1 ProductsQualityLogisticsHistoryWhy NIC | “NIC Components” Corporation Has Established a...

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Products Quality LogisticsHistory Why NIC

www.niccomp.com | www.LowESR.com

“NIC Components” Corporation Has Established a Reputation for Supplying

Quality Products and Best-in-Class Service for Over 20+ Years

We Supply Electronic Components That Meet the Demands of Today's

Cutting-edge Technology

We Offer Multiple Component Solutions, Developed to Aid Our Customer's in Design and Production of Products With

More Features, in Smaller and Less Expensive Formats

Our Global Systems Allows Us to Easily Support and Manage Multiple Location Builds

Why customers prefer NIC:

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NIC Components Corporation [ ™], in association with Nippon Industries Co. Ltd is a designer, manufacturer and worldwide supplier of passive components.

• Established in 1975 as a manufacturer of aluminum electrolytic capacitors, NIC has developed into a major supplier of capacitors, resistors, magnetics and specialty products.

• Using Nippon Industries' manufacturing and design expertise, a select group of specialized factories was recruited to augment our core products and add complimentary products to our expansive line.

• NIC's expertise and diligence in selection and integration of quality fabs is world-renowned. Long-term supplier relationships (averaging over ten years) have been fostered by shared strategy and partnering management teams.

• Quality is our number one commitment. Every step, from component design to raw material selection, manufacturing processing to final inspection is meticulously controlled.

1975 1982 1990 1996 1998

Nippon Industries Company - Japan

“NIC”

NIC Components Corp. (North America)

NIC West (San Jose)

NIC Eurotech(Europe)

NIC Asia(SE Asia)

2000~2002

NIC Regional Sales Offices

• Pacific North West• South East• Southern California• Canada

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Why NIC? Advantages of the NIC Fab-less Model:

NIC’s hybrid model combines strengths of both a direct manufacturer and a global distributor

• Advantage to Factories

• Advantage to NIC

• Advantages to NIC’s Customer’s

NIC Advantages: Global Logistics

SADU - Strategic Account Development Unit

Useful 24-7 Web-tools

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NIC FAB-LESS MODEL PROVIDES FACTORIES WITH: GLOBAL SALES, MARKETING AND LOGISTICS REACHING DIVERSE CUSTOMER BASE PACKAGED COMPONENT OFFERING TECHNICAL COLLABORATION ADDITIONAL LEVEL OF QUALITY INSPECTION & CONTROL STABLE PRODUCTION REQUIREMENTS FINANCING

NIC FACTORY NETWORK

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STRATEGIC FACTORIES PROVIDE NIC WITH: COMPETITIVE MANUFACTURING COSTS

CONSISTENT ALLOCATIONS

SPECIALIZED PRODUCT CONCENTRATION

FLEXIBLE PRODUCTION

QUICK TURNAROUND

NIC FACTORY NETWORK

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“SELECT” CUSTOMER CONCENTRATION

EXTENSIVE OFFERING OF PASSIVE COMPONENTS

SEAM-LESS GLOBAL LOGISTICS

GLOBAL ENGINEERING SUPPORT

TECHNOLOGY LEADER

COMPETITIVELY PRICED COMPONENTS

NIC OFFERS IT’S CUSTOMERS

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SADU Strategic Account Development Unit

EBN (02/19/99) [ SADU INFO PAGE ]

New NIC unit to provide local service to CEMS

NIC Components Corp. has created a new Strategic Global Accounts business unit (SADU - Strategic Account Development Unit) at its Melville, N.Y., headquarters in a continuing effort to position itself as a global supplier to contract-manufacturing customers. Creation of the business unit was prompted by the fact that major CEMs such as Celestica, Jabil, SCI, and Solectron are building manufacturing facilities all over the world to support their local markets, according to Richard Schuster, president of the passive-component supplier. They are demanding local stocking facilities to meet their just-in-time deliveries and demand-pull inventory requirements, he added.By offering a global-logistics solution to inventory management, as well as global sales and technical support, Schuster believes that the midsize company can effectively compete with some of its larger competitors…

[ more ]

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SADU Team Members Support Multi-National CEMs & OEMs

Provide Global Logistics Support

Material Management Control of Inventory Levels

Product Bonding

Auto Replenishment Programs

Consignment Inventory Programs

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SADU Team Members Activities:

Tracking Requirements of Multi-location Builds

Assuring Local Inventory Is Available

Consolidating Item Orders From Multiple Locations

Daily Interface to Support Critical Need Items


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SADU Strategic CEM / ODMs Jabil FoxConn SCI-Sanmina Solectron Flextronics Celestica SMTC Cisco HP – Compeq nVIDIA Dell EMC Symbol Technologies Lucent Technologies Mars Motorola Matrox Tivo

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www.niccomp.com

On-Line Cross Referencing

On-Line Stock Check

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www.lowESR.com

Premier WebsiteFocused on Low ESR Capacitor

Solutions: Materials, Technologies, Specs,

Performances Data, Comparisons, Technical Articles

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www.lowESR.com

On-Line Comparison Tables

Review & Select Low ESR Capacitors

by Cap, VDC, Type, Size, ESR, RCR and Price

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NIC Products SURFACE MOUNT COMPONENTSCapacitors: » Aluminum Electrolytic Capacitors » Ceramic Capacitors: Chip - Array - IPC » Film Capacitors » Tantalum Electrolytic Capacitors » Low ESR Electrolytic Capacitors

