Post on 04-Feb-2020
UW-Madison College of Engineering Shared Research
Facilities
Jerry Hunter, Director Wisconsin Center for Applied Microelectronics (WCAM)
Materials Science Center (MSC)Soft Materials Laboratory (SML)
Meeting Organizers
Jerry Hunter, Ph. D.Director
CoE Shared Facilities
Isabelle Girard, Ph. D.Director
Office of Campus Research Cores
Felix Lu, Ph. D.Electrical and Computer Engineering
Co-Director AMIC
Kate SalterAssistant Administrative Director
MRSEC
Julie Last, Ph. D.Instrument Manager
UW-Materials Science Center
Desirée Benefield, Ph. D.Facility Manager
UW Cryo-EM Facility
Agenda for Tutorials
Union South
Level 2 Level 3
Meeting Sponsors
Demonstrations
• Everyone that scheduled Demos should have a personalized schedule 45 minute demonstration, 15 min to get to next demo Please adhere to your schedule
• Demonstration location Materials Science and Engineering
SEM, TEM, AFM, APT, FIB, Nanoindentation, Raman, Mechanical Sample Preparation and XPS
Engineering Research Building RBS and XRD
Engineering Hall Ellipsometry
Engineering Centers Building Electron Beam Lithography
Outline
• Introduction to College of Engineering Shared Research Facilities Wisconsin Center for Applied Microelectronics (WCAM) Materials Science Center Soft Materials Laboratory
• Overview of Analytical Techniques• Summary
CoE Shared Facilities Overview
Wisconsin Center for Applied Microelectronics• Micro and nano-fabrication
facility• 10,000 sq. ft. cleanroom
with 60 instruments
Soft Materials Lab• Polymer characterization
laboratory• 30 major instruments
Materials Science Center• High end microscopy and
microanalysis facility• 30 major instruments
Director: Jerry Hunter
Materials Science Center
Pictures
CoE Shared Research Facilities
Wisconsin Center for Applied Microelectronics
Soft Materials Laboratory
AMIC members receive 20% discount
Overview: FY17 Use
• ~77,000 use hours from 45,000 activities
• 180 Principle Investigators and ~700 users
• 48 different departments covering 8 colleges/schools
• ~30 Companies• ~10 other institutions• 8 courses supported• 320 grants totaling $175M in
research supported
Research in the Physical Sciences • Materials structure/property
relationships• Structures, magnetism and electronics• Advanced materials for energy• Flexible electronics• Quantum devices• Power electronics• Organic/Inorganic interfaces
Research in the Biological Sciences • Hierarchical and active soft materials• Molecular virology• Plant pathology• Membrane trafficking pathways in
plants
Usage statistics (FY17)
WCAM Fabrication Toolset
WCAM Fabrication Toolset• Lithography
ꞏ Nikon NSR-2005i8A Stepperꞏ Canon PLA-501 Contact Alignerꞏ Suss MA6/BA6 double-sided alignerꞏ Suss MJB-3 Contact Alignerꞏ Suss MJB-3 Contact Aligner (with I.R.
