1 EE587 SoC Design & Test Partha Pande School of EECS Washington State University...
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Transcript of 1 EE587 SoC Design & Test Partha Pande School of EECS Washington State University...
![Page 2: 1 EE587 SoC Design & Test Partha Pande School of EECS Washington State University pande@eecs.wsu.edu.](https://reader036.fdocuments.us/reader036/viewer/2022062516/56649db25503460f94aa0ce5/html5/thumbnails/2.jpg)
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Lecture 2
Overview of System-on-Chip Design
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System on chip
Technology Scaling
Transistor count:
exponential growth
Prohibitive manufacturing costs
Over 100 millions for today’s SoCs
10M$ - 100M$0.13micron designs
Reusability + Platform Based Design
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Evolution of design methodologies
Source: Henry Chang et al “Surviving the SoC Revolution: A Guide to Platform-Based Design”
SoC = SoC = SFIP ?SFIP ?
Semiconductor Intellectual Property (SIP)• Functional SIP
Memory, processors, DSPs, I/O, UARTs …….
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Trends in IC Design Methodologies
100-200k gates
0.6-0.35 micron
Minimal design reuse
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System on Board vs. System on Chip
Conceptually System on Chip refers to integrating the components of a board onto a single chip.
Looks straightforward but productivity levels are too low to make it a reality
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Motivation for SoC Design
What is driving the industry to develop the SoC design methodology?
– Higher productivity levels – Lower overall cost– Lower overall power– Smaller form factor– Higher integration levels– Rapid development of derivative designs
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SoC vs. SiP vs. SoB
System-on-Chip (SoC)
MPU Core
Cache
ROMLogic
AnalogUSB
DRAM
System-in-Package (SiP)
MPU Core
Logic
Analog
Cache
USBROM
DRAM System-on-Board (SoB)
Quick Turn-around Time
Smaller form factor
Lower power, cost
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Projections of Productivity Gap
Year Technology Chip Complexity ASIC Frequency
1997 250 nm 50M Tr. 100MHz
1999 180 nm 150M Tr. 200MHz
2002 130 nm 250M Tr. 400MHz
2004 90 nm 500M Tr. 600MHz
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Design Reuse Options
• Option 1: chip-level reuse– Fewer chips designed, HW programmable
– Undifferentiated silicon
• Option 2: processor-level reuse or software reuse– Chip = processors + memory
– Big SW, little hardware model
– Undifferentiated silicon
• Option 3: widespread reuse– High-value, domain specific reusable blocks
– Differentiated silicon
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Defining System-on-Chip
• Definitions:– Virtual Socket Interface (VSI) Alliance: “Highly integrated device.
Also known as system on silicon, system- on-a-chip, system-LSI, system-ASIC”
• Our view of an SoC design is defined by extensive use of reusable IP blocks, and mixed HW/SW design issues:– Programmable processor – Embedded memory– Digital signal processors– System bus + interfaces– Embedded programmable logic– Embedded software– Analog components…..
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Classification of IP Blocks
• Soft IP (RTL):– High flexibility/low predictability– Synthesize from hardware
description language (HDL)• Firm IP (gate level):
– Medium flexibility/medium predictability
– Gate level netlist that is ready for P&R
• Hard IP (layout level):– Low flexibility/high predictability– Layout and technology dependent
information
Soft
IP
Firm
IPHard
IP
Predicitability, Performance,
Cost, Effort by vendor.
Reusability
Portability
Flexibility
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Examples of IP Blocks in Use today
• RISC: ARM, MIPS, PowerPC, SPARC• CISC: 680x0 x86• Interfaces: USB, PCI, UART, Rambus• Encryptions: DES, AES• Multimedia” JPEG coder, MPEG decoder• Networking: ATM switch, Ethernet• Microcontroller: HC11, etc.• DSP: Oak, TI, etc.
SoC is forcing companies to develop high-quality IP blocks to stay in business.
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Evolution of Silicon Technology
10-8 months
4-2 months
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What is a Platform?