Resistive Products: » Thick Film Chip - Array - IPC » NTC Thermistors

Magnetics: » Inductors » Ferrite Beads

Diodes & Circuit Protection: » Silicon Rectifier Diodes » Schottky Barrier Diodes » Varistors (MLV)

NEW! Lead-Free Products

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NIC Products

LEADED (TH) COMPONENTSCapacitors: » Aluminum Electrolytic Capacitors » Ceramic Capacitors » Film Capacitors » Tantalum Electrolytic Capacitors

Resistive Products: » Film Resistors » Networks


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Cutting Edge Technology Ultra-Low ESR Capacitors: Solid Aluminum E-Caps


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Cutting Edge Technology Ultra-Low ESR Capacitors: Solid Aluminum E-Caps


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Cutting Edge TechnologyLow ESR Capacitors: Hybrid Electrolyte Aluminum E-Caps


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Cutting Edge TechnologyLow ESR Capacitors: Polymer Cathode Tantalum E-Caps


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Cutting Edge TechnologyLow ESR Capacitors: High Capacitance & High Frequency MLCCs


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Cutting Edge TechnologyHigh Frequency (Wireless) Design Components


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Cutting Edge TechnologyUltra-Small (0201) Components

» MLCC Capacitors » Chip Inductors» Chip Resistors


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Passive Component UpdateTopics:• Market• Technology • Production • Material Issues

New & Redesign RecommendationsNew Products

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Sources:

Nippon Industries Company Ltd (Japan)

NIC Components Corp. (Taiwan)

Paumanok Publications, Inc Leading passive component market analysts… & publishers of

Passive Component Industry Magazine

Bi-monthly look at the passive component market and technology www.paumanokgroup.com/

Reed Electronics Research www.rer.co.uk

Electronic Buyer News (EBN) www.ebnonline.com

Electronic Component News (ECN) www.ecnmag.com

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Changing Technology Impact Passive Devices

Technology Innovations

Lower voltage of operation = increased circuit current = higher demands on voltage - power management circuitry = tighter line regulation (reduce ripple) = lower ESR capacitors

Faster circuit speeds = reduced response time for voltage - power management circuits = energy from capacitor bank

Higher frequency operation = reduced trace distances = better performing & smaller devices All impact signal & supply voltage integrity

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Development of Passive Components

Passive component research & development:

New & Improved Materials- improve characteristics - reduce costs

Improved Processing & Equipment - expanded available range- increased production- reduced components sizes

InductorsResistorsCapacitors Ferrite Beads

Thermistors

Varistors

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MULTILAYER CERAMIC CHIP CAPACITORS : Materials Shift

Electrodes (PdAg or BME- Base Metal: Nickel)

BME

Pd-Ag

2002 Estimates: 80% of global MLCC production is BME

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MULTILAYER CERAMIC CHIP CAPACITORS : Developments

Nickel electrodes = reduced component costs

– Greater equipment (firing) costs

Increased number of layers [ >100 layers ]

1uF and above = very low ESR [ sub 0.010ohm @ 100KHz)

X7R (-55 ~ +125) & X5R (-55 ~ +85) = ±15% Cap change

Encroaching upon tantalum electrolytic range

100uF / 6.3VDC [1210 in X5R & Y5V TCs]

Thinner dielectric layers = lower voltage ratings

– Voltage-coefficient effects

– Aging effects & piezo-electric noise

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MULTILAYER CERAMIC CHIP CAPACITORS

MLCC Market:Year 2000 was record year (~30%* growth to $5.6Billion; source

RER) for MLCC industry with demand exceeding supply and prices inching up. Demand disappeared in 2001, with producers running at reduced capacity. During year 2000 crunch many producers added considerable production expansion equipment. Supply should meet all demands through year 2002 & 2003. Pricing has eroded due to over supply and reduced costs of raw materials (BME vs. Pd-Ag).

MLCC expansion has been focused on BME (Base Metal Electrode; nickel) construction for X7R and Y5V as opposed to Pd-Ag electrode construction. NPO will remain Pd-Ag (although with reduced Pd loading).

