2, 3-, 4-Cell Lithium-Ion or Lithium-Polymer ... - Texas... · PDF fileLDO + Reset I2 C SMBus...

LDO +

Reset

I2C

SMBus

HDQUART

Pack +

Pack –

Discharge / Charge /

Precharge FETs

2-Tier Overcurrent

Protection

2K Bytes of

Data Flash

Fuse

Watchdog &

Protection Timing

Cell

Bala

ncin

gD

rive

System Interface System Interface

32.768 kHz

16 Dig GPIO & Peripherals

8 Dig GPIO or Analog GPI2.5 V Nch FET Drive

(Charge Pumps)

RAM Configuration, Status

and Control Registers

24K x 22 Program

Flash

2K Bytes

of RAM

6K x 22

Mask ROM

Cell,

Batand

Pack

Voltage

Tra

nsla

tion

Precharge

Control

HostIn

terf

ace

UA

RT

&D

ata

Managem

ent

TOUT and LEDOUT

Power Support

Reset

Analog Output Drive

Oscillator and PLL

T1

Internal

Only

Standard Delta-Sigma A-to-D Converter

Integrating Delta-Sigma A-to-D Converter

bq29330

www.ti.com SLUS673E –SEPTEMBER 2005–REVISED MARCH 2012

2-SERIES, 3-SERIES, AND 4-SERIES CELL LITHIUM-ION ORLITHIUM-POLYMER BATTERY PROTECTION AFE

Check for Samples: bq29330

1FEATURES• 2-Series, 3-Series, or 4-Series Cell Protection • NMOS FET Drive for Charge and Discharge

Control FETs• Can Directly Interface with the bq803x-Based • Host Control can Initiate Sleep and Ship Power

Gas Gauge Family Modes• Watchdog and POR for the Host • Integrated 2.5-V, 16-mA LDO• Provides Individual Cell Voltages and Battery • Integrated 3.3-V, 25-mA LDO

Voltage to Battery Management Host • Supply Voltage Range from 4.5 V to 28 V• Capable of Operation With 5-mΩ Sense • Low Supply Current of 100 μA Typical

Resistor Integrated Cell Balancing Drive• I2C Compatible User Interface Allows Access APPLICATIONS

to Battery Information • Notebook Computers• Programmable Threshold and Delay for • Medical and Test Equipment

Overload Short Circuit in Discharge and Short• Instrumentation and Measurement SystemsCircuit in Charge

DESCRIPTIONThe bq29330 is a 2-series, 3-series, and 4-series cell lithium-ion battery pack full-protection analog front end(AFE) IC that incorporates a 2.5-V, 16-mA and 3.3-V, 25-mA low dropout regulator (LDO). The bq29330 alsointegrates an I2C-compatible interface to extract battery parameters such as battery voltage, individual cellvoltages, and control output status. Other parameters such as current protection thresholds and delays can alsobe programmed into the bq29330 to increase the flexibility of the battery management system.

SYSTEM DIAGRAM

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Copyright © 2005–2012, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.

http://www.ti.com/product/bq29330?qgpn=bq29330

http://www.ti.com

http://www.ti.com/product/bq29330#samples

bq29330

SLUS673E –SEPTEMBER 2005–REVISED MARCH 2012 www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.

DESCRIPTION (CONTINUED)The bq29330 provides safety protection for overload, short circuit in charge, and short circuit in dischargeconditions and can also provide cell overvoltage, battery overvoltage and battery undervoltage protection with thebattery management host. In overload, short circuit in charge and short circuit in discharge conditions, thebq29330 turns off the FET drive autonomously, depending on the internal configuration setting. Thecommunications interface allows the host to observe and control the status of the bq29330, enable cellbalancing, enter different power modes, set current protection levels, and set the blanking delay times.

Cell balancing of each cell can be performed via a cell bypass path integrated into the bq29330, which can beenabled via the internal control register accessible via the I2C-compatible interface. The maximum bypass currentis set via an external series resistor and internal FET on resistance (typ. 400 Ω).

ORDERING INFORMATION (1)

PACKAGETA

TSSOP(DBT) (2) QFN(RSM) (2)

–40°C to 110°C bq29330DBT bq29330RSM

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com.

(2) The bq29330 can be ordered in tape and reel by adding the suffix R to the orderable part number, i.e., bq29330DBTR.

SPACER

THERMAL INFORMATIONbq29330

THERMAL METRIC (1) TSSOP (DBT) QFN (RSM) UNITS

30 PINS 32 PINS

θJA, High K Junction-to-ambient thermal resistance 81.4 37.4

θJC(top) Junction-to-case(top) thermal resistance 16.2 30.6

θJB Junction-to-board thermal resistance 34.1 7.7°C/W

ψJT Junction-to-top characterization parameter 0.4 0.4

ψJB Junction-to-board characterization parameter 33.6 7.5

θJC(bottom) Junction-to-case(bottom) thermal resistance N/A 2.6

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated

Product Folder Link(s): bq29330


http://www.ti.com

http://www.ti.com

http://www.ti.com/lit/pdf/spra953

http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SLUS673E&partnum=bq29330


1SRN

2NC

3SRP

4VC5

5VC4

6VC3

7VC2

8VC1

9 10

11

12

13

14

15

16

24 WDI

23 TOUT

22 LEDOUT

21 VSS

20 NC

19 PMS

18 GPOD

17 ZVCHG

25

26

27

28

29

30

31

32

SC

LK

RE

G

VS

S

XR

ST

CE

LL-

NC

XA

LE

RT

CE

LL+

DS

G

PA

CK

VC

C

CH

G

SD

ATA

BA

T

NC

NC

RSM PACKAGE(TOP VIEW)

2

7

6

5

4

3 28

27

26

25

24

23

22

8

9

10

11

12

21

20

19

18

17

13

14

16

1

WDI

SCLKREG

VSS

XRST

SRN

CELL-

NC

XALERT

TOUT

CELL+

PMS

GPOD

SRP

VC5

ZVCHG

VC3

VC2

DSG

PACK

VCC

CHG

SDATA

VC1

LEDOUT

VC4

VSS

15

BAT

NC

30

29

NC

TSSOP PACKAGE(TOP VIEW)

bq29330


PACKAGE OPTION PIN DIAGRAMS

PIN FUNCTIONSPIN

DESCRIPTIONNAME DBT NO. RSM NO.

CELL– 1 28 Output of scaled value of the measured cell voltage.

CELL+ 2 29 Output of scaled value of the measured cell voltage.

REG 3 30 Integrated 2.5-V regulator output

VSS 4, 23 31,21 Power supply ground

XRST 5 32 Active-low output

SRN 6 1 Current sense terminal

Current sense positive terminal when charging relative to SRN; current sense negative terminal whenSRP 7 3 discharging relative to SRN

VC5 8 4 Sense voltage input terminal for most negative cell; balance current input for least positive cell.

Sense voltage input terminal for least positive cell, balance current input for least positive cell, and returnVC4 9 5 balance current for third most positive cell.

Sense voltage input terminal for third most positive cell, balance current input for third most positive cell,VC3 10 6 and return balance current for second most positive cell.

Sense voltage input terminal for second most positive cell, balance current input for second mostVC2 11 7 positive cell, and return balance current for most positive cell.

