» 2014/2015 Embedded Boards - Kontron · » 2014/2015 Embedded Boards « ... Evaluation Break-out...

» 2014/2015 Embedded Boards «

The pulse of innovation

» Computer-on-Module» Pico-ITX 2.5"» Mini-ITX to Flex-ATX

2

Why buy an Embedded Board? ______________________ 03

Lowest total cost of Ownership ______________________ 03

Complete lifecycle management ______________________ 03

The Longevity Factor ______________________________ 04

Embedded Motherboards Compatibility ________________ 04

Your value add beyond Hardware _____________________ 05

Kontron‘s innovation cycle _________________________ 06

Computer-on-Modules _____________________________ 07

Proven designs for extended temperatures _____________ 08

Rapid Shut Down (RXT Modules) _____________________ 08

The Thermal Concept _______________________________ 08

Software & Services _______________________________ 08

Fast, complete solutions with... _____________________ 09

Motherboard _____________________________________ 10

KTQ87/mITX ______________________________________ 11

Embedded Mini-ITX Motherboards ____________________ 12

Technology Highlights ______________________________ 12

Hardware-based remote Diagnosis and Repair ___________ 13

Accessories ______________________________________ 14

New Long-Life Cooler ______________________________ 14

Evaluation Break-out Boards ________________________ 14

PicoITX _________________________________________ 15

Standard cooling concept ___________________________ 16

Technical Informations ____________________________ 17

» Table of Contents «

www.kontron.com

» Why buy an Embedded Board? «

Lowest total cost of Ownership (TCO) with Embedded Boards

At fi rst glance, buying an industrial board may seem to be more expensive than a board designed for the consumer mar-ket. However, there are several factors that could contribute to cost savings of more than 50% over the lifetime of pro-duct including:

» Strong product life management and revision controlfrom design to EOL

» 7-years life and beyond, giving optimal time for returnof initial design-in investment

» Fast time to market by using complete set of tools, services and software (BSP´s)

» Logistics and service made easy with long life products and product life management

» Free technical support (Hotline)» Highly reduced replacement costs» Stable and reliable products with high MTBF* and low fi eld

failure rate due to high quality industrial grade components» Reduced test and approval efforts

Safety for yourinvestment decisions!

Complete lifecycle management for all Embedded Boards

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EFT

PIB

PMI

PMI

EOL

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» PIB = Product Introduction Bulletin» EFT = Early Field Test» PMI = Product Marketing Information» PCN = Product Change Notifi cation» EOL = The End of Life Notifi cation

Embedded Boards

€

4

Embedded Motherboards

Embedded Motherboards Compatibility

Same Dimension (width) for rear-i/O from Mini-ITX up to full ATX Size

ETH1USB5USB4

ETH2ETH3

USB1USB0DP0

USB3USB2DP1

DVI-I Audio

Samefor reup to

ETH1 ETH2 USB1 USB3 DVI-I Audio

ATXMini-ITX FLEX-ATXPico-ITX

Kontron's entire range of motherboards offers full mechanical compatibility from Mini-ITX to full size ATX.

The Longevity Factor

» Availability up to 7 years and more after release

» 7-years lifetime and beyond, giving optimal time for return of initial design-in investment

Kontron Embedded Board

» Availability 6 -18 Months

ConsumerIT / PC

» Availability 6 -18 Months

www.kontron.com


» Up to seven years lifecycle and long term service and support » Extensive validation, verifi cation and testing » Extended technical support and documentation » Flat panel display support expertise including LVDS, DVI,

CRT, HDMI and ADD2/PCIe Cards » Remote hardware and hard disk monitoring/control

by original API software» Quick time-to-market with standard form factors» Advanced technologies such as solid capacitors and

up to 12 multilayer PCBs» Boards are tested and approved to UL 60950 – Information

Technology Equipment (ITE) for easy validation efforts on behalf of customers and system integrators when system-level products must go through UL / CE safety testing

» All Motherboards are designed and tested for Industrial Operating Temperature Range 0°C to 60°C

» All Motherboards are tested for their shock resistance, to be prepared for rugged environments

Learn more about Kontron Motherboards at:www.kontron.com/technologies/motherboards/collateral

Your value add beyond Hardware

The use of Solid CAPs offers the following advantages:» Long-life cycle – enhanced MTBF» Liquid free – no drying out» Improved resistance against higher ambient temperature» Optimized electric strength

Up to 12 Multilayer PCBs support more features on smaller form factors with the highest signal quality

The availability of 3D-Drawings at earlyintroduction for all available boards allows an instant start of housing design

Extended Documentation and Drivers – ready for download via Website

Up to 12xextended lifetime


6

» Kontron‘s innovation cycle «

SMARC

COM Express®basic

COM Express®compact

COM Express®mini

COM Express®goes mobile – the mini form factor

SMARCCOM Express®®

2008

1998DIMM-PC®

2000ETX®

2002X-board®

Green light forCOM Express® – thebasic form factor

2004

A dimension smaller – the compact form factor

2006

ExtendedCOM Express®pin-outs

2010

Ratifi cation ofCOM Express® mini by PICMG®

2012

Ratifi cation of SMARC Standard by SGeT e.V.

2013

One technology, three form factors» Latest technology with actual high speed interfaces » 100 % band width from Intel® Atom™ to Quad Core» 100 % COMsistent, over 16 years COM experience

125 x 95

COM Express®COM Express®basicbasic

95 x 95

COM Express®COM Express®compactcompact

84 x 55

COM Express®COM Express®minimini

Kontron's innovation cycle

www.kontron.com

» Computer-on-Modules «

Computer-on-Modules (COM) are highly integrated compu-ter modules that support system expansion and application-specifi c customization without the use of cables. When using a Computer-on-Module, customers don't need to worry about the complex design of the COM, instead freeing them to con-centrate on their core business. To tailor this modular solution to the application's specifi c needs, Kontron designs the carrier board that includes all necessary interfaces for the individu-al application. Kontron COMs are based on industry standards like SMARC®, ETX® and COM Express®. As such, Kontron COMs are simply plugged into the carrier board like a component.

Advantages of COMs at a Glance:» Scalability in size and performance» Short time-to-market» Simplifi ed development» Flexibility and interoperability» Reuse of knowledge» Longevity of standards and products» Multi-vendor support

Computer-on-Modules

8

BIOS/Bootloader» Confi guration Services» Customer specifi c bootloader

development and variant handling

OS/Licenses» Evaluation Images» Support for Getting Started» Image Building» Microsoft Embedded Licenses

Software & Services

Proven designs for extended temperatures

The Thermal Concept

COM Express® Heatspreader provides:» Identical mechanical size – all COM Express® modules

fi t in the same system» The only surface that needs cooling is the top of the

heatspreader» Additional active and passive Heatsinks are available

Mission-critical applications in the military, aerospace, transportation, energy and industrial automation markets offer the biggest challenges for extended temperature designs. To achieve functionality in extended temperature ranges, customers have two recommended ways to ensure that COM solutions perform within extended temperature environments – by design (solutions built with all industrial grade components) and by 100 percent extended temperature testing of the solution.The Kontron x86, ARM and Power Architecture® technology COMs in particular SMARC-sXBTi, COMe-cBTiR6 SMARC-sAMX6i, SMARC-sA3874i and COMe-P2020 offers a "by design" modular solution fully approved for use under E2 industrial temperature range (-40°C to +85°C) conditions. Kontron also offers other high-performance COMs re-engineered to be reliable under such extreme temperature conditions.

Board Support Package» Windows Embedded Standard/Compact» Linux and Yocto» Android and VxWorks on request» Customization and Driver

Development Services

Support & Services» Getting Started Support» ARM Baseboard & Software Training» Enhanced Software Support

Rapid Shut Down (RXT Modules)

The Rapid Shut Down function is required by security critical application in defense and transportation application. Kontron enable the system to shut down by an active-high shutdown signal on the COM Express® connector. This technology causes all power regulators to be disabled and the internal power supply rails to be discharged by crowbar circuits to 37% of initial voltage value within 250µS whenelse commercial systems need usually 300 miliseconds for their shut down. All Kontron RXT COM are certifi ed up to industrial temperature environment.

Computer-on-Modules

www.kontron.com

Computer-on-Modules

Fast, complete solutions with...

Concentrate on Your Core Business

With Kontron Computer-on-Modules (COM), customers can con-centrate on their core business and only have to design the ne-cessary interfaces and circuits for their individual carrier boards. The standardized computer module is then simply plugged into the carrier board. Customers can focus on their application-spe-cifi c elements without worrying about the computing core.

Broad Knowledge Base Accelerates Time-to-Market

Kontron offers a variety of hardware and software tools to speed up and simplify your R&D processes.

With complete starter kits that, which include all required hard- and software for quick evaluation, engineers can start develop-ment while defi ning their application-specifi c solution. In addi-tion to the available starter kits Kontron also provides various additional Graphics Adapters help developers to convert panel signals to the required specifi cation of the target application.

Find out more on: kontron.com/mysafechoice

Indiividual Carrierr Board Design

When Carrier Board design and Computer-on-Modules come from a single source, system functionality is optimally tuned for the application. Kontrons Team offers the correct form factor fi t with the highest quality. With x86, ARM and PowerPC design experi-ence, Kontron develops and delivers any kind of Carrier Board, including test, memory, heatsink, housing, assembly, individual confi guration, packaging and shipment. Even if you can't fi nd a suitable module in Kontron's broad product range, we'll take on the design and the manufacturing of complete boards with any desired CPU in any desired form factor.

