110922.Thin.Handling.Daetec.R2

DAETEC

Daetec Experience and Success

Temporary Adhesives for Thin Substrate Handling &

Backside Processing

Daetec, LLC 2011

1 Diversified Applica@ons Engineering Technologies

DAETEC Diversified Applica@ons Engineering Technologies 2

Product Development

Process Development Intellectual

Property

Substrate Handling

Analytical Testing

Toll Support

Fab Mftg Support

Bridging Your Success

DAETEC

DAETEC

Daetec Business Model •  What We Do: Product development and consul>ng

•  How We Do it: Formulate commercially available ingredients & apply to a process

•  Primary Experience: Coa>ngs & cleaning products

•  Deliverables: New product or ancillary •  Clients: Materials & equipment suppliers, end-‐users (manufacturing)

Diversified Applica@ons Engineering Technologies 3

DAETEC

FTIR of DUV Resist on Silicon GATR Accessory

80.0

82.0

84.0

86.0

88.0

90.0

92.0

94.0

96.0

98.0

100.0

1100120013001400150016001700

Wavenumber (cm-1)

Tran

smitt

ance

(%)

1510 cm-1

Top: Resist Reference, 3umBottom (2): 1) Resist @ 16A, 2) Blank

1450 cm-1

1610 cm-1

1170 cm-1

Cleans & Stability Tests

Resin Application via Spin Coater Thickness vs Spin Speed

5.00

10.00

15.00

20.00

25.00

30.00

0 1000 2000 3000 4000 5000 6000

Spin Speed (rpm)

Thic

knes

s (u

m)

v = 3,600

v = 800

v = 300v = 160

v = viscosity

GenTak AdhesiveStatic Dispense, 1min SpinHot Plate Cure 1min @100C Thickness achieve >25um

Eng. Curves, Adhesion Cure Condi@ons -‐ Analy@cal

Product & Process Development

Equipment Applica@ons & Diagnos@cs


DAETEC

Concept to Commercializa>on


Proof of Concept Prototype Demo

Technology Transfer

Commercial Scale-‐Up

Mass Produc@on

Daetec Daetec Daetec

Daetec Client Client

Timing, Demo – Tech Transfer ~6mos

DAETEC

Daetec Working Rela>onship Suppor2ng Market Leaders

•  The staff at Daetec have developed products, patents, wriUen papers, and presented work with a wide number of leaders in the industry. Our work spans temporary adhesives used in 3DIC to PR and residue removal processes.


DAETEC

What is 3DP? •  3DP – 3D Packaging (Chip Stacking) •  Process: Thinning, TSVs for connec>vity, metal for heat dissipa>on, stacking

•  Similar or mul>ple types of chips


DAETEC

Thin Wafer support Thin Wafer Handling

Thickness Min (um)

Chem & Therm

Resistant

Single Wafer or Batch

Backside Processing Support

Tape >50 No Both No Vacuum Chuck

>50 No Single No

Adhesive Bonded Carrier

<25 Yes Both Yes

Thinner is BeXer

Must be Resistant

Versa@lity Is Best

Must do Backside Processing


DAETEC

Temporary Spin-‐On Adhesive Coa@ng and Moun@ng Model

Coat & fix on substrate Penetra@on and se\ng

So]/hard bake Drive-‐off vola@les, planarize

Substrate with topography

Adhesion on cooling Maintain pressure

Substrate Thinning Grind, polish, stress relief

Bonding to carrier Planarized substrate surface

Carrier wafer is mounted to the wafer to be thinned and used to “handle” or “support” the thinned wafer through all the steps of backside processing