Sense voltage input terminal for most positive cell, balance current input for most positive cell, andVC1 12 8 battery stack measurement input

BAT 13 9 Device power supply input

CHG 14 11 Charge pump, charge N-CH FET gate drive

DSG 16 13 Charge pump output, discharge N-CH FET gate drive

PACK 17 15 PACK positive terminal and alternative power source

VCC 19 16 Power supply voltage

ZVCHG 20 17 Connect the precharge P-CH FET drive here

GPOD 21 18 NCH FET open-drain output

PMS 22 19 Determines CHG output state on POR

LEDOUT 24 22 3.3-V output for LED display power supply

TOUT 25 23 Provides thermistor bias current

Copyright © 2005–2012, Texas Instruments Incorporated Submit Documentation Feedback 3



http://www.ti.com



GND

OVERCURRENT

CELL1..4

SRP

SRN

OVERLOAD-

COMPARATOR

SHORT CIRCUIT

COMPARATOR

SHORT_CIRCUIT

DELAY

OPEN

DRAIN

OUTPUT

WATCHDOG

TIMER

GPOD

CELL VOLTAGE

TRANSLATION

POWER

MODE

CIRCUIT

DRIVE

CONTROL

CELL+

RSNS

CCELL

TOUTR

THERM

CTHERM

THERMISTOR

CELL

SELECTION

SWITCHES

2.5-V LDO

POR

SHIP_ONSLEEP_ON

VCCPACKREG

CREG

FET

LOGIC

NCH GATE

DRIVER

CHG_ON

DSG_ONZVCHG_ON

DSG CHG ZVCHG

PACK–

GG VDD

VC1

VC2

VC5

CELL 3

CELL 4

VC3

VC4

CELL 1

CELL 2

GG TS

INPUT

GG ANALOG

INPUT

WDI32 kHz INPUT

FROM GG

GG INTERFACE

SDATA

ALERT TO GG

OPEN DRAIN

OUTPUT

GG INTERFACE

SCLK

SDATA

SCLK

XALERT

SE

RIA

LIN

TE

RFA

CE

STATUS

OUTPUT CTL

STATE CTL

FUNCTION CTL

CELL SEL

OLV

OLD

SCC

SCD

REGISTERS

RZVCHG

GATE DRIVER

0.975V

BAT/25

PACK/25

RST

GG RST

PACK+

2nd

Protection

3.3-V LDO

LEDOUT

CLED

GG LED

INPUT

BAT

CELL–

PMS

bq29330


PIN FUNCTIONS (continued)

PINDESCRIPTION

NAME DBT NO. RSM NO.

Digital input that provides the timing clock for the OC and SC delays and also acts as the watchdogWDI 26 24 clock.

SCLK 28 25 Open-drain serial interface clock with internal 10-kΩ pullup to VREG

SDATA 29 26 Open-drain bidirectional serial interface data with internal 10-kΩ pullup to VREG

Open-drain output used to indicate status register changes. With internal 100-kΩXALERT 30 27 pullup to VREG

2, 10, 12,NC 15,18,27 Not electrically connected to the IC14, 20

FUNCTIONAL BLOCK DIAGRAM




http://www.ti.com



No Power Supply

UVLO Mode

CHG: OFFDSG: OFFZVCHG: OFFVREG: OFFRST: HIGHI2 C: DisabledCurrent Protection: DisabledVCELL: DisabledWatchdog: DisabledTherm, Output: Disabled

Power Supply to PACK

Normal Mode

CHG: ONDSG: ONZVCHG: OFFVREG/VLED: 2.5V/3.3VRST: Driven low after tRSTI2C: Enabled

Current Protection: EnabledVCELL: EnabledWatchdog: EnabledTherm, Output: Enabled

LEGEND:UVLO = Undervoltage Lock Out

KEY:Disabled = OFF and cannot be changed via firmwareEnabled= Can be changed by firmware

InternalVLED < 2.3 V

FirmwareCommand

32 kHz Input Haltedand t WTO expired

32 kHz Resumes

Internal VLED> 2.4 V

Power Supply to PACK

Current Protection ModeCHG: OFFDSG: OFFZVCHG: OFFVREG/VLED: 2.5 V/3.3 VI2C: EnabledCurrent Protection: EnabledVCELL: EnabledWatchdog: EnabledTherm, Output: Enabled

WTO Mode

CHG: OFFDSG: OFFZVCHG: OFF

RST: PulsedI2C: EnabledCurrent Protection: EnabledVCELL: EnabledWatchdog: EnabledTherm, Output: Enabled

Ship Mode


I2C: DisabledCurrent Protection: DisabledVCELL: DisabledWatchdog: DisabledTherm, Output: Disabled

Sleep Mode


I2 C: EnabledCurrent Protection: EnabledVCELL: EnabledWatchdog: EnabledTherm, Output: Disabled

FirmwareCommand

Firmware Command

& No Supply to PACK

FirmwareCommand

FirmwareCommand

32 kHz Input Halted

and tWTOexpired

FirmwareCommand

VREG/VLED: 2.5 V/3.3 V

VREG/VLED: ON/ON

VREG/VLED: OFF/OFF

DSG: OFFNo supply PACK

voltage ModeDSG: OFF

FirmwareCommand

V > V or V for a period of t or t

Respectively, or V > VSR OL SCD OL SCD

SR SCC for a period

of tSCC

bq29330


SAFETY STATE DIAGRAM




http://www.ti.com



bq29330


ABSOLUTE MAXIMUM RATINGSover operating free-air temperature range (unless otherwise noted) (1) (2)

bq29330 UNIT

Supply voltage range (VCC, BAT) –0.3 to 34

(VC1, VC2, VC3, VC4, PACK, PMS) –0.3 to 34

(VC5) –0.3 to 1.0

(SRP, SRN) –1.0 to 1.0Input voltage range(VC1 to VC2, VC2 to VC3, VC3 to VC4, VC4 –0.3 to 8.5to VC5)

(WDI, SCLK, SDATA) –0.3 to 8.5 V

(DSG,CHG) –0.3 to BAT

(ZVCHG) –0.3 to 34

(GPOD) –0.3 to 34Output voltage range(TOUT, SDATA, CELL, XALERT, XRST, –0.3 to 7LEDOUT)

(CELL+) –0.3 to 7

Current for cell balancing 10 mA

Storage temperature range, Tstg –65 to 150 °C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to ground of this device except VCn–VC(n+1), where n=1, 2, 3, 4 cell voltage.

RECOMMENDED OPERATING CONDITIONSMIN NOM MAX UNIT

Supply voltage ( VCC, BAT) 4.5 25 V

VI(STARTUP) Start up voltage (VCC, BAT) 5.5 V

VC1, VC2, VC3, VC4 0 VDD

VC5 0 0.5

VI Input voltage range SRP, SRN –0.5 0.5 V

VCn – VC(n+1), (n=1, 2, 3, 4 ) 0 5.0

PACK, PMS 25

VIH 0.8×REG REGLogic level input voltage SCLK, SDATA, WDI V

VIL 0 0.2×REG

VO Output voltage GPOD 25 V

XALERT, SDATA, XRST REGVO Output voltage range V

CELL+, CELL– 0.975

External 2.5-V REG capacitor CREG 1.0 μF

External LEDOUT capacitor CLED 2.2 μF

Extend CELL output capacitor CCELL 0.1 μF

IOL GPOD 1 mA

RPACK 1 kΩInput frequency WDI 32.768 kHz

WDI high time 2 μs

Operating temperature –25 85 °CTA

Functional temperature –40 110 °C




http://www.ti.com



bq29330


ELECTRICAL CHARACTERISTICSSUPPLY CURRENT, TA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

No load at REG, LEDOUT, TOUT, XALERT, SCLK, SDATA, TA = 25°C 140 190 μAZVCHG= off, WDI = 32 kHzICC1 Supply Current 1 TA = –40°CVMEN = on, VC5 = VC4 = VC3 = VC2 = VC1 = 0 V 220 μAto 110°Cselect VC5 = VC4 = 0 V

No load at REG, LEDOUT TOUT, TA = –40°CICC2 Supply Current 2 XALERT, SCLK, SDATA. ZVCHG = off, WDI = 32 kHz, 105 185 μAto 110°CVMEN = off