Find out more on kontron.com/boardsandmore

10

Feature-packed Kontron embedded KTQM87 - Mini-ITX mother-board with soldered 4th Generation Intel® Core i7, i5, i3, Pen-tium & Celeron® mobile processors offers extended graphics capabilities, best-in-class performance and highest versatility supporting ECC RAM. Shipment including fan and cooler.

» 3x DisplayPort & LVDS» MULTIPURPOSE Feature Connector

Based on 8085 Microcontroller for easycustomizing, KT Break-out Board available

» Solid CAPs for extended Lifetime & MTBF» Longevity up to 7 years and enhanced

life cycle management» License-Bundles for Microsoft

Wind River and Linux OS

333 independentDisplay Support,PCIe 3.0, USB 3.0

» Motherboards «


www.kontron.com


KTQ87/mITX

» 4th Generation Intel® 22nm Dual and Quad Core i7, i5, i3, Pentium & Celeron® CPUs with Intel® Q87 Lynx Point PCH

» Long term available Embedded mITX motherboard» High performance CPU, graphics, and media performance

supporting 3 independent displays pipes» Graphics APIs DirectX® 11.1, OpenGL 4.x, OpenCL 1.2» 3x DisplayPort for fl exible, high resolution display drive» 2x DDR3L/DDR3 DIMM sockets supporting

up to 16GB DDR3 Memory

Typical Applications» Digital Signage: High graphics performance and

multi-display support» Gaming/POS/POI: High graphics and high CPU performance» Medical: High Graphics performance & longevity» Industrial Automation: wide range of I/Os and longevity» Future-oriented devices due to DisplayPort and

mSATA/compact SSD support

mSATA socket on rear side

Widest range of Interfaces: KTQ87/mITX

mSATA interface for compact SSD

eDP

eDPEmbedded DisplayPort» Standardized pinout» High throughput to support

high resolution» Fewer wires than LVDS –

easier wiring» Less EMI

DP to VGA DP to HDMI DP to DVI-D

DisplayPort Adapter

LAN1USB3USB2

LAN2USB1USB0

DP2 DP1DP0

Audio

ATX+12V

FAN CPU

mPCIe &USB8

PCIe x16

mSATA &USB9

ATX/BTXPWR

DD3 Slot 1

DD3 Slot 0

COM1

COM2

SATA4SATA3SATA2SATA0 SATA5 SPI

USB4USB5

USB10USB11FRONTPNL

FEATURE

12

Embedded Mini-ITX Motherboards

Mini-ITX has become a very successful embedded motherboard form factor. Key features including multi LAN and a wide range of I/O options make these products ideal for many applications. The compact and space-saving footprint (17cm x 17cm) meets the growing need for a small form factor board-level solution and allows the customer to design a compact system without sacrifi cing the requirement of standard ATX mounting holes and the I/O bracket area.

The Mini-ITX form factor fi lls the gap between ultra small form fac-tor boards like Pico-ITX and full-size Flex and ATX motherboards.

Whatever your needs are – low power consumption with passive (fanless) cooling or high CPU speed, excellent graphics perfor-mance, TCO reduction by Intel® AMT remote control or a wide range of extension slots and accessories – you will fi nd it here. Additionally, all Kontron Mini-ITX boards offer longevity, low to high-end performance and high MTBF.

Up to 4 independent display outputs with the AMD® R-series based Motherboards KTA70M/mITX and KTA75/FLEX

AMD®

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-Ser

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APU

Please note: Realization requires 1 ADD-Card

DP, single link DVI or HDMI™



DP1

DP2

DP3

DP4DP, single link DVI or HDMI™

Technology Highlights

KTA70M-mITX

ADD card KT-PCIe-DP++ to realize the 4th DisplayPort with AMD R-series boards


www.kontron.com


Intel® AMT is part of the Intel® Management Engine, which is built into PCs with Intel® vPro™ Technology. Intel® AMT is run-ning in a ME integrated into the PCH (Platform Controler Hub) and is independent of the host CPU. This deep level hardware-based AMT Remote Troubleshooting and Recovery for distributed applications offers:

» Remote monitoring, maintenance and installation via existing network connections

» Hardware-based management when system is powered off or when OS is unresponsive

» Remote power up / power down» Support of full KVM remote control» Remote boot and BIOS Update» Remote status information» Remote BIOS parameter changes and fi rmware updates» Proactive Alerting» For enhanced security HW-based encryption is included

This means:» Signifi cant reduction of on-site-fi ndings and fi eld work» Decrease of downtime and minimized time-to-repair» Increased effi ciency of IT technical staff» Reduced TCO (Total Cost of Ownership)

Currently available for KTQM67/77, KTQ67/77, KTH81, KTQM87 and KTQ87 Motherboard families.

Hardware-based remote Diagnosis and Repair with Intel® vPro™ Technology with Intel® Active Management Technology:

Remote power-up and access to protected memory - asset infor-mation, BIOS settings, event logs - when system is powered off*

Remote boot, console redirection, power reset, alerting and access to, protected memory - when OS is unresponsive*

Communication channel "below" the OS throughTCP/ IP Firmware stack - when the system’s working*

MedicalFactory Robots, HMI,Industrial PC

ATM, Kiosks, POS POI

IT or Service Provider can power on, remotely access and fi x inoperable Embedded systems

* Different examples for remote management and security capabilities depending on system status

IT-Console

14

New Long-Life Coolers available!

E.G. the new “Cooler Active 35W 33 mm longlife” (PN 1052-6345) is a cooling solution for 35W CPU’s like all mobile 3rd Generation Core CPU’s and some 2nd Generation Core CPU’s. It fi ts for KTQM67, KTQM77, KTHM65 and KTHM76 and is PWM controlled. The highest part of the cooler is 33 mm above PCB and the MTBF of the fan is 710.000 hours @ 40C, 177.500 hours @ 60C. Please ask for further models!

Evaluation Break-out Boards for the KT Feature Connector

The unique KT Evaluation Break-out Boards will simplify the ac-cess to the functions available on the KT Feature Connector and to add additional functions.

Up to 4 Evaluation Break-out Boards can be connected in series.

The fi rst board includes special functions, shared functions and standard functions, while the other boards include shared and standard functions only.

» 4 DAC & 5 ADC» System Monitoring LED’s» Thermo sensor onboard» 2 digital 7-segment LED» 18 Open Drain Output» 20 GPIO’s

» Thermo sensor remote» Case Open» iBotton» Fan1» Fan2

» Accessories «

Industrial MTBF

Accessories

www.kontron.com

Pico-ITX

Pico-ITX – the small, powerful and cost-effective 2.5" Motherboard family.

» Pico-ITX «

With the Pico-ITX form factor, Kontron supports a new defi ni-tion of small (100 x 72 mm), powerful and cost-effective 2.5" Motherboards. The pITX-E38, Kontron’s latest 2.5" Motherboard

based on the Pico-ITX industry standard, features the Intel® Atom™ E38xx series SoC, along with multiple I/O options and microSD-Card boot.

AccessoryKit Available

pITX-E38Ultrasmall 2.5“ Pico-ITX board with Intel® Atom™ E38XX System on Chip (SoC)

» Intel® Atom™ E38xx SoC (1, 2 or 4 cores), TDP: 5-10W» SO-DIMM Socket DDR3L-1333 Memory (up to 8GB)» Intel® Gen7 Graphics, OpenGL 3.0, OpenCL 1.2, DX11,

H.264, MPEG2, MCV, VC-1, VP8» LVDS 24Bit dual channel and DisplayPort 1.1a» 10/100/1000MBit RJ45 Ethernet LAN, SATA, mSATA or

mPCIe in mPCIe connector

» USB 2.0 & USB 3.0 ports, Serial ports 16550 UART, GPIOs» Bootable high capacity micro SD Card slot» Lockable DC power connector (5V)» Extended temperature operating from -25°C to +75°C (E1)

16

CONCEPT

MINI-ITXTT FAFF NLESS COMPUTER

CB 753 Dual Head

Pico-ITX standard cooling concept – perfect for Box-PC-Design

COM1

AudiomPCIe ormSATA

COM2SPIGPIOSATA0

LAN1

USB3USB2

Ext. Battery

Frontpanel

Clear CMOS

Always On

SOC Temp. Sensor

+5Vin Int.

Power OK LED

Fan

On the backside:» ISODIMM» ISD Card Slot» ISystem Temp. Sensor» IXDP (unsupported)

DP1 USB1 (USB2.0)

USB0 (USB 3.0/2.0)

5Vin Ext.

