10th International LS-DYNA® Users Conference -- June 8-10, 2008

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Welcome to the 10 th International LS-DYNA ® Users Conference 2008 June 8 - 10, 2008 Hyatt Regency Dearborn Dearborn, Michigan USA Thank you for your participation. Our exciting conference program includes: 85 technical paper presentations; more included in the conference proceedings Presentations about the leading Technology Today in high performance computing. Keynote Addresses by: Mr. Tsuyoshi Yasuki, General Manager of CAE Research, Development and Application, Toyota Motor Corporation Mr. Nand K. Kochhar, Executive Technical Leader, CAE, Ford Motor Company Dr. Ted Belytschko, Walter P. Murphy Professor, Northwestern University Dr. Chuan-Tao Wang, Chief Die Engineer, GM Technical Fellow, Global Die Center, GM Manufacturing Engineering, General Motors Corporation Dr. Rahul Gupta, U.S. Army Research Laboratory, Aberdeen Proving Ground Mr. Paul Du Bois, Consulting Engineer Exhibition featuring state-of-the-art hardware and software Presentation by Dr. John. O. Hallquist, President, LSTC Included in the conference packet are the Conference Agenda and Technical Session Locator with Map, our Sponsor Appreciation page, Exhibition Area Layout, and a general hotel map. Remember to fill out your Drawing Entry Form and have it stamped by each exhibitor. All completely filled entries will be eligible for the conference drawing! If you have any questions regarding the conference, members of our staff will be available to assist you at the Registration Desk. The Registration Desk will also act as a Lost and Found and Message Center for you to contact other attendees. Please take the time to visit the conference sponsors and the many other companies in the exhibition area. Please wear your Conference Badge at all times. This will help us and the hotel staff to better recognize and serve you. We hope you have a most enjoyable time!

Transcript of 10th International LS-DYNA® Users Conference -- June 8-10, 2008

Welcome to the 10th International LS-DYNA® Users Conference 2008

June 8 - 10, 2008 Hyatt Regency Dearborn

Dearborn, Michigan USA Thank you for your participation. Our exciting conference program includes:

• 85 technical paper presentations; more included in the conference proceedings

• Presentations about the leading Technology Today in high performance computing.

• Keynote Addresses by:

Mr. Tsuyoshi Yasuki, General Manager of CAE Research, Development and Application, Toyota Motor Corporation

Mr. Nand K. Kochhar, Executive Technical Leader, CAE, Ford Motor Company

Dr. Ted Belytschko, Walter P. Murphy Professor, Northwestern University

Dr. Chuan-Tao Wang, Chief Die Engineer, GM Technical Fellow, Global Die Center, GM Manufacturing Engineering, General Motors Corporation

Dr. Rahul Gupta, U.S. Army Research Laboratory, Aberdeen Proving Ground

Mr. Paul Du Bois, Consulting Engineer

• Exhibition featuring state-of-the-art hardware and software

• Presentation by Dr. John. O. Hallquist, President, LSTC Included in the conference packet are the Conference Agenda and Technical Session Locator with Map, our Sponsor Appreciation page, Exhibition Area Layout, and a general hotel map. Remember to fill out your Drawing Entry Form and have it stamped by each exhibitor. All completely filled entries will be eligible for the conference drawing! If you have any questions regarding the conference, members of our staff will be available to assist you at the Registration Desk. The Registration Desk will also act as a Lost and Found and Message Center for you to contact other attendees. Please take the time to visit the conference sponsors and the many other companies in the exhibition area. Please wear your Conference Badge at all times. This will help us and the hotel staff to better recognize and serve you. We hope you have a most enjoyable time!

