Silicon sensor module production

for PHENIX FOCAL

S.H. Lim Yonsei University

Contents

• Introduction– PHENIX FOCAL– Silicon pad sensor

• Micro-module production– Components & Structure– Wafer dicing– Gluing process– Results

• Summary & Outlook

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PHENIX FOCAL

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Silicon pad sensor

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ground

-

p n

Sensor operation

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ground

--

+++

+++

++++ - -

---

-- --

Depletion

Region

PN diode

Leakage current

•IV measurement data

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Micro-module schematics

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Components for micro-module

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Wafer Dicing

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IV characteristics after dicing

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Gluing Process

• Gluing process

– 3 Steps

– 1 day for each step

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2nd

1st

1st

3rd

Glue properties

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Araldite KE45 CW2400

Company HUNTSMAN(Swiss) ShinEtsu(Japan) CircuitWorks(USA)

Material EpoxySilicone Rubber

CompoundSilver epoxy

Color / appearance

Creamy liquidAmber liquid

White pasteBright silverGray silver

Specific gravity

1.17 /Resin0.92 /Hardener

1.05 2.85

Feature

Production results

•4 sample micro-module production has completed.•Mechanical and electrical issues have been checked

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IV characteristics after gluing

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Summary & Outlook

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THE END

THANK YOU