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The STAR Pixel Upgrade

H. WiemanHeavy Quark WorkshopLBNL1-Nov-2007

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topics

Pixel silicon Readout

STAR telescope tests Mechanical Integration in STAR Pixel mechanical

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Some pixel features

Pointing resolution (13 12GeV/pc) m

Layers Layer 1 at 2.5 cm radiusLayer 2 at 8 cm radius

Pixel size 30 m X 30 m

Hit resolution 8.7 m

Position stability 10 m

Radiation thickness per layer

X/X0 = 0.28%

Beam pipe radiation thickness

X/X0 = 0.14%

Number of pixels 164 M

Integration time (affects pileup) 0.2 ms

Rapid installation and replacement

Reproducible positioning

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Silicon program

IReS/LEPSI IPHC (Strasburg)

M. Winter

C. HuC. ColledaniW. DulinskiA. HimmiA. ShabetaiM. SzelezniakI. Valin

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Grzegorz Deptuch

MIMOSTAR 2/3 technology

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IPHC Functional Sensor Development

Data Processing in RDO and on chip by generation of sensor.

The RDO system design evolves with the sensor generation.

•30 x 30 µm pixels•CMOS technology•Full Reticule = 640 x 640 pixel array

Mimostar 2 => full functionality 1/25 reticule, 1.7 µs integration time (1 frame@50 MHz clk), analog output. (in hand and tested)

All sensor families:

Phase-1 and Ultimate sensors => digital output (in development)

SensorPixels

AnalogSignals ADC /

Disc.CDS

DataSparsification

RDOto

DAQ

Mimostar sensors

Phase-1sensors - 640 us integration time

Ultimate sensors - < 200 us integration time

Leo Greiner

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Phase 1 / Ultimate technology (MIMOSA8/16/22)

forwardbias diode

Discriminator

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IHCP Marc Winter et al

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IHCP Marc Winter et al

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IHCP Marc Winter et al

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IHCP Marc Winter et al

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Silicon summary, development of STAR pixels

Understand MIMOSTAR 3 yield issues Fab Phase 1 based on MIMOSA16/22 technology (digital output,

no zero suppression) Fab Ulitimate based on MIMOSA16/22 and SUZE technology

(digital with zero suppression)

Issues Dead center MIMOSTAR 3

Pursue large area gate oxide hypotheses, change layout Radiation hardness (bulk damage)

Reduce temperature Investigate silicon improvements

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Readout program

LBNL

Leo Greiner

Xiangming SunMichal SzelezniakThorsten StezelbergerChinh VuHoward Matis

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Prototype 3 Sensor Telescope

Our goal was to test functionality of a prototype MIMOSTAR2 detector in the environment at STAR in the 2006-2007 run at STAR. We obtained information on:

Charged particle environment near the interaction region in STAR. Performance of our cluster finding algorithm. Performance of the MIMOSTAR2 sensors. Functionality of our tested interfaces to the other STAR subsystems. Performance of our hardware / firmware as a system. The noise environment in the area in which we expect to put the final PIXEL detector.

Stack of 3 MIMOSTAR2 pixel chips, Chip dimension: 4 mm X 4mm, 128 X 128 pixels

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Telescope Infrastructure at STAR

Magnet Pole Tip

Insertion tube

Electronics Box

Beam Pipe

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On the fly cluster finding first used with MIMOSTAR analog chips

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Telescope DAQ

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Distribution of track angles in Mimostar2 telescope

Xiangming SunMichal Szelezniak

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RDO Board(s)

New motherboard

Two board System – Virtex-5 Development board mated to a new HFT motherboard

Xilinx Virtex-5 Development Board

•Digital I/O LVDS Drivers•4 X >80 MHz ADCs•PMC connectors for SIU•Cypress USB chipset•SODIMM Memory slot•Serial interface•Trigger / Control input

•FF1760 Package•800 – 1200 I/O pins•4.6 – 10.4 Mb block RAM•550 MHz internal clock

Note – This board is designed for development and testing.Not all features will be loadedfor production.

Leo Greiner

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1 m – Low mass twisted pair

3 m - twisted pair

System Design – Physical Layout

Sensors, Ladders, Carriers(interaction point)

LU Protected Regulators,Mass cable termination

RDO Boards DAQ PCs

Magnet Pole Face(Low Rad Area ?)

