18 July 2018 Company Confidential 2

SIC POWER DEVICE COMMERCIAL FOUNDRY

DEVELOPMENT

18 July 2018 Company Confidential 3

X-FAB Key Facts

• The More than Moore Foundry– 25 years of experience, pure-play foundry

– Best-in-class design and engineering support

• Technologies interfacing the real world– CMOS, SOI and HV Technologies

– Dedicated MEMS foundry operations

– First 6-inch SiC Open Foundry

• Manufacturing excellence– 6 wafer fabs: US, Germany, France and Malaysia

– Capacity: ~ 94,000 8-inch equiv. wafers/month

– All production sites are automotive qualified

– Approx. 3,800 employees worldwide

18 July 2018 Company Confidential 4

X-FAB / PowerAmerica Vision

Open SiC Foundry fully integratedwithin a high volume 150mm Si fab(X-FAB TX currently running 23K CMOS wafer/month)

• Efficiency through Integrated Mfg Convert Si tools to run both Si and SiC wafers. Maximize

equipment utilization.

Operators to run both Si and SiC. Maximize labor efficiency.

SiC and Si share overhead. Shared economies of scale.

SiC and Si share mfg and quality systems

• Scalability through Integrated Mfg Additional tools can be converted as SiC demand grows.

Additional human resources can be trained for both Si and SiC production as demand grows for SiC (and shrinks for Si)

Provide SiC Device companies with the manufacturing scale and cost structure

to realize the DOE goal to accelerate the adoption of SiC Power Devices

18 July 2018 Company Confidential 5

X-FAB / PA Accomplishments

• 2013: X-FAB TX begins SiC strategy

• 2013/2014: Conservative progress

• 2015: PA/DOE Project accelerated investments, business engagements

• 2017: Full process capability in place– CMOS tool conversions complete

– Handling of thin and transparent wafers

– SiC tools installed/qualified• HT Implant (Al, N) - HT Anneal

• BS Laser Anneal - Thin wf processing

• Temporary Bond/Debond

– 3 customer devices qualified, additional devices in qualification

PowerAmerica Public/Private partnership has accelerated

offering by minimum 2 years!!

18 July 2018 Company Confidential 6

X-FAB Foundry Progress

• Engaged with 14 different customers on >25 projects

• Current/Past working model

– Initial engagements with highly experienced customers

– Results in copy exact process transfers for each customer

– Great model for early engagements, but not very scalable

• The scalable working model is the Discrete Foundry Model

– The DFM has been defined and will be implemented through 2017

– Expect to offer the initial process installation kit during 1H2018

– The PIK will provide for more streamlined engagements with new and current customers

• Concentrate on engagements with customers experienced in both process and design

– The PIK will be the basis for future innovation in anticipation of customer needs

• Concentrating on manufacturing development

• Barrier to success: Wafer supply remains as a significant barrier to success

18 July 2018 Company Confidential 7

X-FAB Summary

Mission: Enable customers to bring technologies to market faster than in their own fab

• X-FAB is a well established foundry with a long history in Mixed Signal and Analog CMOS, MEMS, SOI, and HV technologies

• X-FAB will create economies of scale for SiC based on our high volume Si fab

• The DOE and PowerAmerica have enabled X-FAB to accelerate the SiC Open Foundry Model

• X-FAB is successfully engaging with multiple customers and projects to provide SiC at the scale of Si

• X-FAB has installed a full set of capabilities for SiC processing– HT Implant, HT anneal, thin wafer handling, backside laser anneal,

temporary bond/debond

– All of the standard Si processes (photo, etch, thin films, metal deposition, oxidation, etc.)

• X-FAB is creating the DFM and implementing a Process Installation Kit– Streamline customer engagements

– The basis for future X-FAB process block innovations

– Introduction of the PIK will be during 1H18

Thank you for your attention.