DAETEC

Integra>ng Thin Wafers & Bumping

Full size wafer

Through Hole

Contact Bond Pad

Solder Bump

Device Build

Thinned Wafer

Carrier or no-

carrier attached

Vias and

metallization

Flip-chip to

solder bump on

board lead

mount with

epoxy

10

Completed Wafer

Bumps Complete

Thinning & Back-‐ Side Processing Using Adhesive/Carrier

Flip-‐chip mounted To board

Diversified Applica@ons Engineering Technologies

DAETEC

Range of Coatings Available •  Solvent or water casting •  Thermoplastic or thermoset •  Evaporative (bake) or UV initiated cure •  Thermal resistance min. 200C; systems

at >500C for extended time are possible •  Many are moisture and/or chemical

resistant •  Transparency is possible


DAETEC

Example Coating Systems Chemistry Cure

Method Thickness Thermal

Resistance Moisture Resistance

Epoxy UV <20um >275C Yes

Rubber Evap <15um >250C Yes

Poly-‐phenylene Evap <10um >330C Yes

Imidazole Evap. <5um >450C Yes

Biphenyl Sulfonate + Polyester

Evap. <10um >300C No

Acrylic UV <20um <250C Yes

Silicone Cataly@c <10um >300C Yes

PEI Evap <10um >400C Yes

Hybrid system Evap >50um >500C Yes


DAETEC

Tunable Properties

•  Thickness – carrier solvent and solids •  Cure condition – material dependent •  Adhesion – neat, promoter, primer •  Outgas – process dependent (i.e. CVD) •  Hardness – crosslinking extent •  Scratch resistance – crosslink, additives •  Rework or cleans – inhibitor addition


DAETEC

Process Development

Wafer w/devices

Spin-‐Coat

Spray Heat Cure (Final)

UV Cure

Molding


DAETEC

Coating Application Options

15

Spin-Coating Spray-Coating


DAETEC

Define UV Operating Window

16

Resin Cutoff 405-415nm

I-line G-line 365nm 436nm


DAETEC 17

200

3

2.5

2

1.5

1

0.5

0

220 240 260 280 300 320 340 360 380 400 420 440 460 480 500

DAROCUR 1173 % in Acetonitrile Wavelength (nm)

Ab

sorb

ance

200

3

2.5

2

1.5

1

0.5

0

220 240 260 280 300 320 340 360 380 400 420 440 460 480 500

IRGACURE 184 % in Acetonitrile Wavelength (nm)

Ab

sorb

ance

200

3

2.5

2

1.5

1

0.5

0

220 240 260 280 300 320 340 360 380 400 420 440 460 480 500


Ab

sorb

ance

200

3

2.5

2

1.5

1

0.5

0

220 240 260 280 300 320 340 360 380 400 420 440 460 480 500


Ab

sorb

ance

200

3

2.5

2

1.5

1

0.5

0

220 240 260 280 300 320 340 360 380 400 420 440 460 480 500


Ab

sorb

ance

200

3

2.5

2

1.5

1

0.5

0

220 240 260 280 300 320 340 360 380 400 420 440 460 480 500


Ab

sorb

ance

200

3

2.5

2

1.5

1

0.5

0

220 240 260 280 300 320 340 360 380 400 420 440 460 480 500


Ab

sorb

ance

200

3

2.5

2

1.5

1

0.5

0

220 240 260 280 300 320 340 360 380 400 420 440 460 480 500


Ab

sorb

ance

0.10 0.010 0.001

IRGACURE 784 % in 1-Methyl-2-pyrrolidone (NMP) Wavelength (nm)

Ab

sorb

ance

3.5

3

2.5

2

1.5

1

0.5

0

250 300 350 400 450 500 550 600

0.0

1.0

200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500


Ab

sorb

ance

0.2

0.4

0.6

0.8

Free Rad Initiators Most are I-line Few are G-line


DAETEC

Simple and Rapid UV Curing

18

Low emission source UV LED Lamp

UV LED Designed Source Diversified Applica@ons Engineering Technologies

DAETEC

LED vs. Hg-Arc

19

LED Narrow

Emission


DAETEC

Low Outgas Product for CVD

•  Low permeability coating •  High Tg •  If amorphous, high softening/melting point •  Softening/melt pt is > process temp •  Design cure program as > process temp