10th International LS-DYNA® Users Conference 2008

June 8 - 10, 2008 Hyatt Regency Dearborn

Dearborn, Michigan USA

10th International LS-DYNA® Users Conference 2008

10th International LS-DYNA® Users Conference - June 8-10, 2008 Page 3

Conference Event Sponsors

LSTC would like to thank the following companies for their generous contributions:

Platinum Sponsors

IBM Entertainment

Intel Corporation & SGI Banquet

Microsoft Corporation Reception

Gold Sponsors

Engineering Technology Associates, Inc. Padfolio

Hewlett-Packard Company Registration & Cyber Café

Silver Sponsors

Arup Breakfast (Tuesday)

Sun Microsystems, Inc. Breakfast (Monday)

Bronze Sponsor

FEA Information, Inc. Lunch

(Monday & Tuesday)

Sponsors (Coffee Breaks)

ANSYS Evergrid, Inc.

NEC Corporation of

America TASS Americas

Exhibitor Contact Information

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Company Name Booth Web Address Sales Contact Email

Altair Engineering, Inc. 404 www.altair.com [email protected]

Advanced Micro Devices, Inc. (AMD) 400 www.amd.com [email protected]

ANSYS Inc. 106 www.ansys.com [email protected]

APTEK Inc. 309 www.aptek.com [email protected]

ARUP 201 www.arup.com [email protected]

BETA CAE Systems USA, Inc. 403 www.ansa-usa.com [email protected]

DatapointLabs 105 www.datapointlabs.com [email protected]

Detroit Engineered Products (DEP) USA 208 www.depusa.com [email protected]

Engineering Technology Associates, Inc. 100 www.eta.com [email protected]

Computaional Engineering International (CEI) - EnSight 206 www.ensight.com [email protected].

ESI North America 305 www.esi-group.com [email protected]

Evergrid, Inc. 203 www.evergrid.com [email protected]

e-Xstream Engineering 402 www.e-Xstream.com [email protected]

FEA Information Inc. 101 www.feainformation.com [email protected]

First Technology Safety Systems, Inc. (FTSS) 107 www.ftss.com [email protected]

Fraunhofer-Institute for Algorithms and Scientific Computing SCAI 104 www.scai.fraunhofer.com [email protected]

Fujitsu Computer Systems Corporation 306 www.computers.us.fujitsu.com/index.php [email protected]

Hewlett-Packard Company 303 www.hp.com [email protected]

IBM 205 www.ibm.com [email protected]

Intel Corporation 202 www.intel.com [email protected]

JRI-Solutions Ltd. 103 www.jri-sol.com [email protected]

Mellanox Technologies 302 www.mellanox.com [email protected]

Microsoft Corporation 301 www.Microsoft.com/HPC [email protected]

MSC.Software Corporation 308 www.mscsoftware.com [email protected]

NEC Corporation of America 207 www.necam.com [email protected]

Panasas, Inc. 204 www.panasas.com [email protected]

QLogic Corporation 102 www.qlogic.com [email protected]

SGI 200 www.sgi.com [email protected]

Sun Microsystems, Inc. 401 www.sun.com/hpc [email protected]

TASS Americas 300 www.tass-safe.com [email protected]

Sunday June 8th

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10:00 a.m. - 12:00 p.m. Intel Cluster Ready Program Seminar Regency Ballroom E

• The purpose, tools, and resources of the program • Intel Cluster Ready reference implementation • How to obtain Intel Cluster Ready Support

12:30 p.m. - 4:00 p.m. Diamond Jack’s River Tour Hotel Lobby

• Join us on The Diamond Belle for a two-hour tour! • Find Melissa with her Captains hat in the hotel's main entrance seating area by 12:30 p.m. • Ground transportation will depart from the Hyatt Regency Dearborn at 12:45 p.m. • The ship will board at 1:15 p.m.; the narrated tour of the sights on both the Detroit

and Windsor sides of the river will be from 1:30 p.m. to 3:30 p.m. • On board you will enjoy a light lunch with beverages. • Ground transportation will return our guests to the Hyatt Regency.

