Post on 21-Jun-2015
Certified DIN EN ISO 9001
Low-Cost RFID IC Packaging and Assembly Workshop
November 14th 2005
Low Cost Bumping for RFID Chips
Dr. E. Zakel; T.Oppert
www.pactech.de
Certified DIN EN ISO 9001
• Electroless Ni/Au Bumping
– Market share & Usage– Process/Yield/Reliability– Equipment– Assembly– Applications
Content
Certified DIN EN ISO 9001
Locations Worldwide
Italy
DenmarkSweden
Singapore
TaiwanThailand Application Center Philippines
Pac Tech USA IncSanta Clara, CA
Boston
Pac Tech GmbHBerlin/ Nauen
TokyoFukui
ManufacturingFacilities
Distributor/ Rep. Office
Finland
Korea
IsraelChina
1995 2005
Certified DIN EN ISO 9001
II
ElectrolessElectroless Ni/Au BumpingNi/Au Bumping
Market Share & UsageMarket Share & Usage
Certified DIN EN ISO 9001
Worldwide Use of Electroless Ni/Au
Distribution
USA (30%)Europe (40%)Asia (30%)
Memory 12.5%
RFID 20%
Pass. Comp./CSP's20%MOSFET 10%
LCD Driver 2.5%
ASIC 22.5%
Medical 12.5%
Applications
Production 50%Qualification 30%Prod. Ramp Up 20%
ImplementationStatus
RFID – Growth !
Certified DIN EN ISO 9001
♣ Europe
- 1 subcontractor bumping facility
- 4 wafer foundries
♣ Asia
- 4 subcontractor facilities
- 5 wafer foundries
♣ USA
- 2 subcontractor facilities
- 3 wafer foundries
WorlwideWorlwide Implementation of electroless Ni/Au Implementation of electroless Ni/Au for Al pad for Al pad metalizationmetalization
Certified DIN EN ISO 9001
Main products using electroless Ni/Au
- ASIC (Sensors)- LCD Drivers- PowerMOS (Automotive)- MOSFET- Protection devices (Passives) CSP‘s, WLCSP‘s- Memories and memory modules- Consumer electronics- Battery control (Mobile Phone)- Medical (Ear phone)
• Products under very high price pressure (RFID)
Certified DIN EN ISO 9001
2000 2001 2002 2003 2004 2005 2006 Year
Gro
wth
JapanSubCon
STWKorea
USAMemory
PacTechUSA
SubCon
Europe
RFID
Business Development – Licenses of Pac Tech
Asia
&
Europe
Chinan.a.
AsiaWL-CSP
Certified DIN EN ISO 9001
IIII
ElectrolessElectroless Ni/Au BumpingNi/Au Bumping
Process/Yield/ReliabilityProcess/Yield/Reliability
Certified DIN EN ISO 9001
Bumping methods
lowMassNi/Au + Solder
n.a.DevelopmentElectroless Pd
highsmall/mediumproduction
Au-Stud
highmass productionElectroplated Au
howmass productionElectroless Ni/Au
CostProduct Scale
Certified DIN EN ISO 9001
Comparison of Bumps for ACF/ NCP bonding
Electroplated Au Electroless Ni/ Au
- Low Hardness
- State of the Art
- Single Wafer Process
- Lowest Cost
- Higher Hardness Requires Modified Assembly Parameters
- Batch Process up to 50 Wafers
- Volume Production for
RFID Applications
Si - Wafer Si - Wafer
Passivation Passivation
Al - Pad Al - PadPlating Base
Certified DIN EN ISO 9001
Backside Coating
Pad Cleaning
Pad Activation
Electroless Nickel
Flash Gold
Coating Removal
Under Bump Metal Process
Electroless Plating of Ni/Au Bumps 1/2
Certified DIN EN ISO 9001
Backside Coating
Aluminum Cleaning
Zincate Pretreatment
Electroless Nickel
Immersion Gold
Coating Removal
Under Bump Metal Process
Electroless Plating of Ni/Au Bumps 2/2
Certified DIN EN ISO 9001
25µm Ni/Au UBM on RFID-Wafers 1/2
Customer A
Certified DIN EN ISO 9001
20µm Ni/Au UBM on RFID-Wafers 2/2
Customer B
Certified DIN EN ISO 9001
Shearforce Measurements of 25µm Ni/Au
Shearvalue: 725g
Shearheight @ 9µm
Customer A
Certified DIN EN ISO 9001
Bump Yield Ni/Au September 2005Yi
eld
(%)
90
91
92
93
94
95
96
97
98
99
10050
3133
; 109
13
5031
32; 1
0916
4848
28; 1
0917
4848
19; 1
0918
5031
20; 1
0919
5034
89; 1
0920
5031
31; 1
0921
5037
70; 1
1012
5037
68; 1
1013
5037
67; 1
1014
5037
69; 1
1015
5037
69; 1
1015
HH
SS
R.0
0; 1
1040
HH
ST2
.00;
110
41
HH
SS
W.0
0; 1
1094
HH
SS
W.0
0; 1
1094
HH
SS
Y.0
0; 1
1095
5037
71; 1
1096
5037
72; 1
1097
HH
ST1
.00;
111
33
HH
SS
S.0
0; 1
1134
HH
SS
S.0
0; 1
1134
HH
ST0
.00;
111
35
HH
ST4
.00;
111
78
HH
SS
T.00
; 111
79
Customer A
Lot #
Certified DIN EN ISO 9001
80,00
85,00
90,00
95,00
100,00
105,0010
932
1094
810
964
1098
110
987
1099
411