20

Targets for successful CVD processing:


DAETEC

Barrier Usage for Reduced Outgas

21

Gas Barrier Properties Assist with formulating low outgas coatings


DAETEC

Process Overlay

22

50 100 150 200 250

50 100 150 200 250

CVD

Cure Program

SP

SP – softening point

De-‐Bond

Temperature


DAETEC Diversified Applica@ons Engineering Technologies 23

Rubber, olefinic & high MW hydrocarbon polymers, blends

Acrylic, styrenic, and blends

Polyimide & silicone

De-Bonding

DAETEC

Low COO Development for Solar •  Solar manufacturer of <10um thick substrates •  Suggest to eliminate spin-coating adhesive

with a film lamination practice •  Use SEMI Std E35 for COO comparison of

the technologies; use a ratio between COO2 (new) and COO1 (current)

•  Assumptions: similar yield, internal costs, scrap, life, maintenance, etc.

•  Tool costs, service, support, etc., identified as a factor of material costs


DAETEC

Adhesive Film lamination Process

COO for Technology Comparison

Adhesive Liquid Spin-Coat Process


DAETEC

COO Comparison of Technologies F$+R$+Y$ L×T×Y×U

COO =

Item Defini@on

F$ Fixed Costs R$ Recurring Costs Y$ Yield Cost (scrap) L Equipment Life T Throughput Y Composite Yield U U@liza@on

= Costs Product

COO2 COO1

Film Adhesive Liquid Adhesive =


DAETEC

COO Calculations

COO2 COO1 F$2+R$2+0 L×33T2×Y×U = L×T×Y×U

F$1+R$1+0 X

COO2 COO1

0.038R$2 R$1

= = (0.38R$2+R$2) 33(0.087R$1+R$1)

= 0.0027

The COO for integrating a film adhesive is 0.3% of the COO for a liquid adhesive.


DAETEC

Daetec’s Experience Temporary Adhesive Development

Date Description Customer Chemistry Product Pre-2000 Wafer dicing &

cleans Johansen Technology

Rosin/oligomer

AquaBond 55 & 85

2000 First spin-on adhesive

GCC – Motorola

Rosin/urethane

GenTak 230

2004 First spin-on high-temp thermoset

GCC – INTEL

Silicone GenTak 330

2005 First spin-on high temp, acid resist

BSI Rubber BSI HT1010

2009 First spin & spray wafer molding

SUSS Acrylic composite

SS1101

2011 First wafer lamination for solar

TCTI Urethane Adh-U


DAETEC

•  US Patent #6,869,894: Spin-on adhesive for temporary wafer coating and mounting to support wafer thinning and backside processing

•  US Patent #7,098,152: Adhesive support method for wafer coating, thinning, and backside processing

•  US Patent #7,232,770: High temperature and chemical resistant process for wafer thinning and backside processing

•  US Patent #7,678,861: Thermal and chemical-resistant acid protection coating material and spin-on thermoplastic adhesive

•  Two additional applications in 2009 (not-issued)

29

Daetec Issued Patents Temporary Adhesives for Thin Substrates


DAETEC

Daetec for Temporary Adhesives •  Include an expert on your team •  Low-‐cost adhesives are available •  Increase throughput -‐ migrate from single-‐wafer to batch (from 6 wph to >100 wph)

•  Process tuning to your process •  You own the adhesive and process •  Conven>onal comparison, COO is <50% and <10% depending upon usage


DAETEC

Contact for More Information

•  DAETEC provides new product development, consulting, and technical support to solve manufacturing problems and introduce new options of doing business.

•  Diversified Applications Engineering Technologies (DAETEC) Camarillo, CA (USA) (805) 484-5546 [email protected]; www.DAETEC.com


110922.Thin.Handling.Daetec.R2

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