Post on 27-Dec-2021
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Rapid prototyping of sensors
Prof. Bruno Andò DIEEI-University of Catania, Italy
bruno.ando@unict.it
Ph.D. School Italo Gorini 2020September 9th, 2020
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Transducers convert a physical quantity into an
electrical quantity, with obvious advantages…
HOW? It’s a Sensing Methodology issue!!
Transducers
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Example #1: a Resistive Temperature Detector
Formetal sensors (RTD) :
r(t)= r(t0)(1+aDt+bDt2+…) ≈ r(t0)(1+aDt)
)1(
)1()1()(
0
00
xRR
tRtS
ltR
S
lR
DD
aar
r
The resistivity increases with temperature due to thermal agitation!
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Example #2: a Strain Gauge
GR
R
D
0
L
dLWhere the strain is defined as:
This is a resistive sensor…so…it is
also influenced by the temperature!
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Sensors for everything….
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Environment
TransducerConditioning
electronic
Sensor
Auxiliary systems
Systemunder
measurement
Load/User
From the transducer…..
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
to a Smart Sensor
Environment
Transducer Conditioning electronic
Sensor
Auxiliary systems
Systemunder
measurement
A/DSignal
processing
Local user interface
Data storage
Communication
Smart sensors are basic sensing elements with embedded intelligence (combination of a sensing element with processing capabilities provided by a microprocessor), that can perform one or more of the following function
logic functions two-way communicationmake decisions.
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Sensor applications
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Challenges
Needs for Low Cost, Stretchable and Disposable sensors.
Short production/prototyping times are required: design & realization.
Applications: biosensors, temperature, humidity, gas, Sensing strategy: resistive, capacitive, inductive, piezoel., photodet.
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Printed electronics aims to create electronic devices by printing functional inks on a variety of substrates. Examples of printed devices are:- flexible keyboards, antennas, electronic skin patches, flexible screens, intelligent labels and packaging, interactive books and posters.
As the substrates grow thinner, printed materials become thin, light, and flexible enough to be integrated into existing production lines.
Main advantages of printed electronicsLow costAttractive and flexible form factorEase of productionEase of integration
ChallengesInksMaterials for substrate
Printed Electronics
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Printed vs Conventional Electronics
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Printed Electronics Technology can be exploited to realize sensors
•Flexible•Stretchable•Thin•Transparent•Low cost•Disposable•Organic•…
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
CHEMICAL AND GAS PHYSICAL MONITORING OTHERS
CO2 sensor Humidity sensor Lab-on-a-chip system
CO sensor Strain gauges Antennas
Ethanolo sensor Pressure sensor TAG, Smart Labels
NO sensor Temperature sensor Passive microwavecircuitry
Glucose biosensor Magnetic/Acousticactuator
Touch sensor forinteractive packaging and display
Printed Sensors: Applications
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Market trends for printed sensors
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Printed Electronics
Thick Film Tech.
Inkjet printing Wearable electronics (Active clothing)
Smart Labels (RFID+sensors)
Disposable devices (biomedical) …
Low Costs/Good Performances
Flexible substrates
Printing technologies for “Flexible and Wearable Sensors”
T. Morrison, J. Silver and B. Otis, "A single-chip encryptedwireless 12-lead ECG smart shirt for continuous healthmonitoring," 2014 Symposium on VLSI Circuits Digest ofTechnical Papers, Honolulu, HI, 2014, pp. 1-2.
InkJet Printing
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
SOTA on “Flexible and Wearable Sensors”
The BioStamp Research Connect: inertial sensors and a gyroscope to monitor movement, as well as chips to monitor the electrical activity of your muscles and heart.
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Integrate sensor design into an everyday objects: sensor arrays on flexible electronics.
http://designmind.frogdesign.com/2014/04/uncommon-sense-the-new-role-of-sensing-in-design-research/
http://www.pbs.org/wgbh/nova/next/tech/wearable-health-sensors/
https://www.packworld.com/trends-and-issues/smartactive-packaging/putting-power-printed-electronics-packaging
T. Morrison, J. Silver and B. Otis, "A single-chip encryptedwireless 12-lead ECG smart shirt for continuous healthmonitoring," 2014 Symposium on VLSI Circuits Digest ofTechnical Papers, Honolulu, HI, 2014, pp. 1-2.
Flexible Sensors Needs & Applications
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Designing “target-specific shapes” for different sensing targets!
Flexible Sensors Needs & Applications
A Paper-Based Electrochemical Sensor Using Inkjet-Printed Carbon Nanotube Electrodes, ECS J. Solid State Sci Technol.
2015 volume 4, issue 10, S3044-S3047
htt
ps:
//w
ww
.pd
dn
et.c
om
/new
s/2
01
3/1
0/p
ho
tos-
da
y-in
kjet
-p
rin
ted
-an
ten
na
s
T. Vuorinen, J. Niittynen, T. Kankkunen, T. M. Kraft, M. Mäntysalo,Inkjet-Printed Graphene/PEDOT:PSS Temperature Sensors on a Skin-Conformable Polyurethane SubstrateScientific Reports 6, Article number: 35289 (2016)
Sensing chemical quantities.Sensing elements (e.g. carbon nanotubes).