CHG, DSG and ZVCHG = off, TA = –40°CI(SLEEP) Sleep current 30 50 μAREG = on, VMEN = off, WDI no clock, SLEEP = 1 to 110°C

CHG, DSG and ZVCHG = off, TA = –40°CI(SHUTDOWN) Shutdown mode REG = off, VMEN = off, WDI no clock, 0.1 1 μAto 110°CVPACK = 0 V, VC1 = VC2 = VC3 = VC4 = 3.5 V

2.5 V LDO, TA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V, IOUT 33 = 0 mA (unless otherwise noted)

Regulator output 4.5 V < VCC or BAT ≤ 25 V, IOUT25 ≤ 16 mA TA = –40°C VV(REG) 2.41 2.5 2.59voltage to 110°C

Regulator output VCC or BAT = 14 V, IOUT25 = 2 mA TA = –40°CΔV(EGTEMP) change with ±0.2%to 110°Ctemperature

ΔV(REGLINE) Line regulation 5.4 V ≤ VCC or BAT ≤ 25 V, IOUT25 = 2 mA TA = 25°C 3 10 mV

VCC or BAT = 14 V, 0.2 mA ≤ IOUT25 ≤ 2 mA TA = 25°C 7 15 mVΔV(REGLOAD) Load regulation

VCC or BAT = 14 V, 0.2 mA ≤ IOUT25 ≤ 16 mA TA = 25°C 15 50 mV

VCC or BAT = 14 V, REG = 2 V TA = 25°C 16 75I(REGMAX) Current limit mA

VCC or BAT = 14 V, REG = 0 V TA = 25°C 5 45

3.3 V LED, TA = 25°C, CREG = 1.0 μF , CL = 2.2 μF, VCC or BAT = 14 V, IOUT25 = 0 mA (unless otherwise noted)

4.5 V < VCC or BAT ≤ 25 V, IOUT33 ≤ 10 mA 3 3.3 3.6Regulator output TA = –40°CVO(LED) Vvoltage to 110°C6.5 V < VCC or BAT ≤ 25 V, IOUT33 ≤ 25 mA 3 3.3 3.6

Regulator output VCC or BAT = 14 V, IOUT33 = 2 mA TA = –40°CΔV(LEDEMP) change with ±0.2%to 110°Ctemperature

ΔV(LEDLINE) Line regulation 5.4 V ≤ VCC or BAT ≤ 25 V, IOUT33 = 2 mA TA = 25°C 3 10 mV

VCC or BAT = 14 V, 0.2 mA ≤ IOUT33 ≤ 2 mA 7 15ΔV(LEDLOAD) Load regulation TA = 25°C mV

VCC or BAT = 14 V, 0.2 mA ≤ IOUT33 ≤ 25 mA 40 100

VCC or BAT = 14 V, REG = 3 V 25 125I(LEDMAX) Current limit TA = 25°C mA

VCC or BAT = 14 V, REG = 0 V 12 50

THERMISTOR DRIVE, TA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V (unless otherwise noted)

VTOUT ITOUT = 0 mA 2.4 2.6 V

TOUT Pass-element ITOUT = –1 mA at TOUT pin, TA = –40°CRDS(ON) 50 100 Ωseries resistance RDS(ON) = [VREG – VOUT (TOUT)] / 1 mA to 110°C

SHUTDOWN WAKE, TA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V (unless otherwise noted)

PACK Exit shutdown VCC or BAT = 14 V, PACK = 1.4 VVSTARTUP 1 μAthreshold

POR, TA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V (unless otherwise noted)

VPOR VREGTH– –3% 1.8 3% V

Hysteresis 50 150 250 mV(Vregth+ – Vregth–)




http://www.ti.com



bq29330


ELECTRICAL CHARACTERISTICS (Continued)CELL VOLTAGE MONITOR, TA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V (unless otherwise noted)


VCn – VCn+1 = 0 V, 8 V ≤ VDD ≤ 25 V 0.950 0.975 1V(CELLOUT) V

VCn – VCn+1 = 4.5 V, 8 V ≤ VDD ≤ 25 V 0.275 0.3 0.325

REF Mode (1), 8 V ≤ VDD ≤ 25 V –1% 0.975 1% VCELL output

ModePACK –2% PACK/18 2% V[Register Address = 0x03, b1(PACK) = 1, b0( VMEN) = 1]

ModeBAT –2% BAT/18 2% V[Register Address = 0X03, b6(BAT) = 1, b0 ( VMEN) = 1]

CMRR Common mode rejection CELL max to CELL min 40 dB

V(CELLSLEW) CELL output rise Min to Max 10% to 90% 9 ms

K = CELL output (VC5 = 0 V, VC4 = 4.5 V) 0.147 0.150 0.153–CELL output (VC5 = VC4 = 0 V) / 4.5K CELL scale factor

K = CELL output (VC2 = 13.5 V, VC1 = 18 V) 0.147 0.150 0.153–CELL output (VC2 = VC1 = 13.5 V) / 4.5

I(VCELLOUT) Drive current VCn– VCn+1 = 0 V , Vcell = 0 V, TA = –40° to 110° 12 18 μA

CELL output offset error CELL output (VC2 = 18 V, VC1 = 18 V)VICR –1 mV–CELL output (VC2 = VC1 = 0 V)

R(BAL) Cell balance internal resistance RDS(ON) for internal FET switch at VDS = 2 V –50% 400 50% Ω

(1) Register Address = 0x04, b2(CAL0) = b3(CAL1) = 1, Register Address = 0x03, b0(VMEN) = 1

CURRENT PROTECTION DETECTION, TA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V (unless otherwise noted)


RSNS = 0 –50 –205V(OLT) OL detection threshold voltage range, typical (1) mV

RSNS = 1 –25 –102.5

RSNS = 0 –5ΔV(OLT) OL detection threshold voltage program step mV

RSNS = 1 –2.5

RSNS = 0 100 475SCC detection threshold voltage range, typicalV(SCCT) mV(2)RSNS = 1 50 237.5RSNS is set in

FUNCTION_CTL registerRSNS = 0 25ΔV(SCCT) SCC detection threshold voltage program step mV

RSNS = 1 12.5

RSNS = 0 –100 –475SCD detection threshold voltage range,V(SCDT) mVtypical (3)RSNS = 1 –50 –237.5

RSNS = 0 –25ΔV(SCDT) SCD detection threshold voltage program step mV

RSNS = 1 –12.5

VOL = –25 mV (typ) –15 –25 –35

VOL(acr) VOL = –100 mV (typ) (RSNS = 0,1) –90 –100 –110 mVOL detection threshold voltage accuracy(1)

VOL = –205 mV (typ) –185 –205 –225

VSCC = 50 mV (typ) 30 50 70

V(SCC_acr) VSCC = 200 mV (typ) (RSNS = 0,1) 180 200 220 mVSCC detection threshold voltage accuracy(2)

VSCC = 475 mV (typ) 428 475 523

VSCD = –50 mV (typ) –30 –50 –70

V(SCD_acr) VSCD = –200 mV (typ) (RSNS = 0,1) –180 –200 –220 mVSCD detection threshold voltage accuracy(3)

VSCD = –475 mV (typ) –426 –475 –523

(1) See OLV register for setting detection threshold(2) See SCC register for setting detection threshold(3) See SCD register for setting detection threshold




http://www.ti.com



bq29330


ELECTRICAL CHARACTERISTICS (Continued)FET DRIVE CIRCUIT, TA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V (unless otherwise noted)


VO(FETOND) = V(DSG) – Vpack TA = 25°C 7.5 12 15.5VVGS connect 10 MΩ

TA = –40°C to 110°C 8 12 16Output voltage, charge,VO(FETON) and discharge FETs on VO(FETONC) = V(CHG) – VBAT TA = 25°C 7.5 12 15.5VVGS connect 10 MΩ