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Case Size 2002 2003

0201 6KK 20KK

0402 400KK 600KK

0603 550KK 650KK

0805 200KK 200KK

1206 55KK 50KK

> 1206 15KK 15KK

Cap Arrays 5KK 20KK

TOTAL = 1230KK 1555KK

NIC Monthly Capacity by Case Size

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NMC Series: 0201 size MLCCsUltra Small Ceramic Chip Capacitors

L x W x H = 0.6 x 0.3 x 0.3mm NPO

10V / 16V / 25V / 50V 0.47 ~ 100pF P/N: NMC0201NPOxxx

X7R 16V / 25V / 50V 39pF ~ 3300pF NMC0201X7Rxxx

Applications:Ultra-Small for Hand Held – Embedded Device

Precautions:Solder Paste & Placement Issues

X5R & Y5V 10V 1200pF ~ 0.01uF NMC0201X5Rxxx

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NMC Series: MLCCsCeramic Chip Capacitors 0201 sizeNPO = (101) 100pF / 25VDCX7R = (332) 3300pF/16VDCX5R = (103) 0.01uF/10VDC

0402 sizeNPO = (471) 470pF / 16VDC» New! X7R = (104) 0.10uF/10VDCX5R = (104) 0.10uF/10VDCY5V = (474) 0.47uF/6.3VDC

0603 sizeNPO = (152) 1500pF / 25VDCX7R = (224) 0.22uF/10VDCX5R = (105) 1.0uF/16VDCY5V = (105) 1.0uF/10VDC

0805 size NPO = (472) 4700pF / 25VDCX7R = (105) 1.0uF/16VDCX5R = (475) 4.7uF/6.3VDCY5V = (474) 4.7uF/16VDC 1206 sizeNPO = (103) 0.01uF / 25VDCX7R = (225) 2.2uF/16VDCX5R = (226) 22uF/6.3VDC Y5V = (226) 22uF/10VDC

1210 sizeNPO = (103) 0.01uF / 50VDCX7R = (106) 10uF/10VDCX5R = (476) 47uF/6.3VDC New! X5R = (107) 100uF / 6.3VDCNew! Y5V = (107) 100uF / 6.3VDC

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NMC-L Series:Low ESR NPO Ceramic Chip Capacitors 0402, 0603, 0805 O.5 ~ 150pF Low ESR up to 1GHz

Ultra-Stable High Frequency Ceramic Chip Capacitors NIC, has added a new range of low ESR multilayer ceramic chip capacitors. NMC-L series is ideally suited to high speed, high frequency applications such as those found in Bluetooth and Wi-Fi (IEEE 802.11b) products. Manufactured using ultra stable, low loss NPO/COG dielectric, the devices are available with values ranging from 0.5pF to 150pF. Both 50V dc and 100V dc rated parts are available. Supplied in tape and reel packaging, the NMC-L range is compatible with both re-flow and flow soldering processes.

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Transition away from larger (>0805) sizes

Use 0603 and 0402 on new and redesigns as much as possible

– Smaller sizes have best availability and lowest costs going forward

Be aware and plan for possible future P&D issues with:

– Larger (>0805) sizes

– Higher voltage parts (>100VDC)

– High capacitance (high Pd content) NPO

MULTILAYER CERAMIC CHIP CAPACITORS : Recommendations

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SMT TANTALUM ELECTROLYTIC CAPACITORS

Market :Year 2000 was record year (~50% growth from 1999* *source RER) . High industry demand, with long lead times and pricing increases. Since December 2000 standard construction (MnO2 cathode) capacitors demand has dropped significantly. Industry over-stock and reduced demand has resulted in lower pricing. Technology:NEW Reduced case sizes low voltage 2.5VDC ~ 16VDC

- 0603 (J) [ 1.0 ~ 10uF] - 0805 (P) [ 0.33 ~ 33uF ]

CASE SIZE 2001 (Units) 2002 (Units)

2,000,000 4,000,000

A 10,000,000 15,000,000

B 10,000,000 15,000,000

C 5,000,000 6,500,000

D/E 5,000,000 6,500,000

Total: 32,000,000 47,000,000

P & J

MONTHLY CAPACITY

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SMT TANTALUM ELECTROLYTIC CAPACITORS

STEPS PROCESS 1 Powder Mixing Tantalum Powder 2 Pressing Tantalum Wire 3 Vacuum Sintering 4 Pellet Assembly 5 Oxide Film Formation Forming Liquid 6 Manganese Dioxide or Polymer Cathode Formation 7 Graphite Baking Graphite 8 Conductive Layer Formation 9 Anode/Cathode Connection

10 Silver Paste 11 Lead Frame 12 Conductive Adhesive 13 Molding Resin 14 Marking Ink 15 Burn-In 16 Lead Forming 17 Inspection

$250 / Lb ~30%of Unit Cost$200 / Lb ~3% of Unit Cost

Primary raw materials account for

~33% of Unit Cost

Source: PCI 11/12-2000

Cathode Materials:MnO2 – Standard & reduced ESR

PPY - Polypyrrole (Low ESR)

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LOW ESR POLYMER CATHODETANTALUM ELECTROLYTIC CAPACITORS

Market & Technology: Use of POLYMER in place of MnO2 for CATHODE results in low ESR, high ripple current ratings (RCR) and suppression of combustion (will not support flame) under failure. Applications in high density low voltage – high current power management designs. Larger sizes C & D/V cases continue to be popular. Expansion will cover all sizes P ~ D/V. New NTP series parts developed include lower ESR 0.025-ohm products, and we will achieve 0.015 ohm.