Multimodal near surface sensing (pressure, touch, folding, proximity sensing).
Sensing antennas
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
M Kaltenbrunner et al. Nature 499, 458-463 (2013) doi:10.1038/nature12314
Imperceptible electronic foil
- Thin large-area active-matrix sensor with 12 × 12 tactile pixels.
- Ultrathin plastic electronic foils are extremely lightweight, virtually unbreakable.
- At 2 μm thickness, devices are ultraflexible and can be crumpled like a sheet of paper.
Flexible Sensors Needs & Applications
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Electronic Skin“A surface embedding a dense sensor network, inspired from biological skin”
http
://w
ww
.des
ign
bo
om
.co
m/d
esig
n/l
esia
-tru
ba
t-e-
tra
ces-
ba
llet-
sho
es-p
ho
ne-
ap
p-1
0-2
4-2
01
4/
http://www.businessinsider.com/flexible-thin-electronics-breakthrough-2013-7?IR=T
Flexible Sensors Needs & Applications
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
ElectronicsEngineering
Chemistry
Printed Electronics: Required Skills
Physics
MEMS & NEMS Technologies
Inks
PrintingSytems
Substrates
C
H
A
L
L
E
N
G
E
S
Before entering the market various technological improvements are still needed.
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Technology …..
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Università Degli Studi di Catania
Dip
arti
men
tod
iIn
gegn
eria
Elet
tric
a, E
lett
ron
ica
e d
eiSi
stem
i
Thick Film Fabrication Techniques: Screen Printing
Keywell Table Sliding Screen Printing Machinewww.keywell-printer.com
+ Many commercial inks are available+ High throughput+ Thick layers can be easily obtained+ Many different materials can be easily printed even with high viscosity- Requires high costs masks.- Ink waste.
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
•Well-suited to mass-production
•Chemical Etching required
•Time and cost involved are at odds with the rapid iteration inherent in research
•Online PCB production services require at least a couple of days
•Lab-based PCB fabrication machines: expensive, fiddly to set up and maintain
•Up to day producing flex-PCB prototypes in the lab has not really been feasible
Fabrication Techniques: PCB
PCB Fluxgate (SensorLab@DIEEI, University of Catania, Italy
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
•Rapid prototyping of circuit boards in a lab setting.
•Remove areas of copper from a copper-clad sheet of rigid PCB material to create pads, signal traces and conductive structures.
•Compared with conventional fabrication methods based on a chemical etching process, PCB milling machines are relatively fast and convenient.
•It is very difficult to mill flexible substrates.
http://www.lpkfusa.com/products/pcb_prototyping/machines/s_series/compare/
Fabrication Techniques: PCB Milling
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Fabbrication Techniques
• Direct writing (inkjet, laser, mechanical pressure)
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Technology Advantages Drawbacks
Mas
kB
ase
d Screen Printing several materialscomplex multilayer
maskslow resolutiontime consuminghigh cost production
PCB based techniques
mass productiongood resolution
development timeshigh cost production
Dir
ect
wri
tin
g
Low cost inkjet printing
good resolutionno masksrapid prototypinglow cost systemlow cost production
restricted kinds of materials
Professional inkjet printing
high resolutionseveral materialsrapid prototypinglow cost production
high cost production
Mixed screen & inkjet printing
good resolutionseveral materials
maskstime consuminghigh cost production
Fabbrication Techniques: a restricted benchmark
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Technology Advantages Drawbacks
Mas
kB
ase
d Screen Printing several materialscomplex multilayer
maskslow resolutiontime consuminghigh cost production
PCB based techniques
mass productiongood resolution
development timeshigh cost production
Dir
ect
wri
tin
g
Low cost inkjet printing
good resolutionno masksrapid prototypinglow cost systemlow cost production
restricted kinds of materials
Professional inkjet printing
high resolutionseveral materialsrapid prototypinglow cost production
high cost production
Mixed screen & inkjet printing
good resolutionseveral materials
maskstime consuminghigh cost production
Fabbrication Techniques: a restricted benchmark
•Viscosity•Surface tension•Volatility•Particle size
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Technology Advantages Drawbacks
Mas
kB
ase
d Screen Printing several materialscomplex multilayer
maskslow resolutiontime consuminghigh cost production
PCB based techniques
mass productiongood resolution
development timeshigh cost production
Dir
ect
wri
tin
g
Low cost inkjet printing
good resolutionno masksrapid prototypinglow cost systemlow cost production
restricted kinds of materials
Professional inkjet printing
high resolutionseveral materialsrapid prototypinglow cost production
high cost production
Mixed screen & inkjet printing
good resolutionseveral materials
maskstime consuminghigh cost production
Fabbrication Techniques: a restricted benchmark
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Technology Advantages Drawbacks
Mas
kB
ase
d Screen Printing several materialscomplex multilayer
maskslow resolutiontime consuminghigh cost production
PCB based techniques
mass productiongood resolution
development timeshigh cost production
Dir
ect
wri
tin
g
Low cost inkjet printing
good resolutionno masksrapid prototypinglow cost systemlow cost production
restricted kinds of materials
Professional inkjet printing
high resolutionseveral materialsrapid prototypinglow cost production
high cost production
Mixed screen & inkjet printing
good resolutionseveral materials
maskstime consuminghigh cost production
Fabbrication Techniques: a restricted benchmark
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Technology Advantages Drawbacks
Mas
kB
ase
d Screen Printing several materialscomplex multilayer
maskslow resolutiontime consuminghigh cost production
PCB based techniques
mass productiongood resolution
development timeshigh cost production
Dir
ect
wri
tin
g
Low cost inkjet printing
good resolutionno masksrapid prototypinglow cost systemlow cost production
restricted kinds of materials
Professional inkjet printing
high resolutionseveral materialsrapid prototypinglow cost production
high cost production
Mixed screen & inkjet printing
good resolutionseveral materials
maskstime consuminghigh cost production
Which is the right IJP Tech?