TA = –40°C to 110°C 8 12 16

V(ZCHG) ZVCHG clamp voltage BAT = 4.5 V 3.3 3.5 3.7 V

VFETOND = VDSG – 0.2VO(FETOF Output voltage, charge, Vpack VF) and discharge FETs off

VFETONC = VCHG – VBAT 0.2

V(CHG): Vpack ≥ Vpack + 4 V 400 1000tr Rise time CL = 4700 pF μs

V(DSG): VBAT ≥ VBAT + 4 V 400 1000

V(CHG): Vpack + VCHG (FETON) ≥ pack + 1 V 40 200tf Fall time CL = 4700 pF μs

V(DSG): VC1 + VDSG (FETON) ≥ VC1 + 1 V 40 200

LOGIC, TA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V (unless otherwise noted)

XALERT 60 100 200

R(PUP) Internal pullup resistance SDATA, SCLK TA = –40°C to 110°C 6 10 20 kΩ

XRST 1 3 6

XALERT 0.2

SDATA, IOUT = 200 μA 0.4Low Logic level output GPOD, IOUT = 50 μA 0.6VOL TA = –40°C to 110°C Vvoltage

VCC or BAT = 7 V, 0.4VREG = 1.5 V,XRST, IOUT = 200 μA

VIH SCLK (hysteresis input) Hysteresis 450 mV

AC ELECTRICAL CHARACTERISTICSTA = 25°C, CREG = 1 μF, CL = 2.2 μF, VCC or BAT = 14 V (unless otherwise noted)


tWDTINT WDT start up detect time 250 500 1000 ms

tWDWT WDT detect time 50 100 150 μs

tRST XRST Active high time 100 250 560 μs




http://www.ti.com



tsu(STA)

SCLK

SDATA

SCLK

SDATA

SCLK

SDATA

tw(H) tw(L) tf tr

tr tf

StartCondition SDA

InputSDAChange

StopCondition

th(STA)th(DAT) tsu(DAT)

th(ch)

Start Condition tv

1 2 3 7 8 9

MSB ACK

Stop Condition

tsu(STOP)

1 2 3 7 8 9

MSB ACK

tsu(BUF)

bq29330


AC TIMING REQUIREMENTS (I2C compatible serial interface)TA = 25°C, CREG = 1 μF, VCC or BAT = 14 V (unless otherwise noted)

PARAMETER MIN MAX UNIT

tr SCLK, SDATA rise time 1000 ns

tf SCLK, SDATA fall time 300 ns

tw(H) SCLK pulse width high 4 μs

tw(L) SCLK pulse width low 4.7 μs

tsu(STA) Setup time for start condition 4.7 μs

th(STA) Start condition hold time after which first clock pulse is generated 4 μs

tsu(DAT) Data setup time 250 ns

th(DAT) Data hold time 0 μs

tsu(STOP) Setup time for Stop condition 4 μs

tsu(BUF) Time the bus must be free before new transmission can start 4.7 μs

tv Clock low to data out valid 900 ns

th(CH) Data out hold time after clock low 10 ns

fSCL Clock frequency 0 100 kHz




http://www.ti.com



bq29330


FUNCTIONAL DESCRIPTION

LOW DROP OUTPUT REGULATOR (LEDOUT)

The inputs for this regulator can be derived from the VCC or BAT terminals. The output is a fixed voltage oftypically 3.3 V with the minimum output capacitance for stable operation of 2.2 μF and is also internally currentlimited. This output is used for LED drive, power supply source for REG (2.5 V) and bq29330 internal circuit.During normal operation, the regulator limits output current to typically 50 mA. Until the internal regulator circuit iscorrectly powered, the DSG and CHG FET drives are low (FETs = OFF).

LOW DROP OUTPUT REGULATOR (REG)

The inputs for this regulator can be derived from the LED (3.3 V). The output is typically 2.5 V with the minimumoutput capacitance for stable operation of 1 μF and is also internally current limited. During normal operation, theregulator limits output current to typically 50 mA.

INITIALIZATION

From a shutdown situation, the bq29330 requires a voltage greater that start-up voltage (VSTARTUP) applied to thePACK pin to enable its integrated regulator and provide the regulators power source. Once the REG output isstable, the power source of the regulator is switched to VCC.

After the regulator has started, it then continues to operate through the VCC input. If the VCC input is below theminimum operating range, then the bq29330 will not operate if the supply to the PACK input is removed.

If the voltage at VLED falls below about 2.3 V, the internal circuit turns off the FETs and disables all controllablefunctions including the REG, LEDOUT, and TOUT outputs.

The initial state of the CHG and DSG FET drive is low (OFF) and the ZVCHG FET drive is low (ON).

OVERLOAD DETECTION

The overload detection is used to detect abnormal currents in the discharge direction. This feature is used toprotect the pass FETs, cells, and any other inline components from excessive discharge current conditions. Thedetection circuit also incorporates a blanking delay before driving the control for the pass FETs to the OFF state.The overload sense voltage is set in the OLV register, and delay time is set in the OLD register. The thresholdscan be individually programmed from 50 mV to 205 mV in 5-mV steps with the default being 50 mV.

If the RSNS bit in the FUNCTION_CTL register is set to 1, then the voltage threshold, programmable step size,and hysteresis is divided by 2.

SHORT CIRCUIT IN CHARGE AND SHORT CIRCUIT IN DISCHARGE DETECTION

The short current circuit in charge and short circuit in discharge detections are used to detect severe abnormalcurrent in the charge and discharge directions, respectively. This safety feature is used to protect the pass FETs,cells, and any other inline components from excessive current conditions. The detection circuit also incorporatesa blanking delay before driving the control for the pass FETs to the OFF state. The short circuit in chargethreshold and delay time are set in the SCC register. The short circuit in discharge threshold and delay time areset in the SCD register. The short-circuit thresholds can be programmed from 100 mV to 475 mV in 25-mV steps.

If the RSNS bit in the FUNCTION_CTL register is set to 1, then the voltage threshold, programmable step size,and hysteresis is divided by 2.

OVERLOAD, SHORT CIRCUIT IN CHARGE AND SHORT CIRCUIT IN DISCHARGE DELAY

The overload delay (default = 1 ms) allows the system to momentarily accept a high current condition withoutdisconnecting the supply to the load. The delay time can be increased via the OLD register which can beprogrammed for a range of 1 ms to 31 ms with 2-ms steps.

The short circuit in charge and short circuit in discharge delays (default = 0 μs) are programmable in the SCCand SCD registers, respectively. These registers can be programmed from 0 μs to 915 μs with 61-μs steps.




http://www.ti.com



bq29330


OVERLOAD, SHORT CIRCUIT IN CHARGE AND SHORT CIRCUIT IN DISCHARGE RESPONSE

When an overload, short circuit in charge, or short circuit in discharge fault is detected, the FETs are turned off.The STATUS (b0…b3) register reports the details of overload, short circuit in charge or short-circuit discharge.The respective STATUS (b0…b3) bits are set to 1 and the XALERT output is triggered. This condition is latcheduntil the STATE_CONTROL (b7) is set and then reset. If a FET is turned on after resetting STATE_CONTROL(b0) and the error condition is still present on the system, then the device again enters the protection responsestate.

2-, 3-, or 4-CELL CONFIGURATION

In a 2-cell configuration, VC1 and VC2 are shorted to VC3. In a 3-cell configuration, VC1 is shorted to VC2.

CELL VOLTAGE

The cell voltage is translated to allow a system host to measure individual series elements of the battery. Theseries element voltage is translated to a GND-based voltage equal to 0.15 ±0.003 of the series element voltage.This provides a range from 0 to 4.5 V. The translation output is presented between CELL+ and CELL– pins ofthe bq29330 and is inversely proportional to the input using the following equation.

