2007 SoCArchitecture using...
Transcript of 2007 SoCArchitecture using...
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2007200720072007
Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
Power Reduction in RF
SoC Architecture using
MEMS
Eric MercierEric MercierEric MercierEric Mercier
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2007200720072007
Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
RF domain overview
RF module architecture MEMS & Si co-integration Digital-oriented RF design Opportunistic Radio Low power consumptionxxparadigm
RF CMOS design Ultra-Low Power RF for WSN mmW 60 GHz full-CMOS High data rate contactless Impulse UWB
RF MEMS High-Q Passives RF switches Filters & Duplexer Time references Resonators
Technologies Piezoelectric materials Acoustic systems Ferroelectric materials Meta materials Magnetic materials
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2007200720072007
Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
MEMS in RF front-end Possible technologies of interest
Initially developped for telecom applications 802.15.4 / Zigbee, Bluetooth low energy ….
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
AlN process - Packaging
Initial uniformity = 0.4%
Kt² = 7.1% (state of the art)
Trimming of frequency
σ improvement = 6X , ∆∆∆∆f target < 1 MHz
AlN 1µm
Mo
Mo
P03
0102030405060708090
100
<2.0
6
2.06
5
2.07
5
2.08
5
2.09
5
2.10
5
2.11
5
2.12
5
2.13
5
2.14
5
2.15
5
>2.1
6
Resonant frequency
Fré
qu
ence
Target=2.11GHzAfter
σ = 2,5 MHz
P03
0
5
10
15
20
25
<2.0
25
2.03
2.04
2.05
2.06
2.07
2.08
2.09 2.1
2.11
2.12
>2.1
25
Resonnant frequency
Fré
qu
ence
Target=2.11GHz
σ = 15 MHz
Before
Air cavity protected by SiO2 and BCB membranes
Overmolding
BGA substrate or IPD
Underfill BAW filter
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2007200720072007
Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
36 filters sampling on 200mm wafer containing
20 000 filters
100Ω - 100Ω differential filter for WCDMA Rx
Resonator Quality factor
= 1800
200mm Si wafer
Bragg
Piezo stack
PackagingTrimming
SMR BAW filters
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2007200720072007
Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
40 filters sampling on 200mm wafer containing
40 000 filters
Filter 50 Ω diff / 12 Ω diff
Filter 50 Ω sing /200 Ω diff
Bragg
Bot Piezo
Top Piezo
Coupl Bragg
Filter 50 Ω sing / 50 Ω sing
CRF Filters
ESSDERC ‘09 Ability to design the filter for
various impedance matching
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
BAW Duplexer / full-duplex communications
Ensure a good rejection of TX band in RX mode High rejection of TX filter in RX band High rejection of RX filter in TX band
to avoid saturation effect in RX chain helps power consumption reduction
Low Insertion Losses Correct impedance matching
on each side Overall filter response impacted by
the matching Mismatch means less rejection / more
insertion loss
very encouraging first results Workshop IMS ‘09
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
Multi-frequency AlN patterning
Process several frequency on a single wafer
Approach investigated AlN patterning
Bragg mirror
AlN Tx(1270 nm)
AlN Rx (1110 nm)
0.5 mm
Workshop IMS ‘09
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
BAW VCO and filters
ISSCC`082 x IMS `091 patent
Current L/C-based integrated VCO Low-Q / high current consumption for phase noise reduction
Piezo-electric resonator High-Q / lower current consumption for better phase noise Passives : lower cost technology than advanced CMOS for passives
High performance broad band BAW VCO for UMTS Increased tuning range thanks to negative capacitor
Impedance
FrequencyFseries Fshunt
CnegCneg
CvarCvarCvar
C0
Lm Cm
BAW
C0
Lm Cm
BAW
)(2
CnegCoLmCm
CnegCmCoShunt +
++=ω
FTR with Cneg
Qseries:700 Qshunt: 600 Qshunt : 220
160MHz
0pF
0.1pF0.2pF
0.3pF0.5pF
0.7pF1.4pF
2.8pF
resonator without Cneg
resonator with Cneg
2.25
Q fa
ctor
Frequency GHz2.3 2.35 2.4
700
600
500
300
400
200
100
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
Digital-oriented TX Architecture
ANALOG RFICBiCMOS
DAC
DAC
SAW DUPL.PA
DIGITAL RFICCMOS
BPF DUPL.
SIGNALSOURCE
SIGNALSOURCE
ANALOG RADIO
DIGITAL RADIO
LOW FSAMPLINGHIGH RESOLUTION
LO
DAC
DAC
SINGLE-STANDARD USAGE
OPPORTUNISTIC USAGE
DIGITAL MODULATOR
LOW RESOLUTION
PA
HIGH FSAMPLING
From analog to digital TX architecture Compatible with advanced CMOS technologies Easy reconfiguration for multi-standard purposes
Use of BAW to recombine the signals LINC architecture Filter out Σ−∆ DAC noise ULP RF under investigation
CogArt`08VTC `092 x patents
0 (fCH)
SIGNALSPECTRUM
fS/2-fS/2 Freq.0 (fCH)
SIGNALSPECTRUM
fS/2-fS/2
BAWFiltering
Freq.