DAQ Room

PowerSupplies

Platform

30 m

100 m - Fiber optic cables

Leo Greiner

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Data Rates - Parameters

Rates as per Jim Thomas, L = 3 x 1027 for Phase-1, L = 8 x 1027 for Ultimate.

2.5 hits / cluster. 1 kHz average event rate. 10 inner ladders, 30 outer ladders. Factor of 1.6 for event format overhead (can be lowered). No run length encoding.

61.5 6.0

157.0 15.0

R = 2.5 R = 8.0

200 us

640 us

Hits / Sensor at L = 8 x 1027.

IntegrationTime

Radius

Leo Greiner

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Data Rates

Ultimate => 49.7 MB / s raw addresses. => 79.5 MB / s data rate.

Phase–1 => 59.6 MB / s raw addresses => 95.4 MB / s data rate.

The dead-time is primarily limited by the number of externally allocated readout buffers!

Leo Greiner

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Mechanical Program

Eric Anderssen, LBNL engineer working on ATLAS pixels is phasing into our pixel program – full time in January 2008 (carbon composite expert)

Contracted ARES company for analysis on cooling, precision mount design and refinement of ladder stability. Phone meetings weekly First results –

we will need a sub ambient cooling system simplified precision mount

First stage report due in January

Addressing two items: Cylinder modifications for integration of GEMS, IST and Pixels Pixel mechanical design

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Cut Apart Current Cones August 2009

Old East Cone and most of Beams to be reused to support New West Cone

Old West cone refurbished into New East Cone in Berkeley Cut Carbon Elliptical Beams avoiding Al Insert

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Send to BerkeleyKeep at Brookhaven

Eric Anderssen

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Modified East Cone and Install with New West Cylinder

View as Temporary Fix—Should be ACAP (as cheap as possible) Supports end of New West Cone/FGT Replicates Old Beam Pipe Interfaces Includes SSD if required Only for summer ’09 to ‘10

Wholly Machined/Bonded Solution Tooling to locate Buck Plate while bonding is

required…Buck Plate aimed forEasy Swap of replacement

Some Tooling Required…

~1.5m

Eric Anderssen

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Goal—Swap-in Replacement and Install pixels – summer 2010

Should BeSame Length

New East Cone with Cylindrical Shell made from Old West Cone

Swap in by matching Bolted Interface to New West Cone…

ModificationWill Take UpLength…

Include SSD interface On Shell

Eric Anderssen

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ISC fits inside and is supported by the cone

ISC supports IST on outsideISC ISC supports pixel and beam pipe inside

Inner Support Cylinder (ISC)

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Pixel support structure – changes and progress

2.5 cm radius

8 cm radius

Inner layer

Outer layer

End view

ALICE style carbon support beams (green)

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cable bundle

connection type number of pairs allocated pair diameter

Analog power 1 6mm

Digital power 1 6mm

signal 40 .64mm

sync 1 .64mm

clk 1 .64mm

marker 1 .64mm

Jtage (5 conductors) 3 .64mm

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Conceptual mechanical design

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Pixel placement concept

Detector assembly slides in on rails Parallelogram hinges support the two detector halves while sliding Cam and follower controls the opening of the hinges during insertion

and extraction Detector support transfers to kinematic dock when positioned at the

operating locationpixel support hinges

spring loaded cam followers and linear cam

slide rails

sliding carriage

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Hinge analysis

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Two sector patch installation – summer 2010

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Final installation, complete cylinders Aug 2011

End

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yearly dose numbers

Au + Au RHIC II luminosity: 7X1027 1/(cm2 sec) Weeks per year operation: 25 Fraction of up time: 60% radius: 2.5 cm

pion dose: 73 kRad UPC electron dose: 82 kRad Total dose: 155 kRad TLD measured projection: 300 kRad

radius: 8 cm pion dose: 7 kRad UPC electron dose: 2 kRad Total dose: 9 kRad TLD measured projection: 29 kRad

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Grzegorz Deptuch

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MIMOSA8, Yavuz Degerli et al IRes/LEPSI DAPNIA/SEDI