1.8,2.5, 3.3 2.7 10 0.5 0.085 20HTSSOP

TPS776xx-EP Fast transient response 500-mA low-dropout voltage regulators 1 Adj., 1.5, 1.8, 2.5, 3.3 2.7 10 0.5 0.085 20HTSSOP

TPS791xx-EP Ultra-low-noise, high PSRR, fast RF, 100-mA low-dropout linear regulator 1 Adj., 1.8, 3.3, 4.7 2.7 5.5 0.1 0.17 6SOT-23

TPS79318-EP Ultra-low-noise, high PSRR, fast RF, 200-mA low-dropout linear regulator 1 1.8 2.7 5.5 0.2 0.17 5SOT-23

TPS793xx-EP Ultra-low-noise, high PSRR, fast RF, 200-mA low-dropout linear regulator 1 Adj., 1.8, 2.5, 3.3,

4.75 2.7 5.5 0.2 0.17 6SOT-23

TPS79718-EP Ultra-low-power, 10-mA low-dropout linear regulators with power good 1 1.8 2 5.5 0.01 0.005 5SC70

TPS79730-EP Ultra-low-power, 10-mA low-droput linear regulators with programmable output 1 3 1.8 5.5 0.01 0.005 5SC70

DC/DC Controllers

Device Description Vin (Min)

(V)

Vin (Max)

(V) Duty Cycle (Max) (%)

Iout (Max)

(A)

Iq (typ) (mA)

Switching Frequency (Max)

(kHz) Type Pin/

Package(s)

TL1451A-EP Dual pulse-width-modulation control circuits 3.6 50 100 3 1.7 500 Non-synchronous 16SOIC

TPS40055-EP Wide-input synchronous buck controller 8 40 94 20 1.5 1000 Synchronous 16HTSSOP

TPS40200-EP Wide-input-range non-synchronous voltage-mode controller 4.5 52 90 3 1.5 500 Non-

synchronous 8SOIC

TPS5120-EP Dual-output two-phase synchronous buck DC/DC controller 4.5 28 100 1.5 1.1 500 Synchronous 30TSSOP

➔



Selection Tables

LDOs (continued)

Device Description

Regulated outputs

(No.) Output voltage

options (V)

Vin (Min)

(V) Vin

(Max) (V)

Iout (Max)

(A) Iq (typ) (mA)

Pin/Package(s)

UC2832-EP Precision low-dropout linear controllers 1 2 3.3 36 0.1 3.3 16SOIC

UCC284-EP Single-output LDO, 500-mA, fixed (5 V), low quiescent current, wide-input, voltage range — -5 -5.2 -16 0.5 0.2 8SOIC

PWM Power Driver

Device Description Vs (mim) (V) Vs (Max) (V) Iq (Max) (mA)

Saturation Voltage (Max)

(V)Output Current

(Min) (A) Pin/Package(s)

DRV401-EP Sensor signal conditioning for close-loop magnetic current sensor 4.5 5.5 6.8 0.4 0.2 20SO PowerPAD

20VQFN

MOSFET Drivers

Device Description

Rise Time (ns)

Peak Output Current (A)

No. of Outputs

Input Threshold

Driver Configuration

Vcc (Min)

(V)

Vcc (Max)

(V)

Prop Delay (ns)

Fall Time (ns)

Pin/Package(s)

TPS2818-EP Inverting high-speed MOSFET driver with internal regulator 25 2 1 CMOS Inverting 5 14 50 35 5SOT-23

TPS2819-EP Non-inverting high-speed MOSFET driver with internal regulator 25 2 1 CMOS Non-Inverting 5 14 50 35 5SOT-23

UCC27423-EP Dual 4A, MOSFET driver with enable 20 4 2 CMOS Inverting 4 15 30 15 8SOIC

UCC27424-EP Dual 4A, high-speed, low-side MOSFET driver with enable 20 4 2 CMOS Non-Inverting 5 15 25 15 8MSOP-

PowerPAD™

Multi-Channel IC (PMIC) Solutions

Device Description

Regulated outputs

(No.) LDO

Vin (Min)

(V)

Vin (Max)

(V) Processor

Name

Step-Down DC/DC

ControllerPin/

Package(s)

TPS75003-EP Triple supply power management IC for powering FPGAs and DSPs 3 1 2.2 6.5 Altera, Xilinx 2 20QFN

Power Factor Correction ICs

Device Description

Practical Operating Frequency (Max)

(MHz)

Duty Cycle (Max) (%)

Startup Current

(mA)

Vref tol (%)

Vref (V)

Operating Supply Current

(mA)

Operating Supply

(Max) (V)

UVLO Thresholds On/Off (V)

Pin/Package(s)

UC2854B-EP Advanced high-power factor preregulator 0.2 95 0.25 1.3 7.5 12 20 10.5/10 16SOIC

UCC2818-EP BiCMOS power factor preregulator 0.25 100 0.15 1.5 7.5 4 18 10.5/10 16SOIC

PWM Power Supply Controllers

Device Description Topology

PWM Outputs

(#)

UVLO Thresholds On/Off (V) Control Method

Frequency (Max) (kHz)


Regulated Output (#)

Pin/Package

UC1842A-EP Current-mode PWM controller Boost, Flyback, Forward 1 16/10 Current mode 500 100 1 8SOIC

UC1843-HIREL Current-mode PWM controller Boost, Flyback, Forward 1 8.4/7.6 Current mode 450 100 1

UC1843A-EP Current-mode PWM controller Boost, Flyback, Forward 1 8.5/7.9 Current mode 500 100 1 8SOIC

UC1844A-EP Current-mode PWM controller Boost, Flyback, Forward 1 16/10 Current mode 500 50 1 8SOIC

UC1846-EP Current-mode PWM controller Boost, Flyback,

Forward, Full-Bridge, Half-Bride, Push-Pull

2 7.7/6.95 Current mode 450 50 2 16SOIC

UCC2800-EP Low-power BiCMOS current-mode PWM

Boost, Flyback, Forward 1 7.2/6.9 Current mode 1000 100 1 8SOIC



➔



Selection Tables

PWM Power Supply Controllers (continued)

Device Description Topology

PWM Outputs

(#)

UVLO Thresholds On/Off (V) Control Method

Frequency (Max) (kHz)


Regulated Output (#)

Pin/Package









UCC2808A-1EP Low-power current mode push-pull PWM

Full-Bridge, Half-Bridge, Push-Pull 2 12.5/8.3 Current mode 1000 50 2 8SOIC

UCC2808A-2EP Low-power current mode push-pull PWM

Full-Bridge, Half-Bridge, Push-Pull 2 4.3/4.1 Current mode 1000 50 2 8SOIC

UC2825A-EP High-speed PWM controller Boost, Flyback,

Forward, Full-Bridge, Half-Bride, Push-Pull

2 9.6 Current mode, Voltage mode 1000 50 2 16SOIC

UC2875-EP Phase shift resonant controller Full-Bridge 4 10/7/9.2 Current mode, Voltage mode 1000 100 4 28SOIC

UCC2895-EP BiCMOS advanced phase shift PWM controller Full-Bridge 4 11.8/9.8 Current mode 527 100 4 20SOIC

UCC28C43-EP Low-power BiCMOS current-mode PWM

Boost Buck Flyback Forward 1 8.4/7.6 Current mode 1000 100 1 8SOIC

UCC28C45-EP Low-power BiCMOS current-mode PWM

Boost Buck Flyback Forward 1 8.4/7.6 Current mode 1000 50 1 8SOIC

SWIFT™ DC/DC Converters

Device Description

Vin (Min)

(V)

Vin (Max)

(V)

Vout (Min)

(V)

Vout (Max)

(V) Preset Vout (V)

Iout (Max)

(A)

Switching Frequency (Max) (kHz)

Pin/Package(s)

TPS5410-EP 5.5V to 36-V, 1A, 500-kHz step-down SWIFT converter 5.5 36 1.23 31 — 1 500 8SOIC

TPS5420-EP 5.5V to 36V, 2A, 500-kHz step-down SWIFT converter 5.5 36 1.23 31 — 2 500 8SOIC

TPS5430-EP 5.5V to 36V, 3A, 500-kHz step-down SWIFT converter 3.6 5.5 1.23 31 — 3 500 8SO, PowerPAD™

TPS54310-EP 3V to 6V, 3A Synchronous Step Down SWIFT converter 3 6 0.9 3.3 — 3 700 20HTSSOP

TPS54311-EP 3V to 6V, 3A output synchronous-buck PWM switcher with integrated FETs 3 6 — — 0.9 3 700 20HTSSOP






TPS54350-EP 4.5V to 20V input, 3A output synchronous PWM switcher with integrated FET 4.5 20 0.891 12 — 3 700 16HTSSOP

TPS54354-EP 4.5V to 20V input, 3A output synchronous PWM switcher with integrated FET 4.5 20 — — 1.8 3 600 16HTSSOP

TPS54356-EP 4.5V to 20V input, 3A output synchronous PWM switcher with integrated FET 5.5 20 — — 3.3 3 600 16HTSSOP

TPS5450-EP 5.5V to 36V, 5A, 500kHz Step Down SWIFT converter 5.5 36 1.22 31 — 5 500 8SO PowerPAD

TPS54610-EP 3V to 6V, 6A output synchronous buck PWM switcher with integrated FETs 3 6 0.9 4.5 — 6 700 28HTSSOP

➔



Selection Tables

SWIFT™ DC/DC Converters (continued)

Device Description

Vin (Min)

(V)

Vin (Max)

(V)

Vout (Min)

(V)

Vout (Max)

(V) Preset Vout (V)

Iout (Max)

(A)

Switching Frequency (Max) (kHz)

Pin/Package(s)

TPS54613-EP 3V to 6V input, 6A output synchronous buck PWM switcher with integrated FETs 3 6 — — 1.5 6 700 28HTSSOP

TPS54615-EP 3V to 6V input, 6A output synchronous buck PWM switcher with integrated FETs 3 6 — — 2.5 6 700 28HTSSOP

TPS54680-EP 3V to 6V Input, 6A output tracking synchronous buck PWM switcher 3 6 0.9 3.3 — 6 700 28HTSSOP

TPS62110-EP 17V, 1.5A synchronous step-down converter 3.1 17 1.153 16 — 1.5 1000 16QFN



Supervisory Circuits (Voltage Supervisors)

Device Description No. of

Supervisors

Vit1 (typ) (V)

Vit2 (typ) (V)

Programmable Delay

Manual Reset

Reset Active Low

IDD (typ) (uA)

Pin/Package

TLC7701-EP Micropower supply voltage supervisor 1 Adj — — — Yes 9 8SOIC, 8TSSOP

TLC7705-EP Micropower supply voltage supervisor 1 4.5 — — — Yes 9 8TSSOP

TLC7733-EP Micropower supply voltage supervisor 1 2.93 — — — Yes 9 8TSSOP

TPS3106-EP Ultra-low supply-current/supply-voltage supervisory circuit 2 2.94 Adj — — — 1.2 6SOT-23

TPS3307-18-EP Triple processor supervisors 3 2.93 1.68 — — Yes 15 8SOIC

TPS3307-33-EP Triple processor supervisors 3 4.55 2.93 — — Yes 15 8MSOP-PowerPAD™

TPS3619-33-EP Backup-battery supervisors for RAM retention 1 2.93 — — — Yes 15 8MSOP

TPS3620-33-EP Backup-battery supervisors for RAM retention 1 2.93 — — — Yes 15 8MSOP

TPS3803-01-EP Single voltage detector 1 Adj — — — Yes 3 5SC70

TPS3803G15-EP Single voltage detector 1 1.4 — — — Yes 3 5SC70

TPS3805H33-EP Dual voltage detector 2 3.05 Adj — — Yes 3 5SC70

TPS3808-EP Low-quiescent current, programmable delay supervisory circuit 1 Adj — Yes Yes Yes 2.4 6SOT-23

TPS3809I50-EP 3-pin supply voltage supervisor 1 4.55 — — — Yes 9 3SOT-23

TPS3809K33-EP 3-pin supply voltage supervisor 1 2.93 — — — Yes 9 3SOT-23

TPS3809L30-EP 3-pin supply voltage supervisor 1 2.64 — — — Yes 9 3SOT-23

TPS3813K33-EP Processor supervisory circuit with window watchdog 1 2.93 — — — — 9 6SOT-23

TPS3836J25-EP Nanopower supervisory circuit 1 2.25 — — Yes Yes 0.22 5SOT-23

TPS3836L30-EP Nanopower supervisory circuit 1 2.64 — — Yes Yes 0.25 5SOT-23

TPS3837K33-EP Nanopower supervisory circuit 1 2.93 3.3 — Yes — 0.22 5SOT-23

➔



Selection Tables

Voltage References

Device Description Sub Family VO (V)

VI (Max)

(V)

VI (Min)

(V)

Temp Coeff (Max) (ppm/

degree C) Iq (Max)

(uA)

Iout/Iz (Max) (mA)

Pin/Package

REF3212-EP 4 Ppm/Degreesc 100 Ua Sot23-6 series voltage references

4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 1.25 5.5 1.8 7 120 10 6SOT-23


4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 2.052 — — — 120 — 6SOT-23




4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 3 5.5 3.05 7 120 10 6SOT-23

REF3233-EP 4 Ppm/Degreesc 100 Ua Sot23-6 Series Voltage References

4 Ppm/C, 100 Ua, Sot23-6 series voltage reference 3.307 — — — 120 — 6SOT-23



TL1431-EP Precision adjustable (programmable) shunt reference

Precision adjustable (programmable) shunt reference — — — — — 100 8SOIC

Digital Signal Processors

Device Description CPU Freq

uenc

y (M

Hz)

PWM EMIF DMA

Core Supply (Volts) McBSP I2C SPI CAN

IO Supply (Volts)

Pin/Package(s)

DaVinci™ Video Processors

SM320DM355-EP Digital media system-on-chip (DMSoC)

1 ARM9; DaVinci Video

216 4

1 16-Bit mDDR/DDR2, 1 8/16-Bit EMIFA

64-Ch EDMA 1.3 — 1 3 — 1.8 337NFBGA

SM320DM642-EP Video/imaging fixed-point DSP

1 C64; Video — — 1 64-Bit 64-Ch EDMA 1.4 2 2 — — 3.3 548GDK,

548ZDK

Fixed-Point Digital Signal Processors

SM320C6201-EP Fixed-point DSP 1 C62x 200 — 1 32-Bit 4-Ch 1.8 2 — — — 3.3 352FC/CSP

SM320C6202-EP Fixed-point DSP 1 C62x 200 — 1 32-Bit 4-Ch 1.5 3 — — — 3.3 352FCBGA

SM320C6424-EP Fixed-point DSP 1 C64x+ 600 3

1 16/8-Bit EMIFA, 1 32/16-Bit

DDR2

64-Ch EDMA 1.05, 1.2 2 1 — — 1.8, 3.3 376BGA

SM320C6455-EP Fixed-point DSP 1 C64x+ 1000 —

1 32-Bit DDR@

EMIF, 1 64-Bit EMIFA

64-Ch EDMA 1.25 2 2 — —3.3, 1.8,

1.5, 1.2

697BGA

SM320VC5409-EP Fixed-point DSP 1 C54x 100 — — 6-Ch Ext 1.8 3 — — — 3.3 144BGA MicroStar™

SM320VC5416-EP Digital signal processor 1 C54x 120, 160 — 1 16-Bit 6-Ch Ext 1.5, 1.6 3 — — — 3.3

144LQFP, 144BGA

MicroStar

SM320VC5421-EP Digital signal processor 2 C54x 100 — 1 16-Bit 2 6Ch Ext 1.8 6 — — — 3.3 144LQFP

SM320VC5507-EP Fixed-point DSP 1 C55x108, 144, 200

— 1 16-Bit 6-Ch 1.2, 1.35, 1.6 3 — — — 2.7 to

3.6 144LQFP

SM320VC5510A-EP Fixed-point DSP 1 C55x 200 — 1 32-Bit 6-Ch Int/Ext 1.6 3 — — — 3.3 240BGA MicroStar

SM320C6414-EP Fixed-point DSP 1C64x — — 1 16-Bit, 1 64-Bit 64-Ch EDMA — 3 — — — — —



➔



Selection Tables

Digital Signal Processors (continued)

Device Description CPU Freq

uenc

y (M

Hz)

PWM EMIF DMA

Core Supply (Volts) McBSP I2C SPI CAN

IO Supply (Volts)

Pin/Package(s)

Floating-Point Digital Signal Processors

SM320C6701-EP Flosting-point DSP 1 C67x 167 — 1 32-Bit 4-Ch 1.8 2 — — — 3.3 352FC/CSP

SM320C6711D-EP Flosting-point DSP 1 C67x 167, 200 — 1 32-Bit 16-Ch EDMA 1.2 2 — — — 3.3 272BGA

SM320C6712D-EP Flosting-point DSP 1 C67x 167 — 1 16-Bit 16-Ch EDMA 1.2 2 — — — 3.3 272BGA

SM320C6713B-EP Flosting-point DSP 1 C67x 200, 300 — 1 32-Bit 16-Ch EDMA 1.4 2 2 — — 3.3 272BGA

OMAP™ Processors

OMAP3530-HIREL Applications processor1 64x+; 1 ARM

Cortex-A8— —

1 16-Bit GPMC,

1 32-Bit SDRC

32-Bit Ch SDMA, 64Ch

EDMA

0.8 to 1.35 5 3 — — 1.8 to

3.0515 POP-

FCBGA

OMAP3525-HIREL Applications processor1 64x+; 1 ARM

Cortex-A8— —

1 16-Bit GPMC,

1 32-Bit SDRC

32-Bit Ch SDMA, 64Ch

EDMA

0.8 to 1.35 5 3 — — 1.8 to

3.0515 POP-

FCBGA

C2000™ Microcontrollers

SM320F2801-EP 32-bit, digital signal controller with flash 1 C28x 100 8-Ch — — 1.8 — 1 2 1 3.3 100LQFP

SM320F2808-EP 32-bit, digital signal controller with flash 1 C28x 100 16-Ch — — 1.8 — 1 4 2 3,3 100LQFP

SM320F2812-EP 32-bit, digital signal controller with flash 1 C28x 150 16-Ch 1 16-Bit — 1.9 1 — 1 1 3.3

176LQFP, 179BGA

MicroStar™

SM320F28335-EP Delfino microcontroller 1 C28x 250 18-Ch 1 32/16-Bit 6-Ch DMA 1.9 2 1 1 2 3.3

176BGA, 176HLQFP,

179BGA MicroStar

SM320LF2407A-EP DSP controller 1 C24x 40 16-Ch — — 3.3 — — 1 2 3.3 144LQFP

MSP430™ Microcontrollers

Device Description Sub Family Frequency ADC RAM GPIOPin/

Package(s)

MSP430F2274-EP 16-bit ultra-low-power microcontroller, 32-KB flash, 1-K RAM 2xx 16-MHz series 16 10-bit SAR — 32 40QFN

MSP430F249-EP 16-bit ultra-low-power microcontroller, 60-KB flash, 2-KB RAM, 12-bit ADC, 2 USCIs 2xx 16-MHz series 16 12-bit SAR — 48 64LQFP

MSP430F2618-EP 16-bit ultra-low-power MCU, 92-KB flash, 8-KB RAM, 12-bit ADC, dual DAC, 2 USCIs 2xx 16-MHz series 16 12-bit SAR 8 KB 48, 64

113BGA, MicroStar™

Junior

➔



Selection Tables

Buffers, Drivers and Transceivers

Device Description No. of Gates

Static Current

IOL (mA)

Voltage Nodes

(V)Output

Drive (mA)

tpd Max (ns)

Vcc Range

(V)ICC (uA)

Pin/Package(s)

Buffers and Drivers

SN74ABT244A-EP Octal buffer/driver with 3-state outputs — — — 5 -24/48 — 4.5 to 5.5 — 20SSOP

SN74ABT541B-EP Octal buffer/driver with 3-state outputs — 30 — 5 -32/64 3.5 4.5 to 5.5 — 20TSSOP

SN74AC04-EP Hex inverter 6 0.02 — 5, 3.3 -24/24 7 2.0 to 6.0 — 14SOIC

SN74AC244-EP Octal buffer/driver with 3-state outputs — 0.04 — 5, 3.3 -24/24 7 2.0 to 6.0 — 20SO, 20SOIC

SN74ACT04-EP Hex inverter 6 0.002 — 5 -24/24 8.5 4.5 to 5.5 — 14SOIC

SN74ACT244-EP Octal buffer/driver with 3-state outputs — 0.04 — 5 -24/24 9 4.5 to 5.5 — 20SO, 20SOIC