Application contexts• labscale prototype
• research laboratories
• educational activities
• customized devices
Fabbrication Techniques: a restricted benchmark
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
SOTA on “Inkjet printed sensors”
A All InkJet Printed B-Field sensor(SensorLab@DIEEI, University of Catania, Italy
Thinfilm Strain Sensor (SensorLab@DIEEI, University of Catania, Italy)
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
• Continuos Printing• DropOnDemand (smaller drop size, higher placement accuracy)
• Thermal DOD (needs water thus restricting possible inks)• Piezoelectric DOD (can be suited for a variety of solvents)
Fabbrication Techniques: Direct writing-Inkjet Printing
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Inkjet Printing Systems
Desktop printersDimatix DMP 2800
www.dimatix.com
Microdrop inkjet systemwww.microdrop.de
Litrex M-Series inkjet systemwww.litrex.com
One Printing system for each application
context!!!
High precision and accuracy Throughput/speed and productivityMaintenance and reliabilityCompatibility with electronic fluids (inks) Compatibility with several substrates
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Inkjet Printing Systems: Inks guidelines
Dimatix DMP 2850www.dimatix.com
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Substrates
Substrate Material FeaturesPET (PolyEthylene Terephtalato) Flexible structure, high impact strength
PEN (PolyEthylene Naphtalato) Good dielectric properties
SEMIFLEX Good thermal resistance
POLYIMIDE Good mechanical and electrical properties
PAPER Low costs, high flexibility, versatile, and
recyclable
GLASS Good thermal capability, good dimensional
stability and chemical durability
CERAMICS High price, use is limited to the most
demanding of applications where rigid, high
temperature or high frequency behavior is
needed
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Inks
Conductors: electrical conducting polymers for structures of electrodes
Semiconductors: electrical semi conducting polymers for transistors and diodes
Dielectrics: electrical insulating polymers (between semi-conducting and conducting layers)
Metallic: polymers containing metal particles as copper, silver, gold and nickel for electrodes
Functional: polymers whose properties are function of some physical quantities of interest
Oxide: electrical semi conducting sol-gel containing metal particles as zinc, tin and copper
•Suitable Resistivity•Functional layers
•High conductivity•Nozzle occlusion problem
PEDOT:PSS PANI
FunctionalInks
ConductivePolymers
Metal ParticleInks
Gold, Silver, Copper CNT, Graphene
•Transparent•High conductance
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Conductive polymers: PEDOT:PSS
PEDOT:PSS or Poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate)
is a polymer mixture of two ionomers. One component in this mixture is made up of sodium polystyrene sulfonate which is a sulfonated polystyrene. Part of the sulfonylgroups are deprotonated and carry a negative charge. The other component poly(3,4-ethylenedioxythiophene) or PEDOT is a conjugated polymer and carries positive charges and is based on polythiophene. Together the charged macromolecules form a macromolecular salt.
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
The PEDOT:PSS in “our” language! It is an organic polymer that conduces electricity It is commercially available as a dispersion in water (typically at 1-3% wt. solids)
(Sigma Aldrich/H.C. Starck/Bayer/AGFA etc.)