5:00 p.m. - 8:00 p.m. Registration Sponsored by Hewlett-Packard Company Regency Ballroom J

5:00 p.m. - 8:00 p.m. Exhibition Great Lakes Center

6:00 p.m. - 8:00 p.m. Welcome Reception Sponsored by Microsoft Great Lakes Center

Monday June 9th

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7:30 a.m. – 4:00 p.m. Registration Sponsored by Hewlett-Packard Company Great Lakes Center 7:30 a.m. – 8:20 a.m. Continental Breakfast Sponsored by Sun Microsystems Great Lakes Center 8:00 a.m. – 6:00 p.m. Exhibition Great Lakes Center 8:20 a.m. Welcome and Opening Remarks – Wayne L. Mindle (LSTC) Great Lakes Center

8:35 a.m. Keynote Presentations Great Lakes Center Session Chair: John O. Hallquist (LSTC)

8:35 Mr. Tsuyoshi Yasuki “Lessons Learned from Crash Analysis by the Earth Simulator” General Manager of CAE Research Development and Application Toyota Motor Corporation

9:15 Mr. Nand K. Kochhar “Advancements of Safety CAE within Ford ”

Executive Technical Leader, CAE Ford Motor Company

9:55 a.m. Coffee Break – Sponsored by Evergrid, Inc. Great Lakes Center 10:05 Dr. Ted Belytschko “Developments in Computational Science and Engineering”

Walter P. Murphy Professor Northwestern University

10:55 a.m. Keynote Presentation Regency Ballroom A-B 10:55 Dr. Chuan-Tao Wang “Autobody Manufacturing CAE –

Chief Die Engineer The Business Needs and Technical Challenges” GM Technical Fellow Global Die Center GM Manufacturing Engineering General Motors Corporation

10:55 a.m. Keynote Presentation Regency Ballroom C-D 10:55 Dr. Rahul Gupta “Multi-Phase, Multi-Material, ALE Approach for Buried Blast Simulation”

U.S. Army Research Laboratory Aberdeen Proving Ground

10:55 a.m. Keynote Presentation Regency Ballroom E 10:55 Mr. Paul Du Bois “Simulation of Polymeric Materials in LS-DYNA®”

Consulting Engineer 11:45 a.m. Lunch – Sponsored by FEA Information Inc. Great Lakes Center

Monday June 9th

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1:00 p.m. Session 1 -- Crash / Safety (1) Marquis Ballroom

Session Chair: Y.C. Deng (General Motors Corporation) 1:00 Kang, S., Ford Motor Company Comparison of Hybrid III Rigid Body Dummy Models 1:25 Franz, U., DYNAmore GmbH Ideas on Applying Very Fine Models in Dummy Model Development 1:50 Kapoor, T., University of Windsor The Effect of using Rigid ISOFIX on the Injury Potential of Toddlers in Near-side Impact Crashes 2:15 Gromer, A., DYNAmore GmbH

WorldSID Dummy Model Development in Cooperation with German Automotive Industry 1:00 p.m. Session 2 -- Metal Forming (1) DeSoto Ballroom

Session Chair: Laurent Chappuis (Ford Motor Company) 1:00 Xu, D., Ford Motor Company

Application of Scrap Shedding Simulation in Stamping Manufacturing 1:25 Tang, A., Engineering Technology Associates, Inc. Visions and Latest Developments in DYNAFORM 1:50 Haufe, A., DYNAmore GmbH

Concepts to take Elastic Tool Deformation in Sheet Metal Forming into Account 2:15 Clarke, M., Continental Tool and Die

Sheet Metal Forming Simulation and Real World Tooling 1:00 p.m. Session 3 -- Simulation Technology (1) Pierce Arrow Suite

Session Chair: Ala (Al) Tabiei (University of Cincinnati) 1:00 Bhatti, A.Q., National University of Sciences & Technology NUST, Pakistan

A Numerical Investigation for Rock Fall Impact Behavior of Pithead of Tunnel with Falling Weight Impact Loading

1:25 Abu-Odeh, A., Texas Transportation Institute

Modeling and Simulation of Bogie Impacts on Concrete Bridge Rails using LS-DYNA® 1:50 Huang, Y., University of California at Berkeley

Coupling FE Software through Adapter Elements: A Novel Use of User-Defined Elements

Monday June 9th

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1:00 p.m. Session 4 -- Optimization (1) Stanley Steamer Suite