SN74AHC04-EP Hex inverter 6 0.02 — 5, 3.3 -8/8 8.5 2.0 to 5.5 — 14SOIC, 14TSSOP

SN74AHC125-EP Quadruple bus buffer gates with 3-state outputs 4 0.04 — 5, 3.3 -8/8 8.5 2.0 to 5.5 — 14SOIC,

14TSSOP

SN74AHC14-EP Hex Schmitt-Trigger inverter 6 0.02 — 5, 3.3 -8/8 12 2.0 to 5.5 — 14SOIC, 14TSSOP

SN74AHC244-EP Quadruple bus buffer gate with 3-state outputs 8 0.04 — 5, 3.3 -8/8 8.5 2.0 to 5.5 — 20SOIC, 20TSSOP

SN74AHC245-EP Octal bus transceiver with 3-state outputs — 0.04 — 5, 3.3 -8/8 8.5 2.0 to 5.5 — 20SOIC, 20TSSOP

SN74AHCT125-EP Quadruple bus buffer gate with 3-state outputs — 0.02 — 5 -8/8 8.5 4.5 to 5.5 — 14SOIC, 14TSSOP

SN74AHCT126-EP Quadruple bus buffer gate with 3-state outputs — 0.02 — 5 -8/8 8.5 4.5 to 5.5 — 14SOIC, 14TSSOP

SN74AHCT14-EP Hex Schmitt-Trigger inverter 6 0.02 — 5 -8/8 9 4.5 to 5.5 — 14SOIC, 14TSSOP

SN74AHCT244-EP Octal buffer/driver with 3-state outputs 8 0.04 — 5 -8/8 9.5 4.5 to 5.5 — 20SOIC, 20TSSOP

SN74AHCT541-EP Octal buffer/driver with 3-state outputs 8 0.04 — 5 -8/8 9.5 4.5 to 5.5 — 20SOIC

SN74AHCU04-EP Hex inverter — — — — — — 2 to 5.5 — 14TSSOP

SN74ALVC244-EP Octal buffer/driver with 3-state outputs — 0.01 — 3.3, 2.7, 2.5, 1.8 -24/24 2.8 1.65 to

3.6 — 20TSSOP

SN74ALVCH16827-EP 20-bit buffer/driver with 3-state outputs — 0.04 — 1.8, 2.5, 2.7, 3.3 -24/24 4 1.65 — 56SSOP

SN74AUC1G125-EP Single bus buffer gate with 3-state output — — — — — — — — 5SC70

SN74AUC1G14-EP Single Schmitt-Trigger inverter — — 0.7, 3, 5, 8, 9 — —

2, 4, 4.5, 5.5,

5.8— 10 5SOT-23

SN74AUC1G14-EP Single Schmitt-Triger inverter — — — — —2, 4,

4.5, 5.5, 5.8

— — 5SOT-23

SN74AUP1G17-EP Low-power single Schmitt-Trigger buffer — — — — — — 0.8 to 3.6 0.5 5SC70

SN74BCT760-EP Octal buffer/driver with open-collector outputs — — — — — — -0.5 to 7 — 20SOIC

SN74HC244-EP Octal buffer and line driver with 3-state outputs 10 0.16 — 6, 4.5, 2 7.8/7.8 34 2.0 to 6.0 — 20SOIC, 20TSSOP

SN74HCT04-EP Hex inverter 6 0.02 — 5 -4/4 20 4.5 to 5.5 — 14SOIC

SN74HCT244-EP Octal buffer and line driver with 3-state outputs — 0.16 — 5 -6/6 38 4.5 to 5.5 — 20TSSOP

SN74LV04A-EP Hex inverter 6 0.02 — 5, 3.3, 2.5 -12/12 7.5 2.0 to 5.5 — 14TSSOP

SN74LV14A-EP Hex Schmitt-trigger inverter 6 0.02 — 5, 3.3, 2.5 -12/12 14 2.0 to 5.5 — 14SOIC, 14TSSOP

SN74LV244A-EP Octal buffer and line driver with 3-state outputs — — — 5/3.3/2.5 — 8.5 2 to 5.5 — 20SOIC

SN74LVC04A-EP Hex inverter 6 0.01 — 3.3, 2.7 -24/24 4.5 2.0 to 3.6 — 14SOIC, 14TSSOP

➔



Selection Tables

Buffers, Drivers and Transceivers (continued)


Static Current

IOL (mA)

Voltage Nodes

(V)Output

Drive (mA)

tpd Max (ns)

Vcc Range

(V)ICC (uA)

Pin/Package(s)

Buffers and Drivers (continued)

SN74LVC06A-EP Hex inverter buffer/driver with open-drain outputs — — — 3.3 — 5 1.65 to

3.6 — 14SOIC

SN74LVC07A-EP Hex buffer/driver with open-drain outputs — 0.01 —5, 3.3,

2.7, 2.5, 1.8

24 2.6 1.65 to 5.5 — 14TSSOP

SN74LVC125A-EP Quadruple bus buffer gate with 3-state outputs — 0.01 — 3.3, 2.7, 2.5, 1.8 -24/24 4.8 1.65 to

3.6 — 14SOIC, 14TSSOP

SN74LVC14A-EP Hex Schmitt-Trigger inverter 6 0.01 — 3.3, 2.7 -24/24 6.4 2.0 to 3.6 — 14SOIC, 14TSSOP

SN74LVC16244A-EP 16-bit buffer/driver with 3-state outputs — 0.02 — 3.3, 2.7, 2.5, 1.8 -24/24 4.1 1.65 to

3.6 — 48TSSOP

SN74LVC1G04-EP Single inverter gate 1 — — — — — 1.65 to 5.5 10 5SOT-23

SN74LVC1G06-EP Single inverter buffer/driver with open-drain output 1 — — — — — 1.65 to

5.5 — 5SC70

SN74LVC1G07-EP Single buffer/driver with open-drain output — — — — — — — 10 5SC70

SN74LVC1G125-EP Single bus buffer gate with 3-state outputs — — 32 1.8, 2.5, 3.3, 5 4 1.65 to

5.5 10 5SC70

SN74LVC1G126-EP Single bus buffer gate with 3-state outputs 1 — 32 1.8, 2.5 3.3,5 +\-24 4 1.65 to

5.5 10 5SC70

SN74LVC1G14-EP Single Schmitt-Trigger inverter 1 — — — — — 1.65 to 5.5 10 5SOT-23

SN74LVC1G17-EP Single Schmitt-Trigger buffer — — 32 — +\-24 4.6 up to 6.5 10 5SC70, 5SOT-23

SN74LVC1G97-EP Configurable multiple-function gate 1 — 32 — — 5.1 1.65 to 5.5 10 6SC70

SN74LVC1G98-EP Configurable multiple-function gate — — 32 — — 5.1 1.65 to 5.5 10 6SC70

SN74LVC1GX04-EP Crystal oscillator driver — — 32 — — 5 1.65 to 5.5 10 6SOT

SN74LVC2G04-EP Dual inverter gate 2 — — — — — 1.65 to 5.5 10 6SC70

SN74LVC2G06-EP Dual inverter buffer/driver with open-drain output 2 — — — — — 1.65 to

5.5 10 6SC70

SN74LVC2G07-EP Dual buffer/driver with open-drain output 2 — 24 5 +24, -24 5.7 1.65 to 5 10 6SC70

SN74LVC2G17-EP Dual Schmitt-Trigger buffer 2 — — — — — 1.65 to 5.5 10 6SC70

SN74LVC2G34-EP Dual buffer gate — — — — — — 1.65 to 5.5 10 6SC70

SN74LVC3G07-EP Triple buffer/driver with open-drain output — — 32 — — — 1.65 to 5.5 10 8US8

SN74LVC540A-EP Octal buffer/driver with 3-state outputs — 0.01 — 3.3, 2.7 -24/24 5.3 2.0 to 3.6 — 20SOIC, 20TSSOP

SN74LVC541A-EP Octal buffer/driver with 3-state outputs 8 0.01 — 3.3, 2.7, 2.5, 1.8 -24/24 5.1 2.0 to 3.6 — 20SOIC,

20TSSOP

SN74LVT125-EP 3.3-V ABT quadruple bus buffers with 3-state outputs — 7 — 3.3, 2.7 -32/32 4.2 2.7 to 3.6 — 14TSSOP

SN74LVTH125-EP 3.3-V ABT quadruple bus buffers with 3-state outputs 4 7 — 3.3, 2.7 -32/64 3.9 2.7 to 3.6 — 14TSSOP

SN74LVTH162240-EP 3.3-V ABT, 16-bit buffer/driver with 3-state outputs — 5 — 3.3, 2.7 -12/12 4 2.7 to 3.6 — 48TSSOP

SN74LVTH162244-EP 3.3-V ABT, quadruple bus buffer with 3-state outputs — 5 — 3.3, 2.7 -12/12 4 2.7 to 3.6 — 48TSSOP

SN74LVTH16240-EP 3.3-V ABT, 16-bit buffer/driver with 3-state outputs — — — 3.3, 2.7 — — 2.7 to 3.6 — 48TSSOP

➔



Selection Tables

Buffers, Drivers and Transceivers (continued)


Static Current

IOL (mA)

Voltage Nodes

(V)Output

Drive (mA)

tpd Max (ns)

Vcc Range

(V)ICC (uA)

Pin/Package(s)

Buffers and Drivers (continued)

SN74LVTH16244A-EP 3.3-V ABT, 16-bit buffer/driver with 3-state outputs — 5 — 3.3, 2.7 -24/24 4.4 2.7 to 3.6 —

48SSOP, 48TSSOP, 48TVSOP,

56BGA MicroStar™

Junior

SN74LVTH240-EP 3.3-V ABT, octal buffer/driver with 3-state outputs — 5 — 3.3, 2.7 -32/64 4 2.7 to 3.6 — 20TSSOP

SN74LVTH241-EP 3.3-V ABT, octal buffer/driver with 3-state outputs 8 5 — 3.3, 2.7 -32/64 3.5 2.7 to 3.6 — 20TSSOP

SN74LVTH244A-EP 3.3-V ABT, octal buffer/driver with 3-state outputs — 14 mA — 3.3, 2.7 -24/32 4.7 2.7 to 3.6 — 20SSOP,

20TSSOP

SN74LVTH32244-EP 3.3-V ABT, 32-bit buffer/driver with 3-state outputs — — — 3.3, 2.7 — — 2.7 to 3.6 — 96LFBGA

Transceivers

SN74ABT16245A-EP 16-bit bus transceiver with 3-state outputs — — — — — — — — 48SSOP

SN74ABT245B-EP Octal bus transceivers with 3-state outputs — 30 — 5 -24/32 3.5 4.5 to 5.5 — 20SSOP

SN74AC245-EP Octal bus transceivers with 3-state outputs — 0.004 — 5, 3.3 -24/32 7 2.0 to 6.0 — 20SOIC

SN74ACT16245-EP 16-bit bus transceiver with 3-state outputs — 160 uA — 5 — 9.3 4.5 to 5.5 — 48SSOP

SN74LVC245A-EP Octal bus transceiver with 3-state outputs — 0.001 — 3.3, 2.7, 2.5, 1.8 -24/24 6.1 1.65 to

3.6 — 20TSSOP

SN74ALVCH16245-EP 16-bit bus transceiver with 3-state outputs — 0.04 — 3.3, 2.7, 2.5, 1.8 -24/24 3 1.65 to

3.6 — 48SSOP

SN74LVCH16652A-EP 16-bit bus transceiver and register with 3-state outputs — 0.02 — 3.3, 2.7,

2.5, 1.8 -24/24 6.3 1.65 to 3.6 — 56TSSOP

SN74LVTH162245-EP 3.3-V ABT, 16-bit bus transceiver with 3-state outputs — 5 — 3.3, 2.7 -32/64 4 2.7 to 3.6 — 48SSOP,

48TSSOP

SN74LVTH16245A-EP 3.3-V ABT, 16-bit bus transceiver with 3-state outputs — 5 — 3.3, 2.7 -24/24 4.5 2.7 to 3.6 —

48SSOP, 48TSSOP, 48TVSOP,

56BGA MicroStar

Junior

SN74LVTH16543-EP 3.3-V ABT, 16-bit registered transceiver with 3-state outputs — — — 3.3, 2.7 — — — — 56SSOP,

56TSSOP

SN74LVTH16646-EP 3.3 V ABT, 16-bit bus transceiver and register with 3-state outputs — — — 3.3, 2.7 — — — — 56TSSOP

SN74LVTH16652-EP 3.3 V ABT, 16-bit bus transceiver and register with 3-state outputs — — — 3.3, 2.7 — — 2.7 to 3.6 — 56TSSOP

SN74LVTH16952-EP 3.3-V ABT, 16-bit registered transceiver with 3-state outputs — — — 3.3, 2.7 — — 2.7 to 3.6 — 56TSSOP

SN74LVTH245A-EP 3.3-V ABT, octal bus transceiver with 3-state outputs — 5 — 3.3, 2.7 -32/64 3.5 2.7 to 3.6 — 20SSOP,

20TSSOP

SN74LVTH543-EP 3.3-V ABT, octal registered transceiver with 3-state outputs — 5 — 3.3, 2.7 -32/64 3.7 2.7 to 3.6 — 24TSSOP

SN74LVTH646-EP 3.3-V ABT, octal bus transceiver and register with 3-state outputs — 5 — 3.3, 2.7 -32/64 4.7 2.7 to 3.6 — 24TSSOP

SN74LVTH652-EP 3.3-V ABT, octal bus transceiver and register with 3-state outputs — 5 — 3.3, 2.7 -32/64 4.7 2.7 to 3.6 — 24TSSOP

➔



Selection Tables

Flip-Flop Latches and Registers

Device Description

Output Drive (mA)

th (ns)

tpd Max (ns)

Vcc range

(V) Static

Current tsu (ns)

Voltage Nodes

(V) Pin/

Package

Flip-flops

SN74ACT16374-EP 16-bit, D-type edge-triggered flip-flop with 3-state outputs -16/16 1 10.9 4.5 to 5.5 160 uA 6.5 5 48SSOP

SN74ACT74-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset -24/24 1 — CMOS 0.02 4 5 14SOIC

SN74AHC74-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset -8/8 0.5 11 2.0 to

5.5 0.02 5 5, 3.3 14SOIC, 14TSSOP

SN74AHCT74-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset -8/8 0 13 4.5 to

5.5 0.02 5 5 14SOIC, 14TSSOP

SN74HC74-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset — — 345 — — 150 — 14TSSOP

SN74LV374A-EP Octal edge-triggered D-type flip-flop with 3-state outputs -16/16 2 — 2 to 5.5 0.02 3 5, 3.3, 2.5 20TSSOP

SN74LVC1G175-EP Single D-type flip-flop with asynchronous clear — — — 1.65 to. 5.5 10 — — 6SC70

SN74LVC1G79-EP Single positive-edge-triggered D-type tlip-tlop 24 — 3.8 1.65 to. 5.5 10 — — 5SC70

SN74LVC2G74-EP Single positive-edge-triggered D-type flip-flop with clear and preset — — 7.9 1.65 to 5 10 — 3.3 8US8

SN74LVC374A-EP Octal edge-triggered D-type flip-flop with 3-state outputs -24/24 1.5 8.5 2.0 to 3.6 0.01 2 3.3, 2.7 20SOIC,

20TSSOP

SN74LVC574A-EP Octal edge-triggered D-type flip-flop with 3-state outputs -24/24 2 8 2.0 to 3.6 0.01 2 3.3, 2.7 20SOIC,

20TSSOP

SN74LVC74A-EP Dual positive-edge-triggered, D-type flip-flop with clear and preset -24/24 1 5.2 2.0 to

3.6 0.01 3 3.3, 2.7 14SOIC, 14TSSOP

SN74LVTH16374-EP 3.3-V ABT, 16-bit edge-triggered D-type flip-flop with 3-state outputs — — — 2.7 to

3.6 — — 3.3, 2.7 48SSOP, 48TSSOP

SN74LVTH273-EP 3.3-V ABT, octal D-type flip-flops with clear -32/+64 0 4.9 2.7 to 3.6 5 2.3 3.3, 2.7 20SO,

20TSSOP

SN74LVTH32374-EP 3.3-V ABT, 32-bit edge-triggered D-type flip-flop with 3-state outputs — — — 2.7 to

3.6 — — 3.3, 2.7 96LFBGA

SN74LVTH374-EP 3.3-V ABT, octal edge-triggered D-type flip-flop with 3-state outputs -32/+64 0.8 4.5 2.7 to

3.6 5 1.5 3.3, 2.7 20TSSOP

SN74LVTH574-EP 3.3-V ABT, octal edge-triggered D-type flip-flops with 3-state outputs -32/+64 0.3 4.5 2.7 to

3.6 5 2 3.3, 2.7 20TSSOP

Latches

SN74ABT16373A-EP 16-bit, transparent D-type latches with 3-state outputs — 2.2 3.3 4.5 to 5.5 — 2.4 — 48SSOP

SN74AC373-EP Octal D-type transparent latche with 3-state outputs -24/24 1 9.5 2.0 to 6.0 0.04 4 5, 3.3 20SOIC

SN74ACT16373-EP 16-bit, transparent D-type latches with 3-state outputs -16/16 5 10.8 4.5 to 5.5 160 uA 1 5 48SSOP

SN74ACT373-EP Octal D-type transparent latche with 3-state outputs -24/24 1 12.5 4.5 to 5.5 0.04 8.5 5 20SOIC

SN74LVC16373A-EP D-type latch with 3-state outputs — 1.6 4.2 1.65 to 3.6 — 1.7 — 48SSOP

SN74LVC373A-EP D-type latch with 3-state outputs -24/24 2 7.5 2.0 to 3.6 0.01 2 3.3, 2.7

20SOIC, 20SSOP, 20TSSOP

SN74LVC573A-EP D-type latch with 3-state outputs -24/24 2.5 7.7 2.0 to 3.6 0.01 2 3.3, 2.7 20SOIC,

20TSSOP

SN74LVTH162373-EP 3.3-V ABT, 16-bit transparent D-type latche with 3-state outputs — — — — — — — 48SSOP

➔



Selection Tables

Flip-Flop Latches and Registers (continued)

Device Description

Output Drive (mA)

th (ns)

tpd Max (ns)

Vcc range

(V) Static

Current tsu (ns)

Voltage Nodes

(V) Pin/

Package

Latches (continued)

SN74LVTH16373-EP 3.3-V ABT, 16-bit transparent D-type latche with 3-state outputs — — — 2.7 to 3.6 — — 3.3, 2.7

48SSOP, 48TSSOP,

56BGA Microstar™

Junior

SN74LVTH32373-EP 3.3-V ABT, 32-bit transparent D-type latche with 3-state outputs — — — 2.7 to 3.6 — — 3.3, 2.7 96LFBGA

SN74LVTH373-EP 3.3-V ABT, octal transparent D-type latche with 3-state outputs -32/+64 1.4 3.9 2.7 to 3.6 5 1.1 3.3, 2.7 20TSSOP

SN74LVTH573-EP 3.3-V ABT, octal transparent D-type latche with 3-state outputs -32/+64 1.5 3.9 2.7 to 3.6 5 0.7 3.3, 2.7 20TSSOP

Registers

SN74HC165-EP 8-bit parallel-load shift registers -4/4 5 30 2.0 to 6.0 0.008 30 6, 5, 2 16SOIC,

16TSSOP

SN74LV165A-EP 8-bit parallel-load shift registers 0.02 0.5 12.5 2 to 5.5 — 5 5, 3.3, 2.5 16TSSOP

SN74HC166A-EP 8-bit parallel-load shift registers +/-4 5 — 2 to 6 0.008 29 2, 4.5, 6 16SOIC

SN74LV595A-EP 8-bit shift register with 3-state output register -16/16 1.5 11.9 2 to 5.5 0.02 8 5, 3.3, 2.5 16TSSOP

SN74LV74A-EP 8-bit shift register with 3-state output register -16/16 1.5 11.9 2 to 5.5 0.02 8 5, 3.3, 2.5 16TSSOP

Line Drivers, Receivers and Transceivers

Device Description Signaling

Rate (Mbps)

Supply Voltage(s)

(V) No. of TX/RX

ICC (Max) (mA)

Pin/Package(s)

AM26C31-EP Quadruple differential line driver — 5 4 TX 3.2 16SOIC

AM26C32-EP Quadruple differential line receiver — 5 4 RX 15 16SOIC

AM26LS32AM-EP Quadruple differential line receiver — 5 4 RX 70 16SOIC

AM26LV31E-EP Low-voltage high-speed quad differential line driver, +/-15-kV IEC ESD protection 32 3.3 4 TX 0.1 16SOIC

AM26LV32E-EP Low-voltage high-speed quad differential line receiver, +/-15-kV IEC ESD 32 3.3 4 RX — 16SOIC