It is compatible with inkjet printing after simple pre-processing (dilution/filtering)
Baytron P from Bayer main Characteristics:
Solid content 1.2 – 1.4 %Viscosity 60 – 100 mPa*s (olive oil = 81 mPa*s) It probably needs to be diluted (20 mPa*s)
pH-value 1.5 – 2.5Conductivity max 10 S/cm (depending on the type of coating formulation)Density at 20 °C 1.003 g/cm^3Mean particle size approx. 80 nm (filtering to avoid nozzles clogging)Surf. tension at 20 °C 71 mN/m (that will determine the adhesion)
3cm
0.2cm0.1mm
RPEDOT:PSS = 150 Ω RCOPPER = 0.25 μΩ
Conductive polymers: PEDOT:PSS
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
PANI or Polyaniline
- conducting polymer- high electrical conductivity
Sigma Aldrich (650013) – PANI main propertiesConcentration: 2-3 wt % (dispersion in xylene)Particle size: < 400 nmConductivity: 10-20 S/cm (film)Viscosity: 3 mPa*s Density: 0.9 g/ml @ 25 °C
Acid/base doping response: allows PANI to be used in chemical vapor sensors.
Conductive polymers: PANI
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
•Metalon® JS-B15P Water-based nano-Silver ink specially formulated for (desktop) piezo inkjet printing methods.
-High conductivity -Compatible with porous substrates (PET)
•Printable through a commercial printer
•Post-processing (curing)
Metal Particle Ink
Resistivity 48 cm
Sheet Resistance 1600 m/
Viscosity 1-5 cps
Ag content 15%
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Metal Particle Ink
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
•Printing of conductive tracks.
•Compared to inks based on nanoparticle suspensions they do NOT contain any solids tending to agglomeration.
•Since no surfactants are necessary to stabilize the organometallic precursors, they can easily be converted into conductive material at moderate conditions.
•The reduction of organometallic precursors is achieved either chemically, thermally, photochemically by UV-light or via combined processes.
•Suitbale for InkJet Printing: inks can easily be adjusted to the physical and rheological requirements of printing processes.
Electrical resistivity of printed silver lines from a commercial silver ink with 20 wt% of silver as a function of sintering time and temperature.J. Perelaer, C. E. Hendriks, A. W. M. de Laat and U. S. Schubert, Nanotechnology, 2009, 20, 165303
Organometallic Inks
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Conductive Polymers Vs Metal Particle Inks
Features Conductive Polymers Metal particle inks
Price 400 €\kg 5000 – 10000 €\kg
Conductivity Low (10 S/cm typical) High (> 10 kS/cm)
Cure temperature Low (50 – 100 °C) High (300 – 500 °C)
Preprocessing Dilution/Filtering None
Adhesion Medium-Low Very good
Compatibility Good performances even with common desktop printer printheads
Only dedicated Piezoelectric Printheads
Availability Few general purpose dispersions
Many different commercial inks application specific
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
•Many printed inks are not initially conductive and require a heat treatment for reduction.•E.g silver nanoparticles have a polymer shell which prohibits agglomeration while in suspension.Once deposited, the ink must be sintered in an oven at more than 150°C for several hours in order to form mutual connections among the metal particles.
•E.g. copper nanoparticles (https://www.nature.com/articles/srep08832)Processing much more demanding than that of silver or gold due to high rate of oxidation and the higher melting point of copper compared to silver and gold. Copper oxides are non-conductive and therefore the oxidation of copper during sintering processes prevents the formation of electrically functional structures. This puts significant requirements for the processing speed of the sintering process or for the ambient atmosphere.
Needs for curing
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Curing techniques- Thermal curing (hot plate, convection Oven) • High temperature (not compatible with cost-effective polymers e.g. PET);• reduces the prototyping speed.
- Laser curing (absorption of emitted photonic energy by the IJP nanoparticle)• high energy sintering • small spot size laser (high spatial resolution, area selective)• high energy density on a fixed wavelength
- IPL Curing (absorption of emitted photonic energy by the IJP nanoparticle)• rapid and high energy sintering• xenon flash lamp emitting light over a wide wavelength spectrum• larger areas at once in comparison to laser sintering, better suited for larger
patterns
Needs for curing
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
The challenge“sintering the printed inks with simultaneously low heat input to the substrate.”
Intensive pulsed light (IPL) Curing
R&D System for sintering silver, copper and other functional inks.http://www.polytec.com/eu/products/lighting-systems/xenon-uv-flash-lamps/photonic-sintering-of-printed-electronics/sinteron-2000/
•Due to the short time interval (milliseconds) of the light pulses, the nanoparticles can be sintered without damage to the underlying substrate layer.
Appropriate for use with PET film and paper for flexible printed electronic applications.
•Intense Pulsed Light (IPL) generated from a xenon lamp source can be used to sinter nano-copper ink particles under ambient conditions.
•IPL delivers a quick burst of intense near-UV energy to the printed surface.
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
•Inkjet printing of semiconducting polymers to develop Organic Thin Film Transistors (OTFTs) is still far from operation in the GHz frequency range.
•Integration of off-the-shelf active electronic components onto flexible substrates provides an exciting alternative.
Integration of COTS components on Flexible substrates #1
Challenges•Bonding rigid components to flexible substrates•Bonding flexible components to flexible substrates•Conductive connection between substrates
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Integration of COTS components on Flexible substrates #2
An exampleActive paper-based RFID tag for wireless temperature sensor platforms utilizing both battery and energy harvesting techniques to carry out sensing function over long ranges and lifespan.
