· Nov. 3, 1992 (Career) May. 25, 1978 (Pucka) - Career merged Pucka in April 2003.
Transcript of · Nov. 3, 1992 (Career) May. 25, 1978 (Pucka) - Career merged Pucka in April 2003.
www.careergroups.com
Location of Career
(40 min.)Taipei 101 Mall(35 min.)
Taipei Station
(40 min.)Taoyuan International Airport
East
-Wes
t Exp
ress
National Freeway No.3
Tucheng Interchange
National Freeway No.1
(5 min.)Shulin Train Station
To Taipei
To Hsinchu
(20 min.)Banciao Station
High Speed Rail
Taiwan Railways
(45 min.)Taoyuan Station
Management Philosophy
Company Overview
EstablishedNov. 3, 1992 (Career)May. 25, 1978 (Pucka)- Career merged Pucka in April 2003.- Pucka was the 1st FPC manufacturer
in Taiwan.
LocationTaipei, Taiwan (H.Q.)Kunshan, ChinaSuzhou, ChinaShenzhen, ChinaNorthridge-CA, USAOulu, Finland
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Pad-in CapitalUS$ 107 Million(NT$3,246 Million, Mar. 2012)Stock public listed since 2002
Manpower Taipei 2,042Kunshan 4,272 Suzhou 2,679Shenzhen 1,347Northridge 100Oulu 55
Year
1978
2003
2002
1993
1992
1997
1998
2004
2008
2007
2010
2012
Milestone
Set up Shu-Lin Plant (Taipei).
Set up Hsin-Chuang Plant (Taipei).
Set up Suzhou Plant (China).
Set up Kunshan Plant (China).
Established Career Technology.
Established Pucka Industrial Co., Ltd.
Stock first traded over the counter as publicly-held company.
Career and Pucka was merged.
Complete the Headquarters Building inShu-Lin Tatung Tech. Park, Taipei .
Set up Shenzhen Plant (China).
Approved and listed in TSEC (TW 6153).
Consolidated sales revenue broke the NT$10 billion mark in 2010.
Career 20th Anniversary
Product Development CentreMr. Richard Wu, Sr. Manager Mr. Tony Chuang, Manager Technology R & D CentreMr. James Chang, DirectorProduction Planning CentreMr. Richard Chuo, DirectorTaipei PlantMr. Stanley Lin, DirectorKunshan PlantSuzhou PlantShenzhen Plant
Group Organization
Internal Auditing
Supervisor
President
Mr. Rick Wu
President Office
Directorate
Stockholders
Group Sales Div.Mr. James Tseng,
Sr. V.P.Financial CentreAccountingInvestment ManagementChina Regional Finance
General AffairsInformation TechnologyMaterials SupportHuman ResourceRisk ManagementChina RegionalMaterials SupportChina Regional IT
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Group Financial Div.Ms. Winnie Cheng,
C.F.O.
Group Admin. Div.Ms. Amy Hsu,
Sr. V.P.
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Quality Assurance Quality ControlQuality SystemQuality EngineeringChina Regional Q.A.
Taiwan Regional SalesMs. Sandy Liang, DirectorChina Regional SalesMr.Hans Ko, DirectorMarket DevelopmentMr.C. C. Lee, Director
Group RD & Manufacturing Div.Mr. Will Li, Executive V.P.
Mr. Jake Yeh, Sr. V.P.Mr. Richard Chuo, Director
Mr. Xavier Chiu, Sr. Manager
Q.A. Centre
Digital CameraHandset / Smartphone
LCD / LED Display
Multiplicity of Applications
Notebook & Light Bar
Touch Panel
Storage DeviceGPS & Wireless Power
Auto Tronics Flexible Electronics
Tablet PC / E-Paper
Application Mix
ConsumerElectronics
NB & Tablet Handset &
Smartphone
36%
45%
Others
3%
16%
Kunshan Plant
Suzhou Plant
Product Mix
35%8%
57%
Single Side
Double Side
Multi-layersMulti-layers
27% 25%
Single Side
48%
Double Side
50 27 12 4 93
260 274 192 117 843
247 303 209 56 815
1,485 3,668 2,266 1,170 8,589
2,042 4,272 2,679 1,347 10,340Current
Operator
Function
Management
Admin.