backside alignment)ꞏ Headway Photoresist Spinnersꞏ Solitec HMDS chamberꞏ Elionix G100 Electron Beam
Lithographyꞏ (3) Scanning Electron Microscopes with
Nabity electron beam lithography
• Packaging WestBond 747677 Wedge Wire Bonder K+S 4124 Ball Wire Bonder Karl Suss RA-120 Wafer Scribe (2) MicroAutomation 1006 Wafer Saw MEI-720 Die Attacher Indium Evaporator (die bonding) YES vacuum oven Package annealer
• Deposition Ebeam Evaporator (metals) CVC-601 DC Sputterer (metals) Denton Discovery 24 Sputterer (RF &
DC) PlasmaTherm 74 PECVD (dielectrics) Telemark Ebeam Evaporator (dielectrics) Angstrom Ebeam Evaporator (metals)
• Plasma Etch PlasmaTherm 74 RIE/PECVD (deposition
and etch of oxide, nitride on Si) STS ICP Multiplex (Deep Silicon Etcher) Unaxis 790 RIE (general purpose) PlasmaTherm SLR 770 ECR (compound
semiconductors) PlasmaTherm 770 ICP (metals) PlasmaTherm 790-2 ICP (general
purpose) YES Asher Samco UV Ozone cleaner SPTS Xetch E1 XeF2 vapor etch
WCAM Fabrication Toolset• Assembly
EVG Wafer-Wafer Bonder EVG Wafer-Wafer Bond Aligner Tousimis Critical Point Dryer Obducat NIL-25 Nano-imprinter 400C Oven for polymers Cooke polyimide vacuum oven
• Wet Chemical (2) General Purpose Wet Benches HF Wet Bench Piranha Wet Bench Metal Etch Wet Bench Nitride Strip Wet Bench KOH / TMAH Wet Etch Bench (3) Solvent Wet Benches Spin Rinse-dryers
• Thermal Processing 4 stack MRL Phoenix Oxidation Tubes
wet/dry oxides 4 stack MRL Phoenix Oxidation Tubes
diffusion/anneals 4 Stack Tystar Furnace
LPCVD Nitride LPCVD Polysilicon LTO oxide Thermal oxide
AG 610 RTA (contact anneal – compound semi) Pre-furnace clean wet bench
• Metrology Equipment Tencor Flexus 2320 Film Stress Measurement Rudolph Ellipsometer Filmetrics Optical Film Thickness (2)Tencor Alpha Step 200 Profilometers KLA-Tencor P7 Stylus Profilometer Wild M420 Stereo Microscope Several Inspection Microscopes Wafer mapping four-point probe
Dan Christensen
Hal Gilles
Ed Gonzales
Quinn LeonardHal GillesDan Christensen,
WCAM manager Kurt Kupcho
MSC/SML Imaging and Analysis Toolset
• Microscopy Zeiss Auriga 1540 XB Cross Beam (FIB
+ SEM) with Nabity electron beam lithography
FEI Helios G4 UX Plasma FIB/FESEM (2) Leo 1530 SEMs with EDS (1) with
EBSD and Nabity electron beam lithography
Leo 1550 VP SEM with EDS and Nabityelectron beam lithography
Philips CM200UT TEM FEI Tecnai T-12 TEM FEI Tecnai TF30 cryo-TEM NanoMEGAS ASTAR TEM orientation
imaging system FEI Titan aberration corrected (S)TEM Cameca 3000 X Si Atom Probe
Microscope Bruker MultiMode 8 AFM Bruker Bioscope Catalyst AFM Andor spinning disc Confocal
microscope
• Soft Materials Characterization Q1000 Modulated Differential Scanning
Calorimetry Perkin Elmer DSC 8000 Q500 Thermo Gravimetric Analysis ARES LS2 Rheometer RSA III Dynamic Mechanical Analyzer Viscotek GPCmax Gel Permeation
Chromatograph Waters Gel Permeation Chromatograph Waters e2695 HPLC OCA 15/20 Contact Angle measurement
tool (2) Rudolph Auto EIII Ellipsometers Thermo Scientific DXRxi Raman Imaging
Microscope Zetasizer Nano ZSP with Multi Purpose
Titrator MPT-2 Biolin Scientific Q-Sense E4 Quartz crystal
microbalance Woollam IR-VASE Ellipsometer Woollam VASE+AR Ellipsometer
MSC/SML Imaging and Analysis Toolset• Spectroscopy
Thermo K-Alpha XPS Zygo 6300 White light profilometer Horiba Aramis Confocal MicroRaman Horiba fluorolog spectrofluorometer Nicolet NicPlan IR Microscope with
Nicolet Magna 550 Fourier Transform Infrared spectrometer
PE spectrum 19 – UV/VIS/NIR spectrometer
• Mechanical Test Hysitron TI 950 TriboIndenter
