Post on 10-Jul-2020
LITE-ON DCC
RELEASE
LITE-ON Technology Corp. / OptoelectronicsNo.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660http://www.liteon.com/opto
PhotocouplerProduct Data SheetLTV-702F (M, S, S-TA, S-TA1) series Spec No.: DS-70-96-0010Effective Date: 07/20/2016
Revision: F
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
1/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
1. DESCRIPTION
1.1 Features
Current transfer ratio (CTR : 40% ~ 320% at IF = 10mA, VCE = 5 V, TA=25oC)
High input-output isolation voltage Viso = 5,000Vrms
High collector-emitter voltage ( VCEO = 70V )
Response time ( tr : TYP. 2s at VCC = 5V, IF = 10mA, RL = 75 ) Dual-in-line package :
LTV-702F
Wide lead spacing package :
LTV-702FM
Surface mounting package :
LTV-702FS
Tape and reel packaging :
LTV-702FS-TA, LTV-702FS-TA1
Safety approval * UL approved (No. E113898)
* TUV approved (No. R9653630)
* CSA approved (No. CA91533-1)
* FIMKO approved (No. 193422-01)
* NEMKO approved (No. P96103013)
* DEMKO approved (No. 303968)
* SEMKO approved (No. 9646047 / 01-30)
* VDE approved (No. 094722 )
RoHS Compliance
All materials be used in device are followed EU RoHS directive (No.2002/95/EC).
ESD pass HBM 8000V/MM2000V
MSL class1
1.2 Applications
Directly connectable to TTL
2/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
2. PACKAGE DIMENSIONS
2.1 LTV-702F 2.2 LTV-702FM
2.3 LTV-702FS
Notes :
1. Year date code.
2. 2-digit work week.
3. Factory identification mark shall be marked
(Y: Thailand, W: China-CZ).
4. Rank shall be or shall not be marked.
5. For VDE option.
Dimensions in millimeters (inches).
3/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
3. TAPING DIMENSIONS
3.1 LTV-702FS-TA
3.2 LTV-702FS-TA1
3.3 Quantities Per Reel
Description Symbol Dimension in mm (inch)
Tape wide W 16±0.3 (0.63)
Pitch of sprocket holes P0 4±0.1 (0.15)
Distance of compartment F 7.5±0.1 (0.295)
P2 2±0.1 (0.079)
Distance of compartment to compartment P1 12±0.1 (0.472)
Package Type TA / TA1
Quantities (pcs) 1000
4/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
4. RATING AND CHARACTERISTICS
4.1 Absolute Maximum Ratings at Ta=25°C
Parameter Symbol Rating Unit
Input
Forward Current IF 60 mA
Reverse Voltage VR 6 V
Power Dissipation P 105 mW
Junction Temperature TJ 125 oC
Output
Collector - Emitter Voltage VCEO 70 V
Emitter - Collector Voltage VECO 6 V
Collector Current IC 50 mA
Collector Power Dissipation PC 160 mW
Total Power Dissipation Ptot 200 mW
*1 Isolation Voltage Viso 5000 Vrms
Operating Temperature Topr -55 ~ +100 °C
Storage Temperature Tstg -55 ~ +150 °C
*2 Soldering Temperature Tsol 260 °C
*1. AC For 1 Minute, R.H. = 40 ~ 60%
Isolation voltage shall be measured using the following method.
(1) Short between anode and cathode on the primary side and between collector and emitter on the
secondary side.
(2) The isolation voltage tester with zero-cross circuit shall be used.
(3) The waveform of applied voltage shall be a sine wave.
