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HUAWEI MU203 WCDMA M2M ModuleDatasheet
MU203 Module V100R001
Issue 1.0
Date 2010-04-02
HUAWEI TECHNOLOGIES CO., LTD.
Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. Please feel free to contact our local office or company headquarters.
Huawei Technologies Co., Ltd.
Address: Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China
Website: http://www.huawei.com
Email: support@huawei.com
Copyright © Huawei Technologies Co., Ltd. 2008. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders. Notice The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute the warranty of any kind, express or implied.
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About This Document
Summary This document provides information about the major functions, supported services, system architecture, and technical references of HUAWEI MU203 WCDMA M2M Module.
The following table lists the contents of this document.
Chapter Details
1 Overview Describes the basic functions, key features, and hardware and software overview of the product.
2 Mechanical Specifications
Describes the mechanical specifications of the product.
3 Electrical Specifications Describes the electrical specifications of the product.
4 RF Specifications Describes the RF specifications of the product.
5 Test and Certification Describes the information about test and certification of the product.
6 Technical Reference Describes the technical references of the product.
Acronyms and Abbreviations
Lists the acronyms and abbreviations mentioned in this document.
Safety Information Lists the safety information of using the product.
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History Date Details
2009-12-01 Creation
Added power on and off timing description in chapter 3.2.2
Updated UART interface description in chapter3.2.6
Removed RST interface description
Removed ADC interface description
Added power supply description and updated power consumption values in chapter 3.3
Updated conducted Rx Sensitivity and Tx power values in chapter 4.3
Removed software overview description
2010-02-01
Removed test and certification description
2010-03-30 Added the LED indicator blinks specification in chapter 3.2.8
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Contents
1 Overview ...........................................................................................................................7 1.1 Introduction .................................................................................................................................... 7 1.2 Key Features ................................................................................................................................. 8 1.3 Hardware Overview...................................................................................................................... 9
1.3.1 Hardware Logic Block Diagram......................................................................................... 9 1.3.2 External Hardware Interfaces .......................................................................................... 10
2 Mechanical Specifications ...............................................................................................13 2.1 Dimensions and interfaces........................................................................................................ 13
2.1.1 Dimensions and interfaces of MU203............................................................................. 13 2.1.2 Dimensions of the BTB Connector.................................................................................. 14 2.1.3 Dimensions of the Antenna Connector........................................................................... 16
2.2 Reliability...................................................................................................................................... 18 2.3 Temperature................................................................................................................................. 19
3 Electrical Specifications ..................................................................................................20 3.1 BTB Connector Pin Definition ................................................................................................... 20 3.2 Pin Descriptions .......................................................................................................................... 23
3.2.1 Digital Signal DC Characteristics .................................................................................... 23 3.2.2 Power Sources and Grounds........................................................................................... 24 3.2.3 VCOIN Power source........................................................................................................ 27 3.2.4 USB Signals ....................................................................................................................... 29 3.2.5 USIM Signals...................................................................................................................... 29 3.2.6 UART Interface Signals .................................................................................................... 33 3.2.7 Analog Audio Signals ........................................................................................................ 36 3.2.8 Status Indication Signals .................................................................................................. 37 3.2.9 WAKEUP_SLEEP_IN Signal ........................................................................................... 40 3.2.10 WAKEUP_SLEEP_OUT Signal..................................................................................... 41 3.2.11 POWER_ON_OFF Signal .............................................................................................. 41 3.2.12 NC Pins ............................................................................................................................. 42
3.3 Power Supply and Consumption .............................................................................................. 43 3.3.1 Power Supply ..................................................................................................................... 43 3.3.2 Power Consumption .......................................................................................................... 44
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3.4 ESD Features.............................................................................................................................. 47 3.4.1 Overview ............................................................................................................................. 47 3.4.2 ESD Protection of the Antenna Interface ....................................................................... 48 3.4.3 ESD Protection of the USIM Card Interface .................................................................. 48
4 RF Specifications ............................................................................................................49 4.1 Operating Frequencies .............................................................................................................. 49 4.2 Conducted RF Measurement.................................................................................................... 49
4.2.1 Test Environment ............................................................................................................... 49 4.2.2 Test Standards.................................................................................................................... 50
4.3 Conducted Rx Sensitivity and Tx Power ................................................................................. 50 4.3.1 Conducted Receive Sensitivity ........................................................................................ 50 4.3.2 Conducted Transmit Power.............................................................................................. 51
4.4 Antenna Design Requirements................................................................................................. 51 4.4.1 Antenna Design Indicators ............................................................................................... 51 4.4.2 Interference......................................................................................................................... 53 4.4.3 Radio Test Environment.................................................................................................... 53
5 Test and Certification.......................................................................................................55 Product Certifications .................................................................................................................. 55 Nameplate..................................................................................................................................... 55
6 Technical Reference ........................................................................................................57 6.1 Layer 1 Specifications (Physical).............................................................................................. 57 6.2 Layer 2 Specifications (MAC/RLC) .......................................................................................... 57 6.3 Layer 3 Specifications (RRC).................................................................................................... 57 6.4 Layer 3 NAS/Core Network (MM/CM) ..................................................................................... 57 6.5 GSM Protocol Specifications..................................................................................................... 58 6.6 GPRS Protocol Specifications .................................................................................................. 58 6.7 General Specifications ............................................................................................................... 58 6.8 Performance/Test Specifications .............................................................................................. 59 6.9 SIM Specifications ...................................................................................................................... 59
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1 Overview
1.1 Introduction HUAWEI MU203 WCDMA M2M Module (hereinafter referred to as MU203) is a WCDMA Wireless Wide Area Network (WWAN) M2M module. It is a multi-mode wireless terminal for industry.