Session Chair: R.J. Yang (Ford Motor Company) 1:00 Müllerschön, H., DYNAmore GmbH

Statistics and Non-Linear Sensitivity Analysis with LS-OPT® and D-SPEX 1:25 Stander, N., Livermore Software Technology Corporation Metamodel Sensitivity to Sampling Strategies: A Crashworthiness Design Study 1:50 Li, G., IBM

Assessing the Convergence Properties of NSGA-ll for Direct Crashworthiness Optimization 2:15 Witowski, K., DYNAmore GmbH Visualization of Pareto Optimal Fronts for Multiple Objectives with D-SPEX 1:00 p.m. Session 5 -- Computing Technology Stearns Knight Suite

Session Chair: Alex Akkerman (Ford Motor Company) 1:00 Posey, S., Panasas, Inc. Novel HPC Technologies for Scalable CAE: The Case for Parallel I/O and File Systems 1:25 Makino, M., Fujitsu Limited

The Performance of 10-Million Element Car Model by MPP Version of LS-DYNA® on Fujitsu PRIMEPOWER

1:50 Shainer, G., Mellanox Technologies

Optimizing LS-DYNA® Productivity in Cluster Environments 2:15 Prince, T., Intel Corporation Intel® Cluster Ready Support for LS-DYNA®/MPP 2:40 Schreiber, O., SGI LS-DYNA® Performance Improvements with Multi-Rail MPI on SGI® Altix® ICE Clusters 3:05 p.m. Coffee Break – Sponsored by NEC Corporation of America Great Lakes Center

3:20 p.m. Session 6 -- Crash / Safety (2) Marquis Ballroom

Session Chair: Stephen Kang (Ford Motor Company) 3:20 Park, C.K., FHWA/NHTSA National Crash Analysis Center, The George Washington University

Simulation of Progressive Deformable Barrier (PDB) Tests 3:45 Asadi, M., Cellbond Composites Ltd.

New Finite Element Model for NHTSA Impact Barrier 4:10 Wood, P.K.C., University of Warwick

Modeling Self-Piercing Riveted Joint Failures in Automotive Crash Structures 4:35 Reid, J.D., University of Nebraska-Lincoln

Modeling Rebound of Foam Backed Racetrack Barriers

Monday June 9th

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3:20 p.m. Session 7 -- Metal Forming (2) DeSoto Ballroom

Session Chair: Robert E. Dick (Alcoa Technical Center) 3:20 Hu, Y., Chrysler, LLC

A Review of Sixteen Years of LS-DYNA® Application in Stamping Manufacturing Engineering at Chrysler, LCC

3:45 Grimes, R.G., Livermore Software Technology Corporation

Metal Forming Applications using Implicit Mechanics Features in LS-DYNA® 4:10 Borrvall, T., Engineering Research Nordic AB

Mortar Contact Algorithm for Implicit Stamping Analyses in LS-DYNA® 4:35 Benson D.J., University of California, San Diego

Preliminary Results for an Isogeometric Shell

3:20 p.m. Session 8 -- Simulation Technology (2) Pierce Arrow Suite

Session Chair: Christine Espinosa (Universite de Toulouse, ISAE) 3:20 Le Blanc, G., ITHPP – Drèle Ramp Wave Compression in a Copper Strip Line: Comparison Between MHD Numerical Simulations (LS-DYNA®) and Experimental Results (GEPI device) 3:45 Zhang, Y., The Ohio State University Numerical Simulation and Experimental Study for Magnetic Pulse Welding Process on AA6061-T6 and Cu101 Sheet 4:10 Medvedev, S.V., United Institute of Informatics Problems NAS of Belarus Influence of the Residual Welding Phenomena on the Dynamic Properties of a Two-Meter Long Tube with 64 Non-Symmetrical Brackets Welded on a Helical Path 4:35 Huang, Y., Livermore Software Technology Corporation Simulation of Acoustic and Vibro-Acoustic Problems in LS-DYNA® using Boundary Element Method 5:00 Rassaian, M., Boeing Phantom Works Structures Technology