Where, V(CELLOUT) = –K × V(CELLIN) + 0.975 (V)

Programming CELL_SEL (b1, b0) selects the individual series element. The CELL_SEL (b3, b2) selects thevoltage monitor mode, cell monitor, offset, etc.

CALIBRATION OF CELL VOLTAGE MONITOR AMPLIFIER GAIN

The cell voltage monitor amplifier has an offset, and to increase accuracy, this can be calibrated.

The following procedure shows how to measure and calculate the offset as an example.

Step 1

Set CAL1=1, CAL0=1, VMEN=1.

VREF is trimmed to 0.975 V within ±1%; measuring VREF eliminates its error.

Measure internal reference voltage VREF from VCELL directly.

VREF = measured reference voltage

Step 2

Set CAL1=0, CAL0=1, CELL1=0, CELL0=0, VMEN=1.

The output voltage includes the offset and represented by:

VOUT(4-5) = VREF + (1 + K) × VOS (V)

Where K = CELL Scaling Factor

VOS = Offset voltage at input of the internal operational amplifier

Step 3


Measure scaled REF voltage through VCELL amplifier.

The output voltage includes the scale factor error and offset and is represented by:

V(OUTR) = VREF + (1 + K) × VOS – K × VREF (V)

Step 4

Calculate (VOUT(4-5) –V(OUTR)) / VREF.

The result is the actual scaling factor, KACT and is represented by:

KACT = (VOUT(4-5) –V(OUTR)) / VREF = (VREF + (1 + K) × VOS) – (VREF + (1 + K) × VOS – K ×VREF)/VREF = K × VREF/VREF = K




http://www.ti.com



bq29330


Step 5

Calculate the actual offset value where:

VOS(ACT) = (V(OUTR) – VREF) / (1 + KACT)

Step 6

Calibrated cell voltage is calculated by:

VCn – VC(n+1) = VREF + (1 + KACT ) × VOS(ACT) – V(CELLOUT)/KACT = VOUT(4-5) – V(CELLOUT)/KACT

To seek greater accuracy, it is better to measure VOS(ACT) for each cell voltage.




Measure VOUT(3-4), VOUT(2-3), VOUT(1-2),

VC4 – VC5 = VOUT(4-5) – V(CELLOUT)/KACT




BATTERY PACK AND BATTERY STACK MEASUREMENTS

The PACK (battery pack) and VC1 (battery stack) inputs can be translated to the CELL+, CELL– outputs of thebq29330 through control bits in the FUNCTION_CONTROL register. If PACK is set, then the input at the PACKis divided by 18 and presented at the CELL+, CELL– outputs. If the BAT bit is set, then the input to VC1 isdivided by 18 and presented at the CELL+, CELL– outputs. If setting both bits at the same time, VC1 ispresented at the CELL+, CELL– outputs.

CELL BALANCE CONTROL

The cell balance control allows a small bypass path to be controlled for any one series element. The purpose ofthis bypass path is to reduce the current into any one cell during charging to bring the series elements to thesame voltage. Series resistors placed between the input pins and the positive series element nodes control thebypass current value. Individual series element selection is made using bits 4 through 7 of CELL_SEL register.

Series input resistors between 500 Ω and 1 kΩ are recommended for effective cell balancing.

XALERT (XALERT)

XALERT is driven Low, when WDF, OL, SCC, or SCD OC are detected. To clear XALERT, toggle (from 0, set to1, then reset to 0) STATE_CONTROL, LTCLR (bit 7), then read the STATUS register.

THERMISTOR DRIVE CIRCUIT (TOUT)

The TOUT pin can be enabled to drive a thermistor from REG. The typical thermistor resistance is 10 kΩ at25°C. The default state for this is OFF to conserve power. The maximum output impedance is 100 Ω. TOUT isenabled in FUNCTION_CONTROL register (bit 3).

GENERAL PURPOSE OPEN DRAIN DRIVE CIRCUIT (GPOD)

The General Purpose Open Drain output has 1-mA current source drive with a maximum output voltage of 25 V.The OD output is enabled or disabled by OUTPUT_CONTROL register (bit 4) and has a default state of OFF.




http://www.ti.com



FET Control Access

by Host

LTCLR Bit

Fault Flag Set

XALERT Output

Fault Timeout

Expired

STATUS Register

Read

REG Output

RST Output

tRST

VREGTH+

VREGTH-

bq29330


LATCH CLEAR (LTCLR)

When a protection fault occurs, the state is latched. To clear the fault flag, toggle (from 0, set 1, then reset to 0)the LTCLR bit in the STATE_CONTROL register (bit 7). The OL, SCC, SCD, and WDF bits are unlatched by thisfunction. The FETs can now be controlled by programming the OUTPUT_CONTROL register, and the XALERToutput can be cleared by reading the STATUS register.

Figure 1. LTCLR and XLAERT Clear Timing

POR and WATCHDOG RESET (XRST)

The XRST pin is activated by activation of the REG output. This holds the host in reset for the duration of thetRST period, allowing the VREG to stabilize before the host is released from reset. When the regulator power isdown, XRST is active below the regulator’s voltage of 1.8 V. Also, when a watchdog fault is detected, the XRSTis also activated to ensure a valid reset of the battery management host.

Figure 2. XRST Timing Chart – Power Up and Power Down

WATCHDOG INPUT (WDI)

The WDI input is required as a time base for delay timing when determining fault detection and is used as part ofthe system watchdog.

Initially, the watchdog monitors the host oscillator start-up; if there is no response from the host within tWDINT oftRST expiring, then the bq29330 turns CHG, DSG, and ZVCHG FETs off. It then activates the XRST output in anattempt to reset the host.

Once the watchdog has been started during this wake-up period, it monitors the host for an oscillation stopcondition which is defined as a period of tWDWT where no clock input is received. If an oscillator stop condition isidentified, then the watchdog turns the CHG, DSG, and ZVCHG FETs off. The bq29330 then activates the XRSToutput in an attempt to reset the host.




http://www.ti.com



REG Output

REG Output

WDI Input

XALERT

FET ControlAccess by Host

tRST

t (500 ms)DWTINIT t (500 ms)DWTINIT

CHG, DSG, andZVCHG = OFF

WDRST = L

REG Output

REG Output

WDI Input

XALERT




tRST tRST tRST

WDRST = H

bq29330


If the host clock oscillation is started after the reset, the bq29330 still has the WDF flag set until it is cleared. Seethe LTCLR section for further details on clearing the fault flags.

During Sleep mode, the watchdog function is not disabled.

Figure 3. Watchdog Timing Chart – WDI Fault at Start-up




http://www.ti.com



REG Output

REG Output

WDI Input

XALERT




tRST

WDRST = L

tWDWTNormal Operation

REG Output

REG Output

WDI Input

XALERT


t (500 ms)DWTINIT t (500 ms)DWTINITtWDWTNormal Operation

tRST tRST tRST


WDRST = H

bq29330


Figure 4. Watchdog Timing Chart – WDI Fault After Startup

DSG and CHG NCH FET DRIVER CONTROL

The bq29330 drives either the DSG or CHG FET off if an OL, SCC, or SCD safety threshold is breacheddepending on the current direction. The host can force any FET on or off only if the bq29330 integratedprotection control allows.

The default-state of the FET drive is off. A host can control the FET drive by programming OUTPUT_CONTROL(b2...b0), where b0 is used to control the discharge FET, b1 is used to control the charge FET, and b2 is used tocontrol the ZVCHG FET. These controls are only valid when not in the initialized state. The CHG drive FET canbe powered by PACK and the DSG FET can be powered by BAT.