MAX3221-EP 3-V to 5.5-V single-channel RS-232 line driver/receiver with +/-15-Kv ESD — 3.3 or 5.0 1 TX/1 RX 1 16SSOP

MAX3223-EP 3-V to 5.5-V multichannel RS-232 line driver/receiver with +/-15-Kv ESD — 3.3 or 5.0 2 TX/2RX 1 20SSOP

Dual-Supply Translators and Tranceivers

Device Description No. of Outputs tpd Max (ns) Vcc Range

(V) Pin/

Package(s)

CD4504B-EP CMOS hex voltage-level shifter for TTL-to-CMOS or CMOS-to-CMOS operation 6 — 5.0 to 20 16TSSOP

SN74ALVC164245-EP 16-bit 2.5-V to 3.3-V/3.3-V to 5-V level-shifting transceiver, 3-state output 16 5.8 SplitRail 48SSOP, 48TSSOP

SN74AVCH4T245-EP 4-bit dual-supply bus transceiver with configurable voltage translation and 3-state outputs — — 1.2 to 3.6 16QFN

SN74LVC1T45-EP Single-bit dual-supply bus transceiver, configurable voltage translation and 3-state outputs 1 — 1.65 to 5.5 6SC70

SN74LVC2T45-EP Dual-bit dual supply transceiver with configurable voltage translation and 3-state outputs — — 1.65 to 5.5 8SM8

SN74LVC4245A-EP Octal bus transceiver and 3.3-V to 5-V shifter with 3-state outputs 8 6.7 SplitRail 24TSSOP

SN74LVC8T245-EP 8-bit dual-supply bus transceiver with configurable voltage translation and 3-state outputs 8 — 1.65 to 5.5 24TSSOP

SN74LVCC3245A-EP Octal bus transceiver with adjustable output voltage and 3-state outputs — 7.6 SplitRail 24SOIC, 24SSOP, 24TSSOP

SN74LVCC4245A-EP Octal dual-supply bus transceiver with configurable output voltage and 3-state outputs — — SplitRail 24TSSOP

SN74LVCH16T245-EP 16-bit dual-supply bus transceiver, configurable voltage translation, 3-state outputs 16 — 1.65 to 5.5 48TSSOP,

48TVSOP

➔



Selection Tables

Line Drivers, Receivers and Transceivers (continued)

Device Description Signaling

Rate (Mbps)

Supply Voltage(s)

(V) No. of TX/RX

ICC (Max) (mA)

Pin/Package(s)

MAX3232-EP 3-V to 5.5-V multichannel RS-232 line driver/receiver with +/-15-Kv ESD — 3.3 or 5.0 2 TX/2RX 1 16SSOP, 16TSSOP

MAX3243-EP 3-V to 5.5-V multichannel RS-232 line driver/receiver with +/-15-Kv ESD — 3.3 or 5.0 3 TX/5 RX 1 28SSOP, 28TSSOP

PCI1520-EP PC card controllers data manual N/A 3.3 — n/a 208LQFP, 209BGA

MicroStar™

SN65HVD1050-EP EMC-optimized CAN transceiver 1 5 1 TX / 1 RX 10, 70 8SOIC

SN65HVD10-EP 3.3-V RS-485 transceiver 25 3.3 1 TX/1 RX 15.5 8SOIC

SN65HVD12-EP 3.3-V RS-485 transceiver 1 3.3 1 TX/1 RX 15.5 8SOIC

SN65HVD21M-EP Extended common-mode RS-485 transceiver 5 5 1 TX/1 RX 15 8SOIC

SN65HVD230M-EP 3.3-V CAN transceiver with standby mode 1 3.3 1 TX / 1 RX 17 8SOIC

SN65HVD233-EP 3.3-V CAN tranceiver 1 3.3 1 TX / 1 RX 6 8SOIC

SN65HVD30-EP 3.3-V full-duplex RS-485 driver and receiver 25 3.3 1 TX/1 RX 2.1 8SOIC

SN65HVD33-EP 3.3-V full-duplex RS-485 drivers and receiver 25 3.3 1 TX/1 RX 2 14SOIC

SN65LBC174A-EP Quadruple RS-485 differential line driver 30 5 4 TX/0 RX 23 20SOIC

SN65LBC176A-EP Differential bus transceivers 30 5 1 TX/1 RX 15 8SOIC

SN65LV1023A-EP 10:1 LVDS SERDES transmitter 100-660 Mbps 660 3.3 1 TX 25 28SSOP

SN65LV1224B-EP 1:10 LVDS SERDES receiver 100-660 Mbps 660 3.3 1 RX 35 28SSOP

SN65LVDS179-EP High-speed differential line drivers and receivers 400 3.3 — 12 8MSOP

SN65LVDS33-EP High-speed differential receivers 400 3.3 — 25 16SOIC

SN65LVDS95-EP 23:1 LVDS SERDES transmitter 1,360 3.3 1 TX 110 48TSSOP

SN65LVDT14-EP Memorystick interconnect extender chipset 125 3.3 1 TX/4 RX 25 20TSSOP

SN65LVDT41-EP Memorystick interconnect extender chipset 125 3.3 4 TX/1 RX 25 20TSSOP

SN75976A-EP 9-channel differential transceiver 20 5 9 TX/9 RX 10, 45, 60 56TSSOP

TFP401A-EP PanelBus DVI receiver 165 MHz, HSYNC fix 495 3.3 3 RX 400 100HTQFP

TFP410-EP PanelBus digital transmitter 495 3.3 3 TX 250 64HTQFP

TL16C752B-EP 3.3-V dual UART with 64-byte FIFO 3 3.3 2 TX/2 RX 20 48LQFP

Gates

Device Description Vcc Range

(V) Voltage

Nodes (V) IOL

(mA)

tpd Max (ns)

No. of Gates

IOH (mA)

ICC (uA)

Output Drive (mA)

Pin/Package(s)

Single Input Gates

SN74AHC1G02-EP Single 2-input positive-NOR gate 2 to 5.5 — 8 — — -8 10 — 5SC70

SN74AHC1G86-EP Single 2-input exclusive-OR gate 2 to 5.5 — 8 — 1 -8 10 — 5SC70

SN74LVC1G00-EP Single 2-input positive-NAND gate 1.65 to 5.5 1.8, 2.5, 3.3, 5 32 4 — -32 10 — 5SC70,

5SOT-23

SN74LVC1G02-EP Single 2-input positive-Nor gate 1.65 to 5.5 — — — 1 — 10 — 5SC70

SN74LVC1G08-EP Single 2-input positive-AND gate 1.65 to 5.5 1.8, 2.5, 3.3, 5 32 4 — -32 10 — 5SC70,

5SOT-23

SN74LVC1G11-EP Single 3-input positive-AND gate 1.65 to 5.5 — 32 5.9 1 -32 10 24 6SC70

SN74LVC1G32-EP Single 2-input positive-OR gate 1.65 to 5.5 1.8, 2.5, 3.3, 5 32 4 — -32 10 — 5SC70,

5SOT-23

SN74LVC1G86-EP Single 2-input exclusive-OR gate 1.65 to 5.5 — 32 — 1 -32 10 — 5SC70

➔



Selection Tables

Gates (continued)

Device Description Vcc Range

(V) Voltage

Nodes (V) IOL

(mA)

tpd Max (ns)

No. of Gates

IOH (mA)

ICC (uA)

Output Drive (mA)

Pin/Package(s)

Dual Input Gates

SN74LVC2G00W-EP Dual 2-input positive-NAND gate 1.65 to 5.5 — 32 3.3 2 -32 10 — 8SM*

SN74LVC2G02-EP Dual 2-input positive-NOR gate 1.65 to 5.5 — 24 5.4 — -24 10 — 8US8

SN74LVC2G08-EP Dual 2-input positive-AND gate 1.65 to 5.5 — 24 4.8 2 -24 10 — 8US8

SN74LVC2G32-EP Dual 2-input positive-OR gate — — — — 2 — — 10 8US8

Triple Input Gates

SN74AC11-EP Triple 3-input positive-AND gate 2.0 to 6.0 5, 3.3 — 8 3 — — -24/24 14TSSOP

SN74HC10-EP Triple 3-input positive-NAND gate 2.0 to 6.0 6, 5, 2 — 19 3 — — -4/4 14SOIC, 14TSSOP

SN74LV11A-EP Triple 3-input positive-AND gate 2.0 to 5.5 5, 3.3, 2.5 — 7.9 3 — — -12/12 14TSSOP

Quadruple Input Gates

CD74ACT86-EP Quadruple 2-input exclusive-OR gate -0.5 to 6 — — — — — — 0.08 14SOIC

CD74HC08-EP Quadruple 2-input positive-AND gate 2 to 6 2, 4.5, 6 — 18 4 — — — 14SOIC

SN74AC08-EP Quadruple 2-input positive-AND gate 2.0 to 6.0 5, 3.3 — 7.5 4 — — -24/24 14SOIC

SN74AC32-EP Quadruple 2-input positive-OR gate 2 to 6 5, 3.3 — 7.5 4 — — -24/24 14SOIC

SN74ACT08-EP Quadruple 2-input positive-AND gate 4.5 to 5.5 5 — 10 4 — — -24/24 14SOIC

SN74AHC00-EP Quadruple 2-input positive-NAND gate 2.0 to 5.5 5, 3.3 — 9.5 4 — — -8/8 14SOIC, 14TSSOP

SN74AHC02-EP Quadruple 2-input positive-NOR gate 2.0 to 5.5 5, 3.3 — 8.5 4 — — -8/8 14TSSOP

SN74AHC08-EP Quadruple 2-input positive-AND gate 2.0 to 5.5 5, 3.3 — 9 4 — — -8/8 14SOIC, 14TSSOP

SN74AHC32-EP Quadruple 2-input positive-OR gate 2.0 to 5.5 5, 3.3 — 8.5 4 — — -8/8 14SOIC, 14TSSOP

SN74AHCT00-EP Quadruple 2-input positive-NAND gate 4.5 to 5.5 5 — 9 4 — — -8/8 14SOIC, 14TSSOP

SN74AHCT08-EP Quadruple 2-input positive-AND gate 4.5 to 5.5 5 — 9 4 — — -8/8 14SOIC, 14TSSOP

SN74AHCT32-EP Quadruple 2-input positive-OR gate 4.5 to 5.5 5 — 9 4 — — -8/8 14SOIC, 14TSSOP

SN74LV08A-EP Quadruple 2-input positive-AND gate 2.0 to 5.5 5, 3.3, 2.5 — 12 4 — — -12/12 14TSSOP

SN74LV32A-EP Quadruple 2-input positive-OR gate 2.0 to 5.5 5, 3.3, 2.5 — 12 4 — — 7.5 14TSSOP

SN74LV86A-EP Quadruple 2-input exclusive-OR gate 2 to 5.5 3.3, 2.5, 5 — 8.8 4 — — -12/12 14TSSOP

SN74ALVC00-EP Quadruple 2-input positive-NAND gate 1.65 to 3.6 3.3, 2.7, 2.5, 1.8 — 3 4 — — -24/24 14SOIC

SN74ALVC08-EP Quadruple 2-input positive-AND gate 1.65 to 3.6 3.3, 2.7, 2.5, 1.8 — 2.9 4 — — -24/24 14SOIC

SN74LVC08A-EP Quadruple 2-input positive-AND gate 2.0 to 3.6 3.3, 2.7 — 4.1 4 — — -24/24 14SOIC, 14TSSOP

SN74LVC86A-EP Quadruple 2-input exclusive-OR gate 2.0 to 3.6 3.3, 2.7 — 4.6 4 — — -24/24 14SOIC, 14TSSOP

SN74LVC00A-EP Quadruple 2-input positive-NAND gate 2.0 to 3.6 3.3, 2.7 — 4.3 4 — — -24/24 14SOIC, 14TSSOP

SN74LVC02A-EP Quadruple 2-input positive-NOR gate 2.0 to 3.6 3.3, 2.7 — 5.5 4 — — -24/24 14TSSOP

SN74LVC32A-EP Quadruple 2-input positive-OR gate 2 to 3.6 3.3, 2.7 — 3.8 4 — — -24/24 14SOIC, 14TSSOP

➔



Selection Tables

Specialty Logic

Device Description Sub Family Output Drive

(mA)

Vcc range

(V) Static

Current

Voltage Nodes

(V)

tpd Max (ns) Pin/Package

SN74LVTH182512-EP 3.3-V ABT, scan test device with 18-bit universal bus transceiver

Boundary Scan (JTAG) Bus Devices -32/64 2.7 to

3.6 24 3.3, 2.7 5.7 64TSSOP

SN74LVTH18502A-EP 3.3-V ABT, scan test device with 18-bit universal bus transceiver


3.6 24 3.3, 2.7 4.9 64LQFP

SN74LVTH18646A-EP 3.3-V ABT, scan test device with 18-bit universal bus transceiver


3.6 24 3.3, 2.7 4.7 64LQFP

SN74LVT8980A-EP Test-bus controller IEEE Std 1149.1 (Jtag) tap master Boundary Scan (JTAG) Support Devices — 2.7 to

3.6 — 3.3, 2.7 — 24SOIC

SN74LVT8996-EP 3.3-V ABT, 10-bit multidrop-addressable IEEE Std 1149.1 tap transceiver

Boundary Scan (JTAG) Support Devices — 2.7 to

3.6 — 3.3, 2.7 — 24TSSOP

SN74SSTV32852-EP 24- to 48-bit registered buffer with Sstl_2-inputs and outputs

DIMM Memory Drivers and Transceivers — — — 2.5 3.1 114BGA

MICROSTAR

SN74SSTV32867-EP 26-bit registered buffer with Sstl_2-inputs and LvCMOS outputs

DIMM Memory Drivers and Transceivers — — — — — 96LFBGA

SN74AHC123A-EP Dual retriggerable monostable multivibrator Monostable Multivibrators — 2 tp

5.5 — 5, 3.3 — 16SOIC

SN74LV123A-EP Dual retriggerable monostable multivibrator Monostable Multivibrators — 2 to

5.5 — 5, 3.3, 2.5 — 16TSSOP

SN74V263-EP 8192 X 18 synchronous FIFO memory Synchronous FIFOs -2/8 3.15 to 3.45 — 3.3 — 80LQFP




Gates (continued)

Device Description Sub Family

tpd Max (ns) Configuration

# of Channels

ron(Max) (ohms)

Vcc range

(V) ICC (uA)

Voltage Nodes

(V) Pin/

Package

Signal Switches

CD74HC4051-EP High-speed CMOS logic analog multiplexer/demultiplexer

Analog Switches and Multiplexers (less than or equal to 5V)

60 1 X 1:8 MUX 8 180 — — 2, 4.5, 6 16SOIC

SN74LV4051A-EP 8-channel analog multiplexer/demultiplexer


7 1 X 1:8 MUX 8 190 2.0 to 5.5 20 5, 3.3,

2.5 16SOIC,

16TSSOP

SN74LV4052A-EP Dual 4-channel analog multiplexer/demultiplexer


8 2 X 1:4 MUX 4 190 2.0 to 5.5 20 5, 3.3,

2.5 16SOIC,

16TSSOP

SN74LV4053A-EP Triple 2-channel analog multiplexer/demultiplexer


16 3 X SPDT 2 190 2.0 to 5.5 20 5, 3.3,

2.5 16SOIC,

16TSSOP

TS5A3159-EP 1-Ohm Spdt analog switch Analog Switches and Multiplexers (less than or equal to 5V)

— 1 X SPDT 1 1.3 1.65 to 5.5 0.01

1.8, 2.5, 3.0, 3.3,

5.0 6SOT-23

SN74CBTLV3257-EP Low-voltage, 4-bit, 1-Of-2 FET multiplexer/demultiplexer

Digital Bus Exchange/Multiplexing Switches — — — 7 2.3 to

3.6 10 3.3, 2.5 16TSSOP


➔

Space

Overview

TI-HiRel Radiation-Tolerant Space ProductsTo support the demanding nature of space applications, TI HiRel has introduced MILPRF-38535 radiation-tolerant products to our extensive qualified manufacturer listing (QML) Class V family.

Benefits of TI HiRel QML Class V Products:

• Broadproductoffering

• Designer-drivenportfolio

• High-performancedevices

• Latestavailabletechnology

• Radiationreportsavailable upon request

Potential Applications:

• Commercialanddefense space-based systems

• Dataprocessing

• Flightcriticalcontrolsystems

• Gaschromatographs

• Particledetectors

• Photometers

• Space-basedimagingandsurveillance

• Spectrometers

• Waveanalyzers

For more information on TI-HiRel space products, see www.ti.com/space.

Radiation EffectsHigh-energy protons, electrons and charged particles in natural space environments can strongly affect the operation of electronic circuits used in space applications.

Radiation is energy in transit, taking the form of high-speed particles and electromagnetic waves. We encounter electromagnetic waves every day. They make up our visible light, radio and television waves, ultraviolet (UV) light and microwaves with a large spectrum of energies. These examples of electromagnetic waves do not cause ionizations of atoms because they do not carry enough energy to separate molecules or remove electrons from atoms.

Ionizing radiation is radiation with enough energy so that during an interaction with an atom, it can remove tightly bound electrons from their orbits, causing the atom to become charged or ionized. Examples are gamma rays, protons and neutrons.

The most common radiation requirement in the aerospace design community is total ionizing dose (TID), also known as total dose. Total

dose irradiation is primarily caused by electrons and protons that penetrate into the silicon and can result in device degradation and/or device failure.

Charge buildup affects the current-voltage characteristics of transistors used in semiconductor circuits. Proper operation of a transistor relies on the ability to switch it from a low-conductance (off) state to a high-conductance (on) state as the gate voltage passes through a threshold. Extended exposure to radiation can shift the threshold voltages making the transistors easier or harder to switch. Radiation may also increase the leakage current, causing the on and off states of the transistors to become less distinguishable. Either effect can ultimately cause circuit failure. HiRel performs total dose testing on all space-qualified, QML Class V new product releases in order to determine how much radiation our devices can absorb before device degradation occurs. The test results for each device are available on request.

➔


Space

Overview

Single-event effectsAlthough total dose is the most common measure of radiation tolerance used in the industry, single-event effects, or SEE, rank as the number-one concern for space system designers. There are three common SEEs. The first is single-event upset, or “SEU.” In digital devices an SEU results in a bit flipping states from “1” to “0” or “0” to “1,” whereas in analog devices, an electrical transient can propagate through the signal chain, causing electrical errors or worse.

The second SEE is a single event latch-up, which can lead to severe disruption or even catastrophic device failure. Once a device latches, it can be recovered if caught soon enough, but only by powering down the system within approximately 500 mS of latch-up.

If not, the unchecked increase in current flow will result in the third SEE, which is single-event burnout. All of these failure modes are difficult enough to diagnose in terrestrial-based applications, but in a closed system such as a satellite can result in a very expensive repair trip.

TI’s complementary bipolar (BiCOM) processes are manufactured using “silicon over insulator,” deep-trench isolated wafer construction techniques that result in devices that are inherently immune to latch-up.

Radiation test servicesTI offers additional radiation test characterization services to accommodate specific program requirements.

• ELDRSandSEEtesting • Promptdosecharacterization

Radiation test methodTo assure reliable performance under the aforementioned environmental conditions, the HiRel space product line is thoroughly tested for radiation performance as part of the qualification process. The flow diagram shown here illustrates the HiRel radiation test procedure.

The devices are electrically tested before irradiation, with parametrics recorded and datalogged for later comparison. Devices are electrically biased in specialized fixtures within the radiation chamber and exposed to a predetermined radiation level. They are then electrically tested after irradiation

to determine if degradation or device failure has occurred. If no measurable degradation has occurred, the devices are irradiated again at a higher dose level and tested once more. This process repeats until the devices fail or reach the maximum predetermined radiation level.

Start

End

Pre-radmeasurements

Record Data

Record Data

Device Failure

Irradiate sample underbias conditions

Increment Dose

YesNo

Radiation test method

Logic

DataConverter

Clocks & Timing

Power Management

EmbeddedProcessing

DataConverter

Low-PowerRFInterface

Amplifier

Amplifier

Temperature

Pressure

Position

Speed

Flow

Humidity

Sound

Light

Identification

The RealWorld

TI space solutionsTI has radiation-tolerant, hermetically packaged devices released for each one of the blocks shown in the block diagram.