Pico-ITX

www.kontron.com

» Technical Information «

The pulse of innovation

» Computer-on-Module» Pico-ITX 2.5"» Mini-ITX to Flex-ATX

www.kontron.com18

» Embedded Flex-ATX Motherboards «

EmbeddedMotherboards

KTQ87/Flex KTH81/Flex KTQ77/FLEX KTQM67/FLEX KTA75/FLEX

Form Factor Flex-ATX Flex-ATX Flex-ATX Flex-ATX Flex-ATX

Dimensions (H x W x D) 9" x 7.5" (22,86 x 19,05 cm) 9" x 7.5" (22,86 x 19,05 cm) 9" x 7.5" (22,86 x 19,05 cm) 9" x 7.5" (22,86 x 19,05 cm) 9" x 7.5" (22,86 x 19,05 cm)

CPU Intel® Core i7-4770S GT2, i5-4570S GT2, i3-4330 GT2Intel® Pentium-3420 GT1 Intel® Celeron® G1820TE GT1

Intel® Core i7-4770S GT2, i5-4570S GT2, i3-4330 GT2Intel® Pentium-3420 GT1 Intel® Celeron® G1820TE GT1

Intel® Core™ i3-3220, i5-3550S, i7-3770Intel® Pentium G2120

Intel® Core™ i7-2710QE, i3-2330E, i5-2510EIntel® Celeron® Processor B810

R-464L Quad Core, R-460H Quad Core, R-460H Quad Core, R-272F Dual Core, R-268D Dual Core, R-268D Dual Core

Chipset Intel® Q87 Intel® H81 Intel® Q77 Intel® QM67 AMD A75 Hudson-D3 FCH

Main Memory Up to 32 GB DDR3L/DDR3 (max. 4x 8 GB) Up to 16 GB DDR3 (max. 2x 8 GB) Up to 32 GB DDR3 (max 4x 8GB), 1067/1333/1600 MHz support

Up to 32 GB DDR3 (max. 4x 8 GB) Up to 16GB DDR3 UDIMM (max 2x 8GB)

Front Side Bus Up to 20 GB/s point-to-point DMI 2.0 interface to PCHFour lanes in each direction

Up to 20 GB/s point-to-point DMI 2.0 interface to PCHFour lanes in each direction

Up to 20 Gb/s each direction, full duplex, DMI 2.0 interface to PCH, Four lanes in each direction

5 GT/s point-to-point DMI 2.0 interface to PCHFour lanes in each direction

UMI (Unifi ed Media Interface) interface, up to 4-lanes and 5GB/S per lane

Graphics Controller Intel® HD Graphics 4600 integrated,GT1 or GT2 depending on CPU type

Intel® HD Graphics 4600 integrated,GT1 or GT2 depending on CPU type

Integrated Intel® HD Graphics 3000 integrated AMD Radeon™ HD 7000G Series,supporting OpenGL/CL, Full DirectX® 11

Graphics 3x DisplayPort (1x shared with optionalLVDS),1x 18/24Bit dual Link LVDS interface

2x DisplayPort (1x shared with optionalLVDS),optional 1x 18/24Bit dual Link LVDS interface

2x DisplayPort, 1x CRT, 1x VGA 2x DisplayPort, 1x DVI-I, 1x LVDS / Embedded DP, HDMI via Adapter, (1x PCIe x 16 PCI slot)

3x DisplayPort version 1.2, 1x DisplayPort Optionally Add-On card, 1x LVDS Optionally Add-On card (TBD), 1x VGA

Ethernet Controller 1x Intel® Clarkville i218LM (i218-LM with AMT 9.0 support),1x Intel® Pearsonville i218AT

1x Intel® Clarkville i218V1x Intel® Pearsonville i218AT

- 1x Intel® Lewisville 82579LM,2x Intel® Hartwell 82574L

Intel® Pearsonville xGB PCI Express Ethernet controller(WGI211ATSLJXZ)

Ethernet 2x Intel® GB LAN (1x AMT 9.0 support) 2x Intel® GB LAN 3x GbE-LAN, (1x AMT 8.0 support) 3x Intel® GB LAN (1x AMT 8.0 support) 2x 10/100/1000Mbits/s

Hard Disk 6x SATA (SATA 150/300/600) w. RAID 0,1,5,10 support 4x SATA (2x SATA 150/300 and 2x SATA 600) 6x SATA interfaces (4x SATA 150/300 and 2x SATA 600) w. RAID 0/1/5/10, mSATA interface for SSD storage

6x SATA (4x SATA150/300 and 2x SATA600) w. RAID 0,1,5,10 support, mSATA for SSD storage

6x SATA (150/300 & 600)1x mSATA shared with mPCIe

Parallel Port n/a n/a - LPT in a FFC connector n/a

Flash Onboard - - - n/a -

PCI 1x PCI 1x PCI 2x PCI 32bits/33MHz 3x PCI 2x PCI 32bit/33MHz

PCI Express® / PCI support 1x PCIe x16 (Gen3), 1x PCIe x4 (Gen2), 1x PCIe x1 (Gen2) 1x PCIe x16 (Gen3), 1x PCIe x4 (Gen2), 1x PCIe x1 (Gen2) 1x PCIe x16, 1x PCIe x4 (in a x16 slot) 1x PCIe x16, 1x PCIe x1 1x PCIe x16 1x PCIe x4 Slot (in x16 slot)

Mini-PCI - - 1x mini-PCI Express® 2x mini PCI-Express 1x mPCIe Slot 1x mPCIe/mSATA (mechanically shared between mSATA and mPCIe)

USB 4x USB 3.0, 8x USB 2.0, (4x USB3.0/USB2.0 Rear IO, 8x USB2.0 Internal Header)

2x USB3.0, 8x USB2.0 (2x USB3.0/USB2.0 + 2x USB2.0 Rear IO; 8x USB2.0 Internal Header)

4x USB 3.0 & 10x USB 2.0 14x USB 2.0 12x USB (4x USB2.0 & 4x USB2.0/USB3.0 on Rear I/O)

IEEE 1394 Firewire n/a n/a - 2x IEEE1394a (Pin header) -

Serial 2x RS232 2x RS232 4x RS232 4x RS232 2x RS232

Rear I/O 4x USB 3.0/2.0, 3x DisplayPort, 2x RJ45 LAN ,2x3 mini Audio Jack tower

2x USB3.0/2.0, 2x USB2.0, 2x DisplayPort, 2x RJ45 LAN,2x3 mini Audio Jack Tower

1x DB9 serial port, 1x VGA, 1x Audio stacked 2x3 mini Jack tower, 6x USB, 2x DisplayPort, 3x RJ45 LAN

2x Dual USB +Displayport, 1x Dual USB + Ethernet, 1x Dual Ethernet, 1x DVI, Audio 3x

2x RJ45 (stacked), 4x USB 2.0, 4x USB 3.0, 3x DP

Audio Controller VT1708S, HD Audio 7.1 channel surround sound VT1708S, HD Audio 7.1 channel surround sound VIA 1708B, 7.1 Channel HD Audio, stacked 2x3 mini Jack tower

HD Audio 7.1, Mic x2, CDROM in and SPDIF VIA VT1708S, 7.1 Channel HD Audio 3x Audiojacks stack (in REAR-IO area)

Keyboard KBD/MSE pinrow connector KBD/MSE pinrow connector Internal PS2 Mouse/Keyboard connector Internal PS2 Mouse/Keyboard connector PS2 Mouse/Keyboard connector

Special Features DAC up to 160 GPIO, TPM, KT embedded feature port with ADC, Intel® AES security

DAC up to 160 GPIO, TPM, KT embedded feature port with ADC, Intel® AES security

KT embedded feature connector with ADC, DAC up to 160 GPIO

DAC up to 160 GPIO, TPM 1.2,KT embedded feature port with ADC

152 GPIO max. expansion, 15 Multiplexed (GPIO, DAC, ADC, PWM & TIMER), Watchdog, TPM 1.2, Exchangeable 3.0V Lithium battery for on-board Real Time Clock and CMOS RAM, KT embedded Controller

BIOS Phoenix Phoenix AMI UEFI AMI BIOS AMI EFI

Power Management ACPI 3.0 ACPI 3.0 - ACPI 3.0 ATX PSU

Operation Temperature 0°C to 60°C (32°F to 140°F) 0°C to 60°C (32°F to 140°F) 0°C - 60°C (32°F - 140°F) 0°C - 60°C (32°F - 140°F) 0°C - 60°C (32°F - 140°F)

Operating System Win7, WES7 32/64bit, Win8, WES8, Linux, VxWorks Win7, WES7 32/64bit, Win8, WES8, Linux, VxWorks WinXP, Win7 (32/64), WES7 (32/64), Linux, VxWorks WES7 32/64bit, Linux, VxWorks, WindRiver Linux Win 7 (32 and 64bit), Win 8 (32 and 64bit), WinXP (32 bit), WES7

www.kontron.com20

Embedded Mini-ITXMotherboards170 x 170 mm

mITX-E38 KTQM87/mITX KTQ87/mITX KTH81/mITX KTQM77/mITX KTHM76/mITX

Form Factor Thin Mini-ITX Mini-ITX Mini-ITX Mini-ITX Mini-ITX Mini-ITX

Dimensions (H x W x D) 6.7" x 6.7" (17,0 x 17,0 cm) 6.7" x 6.7" (17,0 x 17,0 cm) 6.7" x 6.7" (17,0 x 17,0 cm) 6.7" x 6.7" (17,0 x 17,0 cm) 6.7" x 6.7" (17,0 x 17,0 cm) 6.7" x 6.7" (17,0 x 17,0 cm)

CPU Intel® Atom™ E3845, E3826, E3815 Intel® Core™ i7-4700EQ, i5-4400E, i3-4100EIntel® Celeron® 2000E

Intel® Core™ i5-4570S, i7-4770S GT2, i3-4330 GT2; Intel® Pentium-3420 GT1Intel® Celeron® G1820TE GT1

Intel® Core™ i7-4770S GT2 , i5-4570S GT2, i3-4330 GT2; Intel® Pentium-3420 GT1, Intel® Celeron® G1820TE GT1

Intel® Core™ i3-3120ME, i5-3610ME, i7-3610QE Intel® Core™ i7-2710QE, i3-2330E,i5-2510EIntel® Celeron® Processor B810

Chipset - Intel® QM87 Intel® Q87 Intel® H81 Intel® QM77 Intel® HM65

Main Memory Up to 8 GB SO-DIMM Socket DDR3L-1333/1066 (max. 1x 8GB)

