1 Spring 2013/V0.1 Senior Design: A Hands-on Experience with The Engineering Process This is an...
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Transcript of 1 Spring 2013/V0.1 Senior Design: A Hands-on Experience with The Engineering Process This is an...
1Spring 2013/V0.1
Senior Design: A Hands-on Experience with The Engineering Process
This is an iterative process
Problem
Design Constraints
Test Specification
Design
SimulationTest Verification
Prototyping
Test Verification
Hardware Implementation,
Design Refinement, packaging
Test Verification
Design IIDesign I
2Spring 2013/V0.1
• Problem: recognize that a problem exists, and develop a concise statement of the problem.
• Objectives: study the parameters of the problem, and convert them into engineering language you are familiar with.
• Literature Survey: assimilate existing knowledge about the problem, and search for similar data (related experiments, evaluations, etc.)
The Engineering Process
a design methodology . . .
3Spring 2013/V0.1
• Analysis: analyze the problem based on the knowledge gained from the literature survey, produce a set of design constraints, and generate test specifications to verify these design constraints.
• Synthesis: manipulate the analysis to yield a family of solutions (typically through simulation and prototyping).
• Evaluation: choose the best solution and verify it meets the design constraints.
• Presentation: communicate the solution to your peers/management.
The Engineering Processa design methodology continued . . .
4Spring 2013/V0.1
Design I Structure• Lectures: Meets once a week
– Thursdays for Design I lectures, some weeks Tuesdays for Entrepeneurship lectures
– Lectures on team building, planning, software design, design document
• Assignments:
– Writing assignments for design document in conjunction with GE 3513 tech writing
– Website (see syllabus)
• Presentations: mid-term, end-of-semester
Must demonstrate working prototype of project at end of semester!!
5Spring 2013/V0.1
Design I Structure (cont.)
• Grading: Design Document, presentations, weekly deliverables, peer reviews, web site, advisor input, etc (see syllabus)
– Team members do not necessarily all get the same grade!
– Custom grading forms for each team/presentation
• Funding: Donations and other funding
– Ryan Green will handle this, $200 per team
• Lab Space: Room 311, shared by Senior Design I & II
• Conference Room: Simrall 206
6Spring 2013/V0.1
Success in Design 1 is Up to You!• Progress on technical goals is entirely up to the
team– Faculty advisor is not a task master – only “advises”– The team sets the weekly goals, measures weekly
progress
• Many projects require you to explore new technologies on your own initiative– Welcome to life-long learning! – Take advantage of all possible resources
7Spring 2013/V0.1
Design I Pitfalls• Design I is the critical semester
– Design II difficulty depends on Design I success• Pitfalls
– Poorly specified goals, constraints for project• Much time spent in semester beginning on this!!!
– Poor implementation choices for key technical aspects• Spend time on tradeoff analysis, survey of
alternatives!– Lack of weekly progress
• Schedule a weekly meeting with your faculty advisor NOW.
• Make REAL progress – connect wires, write code!– Malfunctioning teams (more on this later)
8Spring 2013/V0.1
Design I Complaints• Believe it or not, we do listen to you!
– Increased from 1 hour to 4 hours spread over two semesters
– Integrated Design I writing with Tech Writing
– Added lab/meeting space reserved for Senior Design
• Common complaints
– “Too much work for too little credit”
• Design takes time – get used to it
• Work smarter to reduce effort by using faculty, expert resources
– “Why do we have to do assignment X? Just let us do our design!”
• Planning, documentation, oral communication – all are a real part of design!!!
9Spring 2013/V0.1
Planning Your Project
• Phase 1 – System definition
– Specifications and Features
– Physical Interface
– Subsystem definition and investigation of alternatives for each subsystem
• Phase 2 – Design/test of individual subsystems
– Requires prototyping of different subsystems, perhaps even prototyping of different alternatives. Do not be surprised when something that you assumed turns out not to be true, requiring you to backtrack!
– agreement between team members on how subsystems will interact
• Phase 3 – Subsystem integration
– Connecting subsystems together and getting them to work correctly takes time!
10Spring 2013/V0.1
Writing Assignments vs. Project Development
• The writing assignments LAG the project development
– Your project development should be well ahead of the writing assignments, as the due dates for the writing assignments are spread out without regard to project development.
• Having the project development ahead of the writing assignments make the writing assignments easier, since you have something to write about!
– Writing up the different alternatives for a subsystem will be easy since you have already had actual experience with the subsystems.
11Spring 2013/V0.1
Pitfalls in Project Development• Do not assume that a circuit you find via Google will work the way that it is
documented.
– Until you build it yourself, you know nothing.
– Understand the circuit! Simulate in Pspice if that is an option!
– If it is an analog circuit, when you integrate it with other components (like a microprocessor), it may quit operating.
• Read the datasheet!!!!!!
– If the datasheet specs are unsuitable, then don’t waste your time.
• Consider packaging – if the part is only available a surface mount package, it will be harder to prototype with.
• If a design has a lot of components, consider using a PCB from the start since breadboard wiring will drive you crazy.
• Order spare parts so that if something breaks, you will have a backup.
12Spring 2013/V0.1
Pitfalls in Project Development (cont)
• Be careful how you divide the labor
– The best way is to divide it by subsystem, with lots of communications between the team members on how the subsystems interact
• In a hardware subsystem that has a microcontroller, you cannot divide the software development and the external hardware development between multiple people
– Software is needed to drive the hardware, and the software creator needs an intimate understanding of the hardware.
– You can divide it by functionality which combines hardware+software (Joe will handle the LCD code and LCD interfacing, Sally will handle the DAC code and DAC interfacing).
• Everybody must contribute technically. You cannot have somebody whose only job is the web page or documentation!
13Spring 2013/V0.1
Assign. #1: Product Specification• One page• Contains Applications, Features, Specifications
– Applications: how can this be used?– Features: what can it do?– Specifications: quantitative measures of what it can
and cannot do, requirements for use
• Visually appealing, tells all in one page– Contains one or more graphics of product itself and
usage of product in typical scenarios
• Post this on your web site (use .pdf files)
14Spring 2013/V0.1
Example Specifications• Signal tolerances (> 30% duty cycle clock at 1MHz +/-1%)
• Supply current range (.5 mA min to 100 mA max)
• Power efficiency (83% supply efficiency at rated load)
• Speed, Response time (interrupt service latency < 10 S)
• Conversion rate (12-bit conversion at 500Ksamples/sec)
• Transmission distance (100 M with unobstructed view)
• Quantization error (+,- 5mV)
• Frequency response (20 Hz to 20 KHz, +/- 3 dB)
• Signal-to-noise ratio (50 dB min)
• Power requirements (7 to 12 V DC)
• Environmental (functions in range of -25 C to +125 C)
• Limitations (requires Windows XP or later)
• Battery life (battery lasts for 20 hours of constant use)