When the bq29330 powers down, the NCH FET drivers power down to GND causing the FETs to turn off.




http://www.ti.com



bq29330


PRECHARGE AND 0 V CHARGING

The bq29330 supports both a charger that has a precharge mode and one that does not. The bq29330 alsosupports charging even when the battery falls to 0 V. In order to charge, the charge FET (CHG) must be turnedon to create a current path. When the VBAT is ~0 V, the V(PACK) is as low as the battery voltage. In this case, thesupply voltage for the device is too low to operate.

POWER MODES

The bq29330 has three power modes, normal, sleep, and ship. The following table outlines the operationalfunctions during these power modes.

Table 1. Outlines the Operational Functions

POWER TO ENTER POWER MODE TO EXIT POWER MODE MODE DESCRIPTIONMODE

Normal STATE_CONTROL, SLEEP( b0) = 0 and The battery is in normal operation with protection,STATE_CONTROL, SHIP ( b1) = 0 power management and battery monitoring

functions available and operating.

The supply current of this mode varies as the hostcan enable and disable various powermanagement features.

Sleep STATE_CONTROL, SLEEP( b0) = 1 and STATE_CONTROL, CHG, DSG, and ZVCHG OFF, OL, SCC, and SCDSTATE_CONTROL, SHIP ( b1) = 0 SLEEP( b0) = 0 function is disabled.

Cell AMP, GPOD , CELL BAL, and WDF is notdisabled

Ship STATE_CONTROL, SHIP ( b1) = 1 Supply voltage to PACK The bq29330 is completely shut down as in theand supply at the PACK < VWAKE Supply sleep mode. In addition, the REG output is

disabled, I2C interface is powered down, andmemory is not valid.

VOLTAGE BASED EXIT FROM SHUTDOWN

If a voltage greater than VSTARTUP is applied to the PACK pin, then the bq29330 exits shutdown and entersnormal mode.

COMMUNICATIONS

The I2C-compatible serial communications provides read and write access to the bq29330 data area. The data isclocked via separate data (SDATA) and clock (SCLK) pins. The bq29330 acts as a slave device and does notgenerate clock pulses. Communication to the bq29330 can be provided from GPIO pins or an I2C supporting portof a host system controller. The slave address for the bq29330 is 7 bits, and the value is 0100 000 (0x20).

(MSB) I2C Address +R/W bit (LSB)

(MSB) I2C Address (0x20) (LSB)

Write 0 1 0 0 0 0 0 0

Read 1

The bq29330 does NOT have the following functions compatible with the I2C specification.• The bq29330 is always regarded as a slave.• The bq29330 does not support the General Code of the I2C specification, and therefore will not return an ACK

but may return a NACK.• The bq29330 does not support the Address Auto Increment, which allows continuous reading and writing.• The bq29330 will allow data to be written or read from the same location without re-sending the location

address.




http://www.ti.com



…

…

SCLK

SDATA

StopStart

A6 R7A5 R6A4 R5 D7 D6 D5 D0R0R/W ACK ACK ACKA0

0 0 00

……

… …

… …

Register AddressSlave Address Data

Note: Slave = bq29330

Stop

… …

…… …

…SCLK

A6 A5 A0 R/W R/WACK ACKACKR7 A6 D7 D6 D0 NACKA0R6 R0SDATA

Start

0 0 0 1 0

…

StartSlave Address Register Address Slave Address Slave DrivesThe Data

MasterDrives

NACK andStopNote: Slave = bq29330

… …

…… …

…SCLK

SDATA

0

…

…

StopStop

A6 A6A5 A5A0 R/W R/WACK ACKACKR7 D7 D0 NACKA0R6 R0

Note: Slave = bq29330

Start StartRegister AddressSlave Slave AddressSlave Drives

The Data

MasterDrives

NACK andStop

bq29330


Figure 5. I2C-Bus Write to bq29330

Figure 6. I2C-Bus Read from bq29330: Protocol A

Figure 7. I2C-Bus Read from bq29330: Protocol B

REGISTER MAP

The bq29330 has nine addressable registers. These registers provide status, control, and configurationinformation for the battery protection system.

NAME ADDR TYPE DESCRIPTION

STATUS 0x00 R Status register

OUTPUT_CONTROL 0x01 R/W Output pin control from system host and external pin status

STATE_CONTROL 0x02 R/W State control

FUNCTION_CONTROL 0x03 R/W Function control

CELL _SEL 0x04 R/W Battery cell select for cell translation and balance bypass and select mode for calibration

OLV 0x05 R/W Overload voltage threshold

OLD 0x06 R/W Overload delay time

SCC 0x07 R/W Short circuit in charge current threshold voltage and delay

SCD 0x08 R/W Short circuit in discharge current threshold voltage and delay




http://www.ti.com



bq29330


BIT MAPNAME ADDR TYPE

B7 B6 B5 B4 B3 B2 B1 B0

STATUS 0x00 R 0 0 0 ZV WDF OL SCC SCD

OUTPUT_ CONTROL 0x01 R/W 0 0 PMS_CHG GPOD XZV CHG DSG LTCLR

STATE_ CONTROL 0x02 R/W 0 0 0 RSNS WDRST WDDIS SHIP SLEEP

FUNCTION_ CONTROL 0x03 R/W 0 0 0 0 TOUT BAT PACK VMEN

CELL _SEL 0x04 R/W CB3 CB2 CB1 CB0 CAL1 CAL0 CELL1 CELL0

OLV 0x05 R/W 0 0 0 OLV4 OLV3 OLV2 OLV1 OLV0

OLD 0x06 R/W 0 0 0 0 OLD3 OLD2 OLD1 OLD0

SCC 0x07 R/W SCCD3 SCCD2 SCCD1 SCCD0 SCCV3 SCCV2 SCCV1 SCCV0

SCD 0x08 R/W SCDD3 SCDD2 SCDD1 SCDD0 SCDV3 SCDV2 SCDV1 SCDV0

STATUS: Status register

STATUS REGISTER (0x00)

7 6 5 4 3 2 1 0

0 0 0 ZV WDF OL SCC SCD

The STATUS register provides information about the current state of the bq29330.

STATUS b0 (SCD): This bit indicates a short circuit in discharge condition.

0 = Voltage below the short circuit in discharge threshold (default).

1 = Voltage greater than or equal to the short circuit in discharge threshold.

STATUS b1 (SCC): This bit indicates a short circuit in charge condition in the charge direction.

0 = Voltage below the short circuit in charge threshold (default).

1 = Voltage greater than or equal to the short circuit in charge threshold.

STATUS b2 (OL): This bit indicates an overload condition.

0 = Voltage less than or equal to the overload threshold (default).

1 = Voltage greater than overload threshold.

STATUS b3 (WDF): This bit indicates a watchdog fault condition has occurred.

0 = 32-kHz oscillation is normal (default).

1 = 32-kHz oscillation stopped or not started, and the watchdog has timed out.

STATUS b4 (ZV): This bit indicates ZVCHG output is clamped.

0 = ZVCHG pin is not clamped (default).

1 = ZVCHG pin is clamped.

STATUS b5, b6, b7: Reserved

OUTPUT_CONTROL : Output control register

OUTPUT_CONTROL REGISTER (0x01)

7 6 5 4 3 2 1 0

0 0 PMS_CHG GPOD XZV CHG DSG LTCLR

The OUTPUT_CONTROL register controls the outputs of the bq29330 and can show the state of the external pincorresponding to the control.

OUTPUT_ CONTROL b0 (LTCLR): When a fault is latched, this bit releases the fault latch when toggled from 0to 1 and back to 0 (default =0).

0 = (default)

0->1 ->0 clears the fault latches, allowing STATUS to be cleared on its next read.




http://www.ti.com



bq29330


OUTPUT_ CONTROL b1 (DSG): This bit controls the external discharge FET.