➔


Space

Data Converters

001

PhaseDetector

LoopFilter

VariableDelay

÷2 ÷2

2.4GspsDAC

001001

InputRegisters

Demuxand

Format

DA_P[13:0]

DA_N[13:0]

DB_P[13:0]

DB_N[13:0]

DLYCLK_P

DLYCLK_N

DTCLK_P

DTCLK_N

P_KLCCA

D

N_KLCCA

D

BandgapRef

REFIO_IN

REFIO

RBIASOUTRBIASIN

CSBIASCSBIAS_IN

IOUT_P

IOUT_N

BTH_S

DVL

INV_CLK

LAMR

ON

YLN

O_A

VNI_YL

NO_A

SZ_YLN

O_A

RESTARTLOCK

SLEEP

001

LoopFilter

VariableDelay

÷2 ÷2

2.4Gsps14-bit

DAC

001001

InputRegisters

Demuxand

Format

_ _

BandgapRef

_

The DAC5670-SP is a 14-bit, 2.4-GSPS digital-to-analog converter (DAC) with dual demultiplexed differential input ports. The DAC5670-SP is clocked at the DAC sample rate and the two input ports run at a maximum of 1.2 GSPS. An additional reference bit input sequence is used to adjust the output clock delay to the data source, optimizing the internal data latching clock relative to this reference bit with a delay lock loop.

Functional block diagram DAC5670-SP

Digital-to-Analog ConverterDAC5670-SPGet samples, datasheets, and evaluation modules at: www.ti.com/sc/device/DAC5670-SP

Key Features

• Radiationperformance: TID = 150kRad (Si)

• 3.3-Vanalogsupplyoperation

• 2-Wpowerdissipation

• 5-mAto30-mAdifferentialscalablecurrent outputs

•On-chip1.2-Vreference

• 192-ballCBGA(GEM)package

•QML-Vqualified,SMD5962-07247

• Defensetemperaturerange-55°Cto125°C

Applications

•Orbitaldataprocessing

• Point-to-pointmicrowave

• Radarandsatellitecommunications

• Space-basedcriticalcontrolsystems

The ADS5463-SP is a 12-bit, 500-MSPS analog-to-digital converter (ADC) that operates from both a 5-V supply and 3.3-V supply, providing LVDS-compatible digital outputs from the 3.3-V supply. The input buffer isolates the internal switch-ing of the onboard track and hold from disturbing the signal source while providing a high-impedance input.

Analog-to-Digital ConverterADS5463-SP Get samples, datasheets, and evaluation modules at: www.ti.com/sc/device/ADS5463-SP

Key Features

• Radiationperformance: TID = 150kRad (Si)

• SNR>64.5dBFSat450MHz and 500 MSPS

• 2.2-VPPdifferentialinputvoltage

• 2.2-Wtotalpowerdissipation

•On-chipanalogbuffer,trackandhold and reference circuit

• 84-pinceramicnonconductive tie-bar package (HFG)

• Defensetemperaturerange -55°C to 125°C

Applications

•Orbitalcommunication

•Orbitalcontrolsystems

• Spacecraftcommunications

Functional block diagram ADS5463-SP

AV DD DVDD

OVR OVR DRY

5

+ +

– –

5 5

D[12:0] GND

AIN

AIN

VREF

CLK

CLK

TH1A1 A2TH2

ADC1 DAC1 ADC2

ADC3

DAC2

TH3 A3

Reference

Timing Digital Error Correction

DRY

➔


Space

Interface

The TLK2711-SP is a member of the WizardLink transceiver family of multi-gigabit transceivers, intended for use in ultra-high-speed, bidirectional, point-to-point data transmission systems. The TLK2711-SP supports an effective serial interface speed of 1.6 Gbps to 2.5 Gbps, providing up to 2 Gbps of data bandwidth. The primary application of this transceiver is to provide very high-speed I/O data channels for point-to-point baseband data transmission over controlled imped-ance media of approximately 50Ω.

LOOPEN

RXN

RXP

BIAS PRE

RecoveredClock

TXP

TXN

RXCLK

RKMSB

RKLSB

TXD0−TXD15

9

9

RXD0−RXD15

PRBSVerification

ClockSynthesizer

Interpolator andClock Recovery

ENABLE

10

PRBSEN

TESTEN

10

10

Controls:PLL, Bias, RX,

TX

8b/1

0bEn

code

r

18 B

itR

egis

ter

Enco

der

18 B

itR

egis

ter

PRBSGenerator

MUX

TXCLK

2:1MUX

Parallel toSerial10

2:1MUX

2:1MUX

Serial toParallel101:2

MUX

10

10

9

9

2:1MUX

Data

CommaDetect

and 8b/10bDecoding

10

CommaDetect

and 8b/10bDecoding

Signal Detect(LOS)

TKLSB

PRBSEN

TKMSB

PRBSEN

PRBSEN

Clock

8b/1

0b

Functional block diagram TLK2711-SP

SerDes Interface TransceiverTLK2711-SPGet samples, datasheets, evaluation modules and application reports at: www.ti.com/sc/device/TLK2711-SP Key Features• Radiationperformance:

TID = 40kRad (Si)

• Hot-plugprotection

• High-performance68-pinceramicquad flat pack package (HFG)

• Low-poweroperation

• InterfacestoPCBs,coppercablesorfiber-optic cable

•On-chipPLLprovidesclocksynthe-sis from low-speed reference

• Receiverdifferentialinputthresholds200-mV minimum

• Lowpower:<500mW

• Idealforhigh-speedbackplaneinter-connect and point-to-point data link

Applications• Flightcriticalcontrolsystems

• Launchvehicles

• Satellitecommunications

• Space-basedimagingand surveillance

➔


Space

Clocks

The CDCM7005-SP high-performance, low-phase noise and low-skew clock synchronizer synchronizes a voltage-controlled crystal oscillator (VCXO) or voltage-controlled oscillator (VCO) frequency to one of two reference clocks. The CDCM7005-SP can lock to one of two reference clock inputs and supports frequency hold-over mode and fast frequency locking for fail-safe and increased system redundancy.

PECLto

LVCMOS

N

PECLINPUT

CTRL_LECTRL_DATACTRL_CLK

VCXO_IN

VCXO_IN

CP_OUT

PLL_LOCK

STATUS_VCXO/

STATUS_REF/PRI_SEC_CLK

I_REF_CP

RESET orHOLD

PD

V 1.3VCC –VBB

VCC_CPVC

GND

PRI_REF

SEC_REF

REF_SEL

RE

F_M

UX

LVCMOS

FB_MUX

LVCMOS

Y0B

Y0ALV

CMOS

LVPECL

LVCMOS

Y1B

Y1ALV

CMOS

LVPECL

LVCMOS

Y2B

Y2ALV

CMOS

LVPECL

LVCMOS

Y3B

Y3ALV

CMOS

LVPECL

LVCMOS

Y4B

Y4ALV

CMOS

LVPECL

Automatic

CurrentReference

ReferenceClock

N 212

P Divider

/8

90o

90o

LOCK

ChargePumpPFD

Y0_

MU

X

HOLD

P16-Div

M 10

FeedbackClock

Y1_

MU

XY

2_M

UX

Y3_

MU

XY

4_M

UX

AVCC

Functional block diagram CDCM7005-SP

Clock Synchronizer/Jitter CleanerCDCM7005-SP Get samples, datasheets, evaluation modules and application reports at: www.ti.com/sc/device/CDCM7005-SP Watch our video “Clocking a High-Speed ADC”.

Key Features• Radiationperformance:

TID = 50kRad (Si)

• Tworeferenceclockinputs(primaryand secondary clock) for redundancy support with manual or automatic selection

• AcceptsLVCMOSinputfrequenciesup to 200 MHz

• VCXOINoperatingfrequenciesupto2.2 GHz (LVPECL)

• UptofivedifferentialLVPECLout-puts or up to 10 LVCMOS outputs

• Frequencyisindividuallyselectableon each output

• SPI-controllabledevicesetting

• 3.3-Vpowersupply

• High-performance52-pinceramicquad flat pack (HFG)

Applications• High-speeddataacquisitionand

generation

•MRI:magneticresonanceimaging

•Orbitaldataaquisition

• Satellitecommunications

• Softwaredefinedradio(SDR)

• Space-basedimaging&surveillance

• Spacecraftwirelessinfrastructure

• Ultrasoundsystem

• X-ray:baggagescanner

• X-ray:medical

➔


Space

Digital Signal Processor

The C6701 DSP is based on TI’s high-performance VelociTI™ very-long-instruc-tion-word architecture, making it ideal for multichannel, multifunction applications. The C6701 DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. This processor has 32 general-purpose registers of 32-bit word lengths and eight highly independent functional units.

The land grid array (LGA) package configuration is designed for column attachment, yielding a column grid array (CGA) package.

The LGA facilitates ease of socketing for testing before column attachment, giving designers a choice in vendors for column attachment and the flexibility to specify column width and column length.

Prog

ram

ControlLogic

Test

C67x CPU

Data Path B

B Register File

ProgramAccess/Cache

Controller

Instruction Fetch

Instruction Dispatch

Instruction Decode

Data Path A

A Register File

DataAccess

ControllerPower-DownLogic

.L1† .S1† .M1† .D1 .D2 .M2† .S2† .L2†

32

ROM/FLASH

SRAM

I/O Devices

16

Timer 0

Timer 1

External MemoryInterface (EMIF)

MultichannelBuffered Serial

Port 0

MultichannelBuffered Serial

Port 1

Direct MemoryAccess Controller

(DMA)(4 Channels)

Host PortInterface

(HPI)

Internal Program Memory1 Block Program/Cache

(64K Bytes)

ControlRegisters

Internal DataMemory

(64K Bytes)2 Blocks of 8 Banks

Each

In-CircuitEmulation

InterruptControl

Framing Chips:H.100, MVIP,SCSA, T1, E1

AC97 Devices,SPI Devices,Codecs

DM

A B

uses

Dat

a B

usC6701 Digital Signal Processor

PLL(x1, x4)

Bus

SBSRAM

SDRAM

HOST CONNECTIONMC68360 GluelessMPC860 GluelessPCI9050 Bridge + InverterMC68302 + PALMPC750 + PALMPC960 (Jx/Rx) + PAL

† These functional units execute floating-point instructions.

Functional block diagram C6701-SP

Floating-Point DSPSMJ320C6701-SP Get samples, datasheets, evaluation modules and application reports at: www.ti.com/sc/device/SMJ320C6701-SP Key Features• Radiationperformance:

TID = 100kRad (Si)

• 1GFLOPperformanceata 167-MHz clock rate

•QualifiedtoQMLClass-V MIL-PRF-38535 standards

•Operatingtemperatureranges

• Extended (W) -55°C to 115°C

• TwoMACspercycleforatotalof334 million MMACs

• 1MBon-chipSRAM

• 64KBblockofprogrammemoryconfigurable as cache or memory-mapped program space

• Peripherals:

• Two McBSPs

• Two general-purpose timers

• HPI

• Glueless EMIF

Applications•Multichannelandmultifunction

applications

➔


Space

Power Management/Selection Tables

Unitrode Radiation Improvement Releases

Device SMD Orderable Description

UC1825J-SP/FK-SP 5962-8768104VEA/V2A Dual output, 1-MHz voltage/current mode PWM Controller

UC1825AJ-SP 5962-8768105VEA Dual output, 1-MHz voltage/current mode PWM Controller

UC1525BFK-SP 5962-8951106V2A Dual output, 250KHz voltage mode PWM Controller

UC1846J-SP/FK-SP 5962-8680603VEA/V2A Dual output, 500KHz voltage/current mode PWM Controller

UC1843AJG-SP 5962-8670409VPA Single ended, 500KHz voltage/current mode PWM Controller

UC19432-SP TBD Precision analog controller

UC1637-SP 5962-8995701VSA Switched-mode controller for DC motor drive

AC Logic Family Releases


SN54AC14-SP 5962-8762402VDA Hex Inverter, Schmitt Trigger

SN54AC02-SP 5962-8761203VDA Quadruple 2-Input Positive-NOR Gates

SN54AC00-SP 5962-8754903VCA Quadruple 2-Input Positive-NAND Gates

Enhanced low-dose-rate sensitivity (ELDRS) has become an issue in total dose radiation-tolerant analog applica-tions. To help mitigate this effect, TI improved the radiation performance on its UC18xx power management devices to achieve > 40kRad (Si) toler-ance to low-dose-rate radiation.

TI also released new versions of its AC logic device family, which reach total irradiated dose levels of 100 Krads. These improvements provide lower leakage current and improve radia-tion performance for high-temperature aerospace applications.

Unitrode UC18xx PWM Controllers and AC Logic Devices. Get samples, datasheets, evaluation modules at: www.ti.com/sc/device/space


VI/O (25 ºC)

(Max) (mV)

Vs (Max)

(V) Lib

(Max)

Slew Rate (typ)

(V/µs)

GBW (typ)

(MHz) Packages

LM124-SP 5962-7704301VCA Quadruple op amp, 4 channels 3 32 50 nA 100 1.2 14-CDIP

THS4511-SP 5962-0722201VFA Rad-tolerant Class V, wideband, fully differential amplifier, 100 MHz, 1 channel 4 5.25 20 uA 5100 1100 16-CFP

THS4513-SP 5962-0722301VFA Rad-tolerant Class V, wideband, fully differential amplifier, 100 MHz, 1 channel 5 5.5 20 uA 5100 1100 16-CFP

Device SMD Orderable Description Channels tRESP Low to High (µs) VS (Min) VS (Max) Output Type Package

LM139-SP 5962-7700801VCA Quad differential comparator 4 0.3 2 30 Open collector 14-CDIP

Comparator



SampleRate

(MSPS)SNR(dB)

SFDR(dB)

DNLLSB

INLLSB

SupplyVoltage

(V)Power(mW) Packages

ADS5424-SP 5962-0720601VXC 100kRad tolerant class V, 14-bit, 105-MSPS ADC w/one input channel 105 64 65.4 1.5 6.9 4.75, 5.25 1900 52-CFP

ADS5444-SP 5962-0720701VXC 100kRad tolerant class V, 13-bit, 250-MSPS ADC w/one input channel 250 6.5 60.5 2 4.8 4.75, 5.25 2000 84-CFP

ADS5463-SP 5962-0720801VXC 100kRad tolerant class V, 12-bit, 500-MSPS ADC w/one input channel 500 62.2 51.6 1.2 2.9 4.75, 5.25 2425 84-CFP

➔ Selection Tables


➔


Space

Selection Tables

Device SMD Orderable Description Operating Supply

Current (mA) VIN (Min)

(V) VIN (Max)

(V) Reference Voltage (V) Tolerance (%) Package

UC1901-SP 5962-8944101VCA Isolated feedback generator 5 4.5 40 1.5 1 14-CDIP

Device SMD Orderable Description Idrive (Max) (mA) VO (Min) (V) VIN (Max) (V) Packages

UC1832-SP 5962-9326501VCA/V2A Precision low-dropout linear controller 100 2 40 14-CDIP, 20-LCCC

UC1834-SP 5962-8774201VEA/V2A High-efficiency linear regulator 200 1.5 40 16-CDIP, 20-LCCC

LDO Controllers

Device SMD Orderable Description ESD HBM (kV) Packages

SN55182-SP 5962-7900801VXA Rad-tolerant Class V dual differential line receiver 2 14-CDIP, CFP

SN55183-SP 5962-7900901VCA Rad-tolerant Class V dual differential line driver 2 14-CDIP

SN55LVDS31-SP 5962-9762101VFA 100kRad tolerant quad LVDS transmitter 8 16-CFP

SN55LVDS32-SP 5962-9762201VFA 100kRad tolerant quad LVDS receiver 8 16-CFP

SN55LVDS33-SP 5962-0724801VFA 100kRad tolerant high-speed differential receiver 15 16-CFP

TLK2711-SP 5962-0522101VXC 1.6- to 2.5-Gbps, low-power serializer/deserializer 2 HFG

Interface

Feedback Signal Generator

Contact a Product Information Center near you for ELDRS free version. Contact information on back.


Device SMD Orderable Description Input levelOutput Frequency

(Max) (Mhz)Output Level

VCC (V)

No. of Outputs Package

CDCM7005-SP 5962-0723001VXC 3.3-V, high performance rad-tolerant class V, clock synchronizer and jitter cleaner

LVCMOS, LVPECL 1500 LVPECL,

LVCMOS 3.3 5 52-HFG


Power Supply Controllers

Device SMD Orderable Description VIN (Min)

(V) VIN (Max)

(V) Duty Cycle (Max)(%)

PWM Outputs (#) Packages

UCC1805-SP 5962-9451305VPA Low-power BiCMOS current-mode PWM 3.6 12 50 1 8-CDIP

UCC1806-SP 5962-9457501VEA/V2A Low-power, dual-output, current-mode PWM controller 6.75 15 50 2 16-CDIP, 20-LCCC

UC1823A-SP 5962-8990502VEA/V2A High-speed PWM controller 8.4 22 100 1 16-CDIP, 20-LCCC

UC1842-SP 5962-8670401VPA/VXA Current-mode PWM controller 10 30 100 1 8-CDIP, 20-LCCC

UC1842A-SP 5962-8670405VPA/VXA Current-mode PWM controller 10 30 100 1 8-CDIP, 20-LCCC

UC1844-SP 5962-8670403VPA/VXA Current-mode PWM controller 10 30 50 1 8-CDIP, 20-LCCC

UC1844A-SP 5962-8670407VPA/VXA Current-mode PWM controller 10 30 50 1 8-CDIP, 20-LCCC

UC1845-SP 5962-8670404VPA/VXA Current-mode PWM controller 7.6 30 50 1 8-CDIP, 20-LCCC

UC1845A-SP 5962-8670408VPA/VXA Current-mode PWM controller 7.6 30 50 1 8-CDIP, 20-LCCC

UC1863-SP 5962-9203103VEA/V2A Resonant-mode power-supply controller 7 22 50 2 16-CDIP, 20-LCCC

UC1875-SP 5962-9455501VRA/V3A Phase-shift resonant controller 9.25 20 100 4 20-CDIP, 28-LCCC


Device SMD Orderable DescriptionSample/Update

Rate (MSPS)Settling

Time (µs)SNR(dB)

SFDR(dB)

DNLLSB

INLLSB

SupplyVoltage (V)

Power(mW) Packages

DAC5670-SP 5962-0724701VXA 14-bit, 2.4-GSPS DAC with two DAC channels 2400 0.0035 60 55 1.75 7.5 3.0, 3.6 2000 192-CBGA

DAC5675A-SP 5962-0720401VXC Class V, 14-bit, 400-MSPS DAC w/one DAC ch. 400 0.012 67 82 2.5 4.6 3.15, 3.6 660 52-CFP

Clocks

➔


Space

Selection Tables

Device SMD Orderable Description Output Current (A) VIN (Min) (V) VIN (Max) (V) Number of outputs (#) Packages

UC1611-SP 5962-9053801VPA/V2A Quad Schottky diode array 1 0 50 100 8-CDIP, 20-LCCC

Device SMD orderable Description Initial Accuracy

at 25°C (%) V0 Adj

(Min) (V)

V0 Adj (Max)

(V)

Min Iz for Regulation

(μA) Package

TL1431-SP 5962-9962001VPA 30kRad ELDRS free precision-adjustable (programmable) shunt reference 0.4 2.5 36 1000 8-CDIP

Schottky Diode Arrays

Shunt Voltage Reference

MOSFET Drivers

Device SMD Orderable Description Peak Output Current (A)

VIN (Min) (V)

VIN (Max) (V)

Number of Outputs (#) Packages

UC1705-SP 5962-9579801VPA Complementary high-speed power driver w/internal regulator 1.5 5 40 1 8-CDIP

UC1707-SP 5962-8761901VEA/V2A, 5962-0051401VPA Complementary high-speed power driver 1.5 5 40 2 8, 16-CDIP, 20-LCCC,

UC1708-SP 5962-0051401VEA/V2A Non-inverting high-speed power driver 3 5 35 2 16-CDIP, 20-LCCC

UC1709-SP 5962-0151201VPA Inverting high-speed MOSFET driver 1.5 5 40 2 8-CDIP

UC1710-SP 5962-0152001VPA Complementary high-current MOSFET driver 6 4.7 18 1 8-CDIP


Device SMD Orderable Description VIN (Min)

(V) VIN (Max)

(V) Duty Cycle (Max)(%)

PWM Outputs (#)

Radiation Tolerance (TID [Si]) Packages

UC1825-SP 5962-8768101VEA/V2A High-speed PWM controller 8.4 22 50 2 40 KRad (ELDRS-free) 16-CDIP, 20-LCCC

UC1525B-SP 5962-8951105VEA/V2A Regulating pulse-width modulator 8 35 50 2 40 KRad (ELDRS-free) 16-CDIP, 20-LCCC

UC1825A-SP 5962-8768102VEA/V2A High-speed PWM controller 8.4 30 50 2 40 KRad (ELDRS-free) 16-CDIP, 20-LCCC

UC1843-SP 5962-8670402VPA/VXA Current-mode PWM controller 7.6 30 100 1 40 KRad (ELDRS-free) 8-CDIP, 20-LCCC

UC1843A-SP 5962-8670406VPA/VXA Current-mode PWM controller 7.6 30 100 1 40 KRad (ELDRS-free) 8-CDIP, 20-LCCC

UC1846-SP 5962-8680601VEA/V2A Current-mode PWM controller 7 40 50 2 40 KRad (ELDRS-free) 16-CDIP, 20-LCCC

Radiation-Tolerant PWM Power Supply Controllers

Digital Signal Processor

Device SMD Orderable Description DMA Core Supply

(V) I/O Supply

(V) Rating Timers Radiation Tolerance Packages

SMJ320C6701-SP 5962-9866102V Rad-tolerant, Class V, floating-point digital signal processor 4 1.9 3.3 Space (2) 32-bit 100kRad 429-CFCBGA,

429-FCLGA

Device SMD Orderable Description Packages

54ALS244-SP 5962-8683901 Octal buffer and line driver with 3-state outputs VRA, VSA

54LVT162244-SP 5962-9680901 3.3-V ABT, 16-bit buffer/driver with 3-state outputs VXA

54LVTH16244A-SP 5962-9668501 3.3-V ABT, 16-bit buffer/driver with 3-state outputs VXA

54HC244-SP 5962-8409601 Octal buffer and line driver with 3-state outputs VRA, VSA

54HCT244-SP 5962-8513001 Octal buffer and line driver with 3-state outputs VRA, VSA

54LVTH244A-SP 5962-9584401 3.3-V ABT, 16-bit octal buffer/driver with 3-state outputs V2A, VRA, VSA

54LVTH162245-SP 5962-9678001 3.3-V ABT, 16-bit bus transceiver with 3-state outputs VXA

54LVTH162373-SP 5962-9763801 3.3-V ABT, 16-bit transparent D-type latch with 3-state outputs VXA

54HC273-SP 5962-8409901 Octal D-type flip-flop VRA, VSA

Logic

To view more of our Logic portfolio for space applications, visit www.ti.com/space.