Polymer Cathode SuppliersNIC NTPKemet T520 "KO- Cap"Tokin- NEC PSL "NeoCap"Sanyo TP "PosCap"Nichicon F55

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Niobium Electrolytic Capacitors

Niobium is one of the alternatives being considered to replace tantalum in capacitors. Estimates, niobium is over 100 times more plentiful than tantalum (less than 1/10th the cost). NIC’s NBP series has same construction as conductive polymer cathode tantalum (NIC NTP Series). It is anticipated that in the future, niobium capacitors will be used for high-capacity devices (up to 1000µF), which are too costly to produce using tantalum.

NIC’s niobium capacitor at a glance Specifications:Rated Voltage 2.5VCapacitance 220uFSize (D) 7.3 x 4.3 x 2.8mmESR 0.055ohmsPart Number NBP series (specifications in development)

Production On-Hold

NEW TECHNOLOGY COMPONENTS:New Product

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Nb92.90638

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Use SMT tantalum aluminum electrolytic capacitors: when small size is required when low profile (low head-row) is needed where long life at high temperature operation (>+65°C) is needed where operation voltage is tightly regulated:

protected from transients, over-voltage or reverse voltage when looking to replace leaded electrolytic capacitors when high speed placement are needed when flow – wave soldering compatibility is needed

SMT TANTALUM ELECTROLYTIC CAPACITORS:Recommendations

Today SMT tantalum electrolytic capacitors are available in: Low ESR – Polymer Cathode and MnO2 Cathode Types Reduced 0603 (J) & 0805 (P) case size Capacitance values to 470uF (2VDC)

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SMT ALUMINUM ELECTROLYTIC CAPACITORS:

Market - Technology:SMT aluminum electrolytic types have led (and will continue to lead) in high demand. Useful as alternates to chip tantalum in many applications, and at lower cost has fueled growth – acceptance industry wide. No raw material – production issues are expected to impact this product type. Lower unit pricing expected over time as non-Japanese manufactures accelerate production.

Focus (chiefly solid electrolyte types) in development of lower ESR – Z types for lower voltage – higher current power management applications. Introduction of larger case sizes has allowed higher capacitance values and high voltage rated versions, as replacement for leaded & snap-in types.

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Case Diameter 2002 2003

3mm 1KK 2KK

4mm 30KK 37.5KK

5mm 8.5KK 10KK

6.3mm 18KK 21.5KK

8mm 10KK 12.5KK

10mm 3.5KK 4KK

12.5mm & larger 2.2KK 3.2KK

TOTAL = 73.2KK 90.7KK

NIC Monthly Capacity by Size

SMT ALUMINUM ELECTROLYTIC CAPACITORS:

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SMT Low ESR ELECTROLYTIC CAPACITOR COMPARISON:

also see www.lowESR.com

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POLYMER CATHODE

TANTALUM

TYPE: SMT V-ChipPlastic Molded SMT Flat Chip Radial Lead SMT V-Chip Radial Lead

Plastic Molded SMT Flat Chip

ELNA PV - - - - - - - - - - - - - - -

FUJ ITSU - - - - - - FP-RE - - - - - - - - -

KEMET - - - AO-CAP - - - - - - - - - KO-CAP

NIC Components Corp.

NSPZ NSP NSPZR NSPE NSPER NTP

NICHICON NA - - - SEP - - - - - - F55

PANASONIC SPV SP - - - - - - - - - - - -

SANYO SVP - - - SEP - - - - - - POSCAP

UCC- NIPPON CHEMICON

PXA PT PS - - - - - - - - -

SOLID ALUMINUMHYBRID ELECTROLYTE

ALUMINUM

Many E-capacitor suppliers have developed low ESR capacitors…

NIC offers the most options – design choices…

SMT Low ESR ELECTROLYTIC CAPACITOR COMPARISON:

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Use SMT aluminum electrolytic capacitors: when low cost is needed (lowest cost per uF of SMT types)

when high voltage (>20VDC) rating (or no de-rating is possible) is required when >470uF is required (values to 6800uF in SMT Alum V-Chip)

where component must be tolerant of voltage – current transients where component height can be tolerated when looking to replace leaded electrolytic capacitors when high speed placement is needed & reflow soldering

SMT ALUMINUM ELECTROLYTIC CAPACITORS:Recommendations

SMT aluminum electrolytic capacitors are available in: Low ESR – Solid Aluminum (100KHz ESR to 0.012ohm) High Voltage (up to 450VDC)

+125°C, +105 °C & +85°C Ratings Low Leakage Current & Bi-Polar Styles

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LEADED ALUMINUM ELECTROLYTIC CAPACITORS

Market & Technology:Limited growth expected over long term. Explosive growth in SMT type is replacing portions of radial leaded applications. No raw material – production issues expected to impact this product. Focus is upon development of lower ESR – Z types for lower voltage – higher current power management applications. Elimination or alternate to PVC Sleeving to be phased in. Migration of Japan – Taiwan production to China likely will result in price erosion over time

CAPACITY (UNIT : KPCS) CAPACITY (UNIT : KPCS)

φ4 4,000 4,000

φ5 8,910 8,910

φ6.3 9,400 9,400

φ8 8,860 16,860

φ10 21,350 26,750

φ12 3080 3080

φ16 840 840

φ18 230 230

OTHERS: 2,500 5,000

TOTAL: 56,670 70,070

2001 2002+

SIZE

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LEADED ALUMINUM ELECTROLYTIC CAPACITORS: New Products