Up to 16 GB DDR3 (max. 2x 8 GB) Up to 16 GB DDR3 (max. 2x 8 GB) Up to 16 GB DDR3 (max. 2x 8 GB) Up to 16 GB DDR3 (max. 2x 8 GB) Up to 16 GB DDR3 (max. 2x 8 GB)

Front Side Bus - Up to 20 GT/s point-to-point DMI 2.0 interface to PCH, Four lanes in each directio

Up to 20 GB/s point-to-point DMI 2.0 interface to PCH, Four lanes in each direction

Up to 20 GB/s point-to-point DMI 2.0 interface to PCH, Four lanes in each direction

5 GT/s point-to-point DMI 2.0 interface to PCH, Four lanes in each direction

5 GT/s point-to-point DMI 2.0 interface to PCH, Four lanes in each directio

Graphics Controller Intel® Gen7 GraphicsOpenGL 3.0, OpenCL 1.2

Intel® ® HD Graphics 4600 internal Intel® HD Graphics 4600 integrated, GT1 or GT2 depending on CPU type

Intel® HD Graphics 4600 integrated, GT1 or GT2 depending on CPU type

Intel® HD Graphics 4000 integrated,supporting 3 independent Displays

Intel® HD Graphics 3000 integrated

Graphics 2x independent graphic outputs, E3815/E3826: 1x DP 1.1a, up to 2560x1600, E3845: 1x DP 1.1a, up to 2560x1600, 1x LVDS dual channel 24bit, up to 1920x1200

3x DisplayPort (1x PCIe x16 Gen3) 3x DisplayPort (1x PCIe x16 Gen3) 2x DisplayPort (1x PCIe x16 Gen2) 2x DisplayPort, 1x DVI-I, 1x LVDS / Embedded DP, HDMI via Adapter (1 x PCIe x 16 PCI slot)

2x DisplayPort, 1x DVI-I, 1x LVDS, HDMI via Adapter (1 x PCIe x 16 PCI slot)

Ethernet Controller Intel® Pearsonville i211AT 1x Intel® Clarksville WGI218LM (supporting AMT 9.0)1x Intel® Pearsonville I211AT

1x Intel® Clarkville i218LM (with AMT 9.0 support), 1x Intel® Pearsonville i218AT

1x Intel® Clarkville i218V1x Intel® Pearsonville i218AT

1x Intel® Lewisville 82579LM, 2x Intel® Hartwell 82574L 1x Intel® Lewisville 82579LM

Ethernet 2x Intel® GB LAN 2x Intel® GB LAN (1x AMT 9.0 support) 2x Intel® GB LAN (1x AMT 9.0 support) 2x Intel® GB LAN 3x Intel® GB LAN (1x AMT 8.0 support) 1x Intel® GB LAN

Hard Disk 2x SATA (SATA 150/300)(1x mSATA shared with mPCIe)

4 x SATA (SATA 150/300/600) w. RAID 0,1,5,10 support, 2x mSATA

5x SATA (SATA 150/300/600) w. RAID 0,1,5,10 support, 1x mSATA (w. USB, LPC)

3x SATA (2x SATA 150/300, 1x SATA 600), 1x mSATA (w. USB, LPC)

6x SATA (4x SATA150/300 and 2x SATA600) w. RAID 0,1,5,10 support, mSATA for SSD Storage

6x SATA (4x SATA150/300 and 2x SATA600)

Parallel Port n/a n/a n/a n/a Optional LPT in a FFC connector

Flash Onboard eMMC 16GB TLC Nand. E3845 only - - - n/a mSATA

PCI Express® / PCI support

1x PCIe x1 1x PCIe x16 Gen3 1x PCIe x16 Gen3 1x PCIe x16 Gen2 1x PCIe x16, 1 PCIe x1 1x PCIe x16, 1x PCIe x1

Mini-PCI 1x mini-PCI Express® x1 2x mini-PCI Express® 1x mini-PCI Express® (w. USB) 1x mini-PCI Express® (w. USB) 2x mini PCI-Express® 2x mini PCI-Express®

USB E3815/E3826: 3x USB 2.0, 1x USB2.0/3.0; E3845: 6x USB 2.0, 1x USB2.0/3.0

4x USB 3.0/2.0, 8x USB 2.0 (2x Internal Header, 2x PCIe sockets)

4x USB 3.0/2.0, 6x USB 2.0 2x USB 3.0/2.0, 8x USB 2.0 10x USB 2.0, 4x USB 3.0 12 x USB 2.0 (6 External + 6 Internal)

IEEE 1394 Firewire n/a n/a n/a n/a 2x IEEE1394a (Pin header) n/a

Serial E3815: 2x RS232 UART 16550E3826/E3845: 6x RS232 UART 16550

2x RS232 2x RS232 2x RS232 4x RS232 4x RS232

Rear I/O Ext. 12V, 2x DP, 2x USB 2.0,1x USB 3.0, 2x LAN, 1x Audio Jack

4x USB3.0/USB2.0, 4x USB2.0,, 3x DisplayPort, 2x RJ45 LAN, 1x3 mini Audio Jack tower

4x USB 3.0/2.0, 3x DisplayPort,2x RJ45 LAN, 2x3 mini Audio Jack tower

2x USB 3.0/2.0, 2x USB 2.0, 2x DisplayPort, 2x RJ45 LAN, 2x3 mini Audio Jack tower

2x Dual USB +Displayport, 1x Dual USB + Ethernet, 1x Dual Ethernet, 1x DVI, Audio 3x

2x Dual USB +Displayport, 1x Dual USB + Ethernet, 1x DVI, 1x Audio 3x

Audio Controller VIA VT1708S, HD Analog, 2x Audio Jack, SPDIF Out, Line-Out

VT1708S, HD Audio 7.1 channel surround sound

VT1708S, HD Audio 7.1 channel surround sound

VT1708S, HD Audio 7.1 channel surround sound HD 7.1, Mic x2, CDROM in and SPDIF VIA 1708B, HD Audio 7.1, Mic x2,CDROM in and SPDIF

Keyboard 6-pin PS/2 Keyboard/Mouse KBD/MSE pinrow connector n/a n/a Internal PS2 Mouse/Keyboard connector Internal PS2 Mouse/Keyboard connector

Special Features DAC up to 160 GPIO, TPM (E3845 only), KT embedded feature port with ADC; E3826 and E3845 only: 1x Micro SD Card Slot , SD Card 3.0 interface

DAC up to 160 GPIO, TPM, KT embedded feature port with ADC, Intel® AES security

DAC up to 160 GPIO, TPM, KT embedded feature port with ADC, Intel® AES security, ATX power supply only!

DAC up to 160 GPIO, TPM, KT embedded feature port with ADC, Intel® AES security, ATX Power supply only

DAC up to 160 GPIO, TPM, KT embedded feature port with ADC, ATX and single 12V power supply

DAC up to 160 GPIO, TPM 1.2,KT embedded feature port with ADCATX and single 12V power supply on Mini-ITX

BIOS Phoenix Phoenix Phoenix Phoenix AMI AMI

Power Management - ACPI 3.0 ACPI 3.0 ACPI 3.0 ACPI 3.0 ACPI 3.0

Operation Temperature 0°C to 60°C (32°F to 140°F) 0°C to 60°C (32°F to 140°F) 0°C to 60°C (32°F to 140°F) 0°C to 60°C (32°F to 140°F) 0°C - 60°C (32°F - 140°F) 0°C - 60°C (32°F - 140°F)

Operating System Win7, WES7, WES8, Win8 (32 and 64bit), Linux, WxWorks

Win XP, Win7, WES7 32/64bit, Win8, Linux, VxWorks

Win7, WES7 32/64bit, Win8, WES8, Linux, VxWorks

Win7, WES7 32/64bit, Win8, WES8Linux, VxWorks

WES7 32/64bit, Linux, VxWorks, WindRiver Linux WES7 32/64bit, Linux, VxWorks, WindRiver, Linux

» Embedded Mini-ITX Motherboards «

22

Embedded Mini-ITXMotherboards170 x 170 mm

KTA70m/mITX KTT30/mITX

Form Factor Mini-ITX Mini-ITX

Dimensions (H x W x D) 6.7” x 6.7” (17,0 x 17,0 cm) 6.7” x 6.7” (17,0 x 17,0 cm)

CPU AMD R-Series R-252F,R-452L,R-460L NVIDIA Tegra 3ybr> ARM Cortex-A9 Quad Core 900MHz

Chipset AMD Fusion Controller Hub A70M -

Main Memory Up to 16 GB DDR3 (max. 2x 8 GB) Up to 2 GB DDR3L memory down

Front Side Bus Unifi ed Media Interface (UMI), Up to 4-lanes and 2GB/S per lane

-

Graphics Controller Integrated Graphics AMD Radeon™ HD 7000G, 2D Acceleration Features, Open GL 4.2 & 2.0, DirectX® 11 compliant 3D Acceleration Features, Dedicated hardware (UVD 3) for H.264, VC-1, DivX and MPEG2 decode

NVIDIA GeForce GPU, Enhanced 3D capabilities, 1080p H264 MPEG-4 encoding/decoding Video Processorsupport 2 independent displays

Graphics 3x DisplayPort, Optionally Add-On card with 1x DisplayPort, Up to 4x independent display outputs

1x HDMI 1.4a (up to 1920x1080 pixel),1x LVDS 24bit (up to 2048x1536 pixel @ 18bpp)), DSI (up to 1440x900 @ 18bpp)

