Post on 27-Mar-2015
IST Workprogramme 2000IST Workprogramme 2000
Microelectronics Optoelectronics
Patrick.Van-hove@cec.eu.intPatrick.Van-hove@cec.eu.int
European Commission INFSO E6European Commission INFSO E6
Organisation & IntegrationOrganisation & Integration
KA4KA4Essential technologies & infrastructureEssential technologies & infrastructure
KA1KA1 Systems & servicesSystems & services
for the citizen for the citizen
KA2KA2New methods of work &New methods of work & Electronic Commerce Electronic Commerce
KA3KA3 MultimediaMultimedia
content & toolscontent & tools
Research networkingResearch networking
Future & emerging technologiesFuture & emerging technologies
Cross Programme Themes
KAIV: Strategic Focus & ArchitectureKAIV: Strategic Focus & Architecture
Software,Systems
& Services
Microsystems,Subsystems & Peripherals
Micro- &Opto-electronics
Mobile & SatelliteCommunications & Systems
Computing,Communications
& Networking
Simulation, Visualisation& Interfaces
Nuts and Bolts of the e-Economy
KAIV: Main highlightsKAIV: Main highlights
Strengthening infrastructure convergenceStrengthening infrastructure convergence– IP/Mobile/fixedIP/Mobile/fixed– Broadcasting and communicationsBroadcasting and communications
Higher visibility to networked embedded devices, and Higher visibility to networked embedded devices, and related architectures related architectures
– Embedded devices, Software, real-time systemsEmbedded devices, Software, real-time systems
Highlighting open source software and open systemsHighlighting open source software and open systems Includes a comprehensive range of take-up measuresIncludes a comprehensive range of take-up measures Two-phase perspective Two-phase perspective
– Integration in short to medium termIntegration in short to medium term– Higher performance and adaptivity in longer termHigher performance and adaptivity in longer term
KAIV Micro- and OptoelectronicsKAIV Micro- and Optoelectronics
Connectivity Mobility+ Interactivity+
System on ChipFocus:
ApplicationsInfo appliances
CommunicationSystems (optoE)
2000 Calls 4&5: Micro- and Opto-2000 Calls 4&5: Micro- and Opto-
Microelectronics - OptoelectronicsMicroelectronics - Optoelectronics– IST 2000 - IV.8.1IST 2000 - IV.8.1(R&D)(R&D) Microelectronics Design and TestMicroelectronics Design and Test– IST 2000 - IV.8.2IST 2000 - IV.8.2(R&D)(R&D) Application-Specific MicroelectronicsApplication-Specific Microelectronics– IST 2000 - IV.8.3IST 2000 - IV.8.3(R&D)(R&D) Industrial µelectronics technologies: processes,Industrial µelectronics technologies: processes,
equipment and materialsequipment and materials– IST 2000 - IV.8.4 IST 2000 - IV.8.4 (R&D)(R&D) Opto-electronic technologiesOpto-electronic technologies– IST 2000 - IV.8.5 IST 2000 - IV.8.5 (R&D)(R&D) Advanced micro and opto-electronicsAdvanced micro and opto-electronics– IST 2000 - IV.8.6 IST 2000 - IV.8.6 (Take-up)(Take-up) µelectronics design and test.µelectronics design and test.– IST 2000 - IV.8.7 IST 2000 - IV.8.7 (Take-up)(Take-up) Application Specific micro-electronics.Application Specific micro-electronics.– IST 2000 - IV.8.8 IST 2000 - IV.8.8 (Take-up)(Take-up) Industrial µelectronics technologiesIndustrial µelectronics technologies– IST 2000 - IV.8.9 IST 2000 - IV.8.9 (Take-up)(Take-up) Research training in microelectronics: Research training in microelectronics:
Accompanying MeasuresAccompanying Measures
Call 4
Call 5
AL IV.8.4 Optoelectronic TechnologiesAL IV.8.4 Optoelectronic Technologies
Focus:Focus: Materials, devices and modules for: Materials, devices and modules for:– High-speed routingHigh-speed routing– Data processingData processing– InterconnectionsInterconnections– SensingSensing
Application Areas:Application Areas: – Photonic networks (low-cost broad-band to-the-home applications)Photonic networks (low-cost broad-band to-the-home applications)– Information and Communication TerminalsInformation and Communication Terminals
Advanced processes, materials and devicesAdvanced processes, materials and devices– based on compound semiconductors and on SOIbased on compound semiconductors and on SOI
– very high frequency and low power communicationvery high frequency and low power communication
– high power communication applications.high power communication applications.
