LHCf Arm2 – status of hardware upgrade in Firenze

Lorenzo Bonechi20 December 2013

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Main points for the work in Firenze• Assembling of new silicon -strip detectors

– New silicon wire bonding scheme to reduce the saturation effect in the front-end electronics for high energy releases with respect to the original scheme

– 8 sensors are available (8 needed)• One recovered from a test plane

• Testing the new hybrid boards– 2 types (Left and Right)– Not enough electronics components for the complete replacement of

the old hybrids– 7+7 under test (8+8 needed)– Some faults found

• Modification of the manipulators– We must increase the speed to decrease the time that is necessary to

go from the GARAGE position to the RUNNING position and vice versa

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The idea for the new silicon planes

Readout

ReadoutFloating

80 mm implant pitch160 mm readout pitch

Silicon sensor

In the original scheme one strip over two was connected to the front-end electronics and theother strips were floating.

Silicon sensor

Readout

ReadoutGND

OLD

OLD

Loosing some part of the released energy

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Assembling of new silicon planesGluing of NEW type hybrid circuits to old type kapton fanout

Gluing of silicon layers to the NEW kapton fanout (with GND pads for charge loss)

-strip fanout

Bias pad(to be connected to the silicon back-plane)

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Glue deposition on the new kapton fanout cable

Y-side

Thin layer of siliconic glue(not hard)

Electrically-conductive(Ag) glue deposited on a bent strip of golden kapton film for sensor biasing

Thin layer of kaptontape for insulation

GND large pad

Plane with vacuum system

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7

8

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X-side

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Gluing X-side silicon+kapton fanout to the thin (0.5 mm) aluminum layer

ARALDITE 2011Epoxy glue

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Wire bonding at the Delvotec machine

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Wire bonding at the Delvotec machine

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Wire bonding at the Delvotec machine

Mirko BrianziINFN-Fi technician

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• Wire bonding on the first layer has been completed yesterday afternoon

• I will continue the assembling after testing the first layer– We can test for pedestals and noise– Do we test also with laser?

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Test of the new hybrid circuits

• 7 (Left) + 7 (Right) boards have been mounted by an external company– not enough electronics devices to produce 8+8

• Successful testing for 10 boards– 1 board has a problem on one PACE3 chip– 3 boards have shorted power lines

• The 4 faulty boards have been delivered to the company for a x-ray check– There should be some news within today…

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Pedestals and noise on a good boardAD

Cs

Strip number Strip number

ADCs

PEDESTALS SIGMAS

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1 PACE3 chip with some problems?AD

Cs

Strip number Strip number

ADCs

PEDESTALS SIGMAS

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Modification of the manipulatorsOnly one manipulator has been modified and tested (two days ago).The modification was necessary because the beam dumping procedure in 2013 went faster than in 2010. It lasted about 5 min. So the target of this modification was 5 min for 12 cm movement (from the operation position to the garage position it took about 12min before the modification) (email by Menjo)

Replacement of the gear box(decreased the gear ratiofrom 30 to 12.5)

Test with 20.7 kg weightwas successfull.

Final vertical speed: 12 cm / 4 min

Power consumption is well below the limits of the engine

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Conclusions

MERRY CHRISTMAS !!!