Ethernet Controller Intel® Pearsonville xGB PCI Express Ethernet controller(WGI211ATSLJXZ)

Intel® 82574L

Ethernet 2x 10/100/1000 Mbits Intel® GB LAN 1x 10/100/1000 Mbit LAN

Hard Disk 5x SATA (SATA 150/300/600) w. RAID 0,1,10 support 1x mSATA

1x SATA (SATA 150/300), 1x mSATA shared with Mini-PCI Express

Parallel Port n/a n/a

Flash Onboard n/a 1x eMMC (Bootable)


1x PCIe x8 (in mechanically x16 slot)1x PCIe x4 (in mechanically x16 slot)

-

Mini-PCI 1x mini-PCI Express (mechanically sharing space with mSATA slot)

1x Mini-PCI Express x1,1x Mini-PCI Express x1 shared with mSATA

USB 4x USB2.0/3.0, 9x USB2.0 3x USB 2.0 (2x Type A and 1x Micro (supports also one port USB client mode))

IEEE 1394 Firewire n/a n/a

Serial 2x RS232 2x RS232

Rear I/O 4x USB 2.0, 2x DP + 2x USB 2.0/USB3.0,1x DP, 1x 2x RJ45, 1x Audio Jack, 1x 4 pole External connector

2x USB 2.0 Type A, 1x USB 2.0 micro (USB client), 1x HDMI, 1x Audio (LineIn, LineOut, Mic), 1x Power external

Audio Controller VT1708SHD Audio 7.1 channel surround sound

Two integrated audio controllers(PCM and Inter-IC Sound, called IIS or I2S)

Keyboard Internal PS2 Mouse/Keyboard connector via GPIO or USB

Special Features 15 Multiplexed (GPIO, DAC, ADC, PWM & TIMER), Possible 152 GPIO expansionSoftware Watchdog, TPM, KT embedded controller for feature rich Intel®ligent I/O

Up to 18 GPIOs on a Feature connector,USB modem card interface with SIM card socket, One SPITM interface (3.3V) on a pin header, Serial Atmel® touch screen interface (I2CTM), CSI/DSI/12-bit par. Camera input, 2x SDcard socket

BIOS AMI Bootloader on SPI Flash

Power Management ACPI 3.0 -

Operation Temperature 0°C - 60°C (32°F - 140°F) 0°C to 60°C (32°F to 140°F)

Operating System Win XP, Win7 (32 and 64bit), WES7, Win 8 (32 and 64bit)

WEC7, Linux, Android

» Embedded Mini-ITX Motherboards «

www.kontron.com

» Embedded Pico-ITX SBC «

2.5" Pico-ITX

pITX-E38 KTA55/pITX KTAM3874/pITX

Form Factor Pico-ITX Pico-ITX Pico-ITX

Dimensions (H x W x D) 100 x 72 mm 100 x 72 mm 100 x 72 mm

CPU Intel® Atom™ E3845, E3826, E3815 AMD G-series 1.0 GHz dual core T40N TI® AM3874 SitaraTM up to 800 MHzARM® CortexTM-A8

Chipset - AMD A55E -

Main Memory 1x SO-DIMM Socket supporting DDR3L-1333/1066 (up to 8 GB)

Up to 1x 4 GB DDR3 SODIMM 1GB Dual 32bit DDR3-800 memory onboard (up to 2 GB optional)

Graphics 2x independent graphic outputs, 1x DP 1.1a, up to 2560x1600, 1x LVDS dual channel 24bit, up to 1920x1200

1x DVI and VGA Output via DVI-I, 2x 24 Bit LVDS dual independent display support up to 2 x Full HD

2 independent graphic outputs,1x HDMI 1.3a, up to 1080p,1x LVDS dual channel 24bit, up to 1080p

Ethernet 1x RJ45 10/100/100 Mb/s Ethernet 1x 10/100/1000Mbit Ethernet 2x 10/100 Mb/s Ethernetwith integrated optional switch

Hard Disk 1x microSD card slot (SDXC) 1x microSD-Card-Slot, bootable 1x microSD card slot, Onboard 4GB eMMC Nand fl ash (optionally up to 16GB)

SATA 1x SATA 2.0, 1x mSATA shared with mPCIe

2x SATA connector incl. RAID-support

1x SATA 2.0,1x mSATA shared with mPCIe

PCI Express® / PCI support 1x mPCIe® 2.0 port (x1 lane) - 1x mPCIe® 2.0 port (x1 lane)

USB 1x USB2.0 + 1x USB3.0/2.0 (Front IO)2x USB2.0 (Internal)

6x USB 2.0 4x USB 2.0 (2 on front I/O, 2 internal (1x USB client)), 1x USB 2.0 on mPCIe connector

Serial 2x Serial ports UART 16550(3v3 digital inputs/outputs)

- 2x RS232,1x RS232/485

Audio HD Analog audio interface(Line-In, Line-Out, Mic-In)

Via VT1708S Analog audio interface (Line-In, Line-Out, Mic-In), 1 W Speaker interface

I/Os 8x GPIOs, SUSLED, SATALED 8x GPIO, Backlight Output selectable 5V or 12V, TPM 1.2

26x GPIOs, 1x I2C, 2x CAN Bus, 1x UART, Timer and SPI output shared with GPIO´s, 1x SIM-card slot onBoard for mPCIe modem cards

Operating System WEC7, WES7, WES8, Win7, Win8,Linux, Linux Yocto, VxWork

WEC7, WinXPe, WES7, Linux, VxWorks WEC7, Linux, Android

Operation Temperature -25°C to +75°C (E1) 0°C - 60°C -40°C to +85°C (E2)

Cooling Passive (5W SoC), Active (7-10W SoC)

- -

Power Supply Single supply 5V DC, Internal and external lockable connector

Single supply 5V DC, Internal andexternal lockable connector

Single supply 5V DC

Power Consumption 3.8W to 5.75W Idle (depending on CPU)

7.25 W Idle 4.9 W Idle

www.kontron.com24

» COM Express® basic «

COM Express® basic

COMe-bHL6 COMe-bHL6RXT COMe-bIP# COMe-bSC# COMe-bSC2RXT

Compliance COM Express® basic, Pin-out Type 6 COM Express® basic, Pin-out Type 6 COM Express® basic, Pin-out Type 2 & 6 COM Express® basic, Pin-out Type 2 & 6 COM Express® basic, Pin-out Type 2

Dimensions (H x W x D) 125 x 95 mm 125 x 95 mm 125 x 95 mm 125 x 95 mm 125 x 95 mm

CPU Intel® Core™ i7-4860EQ, i7-4850EQ, i7-4700EQ, i5-4410E, i5-4400E, i5-4422E, i5-4402E, i3-4110E, i3-4100E, i3-4112E, i3-4102E

Intel® Celeron® 2000E, 2002E

Intel® Core™ i7-4700EQ, i7-4860EQ, i5-4410E, i7-4400E Intel® Core™ i7-3615QE, i7-3612QE, i7-3555LE, i7-3517UE, i5-3610ME , i3-3120ME, i3-3217UE

Intel® Celeron® 1020E, 1047UE, 927UE

Intel® Core™ i7-2715QE, i7-2655LE, i7-2610UE, i5-2515E, i3-2310E, i3-2340UE

Intel® Celeron® B810E, 847E, 827E, 807UE

Intel® Core™ i7-2655LE, Intel® Core™ i7-2610UE

Chipset Intel® Mobile QM87 (Core™ i5, i7)Intel® Mobile HM86 (Core™ i3 & Celeron®)

Intel® Mobile QM87 Intel® Mobile QM77 (Core™ i3, i5, i7),Intel® Mobile HM76 (Celeron®)

Intel® Mobile QM67 (Core™ i3, i5, i7)Intel® Mobile HM65 (Celeron®)

Intel® Mobile QM67 (Core™ i7)

Main Memory 2x DDR3L-1600 SO-DIMM up to 2x 8GB

2x DDR3L-1600 ECC SO-DIMM up to 2x 8GB

2x DDR3-1600 SO-DIMM up to 2x 8 GB or 2x DDR3-1600 ECC SO-DIMM up to 2x 8 GB

2x DDR3-1333 ECC SO-DIMM up to 2x 8GB or 2x DDR3-1333 SO-DIMM up to 2x 8GB

2x DDR3-1333 ECC SO-DIMM up to 2x 8GB

Graphics Controller Intel® HD5200 (GT3e), Intel® HD4600 (GT2), Intel® HD Graphics (GT1)

Intel® HD5200 (GT3e), Intel® HD4600 (GT2) Intel® HD4000 (GT2),Intel® HD Graphics (GT1)

Intel® HD3000 (GT2)Intel® HD Graphics (GT1)

Intel® HD3000 (GT2)

Ethernet Controller Intel® I218LM Intel® I218LM Intel® 82579LM Intel® 82579LM Intel® 82579LM

Ethernet 10/100/1000 MBit Ethernet 10/100/1000 MBit Ethernet 10/100/1000 MBit Ethernet 10/100/1000 MBit Ethernet 10/100/1000 MBit Ethernet

Hard Disk QM87: 3x SATA 6Gb/s, 1x SATA 3Gb/sHM86: 2x SATA 6Gb/s, 2x SATA 3Gb/s

QM87: 3x SATA 6Gb/s, 1x SATA 3Gb/s Type 2: 2x SATA 6Gb/s, 2x SATA 3Gb/s, 1x PATA; Type 6: 2x SATA 6Gb/s, 2x SATA 3Gb/s

Type 2: 2x SATA 6Gb/s, 2x SATA 3Gb/s, 1x PATAType 6: 2x SATA 6Gb/s, 2x SATA 3Gb/s