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
Linear Amplification using Non-Linear Components
I
Q
sI,1(t)
s I,2(t)
)(tϕ−
s I(t)
)(tϕ )(tθ
FILTER
&
COMBINER
SAT.PA
ANTENNA
I
Q
I&QSIGNAL:
GSM/EDGE/
WCDMA/OFDM
PI
SAT.PA
LINC
PQ
NI
NQ
Σ−∆Σ−∆Σ−∆Σ−∆MOD
PA MODULE
DSP
Σ−∆Σ−∆Σ−∆Σ−∆MOD
Σ−∆Σ−∆Σ−∆Σ−∆MOD
Σ−∆Σ−∆Σ−∆Σ−∆MOD
ANALOGUEPASSBAND
FILTER
POWERCONTROL
DIGITAL CIRCUIT
ANALOGUEPASSBAND
FILTER
0 fCH
SIGNALSPECTRUM
fS/2-fS/2 Freq.
0
SIGNALSPECTRUM
-fS/8 0
SIGNALSPECTRUM
fS/8 Freq.-fS/8fS/8
fC = R.fS/2
+
Non-linear PA Whatever the modulation scheme Very interesting power reduction
…. But still some limited bandwith issues ~ 5 % providing 80 MHz
Bandpass Filter Bandwidth
TX Band
Sigma Delta Filter Bandwidth
fCfB1
SPECTRUM
TX FrequencyfB2
NON-LINEAR PA
LINEAR PA
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
LAMB wave filters for channel filtering
1st demonstration of BAW Lamb wave filter for IF use
Coupling acoustic filter &air gap isolation
SimulatedMeasured.
fc = 156.5 MHz I.L. = -7,3 dBZ0 = 1 kΩ
ESSDERC‘07
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
In progress on Lamb filters
Synthesis of band pass filters Electrical connections between resonators
Acoustic coupling between resonators
2 poles ladder filter 2 poles lattice filter
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2007200720072007
Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
RX Intermediate Frequency
Bulky external filter Good rejection but high cost / low integration
Integrated Gm/C filters Good integration factor / power consumption but not sharp enough
High input / output impedance Reduction of the power consumption at moderate frequencies
High-Q channel filter Enhanced performance Relaxed linearity specifications Low cost technologies
As low frequency as possible Sub-sampling process for digital-oriented architecture Much better performance with comparable power consumption Better scalability for power reduction improvement
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2007200720072007
Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
Interest in bringing the digital world towards the analog chain No compromise on quality of the filtering New architecture of ADC to limit the power consumption
Digital robustness and technology scaling Small number of analog IC blocks to design
fs = 4 x fc to simplify demodulation Multi-standard RF receiver for the 2.4-2.5 GHz band
Co-existence of several standards : BT low energy, WiFi, ZigBee…
A 2nd order band-pass Σ-∆ BW = 25 MHz at 2.45 GHz carrier
Band-pass filtering ADC
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
Mismatch between antenna and PA Optimum matching for maximum power transfer Compensate for hands effects on the antenna
Result : some 100s µs process for 30 dB improvement
more output power
better power consumption MEMS use for better efficiency
Impedance matching in real time
Tunablemachingnetwork
PA
Attenuator
Mixer
RF IF
C
C
Processor
Filter
LO
v1 v2 ZantZ1
Down conversionmodule
Magnitudecalculator
Phasecalculator
Z1
impedancecalculator
MatchingNetworkcontroller
Antennaimpedancecalculator
TunableMatchingNetwork
PROCESSORIFv _1
IFv _2
IF
IF
v
vmag
_2
_1
IF
IF
v
v
_2
_1arg
( )1Re Z
( )1Im Z
( )antZRe ( )antZIm
dcba
antZ1Z
ResetRegistrycontrol
NEWCAS ’08
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
BAW Reference frequency
Miniaturization and integration issue Highly required for cost / integration improvements Temperature behavior of the resonator
Predictive and reproducible Monotonic and low temperature drifts
On-going design by STm, compensating for temperature drifts Actual compensation of the temperature Major improvement for use in wireless applications
IMS `09
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Power Reduction in RF SoC Architecture using MEMS Eric MERCIER – 22th June 2009
© CEA 2009. All rights reservedAny reproduction in whole or in part on any medium or use of the information contained herein
is prohibited without the prior written consent of CEA
MEMS in ULP RF front-end Conclusions on technologies of interest for ULP RF
Some good results on frequency, Q, bandwidth, technologies Sampling architectures under study for RX
Considerations on resonators for reference frequency Multi-standard also for WSN
802.15.4 / Zigbee, Bluetooth low energy ….