Suzhou Shenzhen Total
Engineering
Taipei Kunshan Site
Educational Level(TPE)
Human Resource
Working Experience(TPE)
Employee Age(TPE)
Master &Doctoral
2%
Senior High& VocationalHigh School
51%
JuniorCollege
15%
University24%
Others9%
below 1 yrs.28%
1~2 yrs.18%
10 yrs. over23%
5~9 yrs.22%
3~4 yrs.9%
30~39 yrs.42%
40 yrs. over19%
20~29 yrs.31%
below 20yrs.8%
Taipei Kunshan Suzhou Shenzhen
Sheet by Sheet ● ● ●
Roll to Roll ● ● ●
Sheet by Sheet ● ● ●
Sheet to Roll ● ● ●
Roll to Roll ● ● ●
● ● ●
● ● ●
● ● ●
● ● ● ●
● ● ● ●
Single Side Double Access
Structure
S/S
D/S
Multi-layers
Backend Process + SMT
Module Assembly
S/S + S/S with Air Gap
Manufacturing Capability
Capacity Allocation
Unit: K M2 / month
100KK pcs / month → 120KK pcs / month(panel size 250×300mm, 40pcs / panel)
Taipei Kunshan Suzhou Subtotal2012
15 19 18 52
Single SideDouble Access
Multi-layers & Others
Structure
Subtotal
Single Side
Double Side
2012 2012 2012
59 81 112 252
7 8 5 20
54 81 9 144
135 189 144 468
Worldwide Service
Manufacturing SiteSales R&D Center
JapanSeoul Northrig, CA
Singapore
HK
Oulu, Finland
Proto, RFIDLarge ScaleArea 4K M2
Quickturn ProtoSmall-Medium
Area 3K M2
Mass ProductionArea 43K M2
Mass ProductionArea 43K M2
Mass ProductionArea 28K M2
Backend ProcessArea 8K M2
XiamenDongguan
Suzhou Kunshan
Shenzhen
25% 75%
20% 80%
20% 80%2013
Taipei ChinaYear
2011
2012
Production Distribution
Group Sales
Amount
Group-wise Quality Assurance
System
Plant
Hazardous Substance Free Management
2006/7/1 Beginning of RoHS 2008/6/27 Beginning of PFOS2009 Q1 Beginning of REACH_ SVHC12009/5/1 Beginning of DMF
‧GP Mutual Database in Three Overseas Plants
‧Set up Environment Resource Section in Group
‧Trends of RoHS Insurance Policy‧Set up Full Material Declaration
System for Suppliers
2013 Q1~
2011 Q1‧Trends of Halogen-free
Factory‧Beginning of REACH_
SVHC4
2011 Q3
2011 Q2
Beginning of REACH_ SVHC5
‧Set up Green Product Management System
‧Beginning of REACH_SVHC6
2012 Q1
‧Green Product Supplier Conference‧Trends of Paperless Documents‧Career GP Guideline / Declaration‧Beginning of REACH_SVHC7
2012 Q2
2012 Q32010 Q2~
2011 Q4 Beginning of RoHS 2.0
‧Beginning of REACH_ SVHC2/3
‧GP Document Check List‧GP Mutual Database in TPE Plant
Trends of GPM with Subcontractor2012 Q4
Set up Hazardous Substance Crosscheck System
Laboratory Category
Reliability Lab.Reliability Lab.
Environment Storage / Shock
Mechanical StrengthElectric Measured
Chemical Resistance
GP/GP/RoHSRoHS Lab.Lab.
(IC) F、Cl、Br、I(ICP) Pb、Cd、Hg
(UV) Cr6+
(XRF)IQC/FQC Control
Failure Analysis Lab. Failure Analysis Lab.