2x SATA 6Gb/s, 2x SATA 3Gb/s, 1x PATA

PCI Express® / PCI support 7x PCIe x1, 1x PEG x16 7x PCIe x1, 1x PEG x16 Type 2: 1x PEG x16, 5x PCIe x1, PCI Rev 2.3 @ 33 MHzType 6: 1x PEG x16, 7x PCIe x1

Type 2: 1x PEG x16, 5x PCIe x1, PCI Rev 2.3 @ 33 MHzType 6: 1x PEG x16, 6x PCIe x1

1x PEG x16, 5x PCIe x1, PCI Rev 2.3 @ 33 MHz

Panel signal DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: Yes, LVDS: Dual Channel 18/24bit

DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: Yes, LVDS: Dual Channel 18/24bit

DDI1: DP++ or SDVO, DDI2: DP++, DDI3: DP++, VGA: Yes, LVDS: Dual Channel 18/24bit

DDI1: DP++ or SDVO, DDI2: DP++, DDI3: DP++ or eDP, VGA: Yes,LVDS: Dual Channel 18/24bit

DDI1: DP++ or SDVO, DDI2: DP++, DDI3: DP++ or eDP, VGA: Yes, LVDS: Dual Channel 18/24bit

USB 4x USB 3.0 + 4x USB 2.0 4x USB 3.0 + 4x USB 2.0 Type 2: 8x USB 2.0Type 6: 2x USB 3.0 + 6x USB 2.0

Type 2: 8x USB 2.0,Type 6: 6x USB 2.0 + 2x USB 3.0 (Renesas PD720200A)

8x USB 2.0

Serial 2x serial interface (RX/TX only) 2x serial interface (RX/TX only) 2x serial interface (RX/TX only) on Type 6 2x serial interface (RX/TX only) on Type 6 -

Audio Intel® High Defi nition Audio Intel® High Defi nition Audio Intel® High Defi nition Audio Intel® High Defi nition Audio Intel® High Defi nition Audio

Common Features SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS

BIOS Phoenix Secure Core UEFI Phoenix Secure Core UEFI AMI Aptio UEFI AMI Aptio UEFI AMI Aptio UEFI

Options 1x PCIe x1 additional w/o onboard LAN, vPRO (AMT/TXT/AES Support), eDP instead of LVDS

1x PCIe x1 additional w/o onboard LAN, vPRO (AMT/TXT/AES Support), eDP instead of LVDS

1x PCIe x1 additional w/o onboard LAN vPRO (AMT/TXT/AES Support)

1x PCIe x1 additional w/o onboard LAN, vPRO (AMT/TXT/AES Support)

1x PCIe x1 additional w/o onboard LAN, vPRO (AMT/TXT/AES Support)

Power Management ACPI 4.0, S5 Eco ACPI 4.0, S5 Eco,Kontron Rapid Shut down Technology

ACPI 4.0, S5 Eco ACPI 4.0, S5 Eco ACPI 4.0, S5 Eco,Kontron Rapid Shut down Technology

Power Supply 8.5V – 20V Wide Range, Single Supply Power

ATX or 12V Single Supply Power 8.5V – 20V Wide Range, Single Supply Power

8.5V–18V Wide Range, Single Supply Power

ATX or 12V Single Supply Power

Special Features POSCAP capacitors, Trusted Platfom Module TPM 1.2, 4k Resolutions, Flexible PEG lane confi guration by Setup Option

POSCAP capacitors, Trusted Platfom Module TPM 1.2, 4k Resolutions, Flexible PEG lane confi guration by Setup Option

POSCAP capacitors, Trusted Platfom Module TPM 1.2, eDP enabling by external Strap Option

POSCAP capacitors, Trusted Platfom Module TPM 1.2, PEG/DDI sharing on Type 2

POSCAP capacitors, Trusted Platfom Module TPM 1.2 PEG/DDI sharing

Operating System Windows® 8, Windows® 7, WE8S, WES7, Linux, VxWorks Windows® 8, Windows® 7, WE8S, WES7, Linux, VxWorks Windows® 8, Windows® 7, WES7, WinXP, XPe, Linux, VxWorks

Windows® 8, Windows® 7, WES7, WinXP, XPe, Linux, VxWorks

Windows® 8, Windows® 7, WES7, WinXP, XPe, Linux, VxWorks

Temperature Commercial temperature: 0°C to +60°C operating,Extended temperature: -25°C to +75°C operating,

Industrial temperature: -40°C to +85°C operating

Commercial temperature: 0°C to +60°C operatingExtended temperature: -25°C to +75°C operating,

Commercial temperature:0°C to +60°C operatingExtended temperature:-25°C to +75°C operating

Industrial temperature: -40°C to +85°C operating

26

» COM Express® compact «

COM Express® compact

COMe-cHL6 COMe-cBTc6 / cBTi6 COMe-cBTi6R

Compliance COM Express® compact, Pin-out Type 6

COM Express® compact, Pin-out Type 6



CPU Intel® Core™ i7-4650U, i5-4300U, i3-4010U

Intel® Celeron® 2980U,

COMe-cBTc6: Intel® Atom™ E3815; Intel® Celeron® J1900, N2920,N2930, N2807

COMe-cBTi6: Intel® Atom™ E3845, E3827, E3826, E3825, E3815

Intel® Atom™ E3845, E3827, E3826, E3825, E3815

Chipset Intel® 8-Series LynxPoint-LP integrated in CPU

- -

Main Memory 1x DDR3L-1600 SO-DIMM up to 8GB, 1x DDR3L-1600 memory down 2-4GB

2x DDR3L-1333 SODIMM up to 2x4GB 2x DDR3L-1333 ECC memory down up to 4GB or 2x DDR3L-1333 memory down up to 8GB

Graphics Controller Intel® HD5000 (GT3), Intel® HD4400 (GT2), Intel® HD Graphics (GT1)

Intel® HD Graphics (Gen7) Intel® HD Graphics (Gen7)

Ethernet Controller Intel® I218LM COMe-cBTc6 Intel® I211ATCOMe-cBTi6 Intel® I210IT

USB SMSC LAN7500i, PCIe Intel® I210IT optional

Ethernet 10/100/1000 MBit Ethernet 10/100/1000 MBit Ethernet 10/100/1000 MBit Ethernet

Hard Disk 4x SATA 6Gb/s 2x SATA 3Gb/s 2x SATA 3Gb/s

Flash Onboard - on E3800 CPU only:2 - 64GB eMMC, 1x microSD Socket

2 - 64GB eMMC, 1x microSD Socket

PCI Express® / PCI support 4x PCIe Gen 2.0 3x PCIe x1 4x PCIe Gen 2.0

Panel signal DDI1: DP++, DDI2: DP++, DDI3: -, VGA: -, LVDS: Dual Channel 18/24bit

DDI1: DP++, DDI2: DP++ (shared w/LVDS), DDI3: -, VGA: Yes, LVDS: Dual Channel 18/24bit

DDI1: DP++, DDI2: DP++ (shared w/LVDS), DDI3: -, VGA: Yes, LVDS: Dual Channel 18/24bit

USB 2x USB 3.0, 6x USB 2.0 1x USB 3.0 (incl. USB 2.0), 3x USB 2.0 from CPU, on COMe-cBTi6 Version only: 4x USB 2.0 from HSIC Hub

1x USB 3.0 (incl. USB 2.0), 2x USB 2.0 from CPU, 4x USB 2.0 from HSIC Hub, 1x USB OTG

Serial 2x serial interface (RX/TX only) 2x serial interface (RX/TX only) 2x serial interface (RX/TX only)

Audio Intel® High Defi nition Audio Intel® High Defi nition Audio Intel® High Defi nition Audio

Common Features SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS

SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS


BIOS Phoenix Secure Core UEFI Phoenix Secure Core UEFI Phoenix Secure Core UEFI

Options 1x PCIe x2 additional w/o onboard LAN, eDP instead of LVDS, vPRO (AMT/TXT/AES Support)

1x PCIe x1 additional w/o onboard LAN, Trusted Platform Module TPM 1.2, on E38xx CPU only: eMMC Flash onboard (2-32GB SLC, 4-64GB MLC), AES-NI

ECC or non-ECC memory, eMMC Flash onboard (2-32GB SLC, 4-64GB MLC), microSD Socket, PCIe GBEthernet, AES-NI

Power Management ACPI 4.0, S5 Eco ACPI, S5 Eco ACPI, S5 EcoKontron Rapid Shut down Technology


4.75V – 20V Wide Range, Single Supply Power


Special Features POSCAP capacitors, Trusted Platfom Module TPM 1.2, 4k Resolutions

POSCAP capacitors, LVDS/DP Multiplexer

POSCAP capacitors, GPIO/SDIO Switch, LVDS/DP Multiplexer, 2x MIPI-CSI on PEG interface

Operating System Windows® 8, Windows® 7, WE8S, WES7, Linux, VxWorks

Windows® 8, Windows® 7, WE8S, WES7, WEC7, Linux, VxWorks


Temperature Commercial temperature: 0°C to +60°C operatingExtended temperature: -25°C to +75°C operating

Commercial temperature: 0°C to +60°C operatingIndustrial temperature: -40°C to +85°C operating