*2. For 10 Seconds
5/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
*CTRI
I100%C
F
4.2 ELECTRICAL OPTICAL CHARACTERISTICS at Ta=25°C
PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS
INPUT
Forward Voltage VF — 1.4 1.7 V IF=60mA
Reverse Current IR — — 10 A VR=6V
Terminal Capacitance Ct — 30 250 pF V=0, f=1KHz
OUTPUT
Collector Dark Current ICEO — — 50 nA VCE=10V, IF=0
Collector-Emitter
Breakdown Voltage BVCEO 70 — — V
IC=0.1mA
IF=0
Emitter-Collector
Breakdown Voltage BVECO 6 — — V
IE=10A
IF=0
TRANSFER
CHARACTERISTICS
Collector Current IC 4 — 32 mA
IF=10mA, VCE=5V
*Current Transfer Ratio CTR 40 — 320 %
Collector-Emitter
Saturation Voltage VCE(sat) — 0.25 0.4 V
IF=10mA
IC=2.5mA
Isolation Resistance RISO 51010 11011 — DC500V
40 ~ 60% R.H.
Floating Capacitance CF — 0.6 1 pF V=0, f=1MHz
Cut-Off Frequency fC — 150 — kHz VCC=5V, IF=10mA
RL=75, -3dB
Response Time (Rise) tR — 2 7 s VCC=5V, IF=10mA
RL=75 Response Time (Fall) tf — 2 8 s
6/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
5. RANK TABLE OF CURRENT TRANSFER RATIO CTR
CTR Rank Min Max Condition
A 40 80
IF=10mA, VCE=5V, TA=25oC
B 63 125
C 100 200
D 160 320
No mark 40 320
7/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
6. CHARACTERISTICS CURVES
Fig.1 Forward Current vs. Fig.2 Collector Power Dissipation vs.
Ambient Temperature
Fig.4 Forward Current vs.
Fig.5 Current Transfer Ratio vs.
Forward Current
Fig.6 Collector Current vs.
Collector-emitter Voltage
Forward voltage V (V)
Forward current I (mA)
F
F CE
FF
orw
ard
curr
ent I (
mA
)
F
-55
Ta= 75 C50 C
25 C
0 C
-25 C
Ta= 25 C
I = 30mA
Pc(MAX.)
5mA
10mA
20mA
F
80
R =
500k100k
2mA
Ambient Temperature
Forw
ard
curr
ent I (
mA
)
Ambient temperature Ta ( C) Ambient temperature Ta ( C)
Colle
cto
r p
ow
er
dis
sip
ation P
c (
mW
)C
olle
cto
r curr
ent Ic
(m
A)
Curr
ent tr
ansfe
r ra
tio C
TR
(%
)
Collector-emitter voltage V (V)
60
40
20
0-25 0 25 50 75 100 125 50-25-55 0 25 12575 100
200
100
50
150
0
160
01
0.5 1.0 1.5 2.0 2.5 3.0
2
5
10
20
50
100
200
500
00 2 4 6 8 10
5
10
15
20
25
30
35
40
45
00
2 5 10 20 50
20
40
80
100
120
140
160
200
180
60
Forward Voltage
o
o
o
o
o
o
o
oo
Fig.3 Collector-emitter Saturation
Voltage vs. Forward Current
Forward current I (mA)F
Colle
cto
r-em
itte
r satu
ration v
oltag
eV
(s
at)
(V
)
2mA
3mA
1mA
5mA
Ic= 0.5mA Ta= 25 Co
0 2.5 5.0 7.5 10.0 12.50
1
2
3
4
5
6
VCE= 5V
Ta= 25 C
8/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
Fig.11 Frequency Response
Fig.9 Collector Dark Current vs.
Vo
ltag
e g
ain
Av
(dB
)
Frequency f (kHz)
-8
-100.5 1
-4
-2
-6
2 5 10 20
R = 200
50010050 200
150 75
Ambient temperature Ta ( C)
10
Co
llecto
r d
ark
curr
ent I (
A)
2
0
10
10-30
-13
-12
200 40
Ambient Temperature
10
10
10
10
CE
O
-11
-10
-9
-8
10
-7
-6
100o
60 80
Load resistance RL (k )
Load Resistance
Fig.10 Response Time vs.
Resp
onse tim
e (
s)
1
0.50.02 0.05
10
5
2
0.1 0.2 0.5
tr
tf
o
Fig.7 Relative Current Transfer Ratio vs.