➔

High Temperature

Overview

Design considerationsThe Texas Instruments High Reliability (HiRel) group offers a wide range of semiconductors for use in High Temperature. Many applications need electronics that operate outside the typical industrial operating temperature range and even beyond the standard defense temperature range of -55°C to +125°C. These applications have special requirements for qualification and packaging. TI has developed semiconductors to satisfy the needs for quality and reliability in areas that need detailed characterization, operating life tests and special packaging.

High Temperature applications: •Oil and gas exploration and

production•Undersea cabling• Industrial•Medical•Aerospace

High temperatureTexas Instruments introduced a new line of devices that can withstand operating temperatures from -55°C to +210°C. These High Temperature (HT) offerings provide a solution to the needs of customers requiring extreme temperature operation for a variety of applications. TI HiRel continues to expand these offerings with new parts to provide a complete signal chain solution for customers.

High temperature offerings:•Standard off-the-shelf parts offering

-55°C to +210°C operation•High temperature characterization

+200°C•+200°C operation for 1,000 hours•Packaging

• Ceramic packages• Known good die

•Support for long product lifecycles•Standard HT datasheet

• High temp data• Operating life curve

•Small size and low-power offerings

For more information about TI’s HiRel and HT products, see www.ti.com/ht.

Featured ProductsHT ARM7TDMI(tm) Flash MicrocontrollerSM470R1B1M-HT

The SM470R1B1M(3) devices are members of the Texas Instruments SM470R1x family of general-purpose 16/32-bit reduced instruction set computer (RISC) microcontrollers. The B1M microcontroller offers high performance utilizing the high-speed ARM7TDMI 16/32-bit RISC central processing unit (CPU), resulting in a high instruction throughput while maintaining greater code efficiency. The ARM7TDMI 16/32-bit RISC CPU views memory as a linear collection of bytes numbered upwards from zero. The SM470R1B1M utilizes the big-endian format where the most significant byte of a word is stored at the lowest numbered byte and the least significant byte at the highest numbered byte.

Key Features• High-Performance Static CMOS

Technology • 60-MHz System Clock (Pipeline Mode) • Independent 16/32-Bit Instruction Set • Open Architecture With Third-Party

Support • Built-In Debug Module• 1M-Byte Program Flash • 64K-Byte Static RAM (SRAM) • Memory Security Module (MSM) • JTAG Security Module• Low-PowerModes:STANDBYandHALT

ApplicationsSupports extreme temperature applications • Controlled Baseline • One Assembly/Test Site • One Fabrication Site • Available in Extreme (–55°C/210°C)

Temperature Range(1)

Memory

SYSTEM Module

PeripheralLibrary

CAN

J1850 Digital

MibADC 10 -bit

SPI

CPU BusOscillator

PLL

Program Flash

DataRAM

WatchdogRTI

SCI

I2C

High End Timer

DMAI/Os / EBM

ECPIEM

SystemDecoder

MemoryProtection

ARM7TDMI

16-b

it Th

umb

Inst

ruct

ion

Set

Deco

mpr

essi

on

Registers

Shifter

Deb

ugM

odul

e

Addr . Registers

32- bit ALU-

INC

Multiplier

JTAG

Iin

terfa

ce

➔

➔


High Temperature

Featured Products

Quad/Octal, Simultaneous Sampling, 24-Bit Analog-to-Digital Converters ADS1278-HT

Based on the single-channel ADS1271, the ADS1278 (octal) is a 24-bit, delta-sigma () analog-to-digital converter (ADC) with data rates up to 128 k samples per second (SPS), allowing simultaneous sampling of eight channels. Traditionally, industrial delta-sigma ADCs offering good drift performance use digital filters with large passband droop. As a result, they have limited signal bandwidth and are mostly suited for dc measurements. High-resolution ADCs in audio applications offer larger usable bandwidths, but the offset and drift specifications are significantly weaker than respective industrial counterparts. The ADS1278 combines these types of converters, allowing high-precision industrial measurement with excellent dc and ac specifications.

AVDD DVDD IOVDD

PDWN[8:1]

DOUT[8:1]

MODE[1:0]

FMAT[2:0]

IN1

IN2

IN3

IN4

SCLK

DRDY/FS

DIN

SYNC

TEST[1:0]

CLKDIV

CLK

Serial

Interface

AGND

REFNREFP

DGND

Control Logic

5V 1.8V - 3.3V1.8V

X 8

FIR Filters

With

Bypass Mode

IN5

IN6

IN7

IN8

ADS1278

Key Features• Simultaneously Measure Eight Channels • Up to 128-kSPS Data Rate • Linear Phase Digital Filter • SPI™ or Frame-Sync Serial Interface • Low Sampling Aperture Error • Modulator Output Option (digital filter

bypass) • Analog Supply: 5 V • Digital Core: 1.8 V • I/O Supply: 1.8 V to 3.3 V • Currently Available in an 84-Pin HFQ

Package and a KGD Chip tray Option

ApplicationsSupports extreme temperature applications •Controlled Baseline •One Assembly/Test Site •One Fabrication Site •Available in Extreme (–55°C/210°C)


➔


High Temperature

Featured Products

Low Noise, Very Low Drift, Precision Voltage ReferencesREF5025-HT

The REF5025 is a low-noise, low-drift, very high precision voltage reference. This reference is capable of both sinking and sourcing, and is very robust with regard to line and load changes. Temperature drift (20 ppm/°C) from –55°C to 210°C is achieved using proprietary design techniques. These features combined with very low noise make the REF5025 ideal for use in down-hole drilling applications.

Key Feature• Low Temperature Drift: 20 ppm/°C • Low Noise: 3 µVPP/V •High Output Current: ±7 mA ApplicationsSupports extreme temperature applications•Down-Hole Drilling •High Temperature Environments• Controlled Baseline •One Assembly/Test Site •One Fabrication Site •Available in Extreme (–55°C/210°C)


1.8-V Micropower CMOS Operational Amplifier Zero-Drift SeriesOPA2333-HT

The OPA2333 series of CMOS operational amplifiers uses a proprietary auto-calibration technique to simultaneously provide very low offset voltage and near-zero drift over time and temperature. These miniature, high-precision, low-quiescent-current amplifiers offer high-impedance inputs that have a common-mode range 100 mV beyond the rails, and rail-to-rail output that swings within 150 mV of the rails. Single or dual supplies as low as 1.8 V (±0.9 V) and up to

5.5 V (±2.75 V) may be used. They are optimized for low-voltage single-supply operation.Key Feature• Low Offset Voltage: 26 µV (Max) • 0.01-Hz to 10-Hz Noise: 1.5 µVPP •Quiescent Current: 50 µA •Single-Supply Operation •Supply Voltage: 1.8 V to 5.5 V •Rail-to-Rail Input/Output

ApplicationsSupports extreme temperature applications •Down-Hole Drilling •High Temperature Environments•Controlled Baseline •One Assembly/Test Site •One Fabrication Site •Available in Extreme (–55°C/210°C)


ADS8326

REF5025

REF

VOUT

GND

+IN

IN

VIN+5 V

OPA365

InputSignal

0 V to 4 V

5 V 5 V

VDD

GND

C1 F

BYPASS

R50

1

C1.2 nF

1

C22 F

2

R1VEX

VOUT

VREF

R1

OPA2333RR

R R+5V

➔


High Temperature Product PortfolioDevice Description Package

Amplifiers

OPA2333-HT 1.8-V Micropower CMOS Operational Amplifier Zero-Drift Series KGD, 8CFP

OPA211-HT Low Noise Precision Operational Amplifier KGD, 8CFP


ADS1278-HT Octal, Simultaneous Sampling, 24-Bit Analog-to-Digital Converters KGD, 84CQFP

Interface

SN65HVD233-HT 3.3-V CAN Transceiver KGD, 8CFP, 8CDIP

SN65HVD11-HT 3.3-V RS-485 Transciever KGD, 8CFP, 8CDIP

Processors

SM320F2812-HT 32-Bit Digital Signal Controller with Flash KGD, 172CQFP

SM470R1B1M-HT ARM7TDMI Flash Microcontroller KGD, 84CQFP

Power Management

TPS62000-HT High-Efficiency, Step-Down, Low-Power DC-DC Converter KGD, 10CFP

TPS76901-HT Single-Output LDO, 100-mA, Adjustable KGD, 8CFP

REF5025-HT Low-Noise, Very Low Drift Voltage Reference KGD, 8CFP

TPS40200-HT Wide-Input Non-Synchronous Buck DC/DC Controller KGD, 8CFP

Standard Ceramic HiRel Parts Used in High TemperatureDevice Description Package

Amplifiers

LM124J Quad Op Amp 14CDIP

LT1014AMJ Quad Precision Operational Amplifier 14CDIP

TL074MJB High-Speed, Low-Noise, JFET-Input Quad Operational Amplifier 14CDIP

TLC2272MJG Low-Noise Advanced LinCMOS Dual Operational Amplifier 8CDIP

TLE2022MJGB High-Speed, Low-Power Precision Dual Operational Amplifier 8CDIP

TLV2262MJGB Low-Voltage, Low-Power Advanced LinCMOS technology based (TM) Dual Op Amp 8CDIP

OPA2335AMJG 0.05-uV/C max, Single-Supply CMOS Operational Amplifier 8CDIP


TLV5638MJGB Low-Power 12-bit Dual DAC 8CDIP

TLC2543MJ 12-Bit, 66 kSPS ADC Serial Out 20CDIP

Power Management

TLC7705MFKB Single Power SVS (5V) with Programmable Time Delay 20LCCC

UC1845J Current-Mode PWM Controller 8CDIP

UC1903J Quad Supply and Line Monitor 18CDIP

UCC1801J Low-Power BiCMOS Current-Mode PWM 8CDIP

UCC1806J Low-Power, Dual-Output, Current-Mode PWM Controller 16CDIP

Processors

SMJ320C30 Third Generation Digital Signal Processor KGD, 181CPGA, 196CFP

SMJ320C40 Fourth Generation Digital Signal Processor KGD, 325CPGA,352CFP

SM320F240HFPM40 16-bit, 5-V Fixed Point DSP with Flash 132 CQFP

High Temperature

Selection Tables


➔

Die/Wafer Solutions

Overview

Texas Instruments offers bare die/wafer solutions for applications that require higher levels of integration to reduce board space. TI provides a wide range of products in bare die and wafer form. A variety of testing and qualification options are available based on product maturity and complexity, as well as customer requirements.

Typical screening options include DC probe or AC/DC probe at temperature.

TI offers three categories of die screening:•Commercial wafers and die

• Standard TI wafer fabrication•Known good die (KGD)

• Stand-alone data sheet and warranted over temperature

•Customer-defined qualification• QML Class Q (MIL-STD)• QML Class V (Space)• Additional options available

Typical processing and capabilities include:•Mount and bond diagrams•Probed die – 55°C to +210°C or

special temp•Shipping: tape and reel, waffle

packs, custom trays, Gel-Pak•Sidewall and visual inspections

For more information regarding TI’s die and wafer offerings, visit www.ti.com/hirel or email [email protected].

Known Good DieDevice Description Tempature Range

OPA2348CKGD4 1-MHz, 45-µA, RRIO, dual operational amplifier (0/70°C)

LT1009MKGD1 2.5-V integrated reference circuit (–55°C/125°C)

TPS40200SKDG1 Wide-input, non-synchronous buck DC/DC controller (–55°C/210°C)

TPS62000SKGD1 High-efficiency, step-down, low-power DC/DC converter (–55°C/210°C)

TPS76901SKGD1 Ultra-low-power 100-mA low-dropout line regulator (–55°C/210°C)

REF5025SKGD1 Low noise, very low drift precision voltage reference (–55°C/210°C)

OPA211SKGD1 1.1-nV/rtHz noise, low-power precision operational amplifier (–55°C/210°C)

OPA2333SKGD1 1.8-V micropower CMOS operational amplifier zero-drift series (–55°C/210°C)

ADS1278SKGDA Octal, 144-kHz, simultaneous sampling 24-bit delta-sigma ADC (–55°C/210°C)

ADS1282SKGDA Ultra-high resolution delta-sigma ADC with PGA for seismic and energy exploration (–55°C/210°C)

INA129SKGD1 Precision low-power instrumentation amplifier (–55°C/210°C)

SN65HVD11SKGDA 3.3-V RS-485 transceiver (–55°C/210°C)

SN65HVD233SKGDA 3.3-V CAN transceiver (–55°C/210°C)

SM320F2812KGDS150A 32-bit digital signal controller with flash (–55°C/220°C)

SM470R1B1MKGDS1 16-/32-bit RISC flash microcontroller (–55°C/220°C)


➔

Defense

Overview

TI’sHighReliabilityDefense&Aerospace (TI HiRel) Group (CAGE code number 01295) was created in 1978 to serve the special requirements of the defense customer. Today, TI HiRel is one of the world’s largest ISO 9001 certified broad-line suppliers, operating as a dedicated business unit under TI’s corporate umbrella.

This position enables us to leverage the latest technology, manufactur-ing capability and product mix for advanced and critical aerospace and defense applications. TI HiRel offers a broad selection of semiconductor

technology, foundry services, compo-nents, advanced packaging and sup-port for specific requirements where reliability, qualification, vendor item drawings (VIDs), standard microcircuit drawings (SMDs) and baseline control are critical.

TI’s HiRel portfolio provides devices as enhanced products (EP) in plastic pack-ages and full military-class ceramic (QML) packages with extended operating-temperature ranges. We offer an expanding portfolio of QML Class Q and V (qualified to MIL-PRF- 38535) product lines with extended

temperature and radiation-tolerant operating ranges. Complexity ranges from a low-voltage single op amp to a complete system on a chip.

It is TI HiRel’s vision to be the world’s leading supplier of semiconductor-based products and services to the defense and aerospace markets, achieving customer satisfaction by providing innovative solutions through standard and differentiated inte-grated circuits. In order to meet this aggressive goal, we must continue to both meet and exceed customer expectations.

Featured Products➔

3-V to 5.5-V, 12-Bit, 200-kSPS, 4-/8-Channel, Low-Power Serial Analog-to-Digital ConverterTLV2548M

Digitization

RFTransmit

Radar

RadarReceiver

ADC

DACSDRAM FIFO

Data CorrectionProcessor

Flash/EPROM

ImageProcessor

SupportLogic

Image Processing

System Control

System Communication

Display

BusInterface

SystemProcessor

SupportLogic

ADC

SupportLogic

CommunicationsProcessor

VRAM VRAM ASIC

DisplayProcessor

CommunicationsRS-465, 1394, LVDS, SerDes

LCD DisplayDrivers

RAMDAC

CRT

FPDJTAGPower Management

Key Features•Maximum throughput 200 kSPS•Built-in reference, conversion clock

and 8x FIFO•Differential/integral nonlinearity error:

±1.2 LSB at –55°C to 125°C•Signal-to-noise and distortion ratio:

65 dB, fi = 12 kHz at –55°C to 125°C•Spurious-free dynamic range: 75 dB,

fi = 12 kHz•SPI-/DSP-compatible serial

interfaces with SCLK up to 20 MHz•Single wide-range supply: 3 VDC to

5.5 VDC•Analog input range: 0 V to supply

The TLV2548M is a high-performance, 12-bit, low-power, 3.5-µs CMOS analog-to-digital converter (ADC) operating from a single 3-V to 5.5-V power supply. This device has three digital inputs and a three-state output (chip select [CS], serial input/output clock [SCLK], serial data input [SDI], and serial data output [SDO]) that provide a direct four-wire interface to the serial port of most popular host microprocessors (with an SPI interface). For interface with a DSP, a frame sync (FS) signal is used to indicate the start of a serial data frame.

voltage with 500-kHz BW• Low operating current:

• 1 mA at 3.3 V• 1.7 mA at 3.3 V• 2 mA at 5.5 V with external ref• 2.4 mA at 5.5 V with internal ref

•Power down:• Software/hardware power-down

mode (1 µA typ, ext ref)• Auto power-down mode (1 µA typ,

ext ref)•Programmable auto-channel sweep

➔


Defense

Featured Products

Defense Digital Signal ProcessorSMJ320F2812

The SMJ320F2812 device, member of the TMS320C28x™ DSP generation, is a highly integrated, high-performance solution for demanding control applications.

Key Features• High-performance static CMOS

technology• 150 MHz (6.67-ns cycle time)• Low power (1.8-V core at 135 MHz,

1.9-V core at 150 MHz, 3.3-V I/O)• 3.3-V flash voltage• JTAG boundary-scan support• High-performance 32-bit CPU (C28x™

DSP)• 16 x 16 and 32 x 32 MAC operations• 16 x 16 dual MAC• Harvard bus architecture• Atomic operations• Fast interrupt response and

processing• Unified memory programming model• 4M linear program address reach• 4M linear data address reach• Code-efficient (in C/C++ and

assembly)• TMS320F24x/LF240x processor,

source-code compatible• On-chip memory

Seeker

Front-EndDown

Conversion

VRAM SDRAM FIFO


Flash/EPROM

ImageProcessor

SupportLogic

Image Processing

Seeker

ADC


DataCommunications

Fin

Fin

Motor

Motor

Display

DisplayProcessor

RAMDAC

Flight Control

Host SystemProcessor

Navigation/Guidance

InertialMeasurement

GPS Processor

Boot-Load

EPROMFlash

SupportLogic

JTAGPower Management

Defense Floating-Point Digital Signal ProcessorSMJ320C40

Key Features•SMJ: QML processing to MIL-PRF-

38535•SM: Standard processing•TMP: Commercial-level processing

TAB•Operating temperature ranges:

• Defense (M): –55°C to 125°C• Special (S): –55°C to 100°C• Commercial (C): –25°C to 85°C• Commercial (L): 0°C to 70°C

•Highest-performance floating-point DSP

•Six communication ports•Six-channel direct memory access

(DMA) coprocessor •Single-cycle 1/x, 1/√–x•Twelve 40-bit registers, 8 auxiliary

registers, 14 control registers and 2 timers

SMJ320C40 digital signal processors (DSPs) are 32-bit, floating-point processors manufactured in 0.72-µm, double-level metal CMOS technology. They are part of the fourth-generation DSP family from TI and are designed primarily for parallel processing.

Digitization

RFTransmit

Radar

RadarReceiver

ADC

DACSDRAM FIFO


Flash/EPROM

ImageProcessor

SupportLogic

Image Processing

System Control

System Communication

Display

BusInterface

SystemProcessor

SupportLogic

ADC

SupportLogic

CommunicationsProcessor

VRAM VRAM ASIC

DisplayProcessor


LCD DisplayDrivers

RAMDAC

CRT

FPDJTAGPower Management

➔


Defense

Analog Family

OverviewTI HiRel offers a strong mixed-signal and analog portfolio. The process/screening levels available include Department of Defense (DoD) and Defense Supply Center Columbus (DSCC) endorsed Standard Micro-circuit Drawing (SMD) and MIL-PRF- 38535 (QML), comprehending best commer cial practices. Mil-temp ceramic and enhanced products (EP) are also available.