S. Kim, A Georgiadis, A Collado, and M. M. Tentzeris, "A InkjetPrinted Solar-Powered Wireless Beacon on Paper for Identification and Wireless Power Transmission Applications", IEEE Transactions on Microwave Theory and Techniques, vo1.60, no.12, pp. 4178-4186, Dec. 2012.
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Y. Kawahara, H. Lee, M. M. Tentzeris, "SenSprout: inkjet-printed soil moisture and leaf wetnesssensor," Proceedings of the 2012 ACM Conference on Ubiquitous Computing (UbiComp '12), New York, 2012.
Integration of COTS components on Flexible substrates #3
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Conventional soldering techniques are not suitable for connecting components to inkjet circuits because solder typically melts at a much higher temperature (e.g. 180) than is tolerated by the substrate.
Bonding COTS components on Flexible substrates
Electrically Conductive Adhesive Transfer Tapes It is designed for attaching Flexible Printed Circuits (FPC) to traditional PCBs.
3M Electrically Conductive Transfer Tape 9707
Two components, silver conductive epoxy adhesiveFast fixture time at room temperatureThe conductivity increases as the epoxy cures. Suggested curing at 65 °C for 15 minutes.Alternatively, 12 hours at room temperature.
Soldering with low-temperature Solder PasteSolder Paste with an eutectic point of 138°C (lower than the PET melting point ~260°C). This technique is suitable for copper, while it is not for Silver nanoparticles.
http://www.sra-solder.com/sra-low-temperature-lead-free-solder-paste-t3-50-gram-jar-4520
CHEMTRONICSCW2400
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly Examples…
InkJet Printed Sensors
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Printed Electronics: Inkjet Printed Sensors SOTA Review 1/3
Printer: Epson Stylus color 480 Plates: PEDOT:PSS (Bayer -Baytron P)Dielectric: PBPDA-PD from Aldrich (PI after heating)R = 17 MΩC = 50 pFτ = 0.85 ms
All-polymer capacitor fabricated with inkjet printing techniqueYi Liu, Tianhong Cui *, Kody Varahramyan
Institute for Micromanufacturing, Louisiana Tech University, 911 Hergot Avenue, P.O. Box 10137, Ruston, LA 71272, USAReceived 17 November 2002; received in revised form 28 January 2003; accepted 31 January 2003
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Printed Electronics :Inkjet Printed Sensors SOTA Review 2/3
Printer: MicrodropInk: PEDOT:PSS (Clevios PH 500)
Inkjet Printing of MicrosensorsHussein Al-Chami, Student Member, IEEE and Edmond Cretu, Member, IEEE
Department of Electrical & Computer Engineering, University of British Columbia, Vancouver, BC V6T 1Z4, Canada
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Printed Electronics: Inkjet Printed Sensors SOTA Review 3/3
Process: Screen printing for the electrodes and inkjet (Dimatix) for the PANIInk: Silver nanoparticles (Acheson) + custom prepared PANI ink
Fabrication of chemical sensors using inkjet printing and application to gas detection Karl Crowley, Aoife Morrin, Malcolm R. Smyth, Anthony J. Killard
Sensors and Separations Group, School of Chemical Sciences, National Centre for Sensor Research, Dublin City University, Dublin 9, Ireland
Evolution of inkjet printed droplet ofnanoPANIsolution over time.
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Smart sensing• Customized IMU• User Tracking&Localization• Inertial navigation systems• Assistive systems• Active Ageing & Well Being• Hazards monitoring• Volcanic monitoring• Structural monitoring
Sensing• E-B Field sensors• ()Fluidics• Bio-receptor enhanc.• Rapid prototyping (IJP)• FF inertial sensors/actuators• Nano-MEMS
x
yz
•Sensor data fusion
•Sensor Networks
•SR&Dithering
•Noise shaping
•Advanced signal
processing
•Non Linear Harvesting
•PCB
•MEMS/NANO
•Rapid prototyping
•Flexible sensors
•INK JET
•WSN
•Smart Sensors
•Piezoelectrics
•Ferroelectrics
•Multiferroics
•Ferrofluids
•-metal
•INKS
•Polimers
Methodologies Technologies Materials
SensorLab@DIEEI-UNICT
Energy-Harvesting• IJP Snap Through Buckling• Double Piezo
App
licatio
ns
Contact: Prof. Bruno Andòbruno.ando@unict.it
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
x
yz
InkJet Printing sensing system Microsensors
Measurement station for sensor characterization
A microcontroller architecturebased multisensor system
-Micro&Nano sensors-Bio-sensors-InkJet Printed Sensors-Polymeric Sensors-Metrological characterization of sensors-Smart multi-sensor systems-Systems for the monitoring of people (ActiveAgeing and Well Being) and the environment(pollutions and seismic activity)
Research Activities at the SensorLab@DIEEI-UNICT
Non Linear Energy Harvesting
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Rapid prototyping@ SensorLab@DIEEI-UNICT
LPKF Protomat S103
CNC Milling Machinefor the rapidprototyping of PCBand micro-patterningmaterials.