The MU203 supports the following standards:
Universal Mobile Telecommunications System (UMTS) Enhanced Data Rates for Global Evolution (EDGE) General Packet Radio Service (GPRS) Global System for Mobile Communications (GSM)
The MU203 provides the following services:
UMTS packet data service EDGE/GPRS packet data service WCDMA/GSM short message service (SMS)
The MU203 can be connected to the external application via the 60-pin board-to-board connector. In the service area of the UMTS, EDGE, GPRS or GSM network, you can surf the Internet, send messages and emails, and receive messages/emails cordlessly. The MU203 is fast, reliable, and easy to operate. Thus, mobile users can experience many new features and services with MU203. These features and services will enable a large number of users to use MU203 and the average revenue per user (ARPU) of operators will increase substantially.
The MU203 family contains MU203 and MU203-b.Figure 1-1 shows the profile of the MU203 family.
Module Top View
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Module Top View
MU203
MU203-b
Figure 1-1 Profile of MU203 family
1.2 Key Features Table 1-1 lists the key features of MU203 family
Table 1-1 Key features of MU203 family
Feature MU203 MU203-b
UMTS 2100 MHz Y Y
UMTS 1900 MHz N N
UMTS 900 MHz N Y
UMTS 850 MHz Y N
UMTS 800 MHz Y N
GSM/GPRS 850/900/1800/1900 MHz Y Y
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Feature MU203 MU203-b
EDGE 850/900/1800/1900 MHz N Y
UMTS PS domain data service of up to 384 kbps Y Y
EDGE packet data service of up to 236.8 kbps N Y
GPRS packet data service of up to 85.6 kbps Y Y
CS domain data service based on UMTS Y Y
CS domain data service based on GSM Y Y
SMS based on the CS/PS domain of WCDMA Y Y
SMS based on the CS/PS domain of GSM Y Y
Analog Audio interface O O
60-pin Board to Board Connector interface Y Y
Windows CE/Windows XP/Linux 2.6.18 or later versions
Y Y
Notes:
Y: The feature is supported.
O: The feature is optional.
N: The feature is NOT supported.
1.3 Hardware Overview The MU203 consists of three sections: baseband section and radio frequency (RF) section and power manager (PM) section. External interfaces include the antenna interface and the 60-pin BTB interface.
1.3.1 Hardware Logic Block Diagram The MU203 is completed on a single-board. Figure 1-2 shows the hardware functional block diagram.
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Figure 1-2 Hardware functional block diagram
The circuitry of MU203 consists of three sections: baseband section, RF section and PM section.
The baseband section includes the baseband processor, power management and MCP. It implements baseband signals processing, wireless protocols, management of various peripheral devices and providing the power supply and power management for the whole module.
The RF section includes the RF transceiver, PA, antenna switches, duplexer, and antenna interfaces.
The PM section providing the power supply and power management for the whole module.
1.3.2 External Hardware Interfaces 1. Antenna interface
The MU203 has an antenna connector and an antenna pad. External antenna can be connected via antenna connector or antenna pad, but both solutions can only be applied alternatively. This means, whenever an antenna is plugged to the connector, the pad must not be used. Vice versa, if the antenna is connected to the pad, then the connector must be left empty.
