1 Pixel Area Detector Development at NSRRC Kuan-Li Yu, Te-Hui Lee, Hui-Fang Chuang, Hsin-Wei Chen,...
-
Upload
carl-brightwell -
Category
Documents
-
view
216 -
download
2
Transcript of 1 Pixel Area Detector Development at NSRRC Kuan-Li Yu, Te-Hui Lee, Hui-Fang Chuang, Hsin-Wei Chen,...
1
Pixel Area Detector Development at NSRRC
Kuan-Li Yu, Te-Hui Lee, Hui-Fang Chuang, Hsin-Wei Chen, Chao-Chih Chiu, Duan-Jen Wang
2011/06/13
2
Outlines
• Sensor• ASIC: preamp, comparator, counter• Bump bonding• Readout system
– Timing control– Interlock– Data transfer and display
3
Operation Principle
4
Background Knowledge
• We started from scratch since 2009.• We learned sensor design from BNL.• We learned microstrip detector installation
and operation from D. Peter Siddons at BNL.
5
General SpecificationDetector area 318.24 x 331.5 mm
Sensor pixels per area detector 81,320 x 40 = 3,252,800 (3 M pixels)
Module per area detector 8 x 5 = 40 modules
Frame rate 10 frame per second (fps)
Chips per module 2 x 4
Pixel size 170 x 170 um2
Energy range 6 ~ 30 keV
Counter in chip 16 or 20 bit (two operation mode)
Charge amplifier (CS AMP + shaper)
4 gains0.25 V/fC, 0.5 V/fC, 1 V/fC, 2V/fC
Intermodule gap between sensor to sensor area (Vertical)
3.4 mm, 20 pixelsSensor guard ring, wire bonding pads and mechanical structure
Intermodule gap between sensor to sensor area (Horizontal)
1.7 mm, 10 pixelsSensor guard ring and mechanical structure.
6
Sensor
7
Sensor Structure
8
Sensor Wafer
6 inches
9
10
ASIC
11
ASIC• ASIC is designed by outsourcing t-WIN Technology Servic
e Inc and manufactured by MXIC.– http://www.t-win.com.tw
• Analog Front End (AFE)– Preamp, shaper– High-pass filter– DAC, comparator
• Pseudo Random Counter (PRC)• Serial Peripheral Interface (SPI)
– Parameters settings– Counter values reading
12
Requirements of Analog Front End• CS amplifier and shaper• Input: 50 nA/10 ns = 0.5 fC (10 keV photons)• Output: amplification 2 V/fC• Power consumption = 24 uW
– Operation current = 8 uA@3 V• Time response < 1 us• Implementation area 4,000 um2
• Radiation hardened• Low Equivalent Noise Charge (ENC)
13
Input current pulse
Output signal
14
AFE Test IC
2.8 mm
2.8 mm
Preamp + shaper
One pixel
Preamp + shaper + comparator
15
Pixel CircuitAnalog Front End (AFE)
Pseudo Random Counter (PRC)
Serial Peripheral Interface (SPI)
16
Analog Front End (AFE)preamp shaper
Threshold DAC
comparator
Amplification selection
17
Pseudo Random Counter (PRC)
Overflow detection
18
Pseudo Random Counter (PRC)0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
1Counting mode
Comparator output
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
1Reading mode
DCLK
20-bit counting mode
20-bit reading mode
Used=1,048,575,CLKNUM=1,048,576, 99.999905%, Last=0X7FFFF, First=0XFFFFFFFFFF(0),FFFFE(1),FFFFC(2),FFFF8(3),FFFF1(4),FFFE3(5),FFFC7(6),FFF8E(7),FFF1C(8),FFE38(9),FFC71(10),FF8E3(11),FF1C7(12),FE38E(13),FC71C(14),F8E38(15),F1C71(16),E38E3(17), …., 7FFFF
19
Pixel Layout
AFE
PRC
SPI
170 um170 um
20
Power Consumption Estimation• AFE :
– CSA(9)+SHP(9)+CMP(7.5)+BIAS(4.5)+DAC(4.5) = 35 uA • SPI :
– 60 uA when clock running• PRC :
– 30 uA when clock running• Total working current/pixel: 40 uA ~ 50 uA• Power Consumption
– 45 x 106 x 94 x 8 = 3.587 A– 3.587 A x 3 V = 10.76 W– 10.76 W/(66 mm x 38.3 mm) = 0.42 W/cm2
22