0 = Discharge FET is off and is controlled by the system host (default).

1 = Discharge FET is on, and the bq29330 is in normal operating mode.

OUTPUT_ CONTROL b2 (CHG): This bit controls the external charge FET.

0 = Charge FET is off, and is controlled by the system host (default).

1 = Charge FET is on, and the bq29330 is in normal operating mode.

OUTPUT_CONTROL b3(ZV): This bit enables or disables the precharge function.

0 = ZVCHG FET is on, and is controlled by the system host (default).

1 = ZVCHG FET is off, and the bq29330 is in normal operating mode.

OUTPUT_CONTROL b4 (GPOD): This bit enables or disables the GPOD output.

0 = GPOD is high impedance (default).

1 = GPOD output is active (GND).

OUTPUT_CONTROL b5 (PMS_CHG): This bit enables the CHG output for 0-V charge, when PMS terminal isconnected to Pack.

0 = CHG FET is off (When PMS = GND, default).

1 = CHG FET is on by connecting CHG and PACK terminal. (When PMS = PACK, default).

STATE_CONTROL : State control register

STATE_CONTROL REGISTER (0x02)

7 6 5 4 3 2 1 0

0 0 0 RSNS WDRST WDDIS SHIP SLEEP

The STATE_CTL register controls the outputs of the bq29330 and can be used to clear certain states.

STATE_CONTROL b0 (SLEEP): This bit is used to enter the sleep power mode.

0 = bq29330 exits sleep mode (default).

1 = bq29330 enters the sleep mode.

STATE_CONTROL b1 (SHIP): This bit is used to enter the ship power mode when Pack supply voltage is notapplied.

0 = bq29330 is in normal mode (default).

1 = bq29330 enters ship mode when pack voltage is removed.

STATE_CONTROL b2 (WDDIS): This bit is used to enable the watchdog timer.

0 = Watchdog timer is enabled (default).

1 = Watchdog timer is disabled.

STATE_CONTROL b3 (WDRST): This bit is used to enable the reset for GC, when watchdog timer is active.

0 = Reset output is disabled, when watchdog timer is active (default).

1 = 2 Times reset output is enabled, when watchdog timer is active.

STATE_CONTROL b4 (RSNS): This bit sets the OL, SCC, and SCD thresholds into a range suitable for a lowsense resistor value by dividing the OLV, SCCV, and SCDV selected voltage thresholds by 2.

0 = Current protection voltage threshold as programmed (default)

1 = Current protection voltage thresholds divided by 2 as programmed

STATE_CONTROL b6..7 (0): These bits are not used and should be set to 0.




http://www.ti.com



bq29330


FUNCTION_CONTROL : Function control register

FUNCTION_CTL REGISTER (0x03)

7 6 5 4 3 2 1 0

0 0 0 0 TOUT BAT PACK VMEN

The FUNCTION_CONTROL register enables and disables features of the bq29330.

FUNCTION_CONTROL b0 (VMEN): This bit enables or disables the cell and battery voltage monitoringfunction.

0 = Disable voltage monitoring (default). CELL output is pulled down to GND level.

1 = Enable voltage monitoring

FUNCTION_CONTROL b1 (PACK): This bit is used to translate the PACK input to the CELL+, CELL– pinswhen VMEN = 1. The PACK input voltage is divided by 18 and is presented on CELL+, CELL– pins regardlessof the CELL_SEL register settings.

0 = CELL_SEL (b0, b1) settings determine CELL+, CELL– output when VMEN = 1(default).

1 = PACK input translated to CELL output regardless of CELL_SEL (b0, b1) selection when VMEN=1

FUNCTION_CTL b2 (BAT): This bit is used to translate the BAT input to the CELL+, CELL– pins whenVMEN=1. The VC5 input voltage is divided by 18 and is presented on CELL+, CELL– regardless of theCELL_SEL register settings.

0 = CELL_SEL (b0, b1) settings determine CELL+, CELL– output when VMEN = 1(default).

1 = BAT input translated to CELL+, CELL– output regardless of CELL_SEL (b0, b1) selection whenVMEN = 1

This bit priority is higher than PACK(b1).

FUNCTION_CONTROL b3 (TOUT): This bit controls the power to the thermistor.

0 = Thermistor power is off (default).

1 = Thermistor power is on.

CELL_SEL : Cell select register

CELL_SEL REGISTER (0x04)

7 6 5 4 3 2 1 0

CB3 CB2 CB1 CB0 CAL1 CAL0 CELL1 CELL0

This register determines cell selection for voltage measurement and translation, cell balancing, and theoperational mode of the cell voltage monitoring.

CELL_SEL b0–b1 (CELL0–CELL1): These two bits select the series cell for voltage measurement translation.

CELL1 CELL0 SELECTED CELL

0 0 VC4–VC5, Bottom series element (default)

0 1 VC4–VC3, Second lowest series element

1 0 VC3–VC2, Second highest series element

1 1 VC1–VC2, Top series element




http://www.ti.com



bq29330


CELL_SEL b2–b3 (CAL1, CAL0): These bits determine the mode of the voltage monitor block

CAL1 CAL0 SELECTED MODE

0 0 Cell translation for selected cell (default)

0 1 Offset measurement for selected cell

1 0 Monitor the VREF value for gain calibration

Monitor the VREF directly value for gain calibration,1 1 bypassing the translation circuit

CELL_SEL b4–b7 (CB0 – CB3): These 4 bits select the series cell for cell balance bypass path.

CELL_SEL b4 (CB0): This bit enables or disables the bottom series cell balance charge bypass path.

0 = Disable bottom series cell balance charge bypass path (default)

1 = Enable bottom series cell balance charge bypass path

CELL_SEL b5 (CB1): This bit enables or disables the second lowest series cell balance charge bypass path.

0 = Disable series cell balance charge bypass path (default)

1 = Enable series cell balance charge bypass path

CELL_SEL b6 (CB2): This bit enables or disables the second highest cell balance charge bypass path.



CELL_SEL b7 (CB3): This bit enables or disables the highest series cell balance charge bypass path.



OLV: Overload Voltage threshold register

OLV REGISTER (0x05)

7 6 5 4 3 2 1 0

0 0 0 OLV4 OLV3 OLV2 OLV1 OLV0

OLV (b4–b0): These four bits select the value of the overload threshold with a default of 0000.

OLV (b5–b7): These bits are not used and should be set to 0.

OLV (b4–b0) configuration bits with corresponding voltage threshold (1)

0x00 –0.050 V 0x08 –0.090 V 0x10 –0.130 V 0x18 –0.170 V

0x01 –0.055 V 0x09 –0.095 V 0x11 –0.135 V 0x19 –0.175 V

0x02 –0.060 V 0x0a –0.100 V 0x12 –0.140 V 0x1a –0.180 V

0x03 –0.065 V 0x0b –0.105 V 0x13 –0.145 V 0x1b –0.185 V

0x04 –0.070 V 0x0c –0.110 V 0x14 –0.150 V 0x1c –0.190 V

0x05 –0.075 V 0x0d –0.115 V 0x15 –0.155 V 0x1d –0.195 V

0x06 –0.080 V 0x0e –0.120 V 0x16 –0.160 V 0x1e –0.200 V

0x07 –0.085 V 0x0f –0.125 V 0x17 –0.165 V 0x1f –0.205 V

(1) If RSNS bit is FUNCTION_CONTROL = 1, then the corresponding voltage threshold is divided by 2.




http://www.ti.com



bq29330


OLD: Overload Delay time configuration register

OLD REGISTER (0x07)

7 6 5 4 3 2 1 0

0 0 0 0 OLD3 OLD2 OLD1 OLD0

OLD(b3–b0): These four bits select the value of the delay time for overload with a default of 0000.