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Rapid prototyping at SensorLab@DIEEI-UNICT
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
IJP Sensors at SensorLab@DIEEI-UniCT
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
PrintingTechnologies
ConductiveINKS
FunctionalINKS
Costs Time consuming
Screen printing
Yes Yes High Yes
Low cost inkjet printer
YesYes with restriction
Low No
Professional inkjet printer
Yes Yes High No
Silver nano-particles Inks
PEDOTPANI
Feasibility of IJP sensors by low cost equipment
IJP Sensors at SensorLab@DIEEI-UniCT
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
IJP Sensors at SensorLab@DIEEI-UniCT
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
IJP Sensors at SensorLab@DIEEI-UniCT
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Epson WF2010W printer Metalon JS-B25 silver ink
Square coils Circular coils Resistors InterdigitsLayouts with strain gauges
PET substrateCartridge
IJP Sensors at SensorLab@DIEEI-UniCT
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Strain Gauges (SensorLab@DIEEI-UniCT)
Dev
ice
Leg
ht
Tracks Width
Track Spacing
LAYOUT
SG1 SG2 SG3
Track Width (m) 200 200 200
Spacing (m) 300 300 300
Length (cm) 1,0 1,5 2,0
Resistance R0 266,0 1,9% 563,2 2,8% 862,8 2,2%
Gage Factor 21 17 15
Uncertainty band ±1.17 10-4 ± 1.50 10-4 ±2.40 10-4
Resolution() 1.2 1.4 1.9
Repeatibility(%) 2.70 10-3 2.67 10-3 3.04 10-3
Metalon® JS-B15P
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Electron microscopy (SEM) inspection of electrodes with a track width of 200 m.
A spacing of 150m does not assure tracks insulation.
Below 200 μm
Electrodes analysis
Over 200 μm
Electron microscopy (SEM) images of the silver layer deposited on the device.The silver layer is quite homogeneous.An approximated thickness of 1.90 µm has been estimated.
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Resonant Mass Sensor (SensorLab@DIEEI-UniCT)
1.9 cm
4.6
7 cm
0 0.05 0.1 0.15 0.2 0.25 0.3 0.355.5
6
6.5
7
7.5
8
8.5
9
9.5
10
10.5
11
Mass (g)
Fre
quency (
Hz)
Frequency trend (B3 fixed)
fr B3 I1
fr B3 I2
fr B3 I3
fr B3 I4
fr B3 I5
0 0.5 1 1.5 2 2.5 3 3.5 4-0.03
-0.02
-0.01
0
0.01
0.02
0.03
0.04
Time (s)
Voltage (
V)
Filtered impulse response (B1 I5 M0)
Impulse response operation
1 2 3 4 5
Current I
(mA)
20 30 40 50 60
Magnetic
field B (G)
2799 1606 945
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
PEDOT PANI GRAPHENE ZnO
Cl2 X
CH4 X X
CO X X
CO2 X X
H2 X
H2S X
NO X
NO2 X X X
NH3 X X X
IJP NH3 sensor (SensorLab@DIEEI-UniCT)
Pedot based NH3 sensor
IDT Silver Inkthickness: 200nm
PET Substratethickness: 200um
PHCV4-TQ Layerthickness: 12um
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
PEDOT PANI GRAPHENE ZnO
Cl2 X
CH4 X X
CO X X
CO2 X X
H2 X
H2S X
NO X
NO2 X X X
NH3 X X X
IJP CO2 sensor (SensorLab@DIEEI-UniCT)
Pedot/Graphene based CO2 sensor
Supply & conditioning
Characterization chamber
DAQ
CO2
USB
Valve Flow switch
Functiongenerator
USB/GPIB
LM35
Humiditysensor
CO2
referencesensor
CO2 sensingsystem
FAN
0 1000 2000 3000 4000 50000.09
0.095
0.1
0.105
0.11
0.115T=50°C
CO2 Concentration [ppm]
dR
/R
0 1000 2000 3000 4000 50000.095
0.1
0.105
0.11
0.115
0.12T=60°C
CO2 Concentration [ppm]
dR
/R
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
APPLICATION POINTS
1
2
3
4
5
1
2
3
4
5
0
5
10
15
20
25
30
distribuzione interpolata 3D
0
5
10
15
20
25
30
Testing the reliability ofmaterials and prosthesyshealth,by monitoring theTibio-Femoral stress.