Ultra-Low ESR Solid Aluminum Electrolytic Capacitors(NSPZR Series) Radial Leaded100KHz ESR = 0.008ohm100KHz RCR = 5.500ArmsCapacitance Values = 180 ~ 820uFVoltage Ratings = 4 ~ 16VDCSizes = 8 & 10mm DiametersLowest ESR of Radial Leaded Types

Lower Cost Hybrid Electrolyte

Aluminum Electrolytic Capacitors (NSPER Series) Radial Leaded

100KHz ESR = 0.012ohm 100KHz RCR = 2.34Arms

Capacitance Values = 330 ~ 1000uF Voltage Ratings = 4 ~ 10VDC Sizes = 8 & 10mm Diameters

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Low ESR Aluminum Electrolytic Capacitors(NRSK Series) Radial Leaded100KHz ESR = 0.012ohm100KHz RCR = 3.29ArmsCapacitance Values = 470 ~ 3300uFVoltage Ratings = 6.3 ~ 16VDCSizes = 8 & 10mm Diameters

4000 Hour Life Aluminum Electrolytic Capacitors

(NRSG Series) Radial Leaded100KHz ESR = 0.016ohm 100KHz RCR = 3.29Arms

Capacitance Values = 82 ~ 4700uF Voltage Ratings = 4 ~ 25VDC

Sizes = 6.3, 8, 10 & 12.5mm Dia.

LEADED ALUMINUM ELECTROLYTIC CAPACITORS: New Products

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also see www.lowESR.com

NICSeries

Type Voltage ESRRipple

CurrentRatings

Load Life at+105degC

Cost Size

NRSZNRSX

LiquidElectrolyte

6.3 ~100VDC

From0.015 ohm

0.03 ~ 3.20AMODERATE

2000 ~ 7000hours

LOW4x7~

18x35.5

NRSG LiquidElectrolyte

6.3 ~ 35VDCFrom

0.016 ohm0.40 ~ 3.29A

BETTER2000 ~

4000hoursLOW

6.3x11 ~12.5x30

NRSJNRSK

LiquidElectrolyte

6.3 ~ 50VDC6.3 ~ 16VDC

From0.012 ohm

0.92 ~ 2.55A1.14 ~ 2.80A

MODERATE2000 hours

LOWEST 8x11.5 ~ 10x23

NSPER HybridElectrolyte

4 ~ 10VDCFrom

0.012 ohm1.45 ~ 2.34A

MODERATE2000 hours

MODERATE8x11.5 &10x12.5

NSPZR SolidAluminum

4 ~ 16VDCFrom

0.008 ohm4.36 ~ 5.54A

LONGEST(No Dry-Out)

HIGH8x11.5 &10x12.5

RADIAL LEADED Low ESR ELECTROLYTIC CAPACITOR COMPARISON:

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Use Leaded aluminum electrolytic capacitors: when lowest cost is needed (lowest cost per uF of all types)

when high voltage (up to 450VDC) rating (or no de-rating is possible) is required when high capacitance is required (values to 1.2Farad = 1,200,000uF)

where component must be tolerant of voltage – current transients where component height can be tolerated

LEADED ALUMINUM ELECTROLYTIC CAPACITORS:Recommendations

Leaded aluminum electrolytic capacitors are available in: Low ESR – Solid Aluminum (100KHz ESR to 0.008ohm) High Voltage (up to 450VDC)

+125°C, +105 °C & +85°C Ratings Low Leakage Current & Bi-Polar Styles Radial, Snap-In and Screw Terminals

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FILM CHIP CAPACITORS (SMT)

Raw Materials: (PEN / PPS Films) Thin metallized films (16 ~ 100VDC) Stable characteristics over temperature, voltage & time

(as compared to X5R/X7R/Y5V/Z5U ceramics)

0805 / 1206 / 1210 / 1913 / 2416 Sizes High capacitance - tight tolerance (up to 0.47uF in ±2%, ±5%)

Low dielectric absorption (DA) characteristics for A/D conversion applications Low dissipation factor (DF) for high efficiency display circuits

(portable - battery powered designs) Immunity to cracking = good choice as compared to SMT ceramic capacitors

Recommendations:Use SMT film chip capacitors

When need better performance than ceramic types is needed When (MLCC) component cracking has been issue When lowest loss (DF) for high circuit efficiency is needed

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Technology RoadmapSMT Magnetics Products

SMT – Surface Mount

Ferrite Chips Beads: Noise suppression – filtering at high frequency

Standard (low ~ medium current) 0603 ~ 1812 sizes

High Current (5Amp) Lead & Core 1612, 3119 & 3312 sizes

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SMT – Surface Mount Chip Inductors:

NIS Series: Surface Sprial (high Q) 0201, 0402 & 0603 sizes

NML Series: Multilayer (MLI) Chips 0402 & 0603 sizes

NIN-H Series: WireWound Open Frame (high current)

0402, 0603, 0805 & 1008 sizes

NIN-F Series: WireWound Molded Case

1008, 1210 & 1812 sizes

NPI Series: Power Inductors (High Current Power Supplies)

9.0mm x 12.0mmm size

High Frequency Performance!