0x00 1 ms 0x04 9 ms 0x08 17 ms 0x0c 25 ms

0x01 3 ms 0x05 11 ms 0x09 19 ms 0x0d 27 ms

0x02 5 ms 0x06 13 ms 0x0a 21 ms 0x0e 29 ms

0x03 7 ms 0x07 15 ms 0x0b 23 ms 0x0f 31 ms

SCC : Short Circuit In Charge configuration register

SCC REGISTER (0x08)

7 6 5 4 3 2 1 0

SCCD3 SCCD2 SCCD1 SCCD0 SCCV3 SCCV2 SCCV1 SCCV0

This register selects the short circuit in charge voltage threshold and delay.

SCCV (b3–b0) : These lower nibble bits select the value of the short circuit in charge voltage threshold with 0000 as the default. (1)

0x00 0.100 V 0x04 0.200 V 0x08 0.300 V 0x0c 0.400 V

0x01 0.125 V 0x05 0.225 V 0x09 0.325 V 0x0d 0.425 V

0x02 0.150 V 0x06 0.250 V 0x0a 0.350 V 0x0e 0.450 V

0x03 0.175 V 0x07 0.275 V 0x0b 0.375 V 0x0f 0.475 V

(1) If RSNS bit is FUNCTION_CTL = 1, then the corresponding voltage threshold is divided by 2.

SCCD (b7–b4): These upper nibble bits select the value of the short circuit in charge delay time. Exceeding the short circuit in chargevoltage threshold for longer than this period turns off the CHG and DSG outputs. 0000 is the default.

0x00 0 μs 0x04 244 μs 0x08 488 μs 0x0c 732 μs

0x01 61 μs 0x05 305 μs 0x09 549 μs 0x0d 793 μs

0x02 122 μs 0x06 366 μs 0x0a 610 μs 0x0e 854 μs

0x03 183 μs 0x07 427 μs 0x0b 671 μs 0x0f 915 μs

SCD : Short Circuit In Discharge configuration register

SCD REGISTER (0x08)

7 6 5 4 3 2 1 0

SCDD3 SCDD2 SCDD1 SCDD0 SCDV3 SCDV2 SCDV1 SCDV0

This register selects the short circuit in discharge voltage threshold and delay.

SCDV(b3–b0) : These lower nibble bits select the value of the short circuit in discharge voltage threshold with 0000 as the default. (1)

0x00 –0.100 V 0x04 –0.200 V 0x08 –0.300 V 0x0c –0.400 V

0x01 –0.125 V 0x05 –0.225 V 0x09 –0.325 V 0x0d –0.425 V

0x02 –0.150 V 0x06 –0.250 V 0x0a –0.350 V 0x0e –0.450 V

0x03 –0.175 V 0x07 –0.275 V 0x0b –0.375 V 0x0f –0.475 V

(1) If RSNS bit is FUNCTION_CTL = 1, then the corresponding voltage threshold is divided by 2.

SCCD (b7–b4): These upper nibble bits select the value of the short circuit in charge delay time. Exceeding the Short Circuit in chargevoltage threshold for longer than this period will turn off the CHG and DSG outputs. 0000 is the default.

0x00 0 μs 0x04 244 μs 0x08 488 μs 0x0c 732 μs

0x01 61 μs 0x05 305 μs 0x09 549 μs 0x0d 793 μs

0x02 122 μs 0x06 366 μs 0x0a 610 μs 0x0e 854 μs

0x03 183 μs 0x07 427 μs 0x0b 671 μs 0x0f 915 μs




http://www.ti.com



bq29330


REVISION HISTORY

Changes from Original (September 2005) to Revision A Page

• Changed package name From: SSOP(DBT) To: TSSOP(DBT) in the Ordering Information Table .................................... 2

• Changed the SCLK pin description From: Open-drain bi-directional serial interface clock with internal 10-kΩ pullupto VREG To: Open-drain serial interface clock with internal 10-kΩ pullup to VREG ................................................................. 4

• Changed Supply Current 2 From: XALERT, SCLK, SDATA. ZVCHG = off, Input WDI, To: XALERT, SCLK, SDATA.ZVCHG = off, WDI = 32 kHz, ................................................................................................................................................ 7

• Changed Calibration of Cell Voltage Monitor Amplifier Gain, Step 3 - From: Set CAL1=1, CAL0=1, CELL1=0,CELL0=0, VMEN=1. To: Set CAL1=1, CAL0=0, CELL1=0, CELL0=0, VMEN=1. ............................................................. 12

Changes from Revision A (December 2005) to Revision B Page

• Deleted the QFN(RHB) package from the Ordering Information Table, the Package Option Pin Diagrams, and thePin Functions table. .............................................................................................................................................................. 2

Changes from Revision B (August 2006) to Revision C Page

• Changed BAT Pin description From: Charge pump, charge N-CH FET gate drive To: Device power supply input ............ 3

• Changed ELECTRICAL CHARACTERISTICS - CURRENT PROTECTION DETECTION section - positive andnegative values were not properly displayed. ....................................................................................................................... 8

• Changed Figure 3 - Watchdog Timing Chart – WDI Fault at Start-up ................................................................................ 15

• Added Figure 4 - Watchdog Timing Chart – WDI Fault After Startup ................................................................................ 16

Changes from Revision C (March 2009) to Revision D Page

• Added the RSM package to the Ordering Information Table ............................................................................................... 2

• Added the RSM pin out package illustration. ........................................................................................................................ 3

Changes from Revision D (July 2009) to Revision E Page

• Changed the device numbers in the Ordering Information Table From: bq29330ADBT and bq29330ARSM To:bq29330DBT and bq29330RSM ........................................................................................................................................... 2

• Added Thermal Information .................................................................................................................................................. 2

• Changed the AC Timing Requiremenst Table, fSCL - Clock frequency MAX value From: 400 kHz To: 100 kHz ............... 10




http://www.ti.com



PACKAGE OPTION ADDENDUM

www.ti.com 6-Aug-2014

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

BQ29330DBT NRND TSSOP DBT 30 60 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 110 29330

BQ29330DBTG4 NRND TSSOP DBT 30 60 Green (RoHS& no Sb/Br)


BQ29330DBTR NRND TSSOP DBT 30 2000 Green (RoHS& no Sb/Br)


BQ29330DBTRG4 NRND TSSOP DBT 30 2000 Green (RoHS& no Sb/Br)


(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

http://www.ti.com/productcontent

PACKAGE OPTION ADDENDUM

www.ti.com 6-Aug-2014

Addendum-Page 2

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

BQ29330DBTR TSSOP DBT 30 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

BQ29330DBTR TSSOP DBT 30 2000 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated

http://www.ti.com/audio

http://www.ti.com/automotive

http://amplifier.ti.com

http://www.ti.com/communications

http://dataconverter.ti.com

http://www.ti.com/computers

http://www.dlp.com

http://www.ti.com/consumer-apps

http://dsp.ti.com

http://www.ti.com/energy

http://www.ti.com/clocks

http://www.ti.com/industrial

http://interface.ti.com

http://www.ti.com/medical

http://logic.ti.com

http://www.ti.com/security

http://power.ti.com

http://www.ti.com/space-avionics-defense

http://microcontroller.ti.com

http://www.ti.com/video

http://www.ti-rfid.com

http://www.ti.com/omap

http://e2e.ti.com

http://www.ti.com/wirelessconnectivity

2, 3-, 4-Cell Lithium-Ion or Lithium-Polymer ... - Texas... · PDF fileLDO + Reset I2 C SMBus...

Documents

Transcript of 2, 3-, 4-Cell Lithium-Ion or Lithium-Polymer ... - Texas... · PDF fileLDO + Reset I2 C SMBus...