Ambient temperature Ta ( C)
50
Rela
tive
curr
ent tr
ansfe
r ra
tio
(%
)
-550
100
0-25 25
Ambient Temperature
150
100o
7550
vs. Ambient Temperature
Ambient temperature Ta ( C)
Fig.8 Collector-emitter Saturation Voltage
Co
llecto
r-em
itte
r satu
ratio
n v
oltag
e
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0-55
V (
sat)
(V
)-25 0
0.16
7525 50o
100
90%
Test Circuit for Frequency Response
Output
Vcc
td
tr
ts
tf
Output
Test Circuit for Response Time
Input
VccInput
Output
10%RDRL
RLRD
IF= 10mA
VCE= 5V
IF= 10mA
VCC= 5V
Ta= 25 C
IF= 10mA
IC= 2.5mA
VCE= 10V
IF= 10mA
VCC= 5V
Ta= 25 Co
9/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
7. TEMPERATURE PROFILE OF SOLDERING
7.1 IR Reflow soldering (JEDEC-STD-020C compliant)
One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three times.
Profile item Conditions
Preheat
- Temperature Min (TSmin)
- Temperature Max (TSmax)
- Time (min to max) (ts)
150˚C
200˚C
90±30 sec
Soldering zone
- Temperature (TL)
- Time (tL)
217˚C
60 sec
Peak Temperature (TP) 260˚C
Ramp-up rate 3˚C / sec max.
Ramp-down rate 3~6˚C / sec
60 ~ 120 sec
25 C
150 C
200 C
260 C
217 C
60 sec
Time (sec)
Tem
pera
ture
( C
)
20 sec
Tsmax
ts (Preheat)
tL (Soldering)
Tsmin
TL
TP
Ramp-down
Ramp-up
35~70 sec
10/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
7.2 Wave soldering (JEDEC22A111 compliant)
One time soldering is recommended within the condition of temperature.
Temperature: 260+0/-5˚C
Time: 10 sec.
Preheat temperature:25 to 140˚C
Preheat time: 30 to 80 sec.
7.3 Hand soldering by soldering iron
Allow single lead soldering in every single process. One time soldering is recommended.
Temperature: 380+0/-5˚C
Time: 3 sec max.
11/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
8. RECOMMENDED FOOT PRINT PATTERNS (MOUNT PAD)
Unit: mm
12/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
9. NAMING RULE
Example : LTV-702FS-TA1-A
Example : LTV702FSTA1A-V
(2) TAPING TYPE (TA, TA1)
Please refer to orientation of taping on Page: 3
(1) No suffix = Dual-in-Line package
M = Wide lead spacing package
S = Surface mounting package
DEVICE PART NUMBER
LTV702F(1)(2)(3)-V
(4) VDE order option
(3) CTR RANK (A,B,C,D or none)
Please refer to the CTR table on Page: 6
(2) TAPING TYPE (TA, TA1)
Please refer to orientation of taping on Page: 3
(1) No suffix = Dual-in-Line package
M = Wide lead spacing package
S = Surface mounting package
(3) CTR RANK (A,B,C,D or none)
Please refer to the CTR table on Page: 6
DEVICE PART NUMBER
LTV-702F(1)-(2)-(3)
13/13
Photocoupler
LTV-702F (M, S, S-TA, S-TA1) series
Part No: LTV-702F (M, S, S-TA, S-TA1) series BNC-OD-FC002/A4
Rev.: -
10. NOTES
LiteOn is continually improving the quality, reliability, function or design and LiteOn reserves the right to make changes
without further notices.
The products shown in this publication are designed for the general use in electronic applications such as office automation
equipment, communications devices, audio/visual equipment, electrical application and instrumentation.
For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment,
Medical equipment, etc, please contact our sales representatives.
When requiring a device for any “specific” application, please contact our sales in advice.
If there are any questions about the contents of this publication, please contact us at your convenience.
The contents described herein are subject to change without prior notice.
Immerge unit’s body in solder paste is not recommended.