– Cost/benefit vs Si and Si/SiGe for industrial useCost/benefit vs Si and Si/SiGe for industrial use
AL IV.8.5 Advanced Micro- and Opto-AL IV.8.5 Advanced Micro- and Opto-electronics: RTD (1)electronics: RTD (1)
E.g. GaAs (and metamorphic compound), SiC, GaN and SOI.E.g. GaAs (and metamorphic compound), SiC, GaN and SOI.
large bandwidth or local loop transmission. large bandwidth or local loop transmission.
base stations and power amplifiersbase stations and power amplifiers
Very innovative Very innovative – materialsmaterials
– processes processes – componentscomponents
for micro- and opto-electronics industries.for micro- and opto-electronics industries.
AL IV.8.5 Advanced Micro- and Opto-AL IV.8.5 Advanced Micro- and Opto-electronics: RTD (2)electronics: RTD (2)
new substrates, gate insulators for future devicesnew substrates, gate insulators for future devices
new device principles for micro-electronics applicationsnew device principles for micro-electronics applications
WAFER WEB
EURACCESS: R&D Enabler CMOS <.1μmEURACCESS: R&D Enabler CMOS <.1μm
LABLABLAB
LAB LAB
SCIENTIFIC ADVISORY BOARDRoadmap
Projects stimulation / coordination
ORGANIZATION COMMITTEE Labs support organization,....
INDUSTRIAL ADVISORY BOARDOrientation
Lighter is better
EURACCESS and ITRS RoadmapEURACCESS and ITRS Roadmap
98 99 00 01 02 03 04 05 06 07 08 09 10
nm
year
Isolated lines (MPU gates)Year of 1st product shipment
300mm
300mm
450mm
200mm VolumeProduction
VolumeProduction
VolumeProduction
VolumeProduction
Integration Pilot
Integration Pilot
Integration Pilot
Integration Pilot
ModulesBasic steps
ModulesBasic steps
ModulesBasic steps
Advanced research
Advanced research
Integration Pilot
ModulesBasic steps
Advanced research
Precompetitive
Precompetitive
130
100
70
50
35 VolumeProduct
300mm
EURACCESS
Integration of opto- and micro- technologies Integration of opto- and micro- technologies (homogeneous and heterogeneous) (homogeneous and heterogeneous)
ultra-compact ICT componentsultra-compact ICT components synergy with basic CMOS processes synergy with basic CMOS processes
– light emission, light emission, – photo-detection,photo-detection,– interconnection.interconnection.
AL IV.8.5 Advanced Micro- and Opto-AL IV.8.5 Advanced Micro- and Opto-electronics: RTD (3)electronics: RTD (3)
Integration of compound semiconductor optical functions (emission, detection) on CMOS circuits
Integration of passive optical components,
Integration of MUX-DEMUX components;
Integration of compound semiconductor optical functions (emission, detection) on CMOS circuits
Integration of passive optical components,
Integration of MUX-DEMUX components;
Evaluation in IST for R&D projectsEvaluation in IST for R&D projects
Criteria Weight (1) Threshold (2)
Scientific/Technological Qualityand innovation 4 >= 3Community Added Valueand contribution to EU policy 1 >= 2Contribution to Comm. Social objectives 1 -Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination) 2 >= 3Resources, Partnership, Management 2 >= 2
1) Weight on a scale of 10 (sum 10)2) Threshold with respect to score 0-5
““Take-up”Take-up”
leading-edge and established leading-edge and established
methods and technologiesmethods and technologies
time
Technology TransferTechnology TransferRTDRTD Commercial PhaseCommercial Phase
“T a k e - u p”
greater efficiencygreater efficiency
Transfer toTransfer toUser industryUser industry
TrialsTrials Best PracticeBest PracticeAssessmentAssessment
““Take-up” typesTake-up” types
Trials: Trials: – evaluation of promising, yet not fullyevaluation of promising, yet not fully
established technologies & solutionsestablished technologies & solutions
Best practice actions:Best practice actions:– promote take-up of well establishedpromote take-up of well established
technologies & methods technologies & methods
Assessments:Assessments:– evaluation of innovative productsevaluation of innovative products
User-SupplierCooperation
User-led
User-SupplierCooperation
Focus:Focus: a) For tools:a) For tools:
All areas of microelectronics design and testAll areas of microelectronics design and test
AL IV.8.6 Microelectronics design and AL IV.8.6 Microelectronics design and test - take-up measurestest - take-up measures
b) For methods:b) For methods:1. collaborative design 1. collaborative design 2. reuse of Intellectual Property (IP blocks).2. reuse of Intellectual Property (IP blocks).
