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ePhysics

Thermal

Stress

EM

Qing-Ming Chen

Senior EM Engineer

Ansoft Japan2004.3.16

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What is ePhysics?

ePhysics extends the capability of AnsoftsMaxwell & HFSS, with new coupled-analysis

capabilities.

3D Thermal Transient Analysis

3D Thermal Steady-State Analysis

3D Linear Stress Analysis

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Thermal Analysis Features

w Heat Transfer Mechanismsw Conductionw Convectionw Radiation

w

Volumetric and SurfaceSource/Boundary Conditionsw Automatic Power Loss Mapping

from EM Analysisw Executive Parameters

w Average Temperature

w Temperature of Hot/Cold spotsw Coordinates of Hot/Cold spots

COUPLES WITH MAXWELL, HFSS, STRESS

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Stress Analysis Features

w Automatic field mapping

w EM Thermal Stress

w Calculates Deformation &

Von Mises Stress Distributionsw Executive Parameters

w Maximum Principal Stress

w Orientation of Principal Planes

w Maximum Von Mises Stress

w Maximum Stress Coordinates

COUPLES WITH MAXWELL, THERMAL

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Maxwell - ePhysics Coupling

MagnetostaticEddy CurrentTransient w/Motion

Electrostatic

Stress

Thermal

Update Maxwell Parameters

Materials, Sources, Geometry

Optimetrics

Maxwell ePhysics

ForceDistribution

EM Field

Power LossEM Field

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Maxwell - ePhysics

w Coupled-Analysisw Magnetostatic Thermal

w Magnetostatic Stress

w Magnetostatic Thermal Stress

w Eddy Current Thermal

w Eddy Current Stress

w Eddy Current - Thermal Stress

w Electrostatic Stress

w Transient - Stress

w Thermal - Stress

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Electromechanical Applications

w MEMS

w Motor & Generator

w Electrical apparatus

w PCB Packages & IGBT

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Example 1:MEMSHeatuatorElectro-Thermal Actuator

Conduction SolverThermal

SolverStress Solver

Controlled Micro Machine

DC current

Displacement

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Example : DC Current SolverScalarPotential

DCC

urrent

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Example :Magnetostatic Solver

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Example :Thermal Solver

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Example :Stress Solver

Temperatureon the animated surface

Displacement

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Example :Strain Energy & Von Mises Stress

StrainE

nergyDensity

VonMisesEquivalentStress

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Example : Motor & Generator3D Induction Motor: EddyThermal

EddyMesh

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Example :Motor & Generator3D Induction Motor: EddyThermal

Rotor

Stator

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Example : Motor & GeneratorClaw Pole Alternator: Transient

Static Thermal

Claw Pole Alternator

Stress DistributionIn a tooth

Displacement in a toothMagnified x1000

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Example :Optimetrics + ePhysicsLoop AnalysisEddyThermalConductivity Calibration

Loop Analysis

Eddy

For Loss

ThermalFor Average T

Conductivity

Maxwell Optimetrics is needed

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Example :Optimetrics + ePhysicsLoop Analysis

EddyThermalConductivity Calibration

Model

Mesh in Thermal analysis

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Example :Optimetrics + ePhysicsLoop AnalysisEddyThermalConductivity Calibration

Distribution of Temperature

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Example : Optimetrics + ePhysicLoop Analysis

EddyThermalConductivity Calibration

Loop

Control Function

Set up Variable

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Example : Optimetrics + ePhysicsLoop Analysis

EddyThermalConductivity Calibration

Loop ResultConvergence!!

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Example 4: Packages

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Example 4: PCB

mKW

mKW

THROUGH

PLANEIN

/26.0/4.17

=

=

Layer 1 (FR4)

Layer 2 (FR4)

Layer i (FR4)

Layer N (FR4)

-4 layers of FR4

0.25 W/m K

-2 inner layerscopper 390 W/m K-35 m copper film (1oz/ft2)

Copper

26.000

04.170

004.17

=

Tensor of Thermal Conductivity

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Example 4: CPGA

Q vector

Temperature

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Example 4:SBGA90%Vector distribution2W

1.14 W

0.66 W

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Example 4:PCB Analysis

Temperature distribution on cut-planes

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Example 4:IGBT Application

Hot spots indevice

Temperature distributionAverage temperature of wire

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HFSS - ePhysics Coupling

HFSSThermal

Stress

ePhysics

Power LossGeometryTemperature

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High Frequency Applications

w HFSS-Thermal

w RF Heating

w Packaging

w High Power Components

w Filters

w Biomedical

w HFSS-Thermal-Structural

w

MEMS, Filters

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BGA PackageHFSS-Thermal

Temperature Distribution

due to losses in:

ChipBond WiresLeadsDielectrics

courtesy of TNO-FEL, the Netherlands

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15 MHz Pass Band FilterHFSS-Thermal-Stress

Transmission (S21)

Reflection (S11)

Final temperaturedistribution

Deformation

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HF CableHFSS-Thermal

HFSSCoax cable (50 Ohm impedance);1 GHz; 100 Watts;

Copper modeled with a surfaceimpedance boundary condition;

Convection- radiationthermal boundary condition

ePhysicsLosses in copper are

applied as thermal sourcesat the surface of the

conductors.

Losses in dielectrics areapplied as volumetrically

distributed thermal sources.

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HF CableHFSS-Thermal

Temperature distribution

Heat flow

Average temperature

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Summary

w Powerful EM-Coupled Analysis

w Limits Need to Export Models

w Saves Time