Industrial temperature:-40°C to +85°C operating

www.kontron.com

COM Express® compact

COMe-cTH6 COMe-cCT6 COMe-cOH#

Compliance COM Express® compact, Pin-out Type 6


COM Express® compact, Pin-out Type 2 & 6


CPU AMD® R-Series APU R-460L, R-452L, R-260H

Intel® Atom™ D2550, N2800, N2600 AMD® G-Series APU T56N, T40N, T52R, T44R

Chipset AMD™ FusionControllerHub A70M M3 Intel® NM10 Express Chipset Type 2: AMD™ FCH A55EType 6: AMD™ FCH A50M

Main Memory 2x DDR3-1333 SO-DIMM up to 2x4GB 1x DDR3-1066 SO-DIMM up to 4GB 2x DDR3-1066 up to 2x4GB

Graphics Controller AMD Radeon™HD7620G (R-460L), AMD Radeon™HD7600G (R-452L), AMD Radeon™HD7500G (R-260H)

Intel® GMA 3650 (D2550, N2800), Intel® GMA 3600 (N2600)

AMD Radeon™HD6310 (T56N, T52R)AMD Radeon™HD6250 (T40N, T44R)

Ethernet Controller Intel® I210-AT Intel® 82574L Intel® 82574L

Ethernet 10/100/1000 MBit Ethernet 10/100/1000 Mbit Ethernet 10/100/1000 MBit Ethernet

Hard Disk 4x SATA 6Gb/s 2x SATA 3Gb/s 4x SATA 3Gb/s1x PATA (Marvel 88SA8052) on Type 2

Flash Onboard - 2 - 64GB SATA NANDrive -

PCI Express® / PCI support 1x PEG x8, 7x PCIe x1 3x PCIe x1 6x PCIe x1, 1x PCI (Type 2 only)

Panel signal DDI1: DP++, DDI2: DP++ shared withLVDS, DDI3: DP++ shared with VGA, VGA: Yes, LVDS: Dual Channel 18/24bit

DDI1: DP++, DDI2: DP++, DDI3:-, VGA: Yes, LVDS: Dual Channel 18/24bit

DDi1: DP++, DDI2: DP++ shared with LVDS, DDI3: -, VGA: yes, LVDS: Dual Channel 18/24bit (Type 2), LVDS: Single Channel 18bit (Type 6)

USB 4x USB 2.04x USB 3.0

8x USB 2.0, 2x USB 3.0 optional (TI TUSB7320)

Type 2: 8x USB 2.0Type 6: 6x USB 2.0 + 2x USB 3.0 (Renesas PD720200A)

Serial 2x serial interface (RX/TX only) 2x serial interface (RX/TX only) optional

2x serial interface (RX/TX only) on Type 6

Audio High Defi nition Audio Intel® High Defi nition Audio High Defi nition Audio



SPI, LPC, SMB, Fast I²C, Watchdog, RTC, MARS

BIOS AMI Aptio UEFI AMI APTIO (UEFI) AMI APTIO (UEFI)

Options - 1x PCIe x1 additional w/o onboard LAN, 2x USB 3.0 (TI TUSB7320), Trusted Platfom Module TPM 1.22x UART, SATA Flash (2-32GB SLC, 4-64GB MLC), Secure Boot

-

Power Management ACPI 4.0, S5 Eco ACPI 3.0, S5 Eco ACPI 3.0, S5 Eco




Special Features POSCAP capacitors, Trusted Platfom Module TPM 1.2

POSCAP capacitors POSCAP capacitors

Operating System Windows® 8, Windows® 7, WES7, Linux

Windows® 7, WES7, WEC7, Windows® XP, Linux, VxWorks

Windows® 8, Windows® 7, WES7, WEC7, WinXP, XPe, Linux

Temperature Commercial temperature: 0°C to +60°C operating

Commercial temperature:0°C to +60°C operatingExtended temperature: -25°C to +75°C operatingIndustrial temperature: -40°C to +85°C operating

Commercial temperature:0°C to +60°C operating

28

COMe-mBTi10 COMe-mBTc10 COMe-mCT10

Compliance COM Express® mini, Pin-out Type 10 COM Express® mini, Pin-out Type 10 COM Express® mini, Pin-out Type 10


CPU Intel® Atom™ E3845, E3827, E3826,E3825, E3815

Intel® Atom™ E3815Intel® Celeron® J1900, N2920, N2930, N2807

Intel® Atom™ D2550, N2800, N2600

Chipset - - Intel® NM10 Express Chipset

Main Memory Up to 8GB DDR3L-1333 memorydown (ECC optional)

Up to 8GB DDR3L-1333/1066 memory down (E3815ECC optional)

Up to 2GB DDR3-1066 memory down

Graphics Controller Intel® HD Graphics (Gen7) Intel® HD Graphics (Gen7) Intel® GMA 3650 (D2550, N2800), Intel® GMA 3600 (N2600)

Ethernet Controller Intel® I210IT Intel® I211AT Intel® 82574L

Ethernet 10/100/1000 MBit Ethernet 10/100/1000 MBit Ethernet 10/100/1000 Mbit LAN

Hard Disk 2x SATA 3Gb/s 2x SATA 3Gb/s 2x SATA 3Gb/s

Flash Onboard 2 - 64GB eMMC E3815 only: 2 - 64GB eMMC 2-64 GB SATA NANDrive

PCI Express® / PCI support 3x PCIe x1 3x PCIe x1 3x PCIe x1

Panel signal DDI: DP++, LVDS: Single Channel 18/24bit or eDP

DDI: DP++, LVDS: Single Channel 18/24bit or eDP

DDI: DP++, LVDS: Single Channel 18/24bit

USB 1x USB 3.0 (incl. USB 2.0), 3x USB2.0 from CPU, 4x USB 2.0 fromHSIC Hub

1x USB 3.0 (incl. USB 2.0), 3x USB 2.0 from CPU

8x USB 2.0

Serial 2x serial interface (RX/TX only) 2x serial interface (RX/TX only) 2x serial interface (RX/TX only) opt.

Audio Intel® High Defi nition Audio Intel® High Defi nition Audio Intel® High Defi nition Audio




BIOS Phoenix Secure Core UEFI Phoenix Secure Core UEFI AMI Aptio (UEFI)

Options 1x PCIe x1 additional w/o onboard LAN,Trusted Platform Module TPM 1.2, ECCmemory, eMMC Flash onboard (2-32GBSLC, 4-64GB MLC), eDP instead of LVDS,General Purpose SPI instead of Boot SPI, AES-NI

1x PCIe x1 additional w/o onboard LAN, Trusted Platform Module TPM 1.2, ECC memory, E3815 variant only: eMMC Flash onboard (2-32GB SLC, 4-64GB MLC), eDP instead of LVDS, General Purpose SPI instead of Boot SPI, AES-NI

1x PCIe x1 additional w/o onboard LAN, Trusted Platfom Module TPM 1.2, 2x UART, SATA Flash (2-32GB SLC, 4-64GB MLC), Secure Boot

Power Management ACPI, S5 Eco ACPI, S5 Eco ACPI 3.0, S5 Eco




Special Features POSCAP capacitors, GPIO/SDIO Switch, General Purpose SPI optional

POSCAP capacitors, GPIO/SDIO Switch, General Purpose SPI optional

POSCAP capacitors

Operating System Windows® 8, Windows® 7, WE8S, WES7, WEC7, Linux, VxWorks


Windows® 7, WEC7, WES 7, Windows® XP, Linux, VxWorks

Temperature Industrial temperature:-40°C to +85°C operating

Commercial temperature: 0°C to +60°C operating

Commercial temperature: 0°C to +60°C operatingExtended temperature: -25°C to +75°C operatingIndustrial temperature: -40°C to +85°C operating

» COM Express® mini «

COM Express® mini

www.kontron.com

COM Express® QorIQ™

COMe-cP2020 COMe-bP5020

Compliance COM Express® compact, Pin-out Type 6" COM Express® basic, Pin-out Type

Dimensions (H x W x D) 95 x 95 mm 95 x 125 mm

CPU Freescale™ QorIQ™ P2020 e500 Power Architecture® Freescale™ QorIQ™ P5020 (P5010) e5500 Power Architecture®

Main Memory Up to 4GB DDR3-667 72-bit Up to 8GB DDR3-1333 MHz ECC

SerDes 4x SerDes up to 3.125 Gbps multiplexed across controllers can be confi gured as: PCI Express®, sRIO, GbE; Example:1x PCIe x42x PCIe x1 + 1PCIe x2 2.5 Gbps1x PCIe x2 + 2x 1GbE SGMII2x SRIO x1 2.5Gbps + 2x GbE SGMII2x SRIO x1 3.125 Gbps1x SRIO x4 with 1.25/2.5 or 3.125 Gbps

18x SerDes lanes confi gurable; pre-selected standard confi gurations:2x PCIe x4 + 4x 1 GbE SGMII + 1x SATA2x PCIe x4 + 4x 1 GbE SGMII + 1x XAUI2x PCIe x4 + 1x XAUI + 1x SATA2x sRIO x4 + 4x 1 GbE SGMII + 1x SATA

Ethernet 3x 10/100/1000 Base-T, 2x IEEE 1588 control 1x 10/100/1000 Base-T, 2x IEEE 1588 control, see SerDes

Hard Disk MicroSD card slot / bootable MicroSD card slot/ bootable, 2x SATA multiplexed with SerDes

Flash Disk 64kbit I²C EEPROM, up to 2GB NAND Flash + 2MB NOR Flash. 2nd 2MB SPI NOR Flash for boot recovery purposes, 512kB MRAM

64kbit I²C EEPROM, up to 2GB NAND Flash + 2MB NOR Flash, 2nd 2MB SPI NOR Flash for boot recovery purposes512kB MRAM

PCI Express® / PCI support see SERDES see SERDES

USB 4x USB 2.0 5x USB 2.0 (one channel device capable)

Serial 2x UART, Serial Rapid I/O see SerDes 4x UART (2x FourWire/ 4x TX/RX), Serial Rapid I/O see SerDes

Operating System Linux; Wind River VxWorks 6.9.2 Linux; Wind River VxWorks 6.9.2

Temperature c-version 0° to +60,i-version -40°C to +70°C

0 °C to 60 °C

Bus type Processor Local Bus Processor Local Bus

Cache 32 KB L1 instruction cache and 32 KB L1 data cache for each core, 512 KB L2 cache with ECC

32 KB L1 instruction cache and 32 KB L1 data cache for each core, 512 KB L2 cache with ECC, 2MB L3 cache shared

CPU Clock 2x 1.2 GHz commercial temp., 2x 1.0 GHz industrial temp.