Nanoindenter Hysitron PI 95 in-situ TEM Picoindenter
• X-ray Analysis Rigaku Small Angle X-ray scattering Panalytical Empryrean XRD Bruker D8 Discover – XRD Panalytical X’Pert Pro MRD -- XRD
• Sample Preparation Leica EM UC7 Cryo Ultramicrotome FEI Vitrobot cryo vitrifier Fischione 1040 NanoMill Fischione 1050 TEM Mill Fischione 1010 Low Angle Ion Mill
Rick Noll, SEM & FIB Manager
Julie Last, SPM & light microscopy
Manager
John Jacobs, Surface Science
Manager
Don Savage, X-Ray systems manager
Alex Kvit, TEM Manager Anna Kiyanova
SML managerMike Efremov
SML
MSC/SML Imaging and Analysis Toolset
Hysitron TriboIndenter
Cameca Atom Probe
Zeiss Auriga SEM/FIB
Bruker D8 Discover XRD
Aramis Confocal Raman
Leo 1530 FESEM
FEI Titan aberration corrected (S)TEM
Thermo k-alpha XPS
Advanced RheometricExpansion System
Summary
• Centers support research campus wide and outside users• Over $3M in new instrumentation added since Jan 2016
Nanoscale Fabrication Center (currently WCAM) Elionix G100 Electron beam Lithography
Nanoscale Imaging and Analysis Center (currently MSC) NanoMEGAS ASTAR TEM orientation imaging FEI Helios G4 Plasma FIB/FESEM Panalytical Empyrean XRD Glow Discharge Optical Emission Spectrometer (GDOES) Phase contrast microscope with temperature stage
Soft Materials Characterization Lab (currently SML) Perkin Elmer DSC 8000 Differential Scanning Calorimeter Waters e2695 High Performance Liquid Chromatography
• Over 100 instruments available for nanoscale fabrication and characterization of polymers, biological and “hard” materials
• Centers are available for use by both internal and external users
Analytical Methods Introduction
Analytical Methods
Theoretical detection limits• How many silicon atoms in a cm3?
((2.33 g/cm3)/ (28.09 g/mol)) * 6.023x1023 atoms/mol= 4.98 x 1022 atoms/cm3
• How many silicon atoms in a nm3?4.98 x 1022 atoms/cm3 * (1e-7nm/cm)3
= 4.98x1022 atoms/cm3 * 1e-21nm3/cm3
= 50 silicon atoms in nm3
• What is the minimum detectable concentration in 1 nm3 (best case)?– Must be one atom in the volume– 1/50 = 0.02 = 2%– In practice no technique can detect 100% of atoms in a
volume, so actual detection limits will always be worse than the theoretical
Excitation followed by detection
• Nearly all these methods are a result of excitation/bombardment of a specimen with Photons (x-rays, visible light, etc.) Electrons Ions
• Followed by detection of Photons Electrons Ions
• Which measure some physical/chemical characteristic Topography, elemental and chemical identification, surface
morphology, density, thickness, phase, etc.
Analytical Methods compared
Courtesy of EAG
Microanalysis Techniques Tutorials
• Measurement of crystallographic orientation and strain
• Measurement of mechanical properties of nanoscale materials
XRD
Nanoindentation
• Quantitative analysis of near surface (5nm) and bondinginformation
XPS
• Standardless quantitative depth profiling for stoichiometry
RBS
• Fast and high Depth resolution depth profiling with ppm detection limits
GDOES E-beam Litho
• nm scale patterning of materials
Imaging Techniques Tutorials
• High (sub nm) resolution measurement of topography
SPM
• Sub-nm lateral resolution, orientation and elemental identification
TEM
• nm lateral resolution with elemental identification, orientation, simple sample preparation
SEM
• High resolution imaging with material addition and subtraction
FIB
Atomic identification with atomic lateral resolution
Atom Probe
• ~1um resolution imaging with chemical bonding
Raman
Analytical Methods