Structural Analysis with Vibro-Acoustic Loads in LS-DYNA®

Monday June 9th

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3:20 p.m. Session 9 -- Impact Analysis Stanley Steamer Suite

Session Chair: Ronald L. Hinrichsen (RHAMM Technologies, LLC.) 3:20 Loikkanen, M., Boeing Commercial Airplanes

Simulation of Ballistic Impact on Composite Panels Element Simulation 3:45 Deka, L.J., The University of Alabama at Birmingham

LS-DYNA® Impact Simulation of Composite Sandwich Structures with Balsa Wood Core 4:10 Stamper, E., CAE Associates Inc.

The Use of LS-DYNA® Models to Predict Containment of Disk Burst Fragments 4:35 Lavoie, M-A., Laval University Application of the SPH Method for Simulation of Aerospace Structures under Impact Loading 5:00 Thatte, B.S., North Carolina A&T State University Studies on Behavior of Carbon and Fiberglass Epoxy Composite Laminates under Low Velocity Impact Loading using LS-DYNA® 3:20 p.m. Session 10 -- Pre/Post and Data Management Stearns Knight Suite

Session Chair: Larsgunnar Nilsson (Engineering Research Nordic AB) 3:20 Makropoulou, I., BETA CAE Systems S.A.

LS-DYNA® Impact Model Build-up: Process Automation with ANSA Data Management and Task Manager

3:45 Walker, B., Arup

Use of Simpleware Software for LS-DYNA® Analyses 4:10 Shetty, S.H., ESI Group Visual-Environment Integrated Pre and Post Environment for LS-DYNA®

4:35 Hörmann, M., CADFEM GmbH Using LS-DYNA® from ANSYS Workbench Environment 5:00 Thornton, M., Arup Automating Oasys PRIMER and Oasys D3PLOT using JavaScript 5:25 Ganesan, V., ESI Group

VisualDSS CAE Data Management and Decision Support System for Simulation Life Cycle Management

7:00 p.m. – 9:00 p.m. Conference Banquet – Sponsored by Intel and SGI Great Lakes Center Entertainment – Sponsored by IBM

Tuesday June 10th

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7:30 a.m. – 8:20 a.m. Continental Breakfast Sponsored by Arup Great Lakes Center

7:30 a.m. Registration Sponsored by Hewlett-Packard Company Great Lakes Center

8:00 a.m. – 4:00 p.m. Exhibition Great Lakes Center

8:25 a.m. Session 11 -- Crash / Safety (3) Marquis Ballroom

Session Chair: Venkatesh Agaram (Chrysler LLC) 8:25 Feng, B., Jaguar Cars and Land Rover

Gas Dynamic Simulation of Curtain Airbag Deployment through Interior Trims 8:50 Lian, W., General Motors Corporation

Benchmark Study on the AIRBAG_PARTICLE Method for Out-Of-Position Applications 9:15 Fukushima, S., Toyota Motor Corporation

Development of Finite Element Models of Restraint System for Injury Analysis in Side Impact 9:40 Shin, J., University of Virginia

Pelvic Response Investigation of Lateral Loading Conditions using Finite Element Models 8:25 a.m. Session 12 -- Metal Forming (3) DeSoto Ballroom

Session Chair: Yang Hu (Chrysler LLC) 8:25 Akarca, S.S., University of Windsor

A Smoothed-Particle Hydrodynamics (SPH) Model for Machining of 1100 Aluminum 8:50 Espinosa, C., Université de Toulouse, ISAE

Modeling High Speed Machining with the SPH Method 9:15 Neukamm, F., Daimler AG

On Closing the Constitutive Gap Between Forming and Crash Simulation 9:40 Imbert, J., University of Waterloo

Comparison Between Experimental and Numerical Results of Electromagnetic Forming Processes 8:25 a.m. Session 13 -- Simulation Technology (3) Pierce Arrow Suite

Session Chair: Matthias Hörmann (CADFEM GmbH) 8:25 Untaroiu, C., University of Virginia

A Finite Element Analysis of Mid-Shaft Femoral Tolerance under Combined Axial-Bending Loading

8:50 Kulkarni, H., Ford Motor Company

Assessment of Automotive Panel to Meet Handling Load Requirements: CAE Simulation 9:15 Perillo, M., EnginSoft SpA

Structural Dynamic Response of a Track Chain Complete Undercarriage System using Virtual Proving Ground Approach

9:40 Edara, R., ArvinMeritor Inc.