2x 2.0 GHz (P5010 2x 1.6 GHz)

Interface 2x GPIO (exclusive with SDHC usage), 2x I²C, 1x SDHC,1x MDIO (IEEE 802.3 clause 22), SPI, 5x IRQ; 1x IRQ OUT,16 bit eLBC (2 Devices), JTAG debug

12x GPIO, 1x I²C, 1x SDHC, 2x MDIO (IEEE 802.3 clause 22), SPI, 5x IRQ, JTAG debug, Aurora debug

Power Consumption est. 12W/12V est. 30W/12V

Watchdog Yes Yes

Real Time Clock Yes -

» COM Express® QorIQ «

30

» ETX® «

ETX®

ETX®-OH ETX®-LX

Compliance ETX® 3.0 compliant ETX® 3.0 compliant

Dimensions (H x W x D) 95 x 114 mm 95 x 114 x 10 mm (3.7 x 4.5 x 0.4")

CPU AMD G-Series T56E, T56N, T40E, T52R, T40R, T16R AMD® Geode™ LX800 processor 500MHz, with integrated graphic

Chipset AMD Fusion Controller Hub (FCH) A55E AMD® Geode™ CS5536 Companion Device

Main Memory Up to 4 GB DDR3-1066/1333 SO-DIMM Up to 1 GB DDR-RAM (266/333/400 MHz)

Graphics Controller Integrated Radeon HD6320 / HD 6310 / HD 6250,(DirectX® 11, PS 5.0, OpenGL 4.1, OpenCL 1.1),ATI Avivo HD with H.264, VC-1, Blue-ray Support

Integrated in AMD® Geode™ LX800

Graphics Memory - Up to 254 MB UMA

Ethernet 10/100 MBit Ethernet, Broadcom BCM54610 10/100 MBit Ethernet, Intel® 82551ER

Hard Disk 2x SerialATA (AHCI), 2x PATA (via PCIe bridge), optional 2-64 GB SATA SSD

2x Serial ATA (RAID 0, 1), 1x PATA 100

USB 4x USB 2.0, optional 2x miniUSB 2.0 onbaord 4x USB 2.0

Serial 2x Serial COM ports -

Audio Controller HDAudio Codec Realtek ALC886GR ALC203 AC'97 controller, line-input / output and microphone

Power Management AMD PowerNow! -

Special Features DisplayPort:via onboard FlatFoil or optional DP connectorSecurity Feature:TPM SLB9635TT1.2 optional

-

Operating System Windows 7, Windows Vista®, Windows® XP, Windows® XP Embedded, WES 7, Linux and others

Windows® XP, Windows® XP Embedded, Windows® CE, Linux and others

Temperature Commercial temperature:0°C to +60°C operatingExtended temperature:-25°C to +75°C operating

Operation: 0°C to +60°C*Ask about extended temperature ranges

Cache - 128 KB L2 Cache

CompactFlash - 1 x CompactFlash™ socket on board

Parallel Port Parallel / Floppy port shared with LPT Parallel / Floppy port shared with LPT

ISA ISA Bus (ETX® 3.0 compliant) -

PCI PCI 2.3, 32 bit / 33 MHz -

Power Consumption Typ. Idle ~ 10.5 W Typ. Idle 6,5 W @ 500 MHz, 5V

Resolution Resolution CRT: 2560x1600Resolution LCD: 1920x1200

CRT: max. WUXGA (1920 x 1440)LVDS: max. UXGA (1600 x 1200)

www.kontron.com

SMARC - Smart Mobility Architecture (82 x 50 mm)

SMARC-sXBTi SMARC-sAMX6i SMARC-sA3874i SMARC-sAT30

Compliance SMARC - Smart Mobile Architecture by SGET - small size

SMARC - Smart Mobile Architecture by SGET - small size



Dimensions (H x W x D) 82 x 50 mm 82 x 50 mm 82 x 50 mm 82 x 50 mm

CPU Intel® Atom™ E3845, E3827, E3826, E3825 or E3815

Freescale i.MX 6, Single, Dual and Quad Core ARM Cortex-A9

Texas Instruments Sitara AM3874 Cortex A8

NVIDIA Tegra 3, Quad Core ARM Cortex A9

Main Memory Up to 8GB DDR3L-1333 memory down (ECC optional)

Up to 2GB DDR3 memory down Up to 2GB DDR3 memory down On Board up to 2GB DDR3

Graphics Controller Intel® HD Graphics (Gen7) Dual DisplayzHD 1080p Decode/Encode,2D/3D acceleration

HD 1080p Decode/Encode2D/3D acceleration

Dual Displays

Ethernet Controller Intel® i210IT Integrated Integrated Integrated

Ethernet 10/100/1000 MBit Ethernet 10/100/1000 MBit Ethernet 10/100/1000 MBit Ethernet 10/100/1000 Mbit/sec

SATA 1x SATA 3Gb/s 1x SATA (dual/quad core)-solo 1x SATA 1x SATA

Flash Onboard 2-64GB eMMC 2-64GB eMMC Up to 32GB NAND FLASH build option

2-64GB eMMC


3x PCIe x1 3x PCIe x1 1x PCI Express® x1 Lanes x1 PCIe Gen 1

Panel signal LVDS Single Channel 18/24 bit or eDPHDMI or DP

Parallel LCD 18/24 bitLVDS Single Channel 18/24bitHDMI

Single Channel 18bit,24bit (18bit compatible) LVDSHDMI

LVDS Single Channel 18 bit / 24 bit - 18 bit compatible. Support for dual channel 24 bit LVDS, HDMI

USB 3x USB 2.0 1x USB 3.0 (via AFB)

3x USB 2.0 (one OTG) 2x USB 2.0, USB OTG 3x USB 2.0 ports (one OTG)

Serial 1x RX/TX (Ser0) 2x UART (Ser1/3)

2x RX/TX (Ser1/3)2x UART (Ser0/2)



Interface HD Audio and I2S, 5x I2C, 2x SPI, Camera Interface (2x MIPI CSI)

12x GPIO, SDIO, 5x I²C, 2x I²S, 2x SPI, SPDIF, WDT, 2x CANCamera Interface (PCAM, CSI)

GPIO, 4x I²C, 4x I²S, 2x CAN, 2x SPI, Camera input 10bit parallel interface

1x SDIO, 1x eMMC, 2x SPI, 5x I2C, 3x I2S, 12x GPIO, SPDIF, WDT

Operating System Windows® 8, Windows® 7, WE8S, WES7, WEC7, Linux, VxWorks

Linux, Android, WEC7 Windows CE6, WES7, Linux, Android

Android ICS, Linux

Power Supply 3V - 5.25V Operates directly from single level Lithium Ion cells or fi xed 3.3V or 5V power supplies

3V - 5.25V Operates directly from single level Lithium Ion cells or fi xed 3.3V or 5V power supplies

3V - 5.25V Operates directly from single level Lithium Ion cells or fi xed 3.3V or 5V power supplies

3V to 5.25V - operates directly from single level Lithium Ion cells, or fi xed 3.3V or 5V power supplies

Power Consumption tbd Typ. 5W Typ. 2 W 5 Watts typical

Power Management - Battery and System Management

- -

Temperature -40°C to +85°C operating Operation: -40° to 85°C Operation: -40° to 85°C 0°C to 70°C

–40°C to +85°C–40°C to +85°C

» SMARC «

–40°C to +85°C

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About Kontron

Kontron is a global leader in embedded computing technology. With more than 40 % of its em-ployees in research and development, Kontron creates many of the standards that drive the world’s embedded computing platforms. Kontron’s product longevity, local engineering and sup-port, and value-added services, helps create a sustainable and viable embedded solution for OEMs and system integrators.

Kontron works closely with its customers on their embedded application-ready platforms and custom solutions, enabling them to focus on their core competencies. The result is an accelera-ted time-to-market, reduced total-cost-of-ownership and an improved overall application with leading-edge, highly-reliable embedded technology.

Kontron is listed on the German TecDAX stock exchanges under the symbol “KBC”. For more infor-mation, please visit: www.kontron.com

Asia Pacifi c

17 Building,Block #1, ABP.188 Southern West 4th Ring RoadBeijing 100070, P.R.China

Tel.: + 86 10 63751188Fax: + 86 10 [email protected]

CORPORATE OFFICES

Europe, Middle East & Africa

Oskar-von-Miller-Str. 185386 Eching / MunichGermany

Tel.: + 49 (0) 8165 / 77 777Fax: + 49 (0) 8165 / 77 [email protected]

North America

14118 Stowe DrivePoway, CA 92064-7147USA

Tel.: + 1 888 294 4558Fax: + 1 858 677 [email protected]

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