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Antenna connector
Antenna pad
Antenna connector The antenna connector has been chosen as antenna reference point (ARP) for the HUAWEI reference equipment submitted to type approve MU203. All RF data specified throughout this datasheet are related to the ARP. For compliance with the test results of the MU203 type approval you are advised to give priority to the connector, rather than using the antenna pad. See Section 2.1.3 for details about antenna connector.
Antenna Pad
When you decide to use the antenna pad take into account that the pad has not been intended as antenna reference point (ARP) for the type approval. Also, consider that 50Ω connector is mandatory for type approval measurements. This requires user devices with an integral antenna to be temporarily equipped with a suitable connector or a low loss RF cable with adapter.
To prevent damage to the module and to obtain long-term solder joint properties you are advised to maintain the standards of good engineering practice for soldering. Be sure to solder the antenna core to the pad and the shielding of the coax cable to the ground plane of the module next to the antenna pad. The direction of the cable is not relevant from the electrical point of view.
2. BTB connector interface
The MU203 provide a 60-pin male BTB connector interface. The major signals of the BTB connector describe as the following figure.
Figure 1-3 BTB connector identification
− USIM interface: The USIM interface provides the interface for a USIM card. The USIM card can be inserted into the host side.
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− USB interface: The USB interface supports USB 2.0 full speed standard. − UART interface: The module supports 3-line or full serial port interface. − Analog voice interface: The module supports two analog audio interfaces,
each with a microphone input and an analog earpiece output. − Power sources and grounds: 3.8V recommended, voltage range is 3.3V~4.2V.
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2 Mechanical Specifications
2.1 Dimensions and interfaces 2.1.1 Dimensions and interfaces of MU203
The dimensions of MU203 are 45 mm (length) × 31 mm (width) × 5.4mm (height). Figure 2-1 shows the dimensions of MU203 in details.
Figure 2-1 Dimensions of MU203
Figure 2-2 shows the appearance of the interfaces on MU203.
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Figure 2-2 Appearance of the interfaces on MU203
60-pin male BTB connector
It is used to connect MU203 to the female BTB interface of the user side.
Screw holes
They are used to fix MU203 on the user’s board with screws.
Antenna interfaces
They are used to connect to antennas. Both solutions can only be applied alternatively. This means, whenever an antenna is plugged to the connector, the pad must not be used. Vice versa, if the antenna is connected to the pad, then the connector must be left empty.
2.1.2 Dimensions of the BTB Connector The MU203 provides a 60-Pin BTB connector interface. The header connector on module is from HRS company and the type is DF12(3.0)-60DS-0.5V(86). Mating receptacle type is DF12(3.0)-60DP-0.5V(86).
Figure 2-3 DF12(3.0)-60DS-0.5V(86) connector on MU203
Figure 2-4 DF12(3.0)-60DP-0.5V(86) receptacle on user board
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Table 2-1 Ordering information DF12 series
Item Part number Stacking
height(mm)
HRS number
Headers on MU203 DF12(3.0)-60DS-0.5V(86)
3.0 537-0611-1-86
Receptacles on user boards
DF12(3.0)-60DP-0.5V(86)
3.0 537-0731-3-86
Figure 2-5 Mechanical dimensions of Hirose DF12 connector on MU203 (mm)
Figure 2-6 Pad dimensions of Hirose DF12 connector on user board (mm)
You can get to know detailed Hirose connector by visiting the website http://www.hirose-connectors.com
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2.1.3 Dimensions of the Antenna Connector MU203 provides an interface for connecting an external antenna. The external antenna is connected to the module through the coaxial connector that is the Hirose U.FL-R-SMT-1(10) (you can get to know Hirose U.FL-R-SMT-1(10) by visiting the website http://www.hirose-connectors.com/products/U.FL_1.htm).
Figure 2-7 Dimensions of the antenna connector
Figure 2-8 shows the specifications of the antenna mating connectors (take the ones with the Hirose part number as U.FL-LP as examples).
Figure 2-8 Specifications of the antenna mating connectors
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For more information about Hirose Ltd., SMD connectors, and mating connectors, visit the website of Hirose http://www.hirose-connectors.com.
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2.2 Reliability Table 2-2 Requirements on the environment reliability
Item Test Condition Standard
Sinusoidal vibration
Frequency range: 5–200 Hz Acceleration: 10 m/s2