Electric Failure
PCB Pollution of Process
RA Test Failure
Chemical Lab.Chemical Lab.
Chemical Solution Analysis
Copper Thickness Measured
IT Infrastructure
KPI( Key Performance Indicators )
ERP
VOIP(Voice Over IP)
VPN(Virtual Private Network)
TCP / IP DBMS(Database Management System)
Windows2003
PLM HRM KM GPM APS
‧Consolidated sales revenue broke the NT$10 billion mark in 2010.
Consolidated Sales Revenue
US$ Million 14%
FPC FPC+PCB1 Nippon Mektron Japan 2,314 2,314
2 Sumitomo Denko Japan 927 927
3 MFLEX USA 832 832
4 Fujikura Japan 601 601
5 Nitto Denko Japan 546 546
6 Zhen Ding Taiwan 544 1,512
7 Young Poong Group (Interflex) Korea 470 1,204
8 Career Technology Taiwan 390 390
9 SI Flex Korea 344 344
10 Flexium Taiwan 258 258
11 Ichia Taiwan 212 212
12 Flexcom Korea 159 159
13 MFS Singapore 125 125
Rank FPC Maker CountryRevenue ($M)
World TOP 13 FPC Makers in 2011
Performance Ranking
(N.T. Information Ltd, July, 2012)
Competitive Advantage
Experienced Management Team and Efficient Operating Decision
Owning a management team with rich experience and professional knowledge in FPC business more than twenty years. We make decisions efficiently to meet business requirements.We have built effective management systems of material support, technical engineering, production, quality and risk control.
Specialized Production Technology and Capability
We have multiplicity of production application to meet various custoemr requirements.Constantly Cooperate with research institutes to develop advanced technologies.
Respond to Customer’s requirements promptly
Set up worldwide facilities to serve customers locally.Build global logistic management system to save customers’ time of procurement. Keep long-term partnerships with alliance suppliers for acquisition of key materials.
Competitive Advantage
Solid Financial Strength and Good Risk Management
Maintaining a lower debit ratio.Simplify capital structure.Focus on our core business (FPC).
Pay Attention to Green Management and Provide Customers with Environmental Friendly Products
Establish a green supplier management platform and work together with our suppliers and customers to comply with the environmental protection rules.Promote aggressively various waste reduction, recycle and energy saving projects to improve efficiency in resource utilization and reduce pollution.
Technical CapabilityReliability
Material Spec.
General Special General Special General SpecialCoverlay ± 0.20mm ± 0.10mm ± 0.20mm ± 0.10mm ± 0.20mm ± 0.10mmStiffener ± 0.15mm ± 0.05mm ± 0.05mm ± 0.05mm ± 0.05mm ± 0.05mmCircuit ± 0.05mm ± 0.04mm ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm
LPI ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm± 0.30mm ± 0.20mm ± 0.30mm ± 0.20mm ± 0.30mm ± 0.20mm± 0.07mm ± 0.05mm ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm± 0.07mm ± 0.05mm ± 0.05mm ± 0.03mm ± 0.05mm ± 0.03mm± 0.07mm ± 0.05mm ± 0.07mm ± 0.05mm ± 0.07mm ± 0.05mm
Hole to Hole ± 0.05mm ±0.04mm ± 0.04mm ± 0.03mm ± 0.04mm ± 0.03mmHole to Outline Edge ± 0.07mm ± 0.05mm ± 0.05mm ± 0.04mm ± 0.05mm ± 0.04mm
Center of Conductor toOutline Edge (Finger) ± 0.07mm ± 0.05mm ± 0.05mm ± 0.04mm ± 0.05mm ± 0.04mm
PitchBallSize
DimensionTolerances
Min. 0.1005Connector
Single SideDouble Side
CNC (Mechanical / Laser)
SMTCapability
Passive ComponentMin. Pitch Under 0.35mm
Specification
Current StatusItem
Min HoleDiameter
22um / 22um40um / 40um
Min. TraceWidth & Space
0.1mm / 0.07mm
Min. 0.1005
2014Under 20um / 20um
30um / 30um
0.075mm / 0.06mm
201320um / 20um35um / 35um
Min. Pitch 0.35mm0.2mm
Min. 3*3 Max. 74*74mmMin. Pitch Under 0.30mm
Min. Pitch 0.4mm
0.075mm / 0.05mm
0.25mmMin. 3*3 Max. 74*74mm
Assy.