Product Nomenclature (Typical Analog Products)Example: TLE2022AMJGBPrefix—TLESNJ = TI interface, MIL-PRF-38535

(QML)SN = commercial processingTL = TI linear control circuitTLC = TI LinCMOS™ technologyTLE = TI Excalibur™ technologyTLV = TI linear low voltageTPIC = TI intelligent powerAD = analog devices1

AM = advanced micro devices1

LM = National Semiconductor1

LT = linear technology1

OP = PMI1

SE = Signetics1

μA = Fairchild1

THS = TI high powerTPS = TI power supplyUnique Device Designator—2022AA or B in last position = upgradeTemperature Range—MM = –55°C to 125°C (applicable to all

TI prefixes except SNJ)Q = –40°C to 125°CI = –40°C to 85°CT = –40°C to 105°CPackage Type/Pin Count—JGDA = plastic small-outline package/28,

30, 32 or 38

FK = ceramic leadless chip carrier (CLCC)/20 or 28

GA = ceramic pin grid array/84HFG = ceramic flatpack/84 or 164J = ceramic DIP/8, 14, 16, 20 or 28JG = ceramic DIP/8U = ceramic flatpack/10W = ceramic flatpack/14 or 16WD = ceramic flatpack/56L = ceramic leadless chip carrier

(CLCC)/20 or 28PHP = plastic quad flatpack

PowerPAD™ integrated circuit package/48

PCE = plastic quad flatpack/144 or 160

PWP = plastic power TSSOP/14, 16, 20, 24 or 28

DW = plastic widebody (30 mil) SOIC/16, 20, 24 or 28

TCP = tape carrier package/customPFB = plastic quad flatpack/48Process Level—BBlank = standard suffix, commercial

processingB = MIL-PRF-38535 (QML)Enhanced Product—EPSelect enhanced products are available. The part numbers for those devices end in EP.

Product Nomenclature (TI-Unitrode Power Management Products)Example: UC1825BJ883BPrefix—UCUC = linear integrated circuitsUCC = BiCMOSPart Number—1825First digit “1” = defense temperature

range2

First digit “2” = industrial temperature range2

First digit “3” = commerical temperature range2

Optional Grades—BA or B = improved versionProcess Level—J883B3

J, JE = ceramic DIP (300 mil and 600 mil)

L, L20 = ceramic leadless chip carrier (CLCC)

Enhanced Product—EPSelect enhanced products are available. The part numbers for those devices end in EP.

1Second source.2Consult individual data sheets for specific temperature ranges on each part.3The “883B” designator was retained to be consistent with the original Unitrode naming convention.

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Defense

Analog Family


Device BitsAnalog Input

ChannelsSupply Voltage

Range (V) Sample Rate

Output Interface

Type

V. Ref Internal/External

Power (Typ)(mW)

DNL (Max) (±LSB)

INL (Max) (±LSB) Package

THS1408M(5962-0051101NXD) 14 1 3.0 to 3.6 8 MSPS Parallel Int. 270 1 5 PHP (QML plastic)

THS1206M(5962-9957701NXD) 12 4 3.0 to 5.5 6 MSPS Parallel Int. 186 1 1.8 PWP (QML plastic)

TLC876M 10 1 4.5 to 5.2 20 MSPS Parallel Ext./Special 107 1 1.6 DW

TLC2543M 12 11 4.5 to 5.5 66 kSPS Serial Ext. 12 1 1 J, FK

TLV1548M 10 8 2.7 to 5.5 85 kSPS Serial Ext. 4 1 1 J, FK

TLV1543M 10 11 3.0 to 3.6 38 kSPS Serial Ext. 8 1 1 J, FK

TLC1542M 10 11 4.5 to 5.5 38 kSPS Serial Ext. 12 1 1 J

TLV2548M 12 8 2.7 to 5.5 200 kSPS Serial Int. or Ext. 9.5 1 1 FK


Device BitsAnalog Input

ChannelsSupply Voltage

Range (V) Sample Rate

Output Interface

Type

V. Ref Internal/External

Power (Typ)(mW)

DNL (Max) (±LSB)

INL (Max) (±LSB) Package

TLV5638M 12 2 2.7 to 5.5 0.233 MSPS Serial Int. 7.5 to 22 1 4 JG, FK

TLC5618AM 12 2 4.5 to 5.5 0.093 MSPS Serial Ext. 9 1 4 JG, FK

TLV5618AM 12 2 2.7 to 5.5 0.093 MSPS Serial Ext. 5.4 1 4 JG, FK

TLV5619M 12 1 2.7 to 5.5 1 MSPS Parallel Int. 2.7 0.5 3 J, FK

Interface (Data Transmission)

DeviceDrivers/Receivers

Per PackagePropagationDelay

tpd (ns)ICC

(mA) Package

EIA-RS-422A, CCITT v.11

AM26LS32AM 0/4 35 70 J, FK, W

AM26LS33AM 0/4 35 70 J, FK, W

SN55173 0/4 35 70 J, FK

AM26C32M 0/4 27 15 J, FK, W

SN55LBC173 0/4 30 20 J, FK, W

SN55LBC175 0/4 30 20 J, FK, W

AM26C31M 4/0 12 3 J, FK, W

EIA-RS-232

SN55189A 0/4 85 26 J, FK, W

SN55188 4/0 350 34 J, FK, W

Miscellaneous Standards

SN55189A 0/4 85 26 J, FK, W

SN55188 4/0 350 34 J, FK, W

AM26C32M 0/4 RS-423 15 J, FK, W

AM26C31M 4/0 RS-423 3 J, FK, W

SN55976A1 9/9 SCSI 60/45 WD

AM26LS32AM 0/4 RS-423 70 J, FK, W

AM26LS33AM 0/4 RS-423 70 J, FK, W

SN55LBC173 0/4 RS-423 20 J, FK, W

SN55LBC175 0/4 RS-423 20 J, FK, W

SN55173 0/4 RS-423 70 J, FK

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Defense

Analog Family

Voltage-Mode Pulse-Width-Modulator (PWM) Controllers

Device

Maximum Practical

Freq.StartupCurrent

OperatingCurrent

SupplyVoltage

(V)

UVLO:On/Off

(V)

Maximum Duty Cycle

(%)SoftStart Shutdown

Drive (Sink/Source)

(A) Package Topology

TL5001 500 kHz 1.0 mA 20 mA 3.6 to 40 3.0/3.0 Prog. Yes No 0.02 8-JG, 20-FK For, fly, buck, boost

TL1451A 500 kHz 1.3 mA 20 mA 3.6 to 50 2.7/2.6 Prog. No No 0.02 16-JG, 20-FK For, fly, buck, boost

UC1524A 250 kHz 4 mA 5 mA 8 to 40 7.5/7 Prog. Yes Yes 0.2/0.2 16-J, 20-L Full, half bridge

UC1525A 450 kHz — 14 mA 8 to 35 7.0/6.8 Prog. Yes Yes 0.1/0.4 16-J, 20-FK For, fly, buck, boost, full, half bridge

UC1525B 450 kHz — 14 mA 8 to 35 7.0/6.8 Prog. Yes Yes 0.1/0.4 16-J, 20-FK For, fly, buck, boost, full, half bridge

UC1526 250 kHz — 14 mA 8 to 35 — Prog. Yes Yes 0.2/0.2 18-J, 20-L Full, half bridge

UC1527A 250 kHz — 14 mA 8 to 35 7.0/7.0 Prog. Yes Yes 0.2/0.2 16-J, 20-L Full, half bridge

Current-Mode PWM Controllers

Device

Maximum Practical

Freq.StartupCurrent

OperatingCurrent

SupplyVoltage

(V)

UVLO:On/Off

(V)

Maximum Duty Cycle


Drive (Sink/Source)


UCC1800 1 MHz 100 μA 500 μA 7.2 to 15 7.2/6.9 100 Yes No 1.0/1.0 8-J, 20-L Buck, boost


UCC1802 1 MHz 100 μA 500 μA 12.5 to 15 12.5/8.3 100 Yes No 1.0/1.0 8-J, 20-L Forward, flyback




UCC1806 350 kHz 100 μA 1.4 mA 7 to 15 7.5/6.7 Prog. Yes Yes 0.5/0.5 16-J, 20-L Full, half, push-pull

UC1842 500 kHz 0.5 mA 11 mA 10 to 30 16.0/10.0 100 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost

UC1842A 500 kHz 0.3 mA 11 mA 10 to 30 16.0/10.0 100 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost

UC1843 500 kHz 0.5 mA 11 mA 7.6 to 30 8.4/7.6 100 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost

UC1843A 500 kHz 0.3 mA 11 mA 7.9 to 30 8.5/7.9 100 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost

UC1844 500 kHz 0.5 mA 11 mA 10 to 30 16.0/10.0 50 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost

UC1844A 500 kHz 0.3 mA 11 mA 10 to 30 16.0/10.0 50 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost

UC1845 500 kHz 0.5 mA 11 mA 7.6 to 30 8.4/7.6 50 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost

UC1845A 500 kHz 0.3 mA 11 mA 7.9 to 30 8.5/7.9 50 No No 1.0/1.0 8-J, 20-L For, fly, buck, boost

UC1846 500 kHz 1.5 mA 17 mA 8 to 40 7.7/7 Prog. Yes No 0.5/0.5 8-J, 20-L Full, half, push-pull

Voltage and Current Mode Compatible

Device

Maximum Practical

Freq.StartupCurrent

OperatingCurrent

SupplyVoltage

(V)

UVLO:On/Off

(V)

Maximum Duty Cycle


Drive (Sink/Source)


UC1823 1 MHz 1.1 mA 22 mA 9 to 30 9.2/8.4 Prog. Yes No 1.5/1.5 16-J, 10-L Buck, boost

UC1823A 1 MHz 1.1 mA 22 mA 9 to 22 9.2/8.4 Prog. Yes No 1.5/1.5 16-J, 10-L Buck, boost

UC1825 1 MHz 1.1 mA 22 mA 9 to 30 9.2/8.4 Prog. Yes No 1.5/1.5 16-J, 10-L Full, half, push-pull

UC1825A 1 MHz 100 μA 28 mA 9 to 22 16/10 Prog. Yes No 2.0/2.0 16-J, 10-L Full, half, push-pull

Soft-Switching PWM—Resonant Mode

Device

Maximum Practical

Freq.StartupCurrent

OperatingCurrent

SupplyVoltage

(V)

UVLO:On/Off

(V)

Maximum Duty Cycle


Drive (Sink/Source)


UCC1895 1 MHz 150 μA 5 mA 11 to 17 11/9.0 100 Yes Yes 0.1/0.1 20-J Full bridge

UC1875 1 MHz 150 μA 45 mA 10.7 to 20 10.7/9.3 100 Yes No 2.0/2.0 20-J, 28-L Full bridge

Power-Factor-Correction Products

Device

Maximum Practical

Freq.

CurrentError AmpBandwidth

AverageCurrentMode

WorldwideInput Voltage

Operation

OutputDrive(A)

StartupCurrent

(mA)

Under-VoltageLockout

(V)EnableInput

Multiplier/Divider

Feedforward Package

UC1854 200 kHz 800 kHz Yes Yes 1 1.5 16/10 Yes Yes 16-J

UC1854B 200 kHz 5 MHz Yes Yes 1 0.3 10.5/10 Yes Yes 16-J

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Defense

Analog Family

DC Motor Controllers

DeviceOutput Clamps

Diodes Hall Logic

Output Current Per Output

(A)Operating Voltage

(V)Differential Current

Sense Amplifier Current Limit Package

UC1637 — 0.1 ±2.5 to ±20 — Yes 18-J (through-hole package and surface-mount package)

Power-Supply Support Products—Supervisory and Monitoring (SVS) Circuits

Device AttributesVCC (Nom)

(V)VIT– (V)

Tolerance (%)

VIN (Min)

(V)Number of SVS’s

Complementary Outputs

ICC (Max) (mA)

Over- Voltage Sense WDI Package

TLC7733M Single micropower with programmable delay 3.3 2.93 2.4 1 1 Yes 0.016 No No JG, FK

TLC7705M Single micropower with programmable delay 5 4.55 1.5 1 1 Yes 0.016 No No JG, FK, U

PWM-Supply Support ProductsDevice Description Key Application Features Package

UC1611 Quad Schottky Four-diode array for high-current bridges and voltage clamps

Matched, four-diode monolithic array, high peak current, low forward voltage, can be connected in parallel for higher current or lower drop 8-J, 20-L

UC1901 Isolated feedbackgenerator

Amplitude modulation system used to couple a control signal across a voltage-isolation barrier

Transformer couples isolated feedback error signal. Low-cost alternative to optocouplers. 5-MHz carrier provides fast-response capability. Modulator synchronizable to an external clock.

14-J, 20-L

PWM Support Products—Power FET Drivers

Device Output FET DriverOutput

ConfigurationPeak Rise Time

(ns)Maximum Voltage

(V)Output Current

(A) Package

UC1709 Single Complementary 80 40 1.5 8-J, 20-L

UC1710 Single Complementary 35 20 6.0 8-J

PWM Support Products—Power Drivers

Device Power DriverOutput

Configuration Enable Inhibit Analog StopOutput Rise Time

(ns)Maximum Voltage

(V)

Peak Output Current

(A) Package

UC1705 Single Complementary — — — 60 40 1.5 8-J, 20-L

UC1706 Dual Complementary — Yes Yes 130 40 1.5 16-J, 20-L

UC1707 Dual Complementary — Yes Yes 50 40 1.5 16-J, 20-L

UC1708 Dual Non-Inverting Yes — — 25 35 3.0 8-J, 16-E, 20-L

Power-Supply Support Products—Quad Line Monitors

Device AttributesVIN Range

(V)Window Adjust

Proj. Fault Threshold

Prog. Time Delay Current Limit

Power-Supply Monitor Package

UC1903 Quad 8 to 40 Yes Yes Yes No Quad J, L

Linear-Regulation Products—Defense Precision Programmable Voltage References

Device AttributesVref(V)

Output Voltage

Tolerance (%)

Sink Current Temp. Coeff.(Type)

(ppm/°C)

Input Voltage (Max)

(V) Package(Min)(V)

(Max)(V)

(Min)(mA)

(Max)(mA)

TL1431 Adjustable shunt 2.5 Vref 36 0.4 1 100 23 36 JG, FK

Linear-Regulation Products—Linear Controllers

Device

Type of

Output

Maximum Input Voltage

(V)

Minimum Output Voltage

(V)Output Drive

(mA)

Type of Short-Circuit

Limit

Reference-Voltage

Accuracy (%)Special

Features Package

UC1832 Positive adjustable 36 2.0 300 Duty cycle 2 Multiple pins 14-J, 20-L

UC1834 Positive or negative adjustable 40 1.5/–2.0 350 Foldback 3/4 — 16-J, 20-L

UC1836 Positive adjustable 40 2.5 500 Foldback 2 Built-in Rsense 8-J

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Defense

Analog Family

ComparatorsDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) IOL (mA) Response Time (Typ) (ns) Package

LM111 4 to 30 4 150 8 165 JG, FK

LM139 4 to 30 9 –300 6 300 JG, FK, W

LM139A 4 to 30 4 –300 6 300 JG, FK, W

LM193 4 to 30 9 –300 6 300 JG, FK

TLC139M 4 to 16 10 30 6 1100 JG, FK, W

TLC193M 4 to 16 10 30 6 1100 JG, FK

TLC372M 4 to 16 10 20 6 200 JG, FK, U

TLC374M 4 to 16 10 20 6 200 JG, FK, W

TLC3702M 4 to 16 10 30 20 1100 JG, FK, U

TLC3704M 4 to 16 10 30 20 1100 JG, FK, W

TLV2352M 2 to 8 10 20 6 1400 JG, FK, U

TLV2354M 2 to 8 10 20 6 1400 JG, FK, W

Operational Amplifiers—SingleDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package

OP27A ±4/±22 0.06 60 600 8 2.8 JG, FK

OP27C ±4/±22 0.3 150 300 8 2.8 JG

OPA688M ±5 6 1200 1 530 1000 JG

OPA689M ±5 5 1200 1 280 1600 JG

TLC2201M ±4.6/±16 0.1 0.5 45 1.8 2.5 JG, FK

TLC2201AM ±4.6/±16 0.1 0.5 45 1.8 2.5 JG, FK

TLC2652M ±4.4/±16 0.01 0.5 1000 1.9 2.8 J, JG, FK

TLC2652AM ±4.4/±16 0.008 0.5 1000 1.9 2.8 J, JG, FK

TLC2654M ±4.4/±16 0.05 0.5 1000 1.9 2 J, JG, FK

TLC2654AM ±4.4/±16 0.04 0.5 1000 1.9 2 J, JG, FK

TLE2021M ±2/±20 1 70 500 2 0.65 JG, JG

TLE2021AM ±2/±20 0.5 65 500 2 0.65 JG, FK

TLE2021BM ±2/±20 0.2 60 500 2 0.65 JG, FK

TLE2027M ±4/±22 0.2 150 2500 13 2.8 JG, FK

TLE2027AM ±4/±22 0.1 150 3500 13 2.8 JG, FK

TLE2061M ±3.5/±18 6 40 20 2 3.4 JG, FK, U

TLE2061AM ±3.5/±18 3.6 40 20 2 3.4 JG, FK, U

TLE2061BM ±3.5/±18 1.7 40 20 2 3.4 JG

TLE2071M ±2.3/±19 9.2 65 88 10 40 JG, FK, U

TLE2071AM ±2.3/±19 7.2 65 88 10 40 JG, FK, U

TLE2161M ±3.5/±20 6 40 20 6.4 10 JG, FK

TLE2161AM ±3.5/±20 3.6 40 20 6.4 10 JG, FK

TLE2161BM ±3.5/±20 1.7 40 20 6.4 10 JG, FK

TLE2141M ±2/±22 1.7 –1800 20 6 45 JG, FK

Operational Amplifiers—High SpeedDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package

THS4011M ±5/±15 6 25 290 290 310 JG, FK

THS4031M ±5/±15 2 75 100 100 100 JG, FK

THS4051M ±5/±15 8 9 70 70 240 JG, FK

THS4061M ±5/±15 9 9 180 180 400 JG, FK

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Defense

Analog Family

Operational Amplifiers—Single (Continued)Device Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package

TLE2141AM ±2/±22 1.2 –1800 20 6 45 JG, FK

TLV2460M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U

TLV2460AM ±2.7/±6 1.7 14 32 5.2 1.6 JG, FK, U

TLV2461M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U

TLV2461AM ±2/±6 1.7 14 32 5.2 1.6 JG, FK, U

Operational Amplifiers—DualDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package