Low Cost!

Crosses – Replaces COILCRAFT

Power Supplies

Older Designs

Technology RoadmapSMT Magnetics Products

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SMT Magnetics Products

Cross-Reference:

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SMT RESISTORS & ARRAYS

Market & Technology:Similar slow market conditions for thick film resistor products at the moment. Pricing is flat, with higher alumina substrates pricing impacting larger (>0805 sizes) packages [Alumina substrate is majority element of thick film chip resistor]. Focus on 0402 & 0603 sizes for new and expanded production. Smaller (0201) size will be expanded as market acceptance increases. 0404, 0408 & 0612 Array sizes expansion ahead of larger sizes.

0201

CASE SIZE 2001 (Units) 2002 (Units)

15 KK 20 KK

0402 250 KK 350 KK

0603 500 KK 600 KK

0805 350 KK 350 KK

1206 200 KK 200 KK

1210 25 KK 25 KK

0.5W & 1W - 2010 & 2512 25 KK 25 KK

Total: 1,365KK 1,570 KK

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LEGACY LEADED TECHNOLOGIES

High Voltage Ceramic Disc Capacitors • 0.5pF ~ 0.22uF• 12V ~ 15,000VDC Rated• Temperature compensating TCs (N150 ~ N3300 PPM/degC) • Taped, Bulk or Cut – Formed Lead Styles

Radial / Axial Film Capacitors• Polyester, Metallized Polyester, Metallized Polypropylene • 1000pF ~ 6.8uF• 100V ~ 630VDC Rated

MLCC Radial – Axial Ceramic Capacitors• NPO / X7R / Z5U • 1.0pF ~ 4.7uF• 50, 100, 200VDC

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Carbon Film, Metal Film, Metal Oxide Film Resistors • 1.0 ohm ~ 10 Meg-ohm• 1/8W, 1/4W, 1/2W, 1W, 2W, 5W, 3W, 5W, 7W Rated• +/-1%, +/-2%, +/-5% tolerance • Taped or Bulk Boxed

SIP Resistor Networks • 4 ~ 13 Pins • Common – Bussed, Isolated or Custom Circuits• 10ohm ~ 3.3Meg-Ohm elements

LEGACY LEADED TECHNOLOGIES

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ENVIRONMENTAL:LEAD–FREE | PVC - FREE

Environmental pressure to remove LEAD (Pb) & PVC Sleeving from components. Item defined as LEAD-FREE if lead content is less than

0.2% (NEMI) or 0.1% (JEITA) of total (component) weight

World Lead-free Soldering Roadmap and Agree to Eliminate Lead by 2005European legislation and the JEITA roadmap will use a target of 0.1wt percent.

Lead-free Solder Alloy Selection… The type of solder composed of Sn-Ag-Cu is recommended for board assembly

National Electronics Manufacturing Initiative (NEMI)

Japan Electronics and Information Technology Industries Association (JEITA) was formed on November 1, 2000, through the merger of the Electronic

Industries Association of Japan (EIAJ) and Japan Electronic Industries Development Association (JEIDA).

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LEAD-FREE Terminal Finish Versions available today…

MLCC (100% Sn)

Tantalum E-Cap (100% Sn) Aluminum E-Cap (100% Sn & Sn-Bi*) Film Cap (100% Sn & Sn-Ag-Cu)

Chip Resistors & Thermistors (100% Sn)

Inductors & Ferrite Chip Beads (100% Sn & Sn-Cu) Diodes (100% Sn)

ENVIRONMENTAL:LEAD–FREE | PVC - FREE

Complete elimination of lead from terminal finish is need for compatibility to Lead-Free (Sn-Ag-Cu or Sn-Zn-Bi) soldering processes

SMT Alum E-Caps: Sn-Bi*

Sn-Zn-Bi group : NEC, Sharp, JVC

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ENVIRONMENTAL:PVC - FREE

Removing PVC Insulation Sleeving Aluminum E-Caps

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• Flow Chart

• Calibration

• Contract Review

• Control of Non-Conforming Material

• Corrective Action

• Document Control

• Handling, Storage

• Packaging and Delivery

• Inspection and Test Status

• Inspection and Testing

• Management Responsibility

• Process Control

• Product Identification and Traceability

• Quality Audits

• Quality Records

• Quality System

• Statistical Techniques

• Training

• ISO-9001:2000 Certification

• Global Support – Product Quality

Bruce HaskinDirector of Quality AssuranceNIC Components Corp.(631) 396-7500 x [email protected]

QUALITY CONTROL

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FLOW CHART:Customer Order QC Process

Customer OrderRequirement

Resolve withCustomer

Contract Review

Review CustomerSpecial

Requirements

Complywith

RequirementsNo

AddSpecial

RequirementsTo

CustomerMaster File

Yes

Yes

Enter order usingCX entry screen.