Action types:Action types: TrialsTrials
““Take-up” typesTake-up” types
Trials:Trials: – evaluation of promising, yet not fullyevaluation of promising, yet not fully
established technologies & solutionsestablished technologies & solutions
Best practice actions:Best practice actions:– promote take-up of well establishedpromote take-up of well established
technologies & methods technologies & methods
Assessments:Assessments:– evaluation of innovative productsevaluation of innovative products
General Explanation of Trials (1)General Explanation of Trials (1)
Objective: Objective: To timely pass the barriers to successful exploitation of new technologies
– Adaptation and introduction of leading edge technology in industrial/service applications
– The technology must be promising, but not yet be established or commercially available (typically: prototype method or tool).
– Commitment for dissemination of the experience to other organisations across Europe
General Explanation of Trials (2)General Explanation of Trials (2)
Participants: At least one (industrial) technology user and one (industrial) supplier
The technology is used in a real case within the user organisation
The technology is adapted (by the supplier) to users’ needs, leading to progress beyond the state of the art.
User-supplier cooperation for joint evaluation of technological and economic benefits is essential
Funding Rules for Trials and Best PracticeFunding Rules for Trials and Best Practice
Up to 100 %:
– Personnel, Co-ordination Costs and other Specific Personnel, Co-ordination Costs and other Specific CostsCosts
Up to 50%:
– Subcontracting, Travel and Subsistence, Subcontracting, Travel and Subsistence, Consumables, Computing and Durable equipment Consumables, Computing and Durable equipment costs.costs.
No contribution:– IPR costs and Overheads.IPR costs and Overheads.
Evaluation in IST for Trial proposalsEvaluation in IST for Trial proposals
Criteria Weight (1) Threshold (2)
Scientific/Technological Qualityand innovation 3 - Community Added Valueand contribution to EU policy 1 >= 2Contribution to Comm. Social objectives 1 -Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination) 3 >= 3Resources, Partnership, Management 2 >= 3
1) Weight on a scale of 10 (sum 10)2) Threshold with respect to score 0-5
Objectives:Objectives:– Promote adoption of EXISTING Microelectronics and Promote adoption of EXISTING Microelectronics and
Optoelectronics TechnologiesOptoelectronics Technologies
– Improve EXISTING Products or ServicesImprove EXISTING Products or Services
Focus:Focus: – New Communication CapabilitiesNew Communication Capabilities
– Improved User InterfacesImproved User Interfaces
AL IV.8.7 Application-Specific AL IV.8.7 Application-Specific Microelectronics and OptoelectronicsMicroelectronics and Optoelectronics
ASICs, FPGAs, reconfigurable devices and micro-controllersASICs, FPGAs, reconfigurable devices and micro-controllersASICs, FPGAs, reconfigurable devices and micro-controllersASICs, FPGAs, reconfigurable devices and micro-controllers
Enhance Capabilities, Enhance EconomyEnhance Capabilities, Enhance EconomyEnhance Capabilities, Enhance EconomyEnhance Capabilities, Enhance Economy
““Take-up” typesTake-up” types
Trials: Trials: – evaluation of promising, yet not fullyevaluation of promising, yet not fully
established technologies & solutionsestablished technologies & solutions
Best practice actions:Best practice actions:– promote take-up of well establishedpromote take-up of well established
technologies & methods technologies & methods
Assessments:Assessments:– evaluation of innovative productsevaluation of innovative products
Example: FUSE, FUSE ABCExample: FUSE, FUSE ABC
130 Replications
471AEs1973
Proposals2,299 workplans
3,215 Company visits8,489 Attendees at Events
14,629 Contacts and Mailings
Training
220 Demonstrators
FUSE Demonstrator ExampleFUSE Demonstrator Example
Example: FUSE, FUSE ABCExample: FUSE, FUSE ABC
Targeted Actions: FocusTargeted Actions: Focus– FunctionalityFunctionality– TechnologyTechnology– Industry SectorIndustry Sector
AL IV.8.7 Application-Specific AL IV.8.7 Application-Specific Microelectronics and OptoelectronicsMicroelectronics and Optoelectronics
Projects with 5-20 UsersProjects with 5-20 Users – Quality of ProposalsQuality of Proposals
– European DimensionEuropean Dimension
Take-Up ProposalTake-Up Proposal
DisseminationDissemination ReplicationReplication
ExpertiseExpertiseCentresCentres
UsersUsers
AL IV.8.7 Application-Specific AL IV.8.7 Application-Specific Microelectronics and OptoelectronicsMicroelectronics and Optoelectronics
Evaluation in IST for Best-Practice proposalsEvaluation in IST for Best-Practice proposals
Criteria Weight (1) Threshold (2)
Scientific/Technological Qualityand innovation 2 >= 3Community Added Valueand contribution to EU policy 1 >= 2Contribution to Comm. Social objectives 2 -Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination) 3 >= 3Resources, Partnership, Management 2 >= 3
1) Weight on a scale of 10 (sum 10)2) Threshold with respect to score 0-5
IV.8.8 Ind. microelectronics technologies:IV.8.8 Ind. microelectronics technologies:Assessment ActionsAssessment Actions
Semiconductor Equipment Assessment (SEA):Semiconductor Equipment Assessment (SEA):Stimulate rapid take-up of advanced prototype Stimulate rapid take-up of advanced prototype equipment by the semiconductor industry. equipment by the semiconductor industry.