Power Management in One Pixel
• Counting mode– AFE ON, PRC ON, SPI OFF
• Reading mode– AFE OFF, PRC ON, SPI ON
• Standby mode– AFE OFF, PRC OFF, SPI OFF
23
Bump Bonding Process
24
Bump Bonding Platform
load cell
prism
microscope
Vacuum chuck
25
Motor controller
Control computer
26
Readout System
27
Readout System
SCB(sensor on
8 ASICs)serial MCB
8 x 20 Mb/s = 160 MbpsDAQ
Computer
NI PCIe 6537
MCB
MCB
MCB
SCB(sensor on
8 ASICs)serial
SCB(sensor on
8 ASICs)serial
SCB(sensor on
8 ASICs)serial
Master TCB
Power Supply
Control Comupter
Para
llel b
us
Ethernet switch Ethernet switch
Intr
anet
Optical fiber
Inside hutch, #1
Outside hutch
Power control, signal synchronization,
HV bias control, system reset,
interlock
Intr
anet
DAQ Computer
SlaveTCB
MCB: Memory Control Board
TCB: Timing Control Board
DAQ: Data Acquisition Computer
Unit #2 ~ #10
SCB: Serial Control Board
28
Serial Control Board (SCB)
MCB
Sensor
ASIC
Serial Control Board (SCB)IC
PCB via
Wire bondFor signal and VCC
1 mm
Mechanical support
CN_SCB_S
CN_SCB_T
CN_MCB_T
Bump bonding for guard ringWire bondFor HV bias
Al
ASIC peripheral logic and power supply circuit
ASIC pixel circuit
Indium
29
Memory Control Board (MCB)
Serial engineASIC #0
Serial engineASIC #1
Serial engineASIC #2
Serial engineASIC #3
Serial engineASIC #4
Serial engineASIC #5
Serial engineASIC #6
Serial engineASIC #7
Module, SCB
SRAM #1PRC lookup
tableDatabus_ram1
Databus out
FPGA
SRAM #0
FIFO
Databus, handshake signal
Ribbon cableDAQ
NI PCIe 6537
Databus in
Databus_ram0
Address
MCB
30
Timing Control Board (TCB)• Power supply to MCB and SCB• Data transfer timing and exposure time contro
l• Synchronization of all modules• Interlock signal monitoring
– Cooling water flow and temperature– HV bias leakage current– SCBs temperature monitoring
• HV bias voltage supply and control
31
Image Data Transfer
• High pulsatile data rate is converted to sustained slower data rate by FIFO memory
time
Data rate
SCBSerial to parallel
conversionFIFO DAQ
160 Mbps
Exposure time
PRC decode
320 MbpsData transfer
32
SCB to MCB Write data to FIFO
20-bit PRC decode
MCB Timing Control
1 usec
33
Data Transfer Speed• Serial to parallel conversion speed
– 20 MHz x 8 =160 Mbps• PRC decoding speed
– 16-bit PRC = 16 bit/125 ns = 128 Mbps– 20-bit PRC = 20 bit/200 ns = 100 Mbps
• National Instruments (NI) PCIe 6537 parallel interface– 16 bit x 50 MHz/4 MCB = 200 Mbps
• Estimated data transfer time for one module– 203,300 / 20,000,000 * 1.5 15.2 ms (20-bit)≒– 162,640 / 20,000,000 * 1.5 12.2 ms (16-bit)≒
34
Start count
Image
Combine and DisplaySAMBA
Report received images
Image Viewer (FITS)http://fits.gsfc.nasa.gov/
35
Develop a device support for areaDetector module
Write a driver inherits from ADDriver
tpsDetector
36
Schedule
• July 2011: AFE Test IC• Dec. 2011: Single operational module• Aug. 2012: Integrated 40 modules• Dec. 2012: Integrated with EPICS control
37
Thank you for your attention.
38
Serial Control Board (SCB)
• Mechanical support for ASIC and sensor• Wire bonding with ASIC• Thermal conduction for ASIC heat dissipation
39
Memory Control Board (MCB)
• SCB ASIC parameter settings• Serial to parallel signal conversion engine• FIFO data flow control• Pseudo Random Counter (PRC)
– Lookup table generation– Hardware decode (20-bit, 200 ns)
• SCB and ASIC temperature monitoring