MUX
IJP sensors for Bio-medical App. (DIEEI-UniCT, DIE-UniBS)
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
IJP Inclinometer (SensorLab@DIEEI-UniCT)
0 1 2 3 4 5 6 7-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
Time (s)
Ou
tpu
t V
olt
ag
e (
V)
0 10 20 30 40 50 60 70 80 90
0
1
2
3
4
5
6
7
8
Tilt (°)
Ou
tpu
t V
olt
ag
e (
V)
experimental data
linear model
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
IJP B-Field sensor (SensorLab@DIEEI-UniCT)
0 0.005 0.01 0.015 0.02 0.025 0.03 0.0350
0.5
1
1.5
2
2.5
3
3.5x 10
-4
Magnetic Field [T]
DR
/R
Driving current (mA)@9.1 Hz 20 30 50 90
Responsivity [(Ω/Ω)/T] 0.009 0.011 0.017 0.024
Resolution [mT/(Ω/Ω)] 1.20 0.46 0.40 0.37
Actuation coil
Strain Gauge
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
IJP Accelerometer (SensorLab@DIEEI-UniCT)
101
-60
-50
-40
-30
-20
-10
0
Frequency (Hz)
Ma
gn
itu
de
(d
B)
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
x 10-3
0
0.1
0.2
0.3
0.4
0.5
Vout (V)
Ac
ce
lera
tio
n (
g)
2 4 6 8 10 12 14
x 10-3
0
0.1
0.2
0.3
0.4
0.5
Vout (V)
Ac
ce
lera
tio
n (
g)
Calibration diagrams at (top) 10 Hzand (bottom) 35 Hz.
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Flexible touch sensor: realization (SensorLab@DIEEI-UniCT)h1
h2
h3
Polymer substrate
Support rubber layer
Functional Layer
Applied force/pressure
S S S SG G G
λ
b
d
l
λ
Functional Layer
Support Rubber IDC sensor
The technology adopted makes use of a silver
nano-particles solution, the “Metalon® JS-
B15P” by Novacentrix [22], and the printer
Epson WorkForce WF 2010W for the
realization of the conductive patterns. The
adopted substrate is the Novele™ IJ-220
Printed Electronics Substrate by Novacentrix
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Flexible touch sensor: characterization (SensorLab@DIEEI-UniCT)
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
5,5
6,0
6,5
7,0
7,5
8,0
8,5
9,0
9,5
2,0 3,0 4,0 5,0 6,0 7,0 8,0 9,0 10,0
CID
C(p
F)
Funtional Layer thickness, h3 (mm)
Experim
Kim model
Model (11)
Average responsivity: 0.140 pF/mm; Resolution: 0.36 mm
Flexible touch sensor: characterization (SensorLab@DIEEI-UniCT)
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Flexible touch sensor: modeling (SensorLab@DIEEI-UniCT)h1
h2
h3
Polymer substrate
Support rubber layer
Functional Layer
Applied force/pressure
S S S SG G G
λ
𝐶1 = 𝜖0𝜖1𝐾 𝑘1
′
𝐾 𝑘1
𝐶2 = 𝜖0 𝜖2 − 𝜖1𝐾 𝑘2
′
𝐾 𝑘2
𝐶3 = 𝜖0𝜖3𝐾 𝑘3
′
𝐾 𝑘3
𝐶𝐼𝐷𝐶 = 𝐶1 + 𝐶2 + 𝐶3
K(ki) is the complete elliptic integral of the first kind
with modulus ki
𝑘𝑖′ = 1 − 𝑘𝑖
2
𝑘𝑖′ =
𝑠𝑖𝑛ℎ𝜋𝑏
4ℎ𝑖
𝑠𝑖𝑛ℎ𝜋
2ℎ𝑖
𝑏
2+𝑑
𝑠𝑖𝑛ℎ2𝜋
2ℎ𝑖
𝑏
2+𝑑+𝑎 −𝑠𝑖𝑛ℎ2
𝜋
2ℎ𝑖
𝑏
2+𝑑
𝑠𝑖𝑛ℎ2𝜋
2ℎ𝑖
𝑏
2+𝑑+𝑎 −𝑠𝑖𝑛ℎ2
𝜋𝑏
4ℎ𝑖
𝐾 𝑘𝑖
𝐾 𝑘𝑖′ ≅
2
𝜋𝑙𝑛 2
1−𝑘𝑖
1+𝑘𝑖𝑓𝑜𝑟
2
2≤ 𝑘𝑖 ≤ 1
Τ𝜋 2
𝑙𝑛 21+𝑘𝑖′
1−𝑘𝑖′
𝑓𝑜𝑟 0 ≤ 𝑘𝑖 ≤2
2
b
d
lλ
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Flexible touch sensor: modeling (SensorLab@DIEEI-UniCT)h 1
h 2h 3
Polymer substrate
Support rubber layer
Functional Layer
Applied force/pressure
S S S SG G G
λ
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
IJP Actuator (SensorLab@DIEEI-UniCT)
0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.160
1
2
3
4x 10
-4
Id [A]
FB
[N
]
BDC
=98.8 mT
BDC
=70.6 mT
BDC
=37.1 mT
FB
=2.56e-3*Id
FB
=1.30e-3*Id
FB
=0.57e-3*Id
0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.160
1
2
3
4
5
6
7x 10
-3
Id [A]
Bea
m d
efle
ctio
n D
y [
m]
BDC
=98.8 mT
BDC
=70.6 mT
BDC
=37.1 mT
Dy=43.5e-3*Id
Dy=19.5e-3*Id
Dy=28.3e-3*Id
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Claims:• Low cost• Autonomous• Embedded signal
processing• Low power budget• Easy of use and wear
Smart Unit
SENSORS
WirelessCommun.