Print order inDist. Center

Picking Process.QMP 280-3

Pick and verify P/N and Qty.Comply with

customer specialinstructions

Yes

Final InspectionQMP 200

Verify P/N and Qty.Verify compliance

with customerspecial Instructions.

(Labeling /Packaging) Does the ordermeet customers

requirement

No

Packagingand

Shipping

Yes

66



Calibration

NIC Components maintains and controls all Measurement and Test equipment used to ensure product quality by:

• Identifying the calibration requirements of this equipment, and ensuring that the equipment remains in a state of calibration throughout specified intervals and conditions of use.

• Ensuring equipment is labeled with calibration status and next calibration due date.

• Using qualified external calibration facilities for all calibrations. The company maintains certified calibration records, which are traceable to NIST standards.

67



Contract Review

All customer requests for quotations are reviewed by NIC Components to ensure that:

• The requirements are adequately defined and documented; where no written statement of requirement is available for an order received by verbal means, NIC Components ensures that the order requirements are agreed upon before their acceptance.

• NIC Components has the capability to meet the contract or accepted order requirements.

• All special contract requirements, special instructions, quality requirements, and delivery requirements are carefully reviewed, to determine whether the company is able to meet these requirements.

• Any requirements differing from those in the order are resolved.

• After acceptance, any changes to the scope of the contract will force additional contract review.

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Control of Non-Conforming Material

A documented system is in place to control non-conforming material. The procedure outlines how non-conforming material is segregated and dispositioned.

All identified non-conforming material is segregated into the (RJ1) warehouse. Material received into this warehouse code cannot be inadvertently mixed or used as good inventory.

The Product Manager is responsible for the disposition of non-conforming material identified during receiving inspection.

The VP of Operations, Director of Quality Assurance, and the Warehouse Manager are responsible for the disposition of all other non-conforming material.

Records are maintained on all non-conforming material.

69



Corrective Action

The company maintains a system for the timely corrective action of all conditions detrimental to product and process quality, including deficiencies encountered during processing. Supplier, Customer and Internal Audit corrective action systems are in effect.

The prime objective of the corrective action system is to preclude the recurrence of a nonconformance by identification and correction of the root cause and contributing factors.

70



Document Control

The Director of Quality Assurance has overall responsibility for the creation, approval and issue of all QMS documents.

The Director of Quality Assurance is also responsible for ensuring that:

• Copies of appropriate documents are available at all locations where operations that can affect quality are performed.

• Obsolete documents are promptly removed from all points of issue and use.

Changes to controlled documents are permitted only after formal submission to the Director of Quality Assurance, who has overall responsibility for approving all changes. He/she will consult with the party(s) responsible for adherence to the document before approving a change.

71



Handling, Storage, Packaging, Preservation and Delivery

Necessary protection of all products is provided to prevent damage, loss, deterioration, or substitution.

•Product is packaged with materials necessary to prevent deterioration, corrosion, or handling damage.

•A FIFO inventory usage system is in effect.

•Packaging and marking of products is in accordance with specified requirements to assure proper identification, preservation, and segregation, including delivery to the customer.

Inspection and Test Status

A system is in place to identify product and customer orders throughout the inspection process. Inspection status is identified on our computer system from product receipt through final inspection.

72



Inspection and Testing

Inspection and Test is performed using documented procedures in the following areas: Receiving Inspection - A documented system exists for receiving inspection. 100% of all incoming receipts are visually inspected for manufacturer's part number, quantity, packaging, condition and documentation. Based on receiving history, suppliers are identified as "Skip Lot" and "Non Skip Lot". All "Non Skip Lot" suppliers require a more in-depth physical inspection.

In-process Inspection - Inspection is performed during the picking process to identify product that does not meet customer special requirements such as, date code restrictions, revision levels, packaging, and labeling. When an error is detected, the product is moved to a "mark out" area-awaiting disposition. Final Inspection - 100% final inspection is performed on all orders prior to shipment. Verification of manufacturer's part number, quantity, date code, packaging, bar code labeling, and customer specific instructions are performed.

73



Management Responsibility

The Director of Quality Assurance is the Management Representative responsible for all matters related to quality and the Quality Management System (QMS).

The Director of Quality Assurance is a member of the company's senior management, and is afforded the authority, support, and resources necessary to adequately fulfill his/her responsibility.

The Director of Quality Assurance is charged with the following:

• Ensuring that the Quality System is established, implemented, and maintained in accordance with the requirements of ISO 9002.

• Setting quality objectives with other management personnel.

• Determining the root causes of non-conformances, initiating corrective / preventive action and verifying solutions.

• Measure quality performance in key areas and review with senior management staff.

• All managers and supervisors are responsible for ensuring that company quality policies are understood, implemented, and maintained throughout the organization.

74



Process Control

A system is established and maintained for monitoring all processing operations. Documented procedures are developed and maintained to ensure that material/product are consistently delivered to meet customer requirements.

Product Identification and Traceability

The part number, lot number and date code and a NIC internal item number identify all products. Inventory is traceable from the time of receipt to the time of shipment.