• What is platform?– A stable core-based architecture for a target application– Can be rapidly extended and customized
• What are the benefits of a platform?– Major benefit
• Increased productivity
– Derivative designs can be easily created• Using software or hardware modifications• Reduces the design time and increasing success rate
– Diverse applications each require a different platform• Example of WPAN application
– Bluetooth platform
– AMBA bus and ARM TDMI CPU based
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SoC Platform Design Concept
SoC Verification FlowSystem-Level PerformanceEvaluationRapid Prototype forEnd-Customer EvaluationSoC Derivative DesignMethodologies
System-level performanceevaluation environmentHW/SW Co-synthesisSoC IC Design Flows
ApplicationSpace
Methodology / Flows:
Foundation Block
MEM
FPGACPU Processor(s), RTOS(es)
and SW architecture
*IP can be hardware (digital or analog) or software. IP can be hard, soft or‘firm’ (HW), source orobject (SW)
*IP can be hardware (digital or analog) or software. IP can be hard, soft or‘firm’ (HW), source orobject (SW)
Scaleablebus, test, power, IO,clock, timing architectures
+ Reference Design
Foundry-SpecificPre-Qualification
Programmable IP
SW IP
Hardware IP
Pre-Qualified/VerifiedFoundation-IP*
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MP-SoC Platforms
• Both general purpose processors and Application-specific processors will be important
• Embedded FPGA (eFPGA) will complement the processors, however power is a concern
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Tality Bluetooth Platform
ARM7TDMI
DAP I/F
RADIOI/F
SPEECHI/F
SHAREDMEMORY
CONTROLLER
LMC
BRIDGE
POWER &CLOCK
CONTROLDMA
SMC
PLLCLOCKS
SHAREDMEMORY
TIC
DECODER
ARBITER
AHB APB
ADC
text ACI USBUARTUARTTIMERSPICGPIOWATCH
DOG
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Design Issues
• Non-net listed cores• Layout dependency• Aspect ratio misfits• Hand-crafted layouts• Clock redistribution• Timing re-verification• ………
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Efforts in Standardization
• Defacto bus standards – AMBA, CoreConnect, etc.• VSIA is involved in developing standards in SoC design to
promote widespread use – on-chip bus attributes– IP design exchange format– specifications for signal integrity, soft/hard IP modeling,
functional verification, test data formats– documentation standards– test access architecture standard– VCID for tracking IP– IP protection, IP quality
• IEEE testing standard (P1500)
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On-chip Standardized Bus Structures
IP’s with low bandwidth
• AMBA (ARM)• Core Connect (IBM)• OCP-IP (VSIA)
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ARM AMBA
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IBM Coreconnect
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Design Cycle Trends
* Software costs overtake total hardware costs at 130nm
Software
Hardware
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80% of System in Embedded SW
• Hardware is not sufficient to build an SoC platform• 70-80% of the system will be implemented in software
– Product differentiation will move to software from silicon– Many IC companies hire more software designers than IC
designers• Standard platforms with software differentiation will be the trend
– Example: in Set-top box market, manufacturers are converting from 7 different chips to 1 chip with 7 different application SW
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Levels of Abstraction
• System application design• Multi-processor SoC (MP-SoC) platform design• High level IP block design• Semiconductor technology & basic IP
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Interconnect
• Ease of Communication• a regular, plug-and-play methodology for interconnecting
various hardwired, reconfigurable or S/W programmable IP's.• Buses won’t be sufficient• Network on chip is a promising solution
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Summary of SoC
Driven by:• Need for New Methodology to Handle Design Complexity• Need for Increased Productivity• Need for Lower System Power• Need for Reduced System Size and Costs
Driver for:• Development and Use of Industry-wide Standards• Improved Quality of IP blocks• Focus on Higher Level HW/SW Issues
Outstanding Issues:• Deep Submicron Physical Design Issues• Development of SoC flows (HW/SW co-design)• Verification and Test Complexity
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Design Flow
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Synthesis
Logic synthesis converts the HDL model to a structured netlist
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Synthesis Flow
Synthesis
Optimization
Fitting Place & Route