EXP.
Printing ProcessPunching Hole
Outline DimensionAccumulated Pitch
Punching
BGASMTType
FPC Structure 8 Layers 10 Layers 12 Layers
Mechanical 0.15mm 0.15mm 0.15mm
Laser 0.07mm 0.06mm 0.05mm
Inner Layer 40um / 40um 35um / 35um 30um / 30um
Outer Layer 50um / 50um 45um / 45um 45um / 45um
Blind 0.07mm 0.07~0.06mm Under 0.05mm
Buried Available Available Available
2013 2014Year
H D I Tech.
Line Width /Space
Min. Drill
Current Items
Multi-layer Structure and Capability
CMOS Module / Mobile Device• Micro via process study• Via filling process evaluate• Half etching technology extended• Relative raw material development• Vacuum metallization process study
S/S 35um 30um Under 30um
D/S 35um 30um Under 30um
S/S 9um 9um 5um
D/S 9um 5um 5um
S/S Available Available Available
D/S Available Available Available
0.05mmMin. Blind Via forD/S Structure
Raw Material
Min. Line /Space
2013
R. t. R. Equipment forM/P Stage
0.07mm 0.06mm
2014Year Items Current
Fine Line / LCM Structure and Capability
COF / LCD Module / E-Ink Display• R. t. R. equipment advance• R. t. R. D/S blind hole evaluate• Direct gold apply• E-Ink COF product trial• Attack automobile market
FPC Structure 2 Layers 2 Layers 2 Layers
Mechanical 0.1mm 0.075mm 0.075mm
Laser 0.07mm 0.06mm 0.05mm
Inner Layer 40um / 40um 35um / 35um 30um / 30um
Outer Layer 50um / 50um 45um / 45um 45um / 45um
PI Base 9um 9um 9um
FR4 Base 12um 12um 12um
2013 2014Year
0.07mm 0.06mm 0.05mm
Raw Material
Line Width /Space
Min. Drill
Current Items
H D I Tech. Blind
E-Paper Structure and Capability
ESL / Smart Card / Watch / Mobile• Production process improvement• Patent applied• Strategic alliance• Attack mobile market
Thinner Material Development
2011 2012 2013 2014
Copper Foil
Base Film
FCCL
Shield Film
1/3oz (12um) 1/4oz (9um) <1/4oz (9um)<5um
Semi-additive Process
2mil (50um)0.5mil (12um) 0.4mil (10um) 0.3mil (7.5um) <0.3mil (7.5um)
3Layer S/S D/S2Layer S/S D/S
3Layer D/S2Layer S/S D/S 2Layer S/S D/S 2Layer S/S D/S
Ag-Shield Shield Film(8um) Shield Film Thinner (<8um)
Ultra bookTablet
Multi-layer (HDI) Capability
2011 2012 2013 2014
Inner:40um/40um Outer:55um/55um
4-6 Layer
Inner:40um/40um Outer:50um/50um
6-8 Layer
Inner:35um/35um Outer:45um/45um
8-10 Layer
Stack Via(N)
Stack Via
Anylayer
Solid Via
Inner:30um/30um Outer:45um/45um
10-12 Layer
TH:ψ0.15mmBH:ψ0.07mm
TH:ψ0.15mmBH:ψ0.06mm
TH:ψ0.15mmBH:ψ0.05mm
TH:ψ0.15mmBH:ψ0.10mm
Layer Count & Thickness
Min. Thickness 220um
2011 2012 2013 2014
Min. Thickness 300um
Min. Thickness 380um
Min. Thickness 460um
6 Layer
8 Layer
10 Layer
12 Layer
Expansion and Integration
Complete our new building constructionat Tatung Technology Park, Shulin City, Taipei in May 2007.
