Post on 28-Apr-2018
2012 PTS/PTNA BIOINTERFACE OCTOBER 20121
Low pressure and atmospheric plasma processing: Applications for the life sciences
Prepared for:
BioInterfaceDublin, Ireland October 23-25, 2012
Mikki Larner, Vice President, Sales & Marketing, PTS and Plasmatreat N.Am.Mikki.Larner@Plasmatreat.comwww.PlasmaTechSystems.com
Graham Porcas, Director, Plasmatreat UKGrahamPorcas@btconnect.comwww.Plasmatreat.co.uk
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Plasma technology is used for molecular re-engineering of surfaces.
There are myriad applications. We refer to it as a technology toolbox.
Allows an engineer to choose a substrate with desired bulk properties and modify the surface for optimum performance.
Power of Plasma
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AgendaCompany details
Technology OverviewAtmospheric Plasma (AP)Low Pressure (LP)
Case StudiesPolypropylene activationSterilisationThin film deposition
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Company Statistics
110 person global team of scientist, chemists, physicists, engineers and support staff that specialize in LP (low pressure) and AP (atmospheric pressure) gas plasma surface modification.
Combined installation base of 5000+ systems worldwide
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LocationsR&D Centers
Great Britian, Bicester
Belmont, California
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Plasma ProcessS t a t e s o f A g g r e g a t i o n
solid liquid
gaseous plasma+
+
**
e-
e-
e-
**
gas molecule
* gas molecule(excited)
*moleculefragment (high-energetic)
temperature
energy
temperature
energy
temperature
energyionsfree electron
+e-
–
+–
–
+
+
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Process FlexibilityPlasma Process Technology Modification Example
Atomic level cleaning (ablation)Surface preparation to include removal of organic contaminants.
VacuumAtmospheric
Activation and FunctionalizationPlasmas are used to break surface layer molecularbonds leading to an altered surface chemistry,depending on the process gas.
VacuumAtmospheric
PECVD (Plasma Enhanced Chemical Vapor Deposition)Unsaturated carbon containing gases and liquids, under the influence of a plasma, can be deposited to create unique surface coatings.
VacuumAtmospheric
Crosslinking (casing)With use of an inert chemistry, ability to crosslink top molecular layers of polymer
Vacuum
GraftingAccomplished when introducing species in a non-powered step -- allows attachment of molecules
Vacuum
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Openair® Plasma Technology Overview
feed in of ionisation gas, e.g.air
screen with boreholes
discharge area
voltage supply
plasma jet
electrode
Insulation layer
stainless steel housing
plasma beam: rotating at high potential
plasma beam: rotating at zero potential
substrate
2012 PTS/PTNA BIOINTERFACE OCTOBER 20129Openair® - Plasma-Technology
O
O
N*
* *
*N N
O
N
NN
ON
O
O
N
O
*
*
*
H H H H H H H
C C CCC C C
H H H H H H H
Attack Surface Contamination
2012 PTS/PTNA BIOINTERFACE OCTOBER 201210Openair® - Plasma-Technology
C
O
O
N*
* *
*N N
O
N
NN
ON
O
O
N
O
*
*
*
H H H H H H H
C C CCC C C
H H H H H H H
Remove Surface Contamination
2012 PTS/PTNA BIOINTERFACE OCTOBER 201211Openair® - Plasma-Technology
C
O
O
N*
* *
*N N
O
N
NN
ON
O
O
N
O
*
*
*
H H H H H H H
C C CCC C C
H H H H H H H
Energize The Surface to …
2012 PTS/PTNA BIOINTERFACE OCTOBER 201212Openair® - Plasma-Technology
C
N
O
N
N
N
NN
*
*N
O O
O
O
N*
*
*
*
*
*
H H H H H H H
C C CCC C C
H H
H
H H H
O
O O
Form Functional Sites
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Chemistry Versatility(chemistries used both in LP and AP Plasma are highlighted)
Silanes (Amino, Carboxy, Hydroxyl, Mercapto, Vinyl)
Hexafluoropropylene Diglymes
Hexafluoroethane Polyethylene glycols
TetramethylsilaneTetrafluoromethane
Hexamethyldisiloxane, OctamethyldisiloxaneAcetylene
GluteraldehydeEthylene
ButylamineEthane
DiaminopropaneMethane
TolueneAir
EthanolCarbon Dioxide
Hydroxyethylmethacrylate, FluoroacrylatesNitrous Oxide
AcetoneHydrogen
Acrylic AcidAmmonia
Ethylenediamine Nitrogen
Allyl AmineHelium
WaterArgon
MethanolOxygen
Liquids (create vapors)Gas
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LP SYSTEM
Multiple Chamber Configurations
PS0150/LP150PS524
TC04
PS0350/TC04
PS0500 TUMBLER T2 FOR POWDERS
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LP SYSTEM
Continuous profile/In-lineFiber & Tubing Treatment
Systems
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LP SYSTEM
14 inch (35 cm) Flex/Film/MembraneRoll-to-Roll Transport
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AP & LP SYSTEM
CASE STUDIES
Polypropylene activationSterilisationThin film depositionAmination
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Untreated B.subtilis Spore Plasma treated B.subtilis Spore
AP SYSTEM
Sterilisation
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feed in of ionization gas e.g. air
electrode
voltage supply
discharge area
substrate
plasma beam: rotating at zero potentialfor coating
insulation layer
stainless steel housing
plasma beam: rotating at high potential
precursor gas vapourpolymerisation jet head
screen with boreholes
AP SYSTEM
Thin Film Deposition Tool
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PROPERTIESLayer Thickness: 10-500 nmStable up to 300 °C (min 2 h)Deposition at 200 m/min line speedOptically transparent (down to 320 nm)
APPLICATIONSBarrier Properties Mould-release LayersEasy to clean properties
Hydrophobic Surfaces
AP SYSTEM
Thin Film Deposition Tool
2012 PTS/PTNA BIOINTERFACE OCTOBER 201228
LP SYSTEM
Fluoropolymer Thin Film Deposition and influence of power on properties
(Normalized for Thickness) Source: Anasys, PTS