LM158 ±1.5/±15 7 300 25 0.6 0.2 JG, FK

LM158A ±1.5/±15 7 300 25 0.6 0.2 JG, FK

LT1013M ±5/±22 0.6 45 250 0.7 0.4 JG, FK

LT1013AM ±5/±22 0.3 30 500 0.7 0.4 JG, FK

MC1558 ±5/±15 0.6 1500 25 1 0.5 JG, FK

TLC2202M ±4.6/±16 1 0.5 100 1.9 2.7 JG, FK

TLC2202AM ±4.6/±16 0.75 0.5 100 1.9 2.7 JG, FK

TLC2252M ±4.4/±16 1.75 0.5 10 0.21 0.12 JG, FK, U

TLC2252AM ±4.4/±16 1 0.5 10 0.21 0.12 JG, FK, U

TLC2262M ±4.4/±16 3 0.5 50 0.73 0.55 JG, FK, U

TLC2262AM ±4.4/±16 1.5 0.5 50 0.73 0.55 JG, FK, U

TLC2272M ±4.4/±16 3 0.1 15 2.18 3.6 JG, FK, U

TLC2272AM ±4.4/±16 1.5 0.1 15 2.18 3.6 JG, FK, U

TLC4502M ±4/±6 100 10 200 4.7 2.5 JG, FK, U

TLC4502AM ±4/±6 50 10 200 4.7 2.5 JG, FK, U

TLE2022M ±2/±20 0.7 90 800 2.8 0.65 JG, FK

TLE2022AM ±2/±20 0.45 90 1000 2.8 0.65 JG, FK

TLE2022BM ±2/±20 0.3 90 1000 2.8 0.65 JG, FK

TLE2062M ±3.5/±18 6 40 20 2 3.4 JG, FK, U

TLE2062AM ±3.5/±18 4 40 20 2 3.4 JG, FK, U

TLE2062BM ±3.5/±18 3 40 20 2 3.4 JG, FK

TLE2072M ±2.3/±19 10.5 60 93 10 40 JG, FK, U

TLE2072AM ±2.3/±19 8 60 93 10 40 JG, FK, U

TLE2082M ±2.3/±20 9.5 60 93 10 40 JG, FK

TLE2082AM ±2.3/±20 6.5 60 93 10 40 JG, FK

TLE2142M ±2/±22 1.6 1.8 20 6 45 JG, FK, U

TLE2142AM ±2/±22 2 1.8 20 6 45 JG, FK, U

TLV2262M ±2.7/±8 3 0.5 50 0.71 0.55 JG, FK, U

TLV2262AM ±2.7/±8 1.5 0.5 50 0.71 0.55 JG, FK, U

TLV2252M ±2.7/±8 1.75 0.5 10 0.2 0.12 JG, FK, U

TLV2252AM ±2.7/±8 1 0.5 10 0.2 0.12 JG, FK, U

TLV2422M ±2.7/±10 0.95 0.3 700 0.052 0.02 JG, FK, U

TLV2422AM ±2.7/±10 2 0.3 700 0.052 0.02 JG, FK, U

TLV2442M ±2.7/±10 2.5 0.3 750 (typ) 1.75 1.3 JG, FK, U

TLV2442AM ±2.7/±10 1.6 0.3 750 (typ) 1.75 1.3 JG, FK, U

TLV2432M ±2.7/±10 2.5 0.3 950 (typ) 0.55 0.25 JG, FK, U

TLV2432AM ±2.7/±10 2 0.3 950 (typ) 0.55 0.25 JG, FK, U

TLV2462M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U

TLV2462AM ±2.7/±6 1.7 14 32 5.2 1.6 JG, FK, U

TLV2463M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK

TLV2463AM ±2.7/±6 1.7 14 32 5.2 1.6 JG, FK

TLV2772M ±2.5/±5.5 2.5 0.006 20 4.8 9 JG, FK, U

TLV2772AM ±2.5/±5.5 1.6 0.006 20 4.8 9 JG, FK, U

TL062M ±5/±15 9 50 4 1 3.5 JG, FK

TL072M ±5/±15 9 50 15 3 13 JG, FK, U

TL082M ±5/±15 9 50 15 3 13 JG, FK

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Defense

Analog Family

Operational Amplifiers—QuadDevice Supply Voltage (V) VIO (Max) (mV) IIB (Max) (nA) AVD (V/mV) B1 (MHz) Slew Rate (V/μs) Package

LM124 ±1.5/±15 7 300 25 0.6 0.13 J, FK, W

LM124A ±1.5/±15 4 100 25 — — J, FK

LM148 ±4/±18 6 325 25 1 0.5 J, FK, W

LT1014M ±5/±22 0.55 45 250 0.7 0.4 J, FK

LT1014AM ±5/±22 0.35 30 400 0.7 0.4 J, FK

OPA4684M ±5 4 13 — 250 750 J, FK

TLC2264M ±4.4/±16 3 0.5 50 0.73 0.55 J, FK, W

TLC2264AM ±4.4/±16 1.5 0.5 50 0.73 0.55 J, FK, W

TLC2274M ±4.4/±16 3 0.5 20 2.3 3.6 J, FK, W

TLC2274AM ±4.4/±16 1.5 0.5 20 2.3 3.6 J, FK, W

TLC54M ±4.4/±16 1.75 0.5 10 0.21 0.12 J, FK, W

TLC2254AM ±4.4/±16 1 0.5 10 0.21 0.12 J, FK, W

TLE2024M ±2/±20 1.2 90 400 2.8 0.7 J, FK, W

TLE2024AM ±2/±20 0.95 90 800 2.8 0.7 J, FK

TLE2024BM ±2/±20 0.7 90 1000 2.8 0.7 J, FK

TLE2064M ±3.5/±18 8 40 20 2 3.4 J, FK

TLE2064AM ±3.5/±18 6 40 20 2 3.4 J, FK

TLE2064BM ±3.5/±18 4 40 20 2 3.4 J, FK

TLE2074M ±2.3/±19 10.5 60 93 10 40 J, FK, W

TLE2074AM ±2.3/±19 8.5 60 93 10 40 J, FK

TLE2144M ±2/±22 4 1800 20 6 45 J, FK

TLE2144AM ±2/±22 3.2 1800 20 6 45 J, FK

TLV2254M ±2.7/±8 1.75 0.5 10 0.2 0.12 J, FK, W

TLV2254AM ±2.7/±8 1 0.5 10 0.2 0.12 J, FK, W

TLV2264M ±2.7/±8 3 0.5 50 0.71 0.55 J, FK, W

TLV2264AM ±2.7/±8 1.5 0.5 50 0.71 0.55 J, FK, W

TL064M ±5/±15 15 50 4 1 3.5 J, FK, W

TL074M ±5/±15 15 50 15 3 13 J, FK, W

TL084M ±5/±15 15 50 15 3 13 J, FK

TLV2464EP ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U

TLV2464AM ±2.7/±6 1.7 14 32 5.2 1.6 JG, FK, U

TLV2465M ±2.7/±6 2.2 14 32 5.2 1.6 JG, FK, U

Special Functions—Precision Timers

DeviceSupply Voltage

(V)Supply Current

(mA)Bandwidth (Typ)

(MHz)Differential Output

Offset (mV)Log Linearity

(30-dB Sections) Package

SE555 4.5 to 18 5 ±200 Single 10 μs to hours JG, FK

SE556 4.5 to 18 8 ±200 Dual 10 μs to hours J, FK

TLC555M 2 to 15 0.7 +100/–10 Single 1 μs to hours JG, FK

TLC556M 2 to 15 1.4 +100/–10 Dual 1 μs to hours J, FK

➔


Defense


OverviewTI is a recognized leader in the field of DSP and DSP product support. Spanning nine product generations, our SMJ320 family of DSP chips offers cost-effective HiRel solutions for computationally intensive applications.

Continuing the tradition of providing leading-edge processing capability to high-reliability products, TI introduced the HiRel C6201 in 1998, and the C6201B and C6701 were released in 2000. The HiRel C6201B offers fixed-point performance of 1200 million instructions per second (MIPS). The HiRel C6701 supports up to 1 billion floating-point operations per second (GFLOPS). In the third quarter of 2001, TI released the HiRel VC33, which offers performance of up to 150 MFLOPS in the smallest available package. The C6203 was released in 2002. This fixed-point DSP features 1600-MIPS performance at 200 MHz over the full HiRel temperature range and offers 7 Mbits of on-chip SRAM. Continuing our commitment to the HiRel DSP market, TI released the ceramic- packaged C6415, which provides up to 4800 MIPS of processing perform-ance at a 600-MHz clock rate. We also offer a HiRel graphics processor in the 34020A.

In recognition of the continually changing demands of the HiRel market, TI DSPs are offered with a variety of processing options, includ-ing MIL-PRF-38535 (QML Class Q), enhanced products, and QML Class V for space applications.

Product Nomenclature1 (Typical Analog Products)Example: SMJ320C40GBM40Prefix—SMJSM = commercial processingSMJ = MIL-PRF-38535 (QML Class Q)SMQ = MIL-PRF-38535 (QML Class N)

(order by SMD)SMP = production prototypeSMX = defense preproductionTMS = commercial qualifiedTMP = commercial gradeSMV = MIL-PRF-38535 (QML Class V)

(order by SMD)320 DSP Family Designator—320 or 32320 DSP Product Designator—C40BC = CMOS bootC = CMOSE = CMOS EPROMF = CMOS flashLC = CMOS 3.3 VVC = CMOS 1.5 V/3.3 V14 = E1415 = C1525 = C2526 = C2630 = C3031 = C3132 = C3233 = VC3340 = C40Package Type/Pin Count—GBJD = CDIPFD/FJ = LCCCGB/GF = CPGAGFA = CFGPGLG/GLP = FC/CSPHFH/HFG = CFPHFP = CFPKGD = KGDPCM/PQ = QFP

GNM = FBGAGAD = FCμBGAGJC = FC/CSPGJL = FC/CSPGLZ = FCBGAGDP = LQFPPGE = Plastic LQFPGGU = BGAGGW = MicroStar BGA™ integrated

circuit packagePGF = LQFPGHH = PBGATemperature Range—MM = –55°C to 125°CA = –40°C to 105°C (TMS320C6000™

DSP)L = 0°C to 70°CW = –55°C to 115°CS = special per data sheetBlank = 25°CSpeed Designator—4012 = 120 MHz16 = 160 MIPS (VC5416)20 = 200 MIPS (VC5421)33 = 33 MHz40 = 40 MHz50 = 500 MHz (C64xx)60 = 60 MHz (600-MHz C6415)60 = 60 MIPS (TMS320C54x™ DSP)66 = 66 MHz10 = 100 MIPS (C54x™)14 = 140 MHz15 = 150 MHz16 = 167 MHz17 = 175 MHz20 = 200 MHz120 = 120 MFLOPS (VC33)150 = 150 MFLOPS (VC33)

1Not all speed, package, process or temperature combinations are available.

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Defense


DSPsDevice Feature Size (μ) Data Format Bits Cycle Time (ns) Performance Package Compiler

320LC31EP 1.6 Fixed 16 4/5 12.5/10 MIPS FD/68, FJ/68, GB/68 C

320C15 2 Fixed 16 4/5 6.25/5 MIPS JD/40, FJ/44 —

320C30 0.72 Floating 32 4/5 50/40 MFLOPS GB/181, HFG/196, KGD/181 Ada, C

320C31 0.72 Floating 32 4/5 50/40 MFLOPS GFA/141, HFG/132, KGD/132 Ada, C

320C40 0.72 Floating 32 33/40/50 60/50/40 MFLOPS GF/325, HFH/352, TAB/TBB/324, KGD/325 Ada, C

320C50 0.72 Fixed 16 3/4 33/25 MIPS GFA/141, HFG/132, KGD/115, PQ/132 C

320C32 0.72 Floating 32 33/40 60/50 MFLOPS PCM/144 Ada, C

320C80 0.5 Fixed/Floating — 1/2 50 MIPS/250 MIPS/ 100 MFLOPS GF/305, HFH/320 —

320LC31 0.72 Floating 32 50 40 MFLOPS KGD/132, PQ/132 Ada, C

320F240 0.72 Fixed 16 50 20 MIPS HFP/132 C

320C6201B 0.18 Fixed 16 6.7 1200 MIPS GLP/429 Ada, C

320C6701 0.18 Floating 32 7 840 MFLOPS GLP/429 Ada, C

320C6203 0.15 Fixed 16 5 1600 MIPS GLP/429 C

320VC33 0.18 Floating 32 20 150 MFLOPS GNM/144 C

320C6414-EP 0.12 Fixed 32 2 4000 MIPS GL2/532 C

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Defense

First In, First Out Memory Family (FIFOs)

OverviewTI’s first-in, first-out (FIFO) memory products provide the speed and features necessary to optimize system performance by eliminating the data bottlenecks common between DSPs, high-speed processors, memory devices and analog front ends (AFEs).

DSP Synchronous FIFO Benefits•Optimizes system performance•Eliminates data bottlenecks between

DSPs, high-speed processors, industry-standard buses, memory devices and AFEs

•Designed for a variety of systems, including real-time DSP applications, telecommunications, internetworking, instrumentation and high-bandwidth computing

•Glueless interface with C6x and newer TMS320C5x™ DSPs

•Output edge control (OEC): Reduces simultaneous-switching noise and

Synchronous FIFOsDevice Organization Technology Process Level Pins Package DSCC SMD Number

SN54ABT3614 64 x 36 x 2 BiCMOS SN 132 HFP NA

SN54ABT3614 64 x 36 x 2 BiCMOS QML Plastic 120 PCB 5962-9560901NXD

SN54ABT7819 512 x 18 x2 BiCMOS SNJ 84 GB 5962-9470401QXA

SN54ACT3632 512 x 36 x 2 CMOS SN 132 HFP NA

SN54ACT3641 1K x 36 CMOS SN 132 HFP NA

SN54ACT3641 1K x 36 CMOS QML Plastic 120 PCB 5962-9560801NXD

SN54ACT7881 1K x 18 CMOS QML Plastic 80 PN 5962-9562701NXD

SN54ABT3614 64 x 36 x 2 BiCMOS SN 132 HFP NA

Asynchronous FIFOsDevice Organization Technology Process Level Pins Package DSCC SMD Number

SN54ABT7820 512 x 18 x 2 BiCMOS SNJ 84 GB 5962-9650901QXA

CD54HC40105 4 x 16 HCMOS SNJ 16 J NA

CD54HCT40105 4 x 16 HCMOS SNJ 16 J NA

CD40105 4 x 16 HCMOS SN 16 J NA

SN54ABT7820 512 x 18 x 2 BiCMOS SNJ 84 GB 5962-9650901QXA

CD54HC40105 4 x 16 HCMOS SNJ 16 J NA

CD54HCT40105 4 x 16 HCMOS SNJ 16 J NA

package inductance•Distributed VCC and GND reduce

package inductance•Programmable flags provide design

flexibility and control•Generates and checks parity to

ensure data integrity in fault-control systems

•Synchronous retransmit feature provides a user-defined point to transmit data

•Mailbox-bypass registers permit the user to bypass the internal SRAM

•Bus-mapping feature sizes data from 36 bits to either 9, 16 or 18 bits

•Byte-swapping feature converts data from big endian (Motorola) to little endian (Intel), ideal for mixed systems

Product NomenclatureExample: SN54ABT36148HFPPrefix—SNSN = commercial processingSNJ = MIL-PRF-38535 (QML Class Q)

Defense Temperature—5454 = –55°C to 125°C74 = 0°C to 70°CTechnology—ABTABT = advanced BiCMOSACT = advanced CMOSLS = low-power SchottkyHC = high-speed CMOS (CMOS input

levels)HCT = high-speed CMOS (TTL input

levels)Circuit Designator—3614J, JE = ceramic DIP (300 mil and

600 mil)L, L20 = ceramic leadless chip carrier

(CLCC)Package Type—8HFPJ = CDIPHFP = CFPKGD = KGDPCB/PN = QFPFK = LCCCGB = MicroStar BGA™ integrated

circuit package

➔


Defense

Logic Family

OverviewTI offers a full spectrum of defense-grade logic devices to support the rigorous demands of the defense and aerospace markets. Standard process options include MIL-PRF-38535 (QML Class Q) (SNJ prefix) and commercial processing only (SN prefix). TI HiRel is committed to supporting defense and aerospace system requirements and will continue to release new logic devices that leverage TI’s most advanced processing technology to create world-class performance.

18 = SCOPE/JTAG Widebus32 = Widebus+™Options—22 = series-damping resistors on

outputsDevice Function—245(See page 18 for device listing by

function.)Package Type—WDPZ = LQFPPW = TSSOPDW = SOICDL = SSOPD = SOICDB = TSSOPDGG = TSSOPDCK = SOPGQL = MicroStar Junior™ BGAZQL = MicroStar Junior BGAJ, JT = CDIPW/WD = ceramic flatpackFK = ceramic leadless chip carrier

(CLCC)HV, HT, HFP = ceramic quad flatpackGB = pin grid array (PGA)

Product Nomenclature (Standard Logic)Example: SNJ54ABTH162245WDPrefix—SNJSNJ = MIL-PRF-38535 (QML Class Q)SN = commercial processingSNV = MIL-PRF-38535 (QML Class V)

(order by SMD)Type—54Technology—ABTNo designator = TTLALS/AS = advanced low-power

Schottky diodes and advanced Schottky diodes

AHC/AHCT = advanced high-speed CMOS

HC/HCT = high-speed CMOSBCT = BiCMOSAC/ACT = advanced CMOSABT = advanced BiCMOSLVC = low-voltage CMOSLVTH = low-voltage advanced CMOS

with bus holdCDC = clock distribution circuitCBT = crossbar bus switchGTL = gunning transceiver logicFCT = fast-CMOS technologyF = fast logicSpecial Features—HD = level-shifting diode (CBTD)H = bus hold (LVTH)Bus/Scan Options—168 = SCOPE™/JTAG16 = Widebus™

➔


Defense

Logic Family

Definitions

Advanced BiCMOS Technology (ABT) —54ABTABT devices offer high-speed switch-ing with the benefit of low noise, low power consumption and high-output drive current. Based on EPIC-IIB BiCMOS design, ABT offers numer-ous improvements over BiCMOS technology (BCT) while retaining TTL compatibility.

Advanced Bipolar—54ALS, 54AS, 54FAdvanced Schottky (AS) diodes and advanced low-power Schottky (ALS) diodes combine to provide the designer with a broad range of func-tions that aid in optimizing designs. The 54ALS, 54AS and 54F families enable a socket-by-socket selection of devices for optimum speed and power.

Advanced CMOS—54AC, 54ACTAdvanced CMOS devices offer advanced bipolar speed with low power consumption and low noise. Industry-standard pinouts allow for ease of design and cross-referencing.

Advanced High-Speed CMOS (AHC)—54AHC, 54AHCTAHC and AHC with TTL (AHCT) provide the HCMOS user with an excellent migration path to upgrade speed performance in low-power, low-noise, low-drive applications. Standard offer-ings include compatible functions for both CMOS (AHC) and TTL (AHCT).

Advanced Low-Voltage CMOS (ALVC) —54ALVCALVC has typical propagation delays of less than 2 ns, a current drive of 24 mA and static power consumption of 40 μA for bus-interface functions. It is the industry standard for speed-critical 3.3-V designs.

BiCMOS Technology (BCT)—54BCTA standard bipolar/CMOS process fea-turing high drive, low noise, low power consumption and TTL compatibility.

CD4000 Series—CD4This series of high-voltage CMOS devices offers a spectrum of functions that range from simple gates to com-plex counters, registers and arithmetic circuits.

Crossbar Technology (CBT)—54CBTCBT enables a bus-interface device to function as a very fast bus switch, effectively isolating buses when the switch is open and offering very little propagation delay when the switch is closed. CBT devices can also be used to translate 5 V to 3.3 V, allowing designers to mix 5-V or 3.3-V compo-nents in the same system.

First In, First Out (FIFO)—54ABT, 54ACTFIFO memories can connect data buses operating at different clock rates. These memories offer different flag configurations and different data widths/depths to allow greater system optimization.

High-Speed CMOS (HC)—54HC, 54HCTHC and HC with TTL (HCT) deliver low power and low noise at a low price. The HC family offers CMOS-compatible inputs, while the HCT family offers TTL-compatible inputs.

Low-Voltage Advanced CMOS—54LVTHThe low-voltage technology (LVTH) product line consists of bus interface functions with bus hold designed to operate at VCC = 3.3 V. These devices feature very low power consumption and provide performance comparable to that of 5-V advanced BiCMOS tech-nology (ABT). LVT input- and output-voltage levels are compatible with 5-V TTL levels, making them ideal for mixed-level systems.

Low-Voltage CMOS (LVC)—54LV, 54LVCWith a range of functions that includes gates, MSI and octals, LVC gives the designer a solid choice for migrating to low voltage in mid-range applications. This family supports mixed-mode sig-nal operations on all ports (5-V input/output voltage with 3.3-V VCC).

SCOPE™—54BCT8, 54ABT8, 54ABT18, 54LVTH18SCOPE devices blend test circuitry with standard logic functions to facili-tate testing of complex circuit-board assemblies. In the normal mode, the SCOPE device is functionally equiva-lent to a standard device. In the test mode, the test circuitry can be acti-vated via the four-wire test access port (TAP) to take snapshot samples of the data appearing at the device pins or to perform a self-test on the boundary test cells. These functions are offered in both standard and Widebus™ pack-aging and are compatible with 5-V and 3.3-V components.

Standard TTL—54LS, 54S, 54Standard TTL devices offer a large number of general-purpose logic func-tions with standard pinouts and stan-dard packaging.

Widebus and Widebus+™—ABT16, ACT16, LVTH116, ABT32Widebus devices offer 16, 18 and 20 bits of bus interface logic in one space-saving package. Widebus+ devices offer 32 and 36 bits of bus interface logic in one package.