75



Quality Audits

Internal quality audits are performed to verify that all Quality Operating Instructions are in compliance with the NI Components QA Manual. The internal quality audit addresses all clauses in ISO 9002. Personnel independent of the function(s) being audited perform audits. Corrective action requests are generated on non-conformances, and corrective action effectiveness is verified. Audit results are reviewed with the area manager/supervisor and distributed to upper management.

Quality Records

Quality records are maintained for all quality and inspection activities. Quality records are filed and retained for auditing, tracking, and reference purposes. Records are easily retrievable and maintained under appropriate environmental conditions.

Records are kept on file for a minimum of 5 years after the conclusion of a contract or activity.

76



Quality System

The Quality Management System (QMS) is comprised of the following:

• The Quality Assurance Manual, which defines the policies relating to the elements of ISO 9001:2000.

• Quality Manual Procedures (QMPs) are the instructions written at the operator level to provide the operator with precise direction on how to perform his/her tasks.

• Records of work and inspections performed.

• Auditing of the system, to ensure compliance with procedures and the requirements of ISO 9001:2000.

• Documentation / Data control system.

• Corrective / Preventive Action system.

• Management Review.

77



Statistical Techniques

Statistical techniques are used to measure internal and external quality data. The data collected is used to identify trends, reject types, and when necessary, to initiate corrective action.

The Director of Quality Assurance is responsible for creating monthly reports to be reviewed with upper management. The review is designed to monitor quality performance and continuous improvement efforts.

Training

It is an essential requirement of our Quality Management System that all staff be suitably trained, and demonstrate a satisfactory level of skill and knowledge in their functional areas.

Training records are kept on file and updated accordingly.

78



ISO-9001:2000 Certification

NIC has been ISO-9002 certified since February 01, 1996NIC received ISO-9001:2000 certification on October 20th, 2002 Auditor: Underwriter's Laboratories Inc. Certification covers NIC facilities located: Melville, NY (USA) & San Jose, CA (USA)

79



NIC Global Support – Product Quality

Asia Operations: NIC Components Asia Pte Ltd 701 Sims Drive, #07-01 LHK BuildingSingapore 387383Tel: 65-8441575Fax: 65-8441646 1 Supplier Quality Personnel on Staff

European Operations: NIC Eurotech Ltd14 Top AngelBuckingham Industrial ParkBuckingham MK18 1THUnited KingdomTel: 44 1280 813 737Fax: 44 1280 814 7371 Supplier Quality Personnel on Staff

e-mail:Global Technical Support: [email protected]

North American Operations Corporate Head Quarters: NIC Components Corp.70 Maxess Road Melville, NY 11747Tel (631) 396-7500Fax (631) 396-75753 Supplier Quality Personnel on Staff

Japan OperationsNippon Industries (Tokyo, Japan)

3 Supplier Quality Personnel on Staff

Taiwan OperationsNIC - EIAN (Taiwan)

1 Supplier Quality Personnel on Staff

80



81



NIC Global Logistics Locations

Asia Operations: NIC Components Asia Pte Ltd 701 Sims Drive, #07-01 LHK BuildingSingapore 387383

Additional Sales Personnel in: Penang, Malaysia Hong Kong Shanghai, China

European Operations: NIC Eurotech Ltd14 Top AngelBuckingham Industrial ParkBuckingham MK18 1THUnited Kingdom

North American Operations Corporate Head Quarters: NIC Components Corp.70 Maxess Road Melville, NY 11747

Japan OperationsNippon Industries (Tokyo, Japan)

Taiwan OperationsNIC – EIAN(Taipei, Taiwan)

West Coast Operations: NIC Components Corp.2070 Ringwood Avenue San Jose, CA 95131

3PL: Monterey, Mexico Guadalajara,Mexico

3PL: Hong Kong

82



NIPPON INDUSTRIES CO., LTD. (NIC JAPAN)

TOKYO, JAPAN

NIC COMPONENTS CORP.

TAIPEI, TAIWAN

NIC COMPONENTS CORP.

NEW YORK, USA

JAPAN

PRODUCTION

CHINA

PRODUCTION

TAIWAN

PRODUCTION

CHINA

PRODUCTION

NEW YORK

NORTH AMERICA

CALIFORNIA

NORTH AMERICA

UK

EUROPE

SINGAPORE

SE ASIA

EUROPEAN CUSTOMERS

Material & Information Flow

PRODUCTION FACILITIES

CORPORATE SALES & MARKETING ENGINEERING, MIS

NIC STOCKING FACILITIES

NORTH AMERICAN

CUSTOMERS

NORTH AMERICAN

CUSTOMERS

SE ASIA CUSTOMERS

83



Global Support

Shared Unified Data-base

Move programs – builds from location to location seamlessly

Single Global Part Numbers No competing -disputing regional divisions

84



Eastern Europe

Mexico

Western Europe

SE Asia

West CoastUSA

Scandinavia

Mid-AtlanticUSA

Mid-WestUSA

NIC LocalWarehouses

(7)

NIC CA

NIC COMP ASIA

NIC NYNIC CA

NIC EUROTECH

NIC NY

NIC EUROTECH

NIC EUROTECH

Global Support Network

85



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