User driven assessment of advanced prototype User driven assessment of advanced prototype equipment, related OEM components and materialsequipment, related OEM components and materialsfor semiconductor manufacture.for semiconductor manufacture.
Facility level equipment is not included. Facility level equipment is not included.
Bridges the gap: R&D to manufacturing requirements (reliability, repeatability, cleanliness, productivity, process parameters).
Bridges the gap: R&D to manufacturing requirements (reliability, repeatability, cleanliness, productivity, process parameters).
Market analysis, initial and final specsAt least 2 industrial assessors.
Market analysis, initial and final specsAt least 2 industrial assessors.
““Take-up” typesTake-up” types
Trials: Trials: – evaluation of promising, yet not fullyevaluation of promising, yet not fully
established technologies & solutionsestablished technologies & solutions
Best practice actions:Best practice actions:– promote take-up of well establishedpromote take-up of well established
technologies & methods technologies & methods
Assessments:Assessments:– evaluation of innovative productsevaluation of innovative products
IV.8.8 Ind. microelectronics technologies:IV.8.8 Ind. microelectronics technologies:Assessment Actions (i,ii)Assessment Actions (i,ii)
(i) Assess beta type equipment (i) Assess beta type equipment – close to production conditions close to production conditions – create reference centres at user sites. create reference centres at user sites.
Prototype equipment, materials for novel processes, architectures plus support (e.g cleaning, metrology). No design or assembly work under SEA!
Prototype equipment, materials for novel processes, architectures plus support (e.g cleaning, metrology). No design or assembly work under SEA!
(ii) Early proof of innovative process concepts (PoC)(ii) Early proof of innovative process concepts (PoC)– adapting state-of-the-art equipmentadapting state-of-the-art equipment
New processes tested on state-of-the-art equipmentAt least 1 industrial user must be involved ; E&M suppliers access to capabilities of Res. and Indus. Equipment costs are not supported.
New processes tested on state-of-the-art equipmentAt least 1 industrial user must be involved ; E&M suppliers access to capabilities of Res. and Indus. Equipment costs are not supported.
IV.8.8 Ind. microelectronics technologies:IV.8.8 Ind. microelectronics technologies:Assessment Actions (iii)Assessment Actions (iii)
(iii) Early proof of concept (PoC)(iii) Early proof of concept (PoC)for alpha type 300 mm equipment.for alpha type 300 mm equipment.
Early tests of 300mm alpha types
At least 1 industrial user involved;
Equipment cost not supported.
Early tests of 300mm alpha types
At least 1 industrial user involved;
Equipment cost not supported.
For PoC (ii,iii) wafer, analytical, metrology services available
SEA for Display Manufacturing called in IV.6.3
SEA for Subsystems, Micro-Systems called in IV.7.5 and IV.7.6
For PoC (ii,iii) wafer, analytical, metrology services available
SEA for Display Manufacturing called in IV.6.3
SEA for Subsystems, Micro-Systems called in IV.7.5 and IV.7.6
Evaluation in IST for Assessment proposalsEvaluation in IST for Assessment proposals
Criteria Weight (1) Threshold (2)
Scientific/Technological Qualityand innovation 4 -Community Added Valueand contribution to EU policy 1 >= 2Contribution to Comm. Social objectives 1 -Economic Dev; S&T prospects(range of applications, exploitation, strategic impact, dissemination) 2 >= 3Resources, Partnership, Management 2 >= 4
1) Weight on a scale of 10 (sum 10)2) Threshold with respect to score 0-5