18 Wheel Truck Dynamic and Durability Analysis using Virtual Proving Ground

Tuesday June 10th

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8:25 a.m. Session 14 -- Optimization (2) Stanley Steamer Suite

Session Chair: Sharath Varadappa (Chrysler LLC) 8:25 Henchi, I., Livermore Software Technology Corporation

Material Constitutive Parameter Identification using an Electromagnetic Ring Expansion Experiment Coupled with LS-DYNA® and LS-OPT®

8:50 Goel, T., Livermore Software Technology Corporation

Influence of Selection Criterion on the RBF Topology Selection for Crashworthiness Optimization 9:15 Goel, T., Livermore Software Technology Corporation

Direct Multi-objective Optimization through LS-OPT® using Small Number of Crashworthiness Simulations

8:25 a.m. Session 15 -- Fluid/Structure Stearns Knight Suite

Session Chair: Mohammad Usman (Ford Motor Company) 8:25 Jackson, K.E., NASA Langley Research Center

Comparison of ALE and SPH Simulations of Vertical Drop Tests of a Composite Fuselage Section into Water

8:50 Del Pin, F., Livermore Software Technology Corporation

An Implicit Incompressible CFD Solver in LS-DYNA® for Fluid-Structure Interaction Problems 9:15 Aquelet, N., Livermore Software Technology Corporation

2D to 3D ALE Mapping 9:40 Zhang, Z.C., Livermore Software Technology Corporation

Using the New Compressible Fluid Solver in LS-DYNA® – CESE Solver and the Input File Setup 10:05 a.m. Coffee Break – Sponsored by ANSYS Great Lakes Center 10:25 a.m. Session 16 -- Simulation Technology (4) Marquis Ballroom

Session Chair: Chris Galbraith (MFAC) 10:25 Turton, N., University of Windsor

Numerical and Experimental Determination of Strains in the Vicinity of a Centrally Located Circular Discontinuity in AA6061-T6 Square Extrusions during Axial Crushing

10:50 Tarigopula, V., Norwegian University of Science and Technology

Influence of Element Formulation on the Axial Crushing of Thin-walled Dual-phase Steel Square Sections

11:15 Sakakibara, T., ITOCHU Techno-Solutions Corporation

A Study of Quasi-static Problem by SPH Method 11:40 Hörmann, M., CADFEM GmbH

FE-Applications in Aircraft Structure Analysis

Tuesday June 10th

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10:25 a.m. Session 17 -- Metal Forming (4) DeSoto Ballroom

Session Chair: Siguang Xu (General Motors Corporation) 10:25 Dick, R.E., Alcoa Technical Center

Effect of Material Characteristics on Wrinkling During Dome Forming of a Beverage Can using LS-DYNA®

10:50 An, H., University of Windsor Optimization and Sensitivity Analysis of Numerical Simulation of Tubular Hydroforming

11:15 Lu, H.S., Livermore Software Technology Corporation Forging and Extrusion Analysis with LS-DYNA® using 3D Adaptive EFG Method

11:40 Ulacia, I., University of Mondragon Influence of the Coupling Strategy in the Numerical Simulation of Electromagnetic Sheet Metal Forming

10:25 a.m. Session 18 -- Simulation Technology (5) Pierce Arrow Suite

Session Chair: John D. Reid (University of Nebraska – Lincoln) 10:25 Tabiei, A., Mason, Ohio, USA

Validation of Finite Element Crash Test Dummy Models for the Prediction of Orion Crew Member Injuries during a Simulated Vehicle Landing

10:50 Fasanella, E.L., NASA Langley Research Center Soft Soil Impact Testing and Simulation of Aerospace Structures