9 floors (B1~F8) with total area =43,000 square meters.
25M USD investment for the building20M USD for the facilities.
eadquarters, R&D Center igh-end Production FacilityH
High-end products:D/S Roll to Roll Fine Line
Allocation of H.Q. Building
H.Q. andR&D Center
Strategic ProductAlliance
Automate Manufacturing
ProcessRoll to Roll
Capital Expenditure
Total Investment USD 35M in Taipei, Kunshan and Suzhou Fab expansion (2012) Total Investment USD 35M in Taipei, Kunshan and Suzhou Fab expansion (2012)
Unit:US$ Million
Facility Shulin Kunshan Suzhou
Outlook
Building 1 4
Capability Upgrade 12 4 5
Capacity Expansion 2 2 2
Others 1 1 1
Subtotal 15 8 12
Floor Guide - Taipei H.Q. Building
Prod. Staff Office, Reliability Lab IQC, Cutting, Punch, Warehouse
Coverlay Assembly, Lamination, NC, Screen Print, SMT, Test, Inspection, FQC, Assembly
Sales, RD, QA, Admin. Staff Office, Conference Room
Assembly, Test, Inspection, FQC, RTR D/S Process
Reception, Conference Room, Shoes Change Area, Parking
Assembly Process, FQC Restaurant, Staff Leisure Room
IQC, CNC, Plasma, Wet Process Subcontract Affairs Educational Room
Exposure, LPI, Wet Process
Vision and Commitment
Maintain Technological Leadership.
Implement Customer Satisfaction.
The Whole Member Management and Profit Sharing.
Enhance Shareholder Value.
Fulfil Social Responsibility.
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FacilitySize
Manpower
Overview - Kunshan Plant
Return
Established Oct. 1998
Location Shanghai
Paid-inCapital
US$ 31.8 Million(NT$963 Million, Mar. 2012)
4,272
43,000 square meters
Overview - Suzhou Plant
Established Feb. 2002
Location Suzhou
Paid-inCapital
US$ 18.9 Million(NT$573 Million, Mar. 2012)
Return
FacilitySize
Manpower 2,679
28,000 square meters
Established
Location
Overview - Shenzhen Plant
Return
Jul. 2004
Shenzhen
Paid-inCapital
US$ 4.5 Million(NT$136 Million, Mar. 2012)
FacilitySize
Manpower 1,347
8,000 square meters
Organization - Kunshan Plant
Financial Div.
Product Development.EngineeringTechnologyDevelopmentMass ProductionTechnologyPrototypeEngineeringDocument Control
Prod. Dept. 1Prod. Dept. 2Prod. Dept. 3Prod. Dept. 4P.C.P.E.
AccountingCustoms Clearance Affairs
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General AffairsH.R.Environmental Mgt.Maintenance
Mr. Sam Wang,Director
R&D Div.
Mr. Richard Wu,Director
Mr. Eric Lin, Sr. Manager
Prod. Div.
Mr. Richard Chen,Plant Director
Admin. Div.
Mr. Sanny Hsieh,Manager
Material Support Div.
Ms. Letitia Lei,Sr. Manager
Q.A. Div.
Mr. David Liu, Sr. Manager
Kunshan Plant
Mr. Henry Su,Vice President
China Regional Sales Div.
Mr. Hans Ko,Director
ProcurementMaterial ControlWarehouse Mgt.
‧Sales and Financial Div designated in different color function-wise cover all plants in Mainland China.
