Reliability Issues

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Reliability Issues. Mohammad Sharifkhani. Reading. Textbook I Chapter 18 Textbook I Chapter 20 The paper on SER. Motivation. There is a long distance from a chip working in a lab to a chip working in the field Reliability Robustness Fatigue - PowerPoint PPT Presentation

Transcript of Reliability Issues

Reliability Issues

Mohammad Sharifkhani

Reading

• Textbook I Chapter 18• Textbook I Chapter 20• The paper on SER

Motivation

• There is a long distance from a chip working in a lab to a chip working in the field

• Reliability• Robustness• Fatigue • Many of the culprits are in rise as technology

scales

Introduction

• Packaging• Electromigration• ESD Protection• SER Protection

Chip Packaging

ChipL

L ´

Bonding wire

Mountingcavity

Leadframe

Pin

•Bond wires (~25m) are used to connect the package to the chip

• Pads are arranged in a frame around the chip

• Pads are relatively large (~100m in 0.25m technology),with large pitch (100m)

•Many chips areas are ‘pad limited’

Pad FrameLayout Die Photo

Chip Packaging• An alternative is ‘flip-chip’:– Pads are distributed around the chip– The soldering balls are placed on pads– The chip is ‘flipped’ onto the package– Can have many more pads

Tristate Buffers

InEn

En

V DD

Out

Out = In.En + Z.En

V DD

In

En

EnOut

Increased output drive

Electromigration• Current density (current per unit area)• A reliability issue creates problem over time– Due to transport of metal ions– AC signals will be fine

• Breaking or shorting to adjacent wire• Keeping current below 0.5 to 1mA/um relaxes the

problem– For DC wires (power/GND)

• IR Drop transient problem (peak current)• Electromigration DC problem (ave. current)• Using copper helps

Electromigration (1)

Limits dc-current to 1 mA/m

Electromigration (2)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Which one fails?

Electro-Static Discharge (ESD)

Second breakdown of the path at a lower voltage than the second break-down of the ESD path

Second breakdown of the path at a higher voltage level than the second break-down of the ESD path

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

There are challenges as technology scales!

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Design of ESD protection circuits:A glimpse!

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

Electro-Static Discharge (ESD)

• ESD protection is extremely important when dealing with high speed input output signals• I/O Capacitance

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error

Soft Error