005
1101
711
023
1103
511
057
1106
311
081
1108
711
101
1110
611
122
1113
811
151
1115
711
167
1118
411
191
1119
611
201
Process #
Yiel
d (%
)
98,00
Bump Yield Ni/Au September 2005Customer B
Certified DIN EN ISO 9001
Process Time September 2005
0,00
1,00
2,00
3,00
4,00
5,00
6,00
7,00
8,00
9,00
10,00
1093
210
945
1095
510
967
1098
410
991
1100
311
009
1102
111
034
1105
711
063
1108
011
086
1110
011
106
1112
111
136
1115
011
156
1116
611
184
1119
011
196
1120
2
Process #
Day
s
Customer B
Certified DIN EN ISO 9001
Chip size: 2.5 x 2.5 mmNumber of I/O's: 4Pitch: 400 µmAssembly type: ACFSubstrate: Polyester
Reliability:· 40°C, 80% rH: 1000 hours - no failure· 125°C 1000 hours - no failure· mechanical torque(ISO) 500 cycles - no failure
Number of samples for test conditions: 100
87 REL
Reliability - Smart Label
Customer C
Certified DIN EN ISO 9001
IIIIII
ElectrolessElectroless Ni/Au BumpingNi/Au Bumping
EquipmentEquipment
Certified DIN EN ISO 9001
Pacline 300 - A50
8 Plating Systems in the Field
Certified DIN EN ISO 9001
♣ Maskless Process
♣ No Sputtering
♣ Low Initial Capital Investment
♣ Quality/Reliable/Proven Chemistries
♣ Suitable for Solder Bumping & Adhesives
♣ Wire bondable Interface
♣ Less cost than Electrolytic Plating
♣ Fastest and Most Cost Effective Method
Electroless UBM AdvantagesElectroless UBM Advantages
• 150 Wafers / hour• 4“ – 12“ Capability• SECS GEM• 300mm Handling• SPC Sofware
Certified DIN EN ISO 9001
Pac Tech Worldwide Production Capacity
Q1* Q2* Q3* Q4* Q1* Q2* Q3* Q4*
Pac Tech Nauen
PacLine 200 A25 40.000 40.000 40.000 40.000 40.000 40.000 40.000 40.000
PacLine 300 A50 ____ ____ ____ ____ 5.000 25.000 75.000 75.000
Japan (Alpha Bumping Technology)
PacLine 200 A25 40.000 40.000 40.000 40.000 40.000 40.000 40.000 40.000
PacLine 300 A50 ____ ____ ____ ____ ____ ____ 25.000 75.000
Pac Tech USA
PacLine 300 A50 ____ ____ ____ ____ 5.000 25.000 75.000 75.000
Total 80.000 80.000 80.000 80.000 90.000 130.000 255.000 305.000
Total Capacity per Year 320.000 Wafers 780.000 Wafers
2004 2005
Certified DIN EN ISO 9001
IVIV
AssemblyAssembly
Certified DIN EN ISO 9001
Low Cost Flip Chip – Attach for Smart Cards / Smart LabelsLow Cost Electroless Ni/Au Bump
1.) Leadfree Soldering 2.) Anisotropic Conductive Adhesive
3.) Isotropic Conductive Adhesive 4.) Nonconductive Adhesive
Low Cost Flip Chip.ppt
Laser Polymer Curing (ICA)
Laser Reflow (LaPlace) Laser Polymer Curing (ACA, ACF)
Laser Polymer Curing (NCA, NCF)
Certified DIN EN ISO 9001
Chip Assembly on RFID- Cards and Labels
• Module– Wire bonding - Flip Chip
• Bare Die Assembly onto Antenna– Wire bond - Flip Chip
168 LAP
Certified DIN EN ISO 9001
Advantage of Flip Chip Technology
• Reduction of Card / Label Thickness– by eliminating wire bond loop
• Cost Reduction
169 LAP
Certified DIN EN ISO 9001
RFID Substrate and antenna material
• Limitation on selection of flip chipprocesses– assembly temperature below TG of substrate
material– joining technology compatible with antenna
material
174 LAP
Certified DIN EN ISO 9001
Challenges of Flip Chip Attach in RFID- Cards and Labels
Solutions/advantages of laser soldering/curing• Low cost materials
– Substrate materials• PVC,PET, PP,....., Paper• TG below 100 °C• Material Property: flexible
– Antenna material• bare Copper (etched, coated wire)• Aluminium• Printed Antenna
Certified DIN EN ISO 9001
Flip Chip Bonder - LAPLACE
Certified DIN EN ISO 9001
VV
ApplicationsApplications
Certified DIN EN ISO 9001
Applications
Ni/Au on Copper
RFID-Tag
Certified DIN EN ISO 9001
FC with ACF - Smart Label
Certified DIN EN ISO 9001
Flip chip on coil for contactless smart cards
Certified DIN EN ISO 9001
Chip-Card-IC on Copper-Coil
Chip: Mifare, Phillips
Coil: Etched Cu-Coil
Contact: Ni/Au + Leadfree Solder
or
NCP, ICP ConductiveAdhesive
Certified DIN EN ISO 9001
Flip Chip Modules for contactless Smart Cards
Substrate handling: reel to reel
Assembly: Laplace soldering Flip chip attach