11:15 Tutt, B., Airborne Systems Development of an Airbag Landing System for the Orion Crew Module

11:40 Babu, S., Atomic Energy of Canada Limited

Drop Analysis of Waste Transfer Flask

12:05 Makino, M., Fujitsu Limited Tippe Top Simulation by LS-DYNA®

10:25 a.m. Session 19 -- Material Modeling Stanley Steamer Suite

Session Chair: Mohamed S. Hamid (Delphi Corporation) 10:25 Carney, K.S., NASA Glenn Research Center

A Heterogeneous Constitutive Model for Reinforced Carbon-Carbon using LS-DYNA® 10:50 Huang, Y., University of California at Berkeley

A Cyclic Damaged Plasticity Model: Implementation and Applications 11:15 Du Bois, P.A., Offenburg, Germany

The Influence of Permanent Volumetric Deformation on the Reduction of the Load Bearing Capability of Plastic Components

11:40 Xiao, X., General Motors Corporation

Simulation of Composite Tubes Axial Impact with a Damage Mechanics Based Composite Material Model

12:05 McGregor, C., The University of British Columbia

Simulation of Energy Absorption in Braided Composite Tubes through Axial Crushing

Tuesday June 10th

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10:25 a.m. Session 20 – Penetration/Blast Stearns Knight Suite

Session Chair: William Ng (U.S. Army ARDEC) 10:25 Lou, K.A., ArmorWorks

Finite Element Modeling of Preloaded Bolt Under Static Three-Point Bending Load 10:50 Toussaint, G., Defence Research and Development Canada – Valcartier

Finite Element Simulation using SPH Particles as Loading on Typical Light Armoured Vehicles 11:15 Nilakantan, G., University of Delaware

Novel Multi-scale Modeling of Woven Fabric Composites for Use in Impact Studies 11:40 Schwer, L.E., Schwer Engineering & Consulting Services

Simple Input Concrete Constitutive Models: An Illustration of Brick Wall & Concrete Cylinder Perforation

12:30 p.m. Lunch – Sponsored by FEA Information Inc. Great Lakes Center 1:45 p.m. Plenary Session -- Technology Today Great Lakes Center

Session Chair: Sharan Kalwani (General Motors Corporation) 1:45 IBM

1:55 Intel Corporation and SGI

2:05 Microsoft Corporation

2:15 Engineering Technology Associates, Inc.

2:25 Hewlett-Packard Company

2:35 Arup

2:45 Sun Microsystems

2:55 ANSYS

3:05 Evergrid, Inc.

3:15 NEC Corporation of America

3:25 TASS Americas 3:45 p.m. Coffee Break – TASS Americas Great Lakes Center

4:00 p.m. Keynote Presentation Great Lakes Center John O. Hallquist “LS-DYNA Development” President, LSTC

Closing Remarks: Wayne L. Mindle, LSTC

Thank you for your participation!

10th International LS-DYNA® Users Conference - June 8-10, 2008 Page 15

Post-Conference Training Seminars June 11th & 12th

Seminars are conducted at the Registration Opens at 8:30 a.m.

9:00 a.m. – 5:00 p.m. (Lunch is provided)

Advanced Crashworthiness Paul A. Du Bois

ALE/Eulerian Fluid/Structure Interaction Mhamed Souli, Ph.D.

Heat Transfer Analysis with Hot Stamping Applications Arthur Shapiro, Ph.D.

Implicit Analysis Ala Tabiei, Ph.D.

LS-OPT® Nielen Stander, Ph.D.

LS-PrePost® Philip Ho

Advanced Training in Stamping Simulation

Xinhai Zhu, Ph.D. Jeanne He, Ph.D.

Page 16 10th International LS-DYNA® Users Conference - June 8-10, 2008

Copyright © 2008 Livermore Software Technology Corporation. All Rights Reserved. LS-DYNA®, LS-OPT® and LS-PrePost® are registered trademarks of Livermore Software Technology Corporation. All other trademarks, product names and brand names belong to their respective owners.