Quality Assurance Quality ControlQuality SystemQuality Engineering
Organization - Suzhou Plant
Product DevelopmentTechnology Research & DevelopmentMass Production Tech.Prototype Engineering
Production DivisionMr. Jason Wu Plant Manager
Admin. DivisionMr. Eric HsiaoSr. Manager
Return
Production TechnologyProduction ControlProd. Dept. 1 Prod. Dept. 2Project Office
Suzhou Plant
Mr. Roger Chiang, Vice President
Quality Assurance Quality ControlQuality SystemQuality Engineering
R&D DivisionMr. Sinsien LinSr. Manager
Q.A. DivisionMr. Peter Tu
Manager
Financial DivisionMr. Sam Wang
Director
AccountingCustoms Clearance Affairs
General AffairsH.R.Environmental Mgt.MaintenanceMaterial Support
Product Mix - Kunshan Plant
Return
37% 27%
36%
Single Side
Double Side
Multi-layers
Product Mix - Suzhou Plant
Return
5%38%
57%
Single Side
Double Side
Multi-layers
Floor Guide – Kunshan Plant
Exposure, Screen Print, LPI, Instrument Room
CNC, Punch, NC, Laminate, Scrubbing, Electroplate, Chemical Lab. SQA, Subcontract
SMT, Assembly, Test, Inspection, Cutting, Warehouse, Instrument Room R&D Sample Preparation, PE
Assembly, O/S Test, Inspection, Pre-laminate, RTR UV Laser , RTR Shadow, RVCP, DES Line, RTR AOI, Nickel-palladium-gold Wire, Horizontal Brown Line, Blind Hole Check, PD Admin.
Chemical Lab, Copper Plating, Black Hole, Shadow, DES Line, PTH, Plasma, AOI
RTR NC, RTR Pre-laminate, RTR Laminate, RTR Hot Press, RTR CuttingAdmin., Sales, PC, QA, R&D Staff Office Reception
Floor Guide – Suzhou Plant
Staff Office, Conference Room
Punch, O/S TestReception
Conference Room
Inspection, Assembly, IQC, FQC, Warehouse
Lamination, RA Lab.
Chemical Lab, Exposure, PTH, ENIG, Gold Planting, Lamination
CNC, Screen Print & LPI, RTR Process
Subcontract Affairs, Educational Room
Assembly Process, Final Inspection
SMT、FT / ICT
Floor Guide – Shenzhen Plant
Screen Print, O/S Test, Punch, Tooling Room, Assembly, Lamination, Plasma, Tool Making Room
SMT, Assembly, Functional Test, Inspection, Parts Warehouse
Inspection Process
Reception Instrument Room, Warehouse
Manufacturing, QE, Admin., PE, Financial Dept., Educational Room, Conference Room, Instrument Room
Laboratory Category
Surface CopperFilm Thickness
Working Instruction for Micro Hardness
IC
Moisture /Resistance
Thermal Shock Salt Spray
Peeling Strength
BendingFlexibility Endurance
Free Fall
Surface Resistance
Dielectric Withstanding
Voltage
SEM / EDS Wetting Balance
UV
AA
GW-C220512
GFG-8219A
OSC LCR
Chemical Lab. GP/RoHS Lab.
Failure Analysis Lab. Reliability Lab.
ASTM D-2176
IEC-68-2-32
IPC-TM-650
IEC-68-2-11IEC62321
US EPA3060A
US EPA7196A
ASTM D3359-02
J-STD-003B
IEC-6013A
ICP
Micro Wave
MicroPeeling
Strength
Auto Wire Bond
Oxygen Bomb Combustion
For Halogens
For RoHS(Hg,Pb,Cd)
Spec.
FPC PI PET LCP 0.3 0.5 1 2 3 5 RACopper
EDCopper
1/4 1/3 1/2 1
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Base Film Thickness (mil)Base Film (mil) Copper Characteristic Copper Thickness (oz)
AdhesivelessDouble Side
Coverlay
AdhesiveSingle Side
AdhesiveDouble Side
Copper Foil
AdhesivelessSingle Side
Material Specification