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Defense

Logic Family

Function1 Description

00 Quad 2-input NAND


02 Quad 2-input NOR


04 Hex inverter

04 Unbuffered ’04

04U Hex inverter (OC)

05 Hex inverter buffer


07 Quad 2-input AND

08 Quad 2-input AND

09 Triple 3-input NAND

10 Triple 3-input AND

11 Triple 3-input NAND

12 Hex Schmitt-trigger

14 Triple 3-input AND


16 Hex buffer

17 Dual 4-input NAND

20 Dual 4-input AND

21 Dual 4-input NOR

23 Dual 4-input NOR


26 Triple 3-input NOR

27 Quad 2-input NOR

28 8-input NAND

30 Quad 2-input OR

32 Quad 2-input NOR

33 Quad 2-input NAND buffer


40 Dual 4-input NAND buffer

42 4-to-10 BCD-to-decimal decoder

45 BCD-to-decimal decoder

47 BCD-to-7 seg. decoder

49 BCD-to-7 seg. decoder

50 Dual AND-OR-INVERT (expandable)

51 Dual AND-OR-INVERT

54 4-wide AND-OR-INVERT

64 4-2-3-2 AND-OR-INVERT

72 J-K master-slave flip-flop

73 Dual J-K flip-flop w/reset

74 Dual D-type flip-flop w/set/reset

75 4-bit bistable latches


76 Dual J-K flip-flop

83 4-bit full adder

85 4-bit mag. comparator

86 Quad exclusive-OR

90 Decade counter

91 8-bit shift register

92 Divide-by-12 counter

93 4-bit binary counter



97 Sync. 6-bit binary rate mult

107 Dual J-K flip-flop w/reset

109 Dual J-K flip-flop w/set/reset

112 Dual J-K flip-flop w/set/reset

114 Dual J-K flip-flop

121 Monostable multivibrators

123 Dual ’122

124 Dual VCO

125 Quad bus buffer (/OE)

126 Quad bus buffer (OE)

128 75-W line driver

132 Quad NAND Schmitt-trigger

133 13-input NAND

134 12-input NAND

136 Quad exclusive-OR (OC)

137 3-to-8 decoder/mux

138 3-to-8 decoder/mux

139 Dual 3-to-4 decoder/mux

140 Dual 4-input NAND (50 W)

145 BCD-to-decimal decoder

147 10-to-4 line priority encoder

148 8-to-3 line decoder

150 1-of-16 data sel/mux

151 1-of-8 data sel/mux

153 Dual 4-to-1 sel/mux

154 4-to-16 line decoder/demux

155 Dual 2-to-4 decoder

156 Dual 1-to-4 demux (OC)

157 Quad 2-to-1 sel/mux

158 Quad 2-to-1 INV. sel/mux

161 Sync. 4-bit binary counter

162Sync. BCD decade counter/ synchronous

reset


163 Sync. 4-bit binary counter


165 8-bit shift register (serial-in/parallel out)

166 8-bit shift register (serial-in/parallel out)

169 Sync. 4-bit U/D counter

170 4-by-4 register file

173 Quad D-type register

174 Hex D-type flip-flop w/reset

175 Quad D-type flip-flop w/reset

177 Binary counter/latch

180 9-bit odd/even parity generator

181 4-bit ALU

182 Look-ahead carry generator

190Presettable sync. BCD decade w/ U/D

counter

192 Sync. U/D BCD counter

193 Sync. U/D binary counter



197 4-bit counter/latch

221 Dual monostable multivibrator

AbbreviationsALU Arithmetic logic unit

ASP Addressable scan ports

C-O Complementary output

FIFO First-in first-out memory

Gen Generator

Inv Inverting

Mult Multiplier

Mux Multiplexer

OC Open collector outputs

Reg Register

Sel Selector

Sync Synchronous

XCVR Transceiver

UBE Universal bus exchanger

UBT Universal bus transceiver

UD Up/down

VCO Voltage-controlled oscillator

1Logic devices are available in a number of technologies. See Product Nomenclature on page 16 for details or visit www.ti.com/defense and click on Logic.

Devices by Function

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Defense

Logic Family


222 16K x 4 bipolar FIFO

224 16K x 4 bipolar FIFO

2373-to-8 line decoder/mux w/address

latches

238 3-to-8 line decoder/demux

240 8-bit buffer

241 8-bit buffer

243 4-bit transceiver

244 8-bit buffer


250 16-to-1 line decoder

251 8-input multiplexer

253 Dual 4-to-1 sel/mux

257 Quad 2-to-1 sel/mux

258 Quad 2-to-4 sel/mux (INV.)

259 8-bit addressable latch

260 Dual 5-input NOR

266 Quad exclusive-NOR (OC)

273 Octal D-type flip-flop w/reset

279 Quad S-R latch

280 9-bit odd/even parity gen

283 4-bit binary full adder

286 9-bit parity checker/gen

298 Quad 2-input mux



348 8-to-3 priority encoder

354 8-input mux/reg, three state

356 8-input mux/reg, three state

365 Hex buffer

366 Hex driver

367 Hex buffer (4-bit and 2-bit)

368 Hex driver

373 8-bit latch

374 8-bit D-type flip-flop

375 4-bit latch




381 ALU function generator

390 Dual decade counter

393 Dual 4-bit counter

396 8-bit storage register


399 Quad 2-input mux

423Dual retriggerable monostable

multivibrator w/reset

480 8-bit dual parity generator/checker

521 8-bit identity comparators

533 8-bit D-type transp. latch


540 8-bit buffer/driver


543 8-bit reg. transceiver



569 4-bit up/down counter

573 8-bit latch




590 8-bit counter

592 8-bit counter

593 8-bit counter






628 Volt. contr. oscillator

629 Volt. contr. oscillator




648 8-bit XCVR and register


653 8-bit XCVR and register

669 Sync. 4-bit counter

670 4-by-4 register file



682 8-bit identity comparator



697 Sync. up/down counter


760 8-bit buffer (OC)


804 Hex 2-input NAND driver

805 Hex 2-input NOR driver

808 Hex 2-input AND driver

821 10-bit interface flip-flop




832 Hex 2-input OR driver

841 10-bit D-type latch


853 8- to 9-bit parity transceiver

857 Hex 2- to 1-line multiplier



873 8-bit D-type transparent latch


885 8-bit magnitude comparator

996 8-bit read-back latch


1004 Hex inverting driver

1032 Quad 2-input OR buffer

1034 Hex non-invert. driver

1035 Hex non-invert. driver

1244 8-bit buffer



2240 240 w/output damping R



2827 10-bit MOS driver

2952 8-bit transceiver and register

3614 36-bit x 64 x 2 FIFO

3641 36-bit x 1K FIFO

4002 Dual 4-input NOR

4015Dual 4-bit serial-in/parallel-out shift

register

4017Johnson decade counter w/10 decoded

outputs

4020 14-bit counter

4024 7-bit counter

4040 12-bit counter

4046 Phase lock loop w/VCO

4049 Hex inverting high-to-low level shifter


Devices by Function

➔


Defense

Logic Family


4050 Hex high-to-low level shifter

4051 8-channel analog mux/demux

4052 Dual 4-channel analog mux/demux

4053 Triple 2-channel analog mux/demux

4059 Prog divided by “n” counter

4060 14-stage binary ripple counter w/oscillator

4066 Quad bilateral switch

4075 Triple 3-input OR gate

4094 8-stage shift and store bus reg

4316 Quad analog switch

4351 Analog mux w/latch

45144-to-16 line decoder/demux w/input

latches

4520 Dual 4-bit sync binary counter

4538 Dual precision monostable multivibrator

7266 Quad exclusive NOR

7819 512 x 18 x 2 FIFO

7820 512 x 18 x 2 FIFO

8240 ’240 with JTAG









8990 Scan test controller

8996 10-bit ASP

8997 Scan path linker

16240 16-bit ’240

16241 16-bit ’241

16244 16-bit ’244

16245 16-bit ’245

16260 12- to 24-bit mux D-type latch

16373 16-bit ’373

16374 16-bit ’374

16543 16-bit ’543

16601 18-bit UBT

16640 16 bit ’640

16646 16-bit ’646


16652 16-bit ’652

16823 18-bit ’823


16952 16-bit reg. transceiver

18245 JTAG ’16245

18502 JTAG ’16502

18646 JTAG ’16646

29520 8-bit identity comparators

29818 Diagnostic scan register

29821 10-bit bus interf. flip-flop

29823 9-bit bus interf. flip-flop

32245 36-bit ’245

32316 16-bit 3-port UBE

32501 36-bit UBT

32543 36-bit ’543

40103 8-bit binary down counter

40105 4 bits x 16 words FIFO register

162244 16-bit ’2244

162245 16-bit ’2245

162373 3.3-V ’162373 w/output damping R


Devices by Function

➔


Defense

CD4000 Series

Device Functional Description

CD4001B Quad 2-input NOR gate

CD4001UB Quad 2-input NOR gate (unbuffered)

CD4002B Dual 4-input NOR gate

CD4006B 18-stage static shift register

CD4007UB Dual complementary pair plus inverter (unbuffered)

CD4009UB Hex buffer/converter (inverting, unbuffered)

CD4010B Hex buffer/converter (non-inverting)

CD4011A Quad 2-input NAND gate

CD4011B Quad 2-input NAND gate

CD4011UB Quad 2-input NAND gate

CD4012B Dual 4-input NAND gate

CD4013B Dual D-type flip-flop with set/reset capability


CD4015B Dual 4-stage static shift register

CD4016B Quad bilateral switch

CD4017B Decade counter/divider

CD4018B Presettable divide-by-n counter

CD4019B Quad and/or select gate

CD4020B 14-stage ripple-carry binary counter/divider


CD4022B Divide-by-8 counter/divider

CD4023B Triple 3-input NAND gate


CD4025A Triple 3-input NOR gate

CD4025B Triple 3-input NOR gate

CD4027B Dual J-K master-slave flip-flop w/set/reset capability

CD4028B BCD-to-decimal decoder

CD4029B Presettable up/down counter

CD4030B Quad exclusive-OR gate


CD4034B 8-stage static bus register

CD4035B 4-stage parallel-in/parallel-out shift register


CD4041UB Quad true/complement buffer

CD4042B Quad clocked D-type latch

CD4043B Quad NOR R/S latch (3-state outputs)

Product Nomenclature (CD4000)Example: CD4XXXXXXXXPrefix—CDDevice Function (up to 5 digits)—4XXXXSupply Voltage—XXA = 2 V max


CD4044B Quad NAND R/S latch (3-state outputs)

CD4046B Micropower phase lock loop

CD4047B Low-power monostable/astable multivibrator

CD4048B Multi-function expandable 8-input gate (3-state outputs)

CD4049UB Hex buffer/converter (inverting, unbuffered)

CD4050B Hex buffer/converter (non-inverting)

CD4051B 8-channel analog multiplexer/demultiplexer


CD4053B Triple 2-channel analog multiplexer/demultiplexer

CD4054B 4-segment LCD display driver

CD4056B BCD-to-7-segment LCD driver

CD4060B 14-stage ripple-carry binary counter/divider and oscillator

CD4063B 4-bit magnitude comparator

CD4066B Quad bilateral switch


CD4068B 8-input NAND/AND gate

CD4069UB Hex inverter

CD4070B Quad exclusive-OR gate

CD4071B Quad 2-input OR gate

CD4072B Dual 4-input OR gate

CD4073B Triple 3-input AND gate

CD4075B Triple 3-input OR gate

CD4076B 4-bit D-type register

CD4077B Quad exclusive-NOR gate

CD4078B 8-input NOR/OR gate

CD4081B Quad 2-input AND gate

CD4082B Dual 4-input AND gate

CD4085B Dual 2-wide 2-input AND-OR-INVERT gate

CD4086B Expandable 4-wide 2-input AND-OR-INVERT gate

CD4089B Binary rate multiplier

CD4093B Quad 2-input NAND Schmitt triggers

CD4094B 8-stage shift-and-store bus register


CD4098B Dual monostable multivibrator

CD4099B 8-bit addressable latch


CD4502B Strobed hex inverter/buffer

CD4503B Hex buffer (non-inverting) (3-state outputs)

CD4504B Hex voltage-level shifter (for TTL-to CMOS or CMOS-to-CMOS operation)

CD4508B Dual 4-bit latch

CD4511B BCD-to-7-segment latch decoder drivers

CD4512B 8-channel data selector (3-state outputs)

CD4514B 4-bit latch/4-to-16 line decoder (outputs low)

CD4515B 4-bit latch/4-to-16 decoder (outputs low)

CD4516B Presettable 4-bit binary up/down counter

CD4517B Dual 64-stage static shift register

CD4518B Dual BCD up counter

CD4520B Dual binary up counter

CD4532B 8-bit priority encoder

CD4536B Programmable timer

CD4541B Programmable timer

CD4555B Dual 1-of-4 decoder/demultiplexer (outputs high)

CD4556B Dual 1-of-4 decoder/demultiplexer (outputs low)

CD4585B 4-bit magnitude comparator

CD4724B 8-bit addressable latch

CD14538B Dual precision monostable multivibrator

CD40103B 8-stage presettable synchronous down counter

CD40105B 4-bit by 16-word FIFO register

CD40106B Hex Schmitt triggers

CD40107B Dual 2-input NAND buffer/driver

CD40109B Quad low-to-high-voltage-level shifter

CD40160B Sync programmable 4-bit decade counter w/async clear

CD40161B Sync programmable 4-bit binary counter w/async clear

CD40174B Hex D-type flip-flop

CD40175B Quad D-type flip-flop

CD40192B Presettable BCD up/down counter

CD40193B Presettable binary up/down counter

CD40257B Quad 2-line-to-1 line data selector/multiplexer

B = 18 V maxUB = 18 V max unbufferedPackage Designation—XF = ceramic dual-in-line package

(CDIP)K = ceramic flatpackD = metal seal CDIP

Process Levels—X3 = mil-temp commercial processing3A = MIL-PRF-38535 (QML)B = MIL-M-38510 electrical (QPL)

Product Functions

➔


Defense

Process Flow

OverviewSeveral process flows are available for TI HiRel products. The flows are typical and may vary depending on changes to applicable defense standards such as MIL-PRF-38535.

TI offers three different types of QML products, processed under MIL-PRF- 38535 Class Q:• JM38510—Processed under MIL-

PRF-38535 and electrically tested to the JAN slash sheet

Process FlowProcess Flows Description

DSCC/SMD (See Note 1) Standard microcircuit drawing products processed to a MIL-PRF-38535 flow. Electricals controlled by DSCC/SMD.

SNJ/SMJ Products processed to MIL-PRF-38535 Class B for defense applications. Electricals controlled by current TI data sheet.

SN/SM Commercial-level ceramic processing. Test flow defined in this section. Electricals defined by current TI data sheet but may not be production tested.

SMX/SNX (See Note 2) Experimental products assembled and tested by TI HiRel before qualification. No minimum screening or testing required. Electricals controlled by current TI data sheet.

SMP/SNP (See Note 2) Prototype devices representative of production material with defense temperature-range testing. Shipped before completion of qualification testing. Electricals controlled by current TI data sheet.

JAN Processed per QML MIL-PRF-38535 flow. Electricals controlled by JAN slash sheet.

EP Processed in compliance with ISO 9001. Testing and screening performed in accordance with TI data sheet.

Note 1: Although TI offers SCDs, it is not the standard or preferred method of procurement.

Note 2: These devices have not met or completed TI HiRel Semiconductors internal qualification requirements. These devices are for prototyping purposes only, and standard TI warranties do not apply. Supply of these devices does not constitute a commitment by TI to release them to production.

Note 3: Per MIL-PRF-38535, if sufficient quality and reliability data is available, the manufacturer, through the QML program and the Technical Review Board (TRB) may modify, substitute or delete tests.

Note 4: Condition A or D at manufacturer’s option.Note 5: According to device type, electrical parameters are defined by the slash

sheet, DSCC/SMD or TI data sheet and method 5004.Note 6: Ceramic packages only.Note 9: Lead-finish options must be specified by ordering the DSCC/SMD

number.

QML Processing Flow Covering DSCC/SMD, SNJ/SMJ and JAN (See Note 3)

Wafer fab certification DSCC/TRB

Certified manufacturing lines DSCC/TRB

Wafer fabrication and device assembly

Traceability to diffusion lot

Internal visual, method 2010, condition B

Bond pull and die shear (sampled), methods 2011 and 2019, condition D

Sealing

Temperature cycle, method 1010,condition C

Constant acceleration

Optional pre-burn-in, electrical parameters

Burn-in test, method 1015,condition A or D (see Note 4)

Post-burn-in electrical parameters

Final electrical test (see Note 5)

Quality conformance inspection, group A(method 5005), sample size = 116/0

Fine/gross leak detection, method 1014,conditions A/B and C (see Note 6)

External visual, method 2009

Group B, method 5005

Group C, method 5005

Top-side symbol

Percent defective allowable (PDA)calculation

Group D, method 5005

•DSCC standard microcircuit drawing (SMD)—Processed under MIL-PRF-38535 and electrically tested to the DSCC/SMD:• SMQ—Processed under MIL-PRF-

38535 Class N (order by SMD)• SMV—Processed under MIL-PRF-

38535 Class V (order by SMD)•SNJ/SMJ—Processed under MIL-

PRF-38535 Class Q and electrically tested to the TI data sheet

All QML products are marked with the quality designator “Q” on the top side.

Enhanced Products (EP)Testing and screening of an EP product is performed in accordance with its TI data sheet. TI performs configuration control and processes EP products per best commercial practices. Proc ess ing and screening is documented in the TI Quality System Manual and is in compliance with ISO 9001.

➔


Defense

Process Flow and Symbolization

SN/SM Processing Flow (See Notes 3 and 7)

Assembly

Top-side symbol

Burn-in (optional)

Final electrical test (see Note 8)



Note 3: Per MIL-PRF-38535, if sufficient quality and reliability data is available, the manufacturer, through the QML program and the Technical Review Board (TRB) may modify, substitute or delete tests.

Note 6: Ceramic packages only.Note 7: Lead finish may vary. For example, ceramic PGA and ceramic QFP

packages may be gold finish. Contact the PIC for detailed information.

Note 8: Contact the TI Product Information Center (PIC) for detailed test information.

Note 9: Lead-finish options must be specified by ordering the DSCC/SMD number.

ESD Markings (Optional)MIL-PRF-38535 ESD Class Designation Marking

ESD Voltage Range (V)

1 1 Triangle 0 to 1999

2 2 Triangles 2000 to 3999

3 No Triangles 4000

Offshore Class V Process Flow (Texas Instruments/Unitrode)

Wafer fab acceptance

SPC bond process monitor

100%/100x internal visual, method 2010,condition A

Temperature cycling condition C,50 cycles, centrifuge condition E

PIND, 100, 0 rejects or 5 cycles

Serialization (symbol) 100%

X-ray monitor, real-time video inspection

Burn-in 240 hr

Post-burn-in 240 hr

Post-burn-in electricals, PDA = 3%

100% high/low electricals

Quality conformance inspection (QCI),group A (method 5005) SS + 116/0

Pre-burn-in electrical test (as required)

Fine/gross leak detection (see Note 6),method 1014, conditions B and C


QCI groups B and D, group C by wafer lot


Symbolization

YQBF† YYWWLLZ § USAJM38510/30003BCA

*Q¥

SNJ54LS161AJ 00XXY7600801EA #

YQBF† THAILAND^*Q¥

SN54LS161AJ 00XXY

THAILAND^¥

SNJ54S381J 00XXY

THAILAND^¥

TI bug is optional

¥ = ESD marking is optional

† YQ = diffusion date, B = die revision,F = wafer fab code (optional)

§ YYWW = seal date,LL = lot window,Z = B/I split lot

* Q marking denotes QML-compliant product

# Where TI is an approved source

^ Country of origin may belocated on package underside.

Example: JANB 54LS161A

Order as: JM38510/3003BCA

Example: SNJ 54LS161A

Order as: SNJ54LS161AJ or 7600801EA

Example: SN 54LS161A

Order as: SN54LS161AJ

Example: SNJ with no SMD

Order as: SNJ54S381J

SMJ YQBF†

320C30GBM405962-9052604MXA¥ 00XXY Q *

YQBF†

UCC1806JQMLV5962-9457501VEAYYWWLLZ§ THAILAND^

*Q¥

Example: SMJ 320C30GBM40Order as: SMJ320C30GBM40

or 5962-9052604MXA

Example: UCC 1806JQMLV

Order as: 5962-9457501VEA

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D042210

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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. Allsemiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the timeof order acknowledgment.

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Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2012, Texas Instruments Incorporated

http://www.ti.com/audio

http://www.ti.com/automotive

http://amplifier.ti.com

http://www.ti.com/communications

http://dataconverter.ti.com

http://www.ti.com/computers

http://www.dlp.com

http://www.ti.com/consumer-apps

http://dsp.ti.com

http://www.ti.com/energy

http://www.ti.com/clocks

http://www.ti.com/industrial

http://interface.ti.com

http://www.ti.com/medical

http://logic.ti.com

http://www.ti.com/security

http://power.ti.com

http://www.ti.com/space-avionics-defense

http://microcontroller.ti.com

http://www.ti.com/video

http://www.ti-rfid.com

http://www.ti.com/omap

http://e2e.ti.com

http://www.ti.com/wirelessconnectivity

2012 Defense Guide (Rev. A)

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Transcript of 2012 Defense Guide (Rev. A)