• CAREGIVERS• PARENT• SERVICE CENTER
SignalProcessing
Wireless Commun.Manag.
Data Acquisition
Wireless Commun.
ZigbeeWSN
GPRS
Bluetooth
The smart sensor concept…
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly Smart Unit
SignalProcessing
Wireless Commun.Manag.
Data Acquisition
Wireless Commun.
ZigbeeWSN
GPRS
Bluetooth
IJP Sensors
Fully LOW COST Inkjet Printed Electronics
WirelessCommun.
Electronics
P
O
W
E
R
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Claims:• Low cost• Autonomous• Embedded signal
processing• Low power budget• Easy of use and wear
Smart Unit
SignalProcessing
Wireless Commun.Manag.
Data Acquisition
Wireless Commun.
ZigbeeWSN
GPRS
Bluetooth
IJP Sensors
WirelessCommun.
Electronics
P
O
W
E
R
Fully LOW COST Inkjet Printed Electronics
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
InkJet Printed– Snap Through Buckling Harvester
X
Y
ΔX
ΔY/2
Stable state
Stable state
ΔY/2
F
t
Proof mass
Z
A real challenge!!!
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
1 c
m
10 cm
Sub
stra
teID
Tel
ectr
od
es
Act
ive
Mat
eria
lPZ
T
InkJet Printed– Snap Through Buckling Harvester
A PZT layer has been screen printed to convert strains due to the beam switches (induced by external vibrations) between its two stable states into an output voltage.
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
InkJet Printed– Snap Through Buckling Harvester
MassIJP STB HarvesterClamping System
Substrate IJP electrodes PZT Clamping System
The STB beam is implemented via a PET (PolyEthyleneTerephthalate) substrate
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Investigations of dynamic performance of the IJP-STB harvester
0 0.5 1 1.5 2 2.5 3 3.5 4-15.9
-7.95
0
7.95
15.9
time [s]
Dis
pla
ce
me
nt
[mm
]
0 0,5 1 1,5 2 2,5 3 3,5 4-19.05
-9.52
0
9.52
19.05
time [s]
Acce
lera
tio
n [
m/s
2]
laser
accelerometer
0 1 2 3 4
-12.9
0
12.9
time [s]
Dis
pla
ce
me
nt
[mm
]
0 1 2 3 4-47.62
-23.81
0
23.81
47.62
time [s]
Acce
lera
tio
n [
m/s
2]
laser
accelerometer
ΔY= 1 mm ΔY= 3 mm
laser
accelerometer
PSD of the laser output signal
Example of time series of signals output in case of sinusoidal solicitation at 6Hz with the strength close to the minimum value assuring the beam switching between its stable states
Bruno Andò, SmartSensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.00
0.005
0.01
0.015
0.02
0.025
AccRMS
[m/s2]
VR
MS
norm
[V
]
0.0 7.9 15.9 23.9 31.9 36.6 40.1 43.6 51.2
Accmax
[m/s2]
0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.00
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
AccRMS
[m/s2]
VA
v P
ea
k [V
]
0.0 7.9 15.9 23.9 31.9 36.6 40.1 43.6 51.2
Accmax
[m/s2]
0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.00
0.02
0.04
0.06
0.08
0.1
0.12
0.14
AccRMS
[m/s2]
VR
MS
norm
[V
]
0.0 8.5 16.9 25.4 33.9 36.4 43.6 46.8 49.9 53.4 59.3
Accmax
[m/s2]
0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.00
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
AccRMS
[m/s2]
VA
V P
eak
[V]
0 8.5 16.9 25.4 33.9 36.4 43.6 46.8 49.9 53.4 59.3
Accmax
[m/s2]
ΔY= 1 mm
ΔY= 3 mm
norm
RMSVAvPeakVand
values as a function of the accelerations applied to the device for the two values of the pre-compression
Electrical Behavior of the IJP - STB Harvester
6 Hz8 Hz
10 Hz
12 Hz14 Hz
6 Hz8 Hz 10 Hz
12 Hz
Powers in the order of 102 nW have been experimentally estimated
Bruno Andò, SensorLab
DIE
EI –
Un
ive
rsit
y o
f C
atan
ia, I
taly
Rapid prototyping of sensors
Prof. Bruno Andò DIEEI-University of Catania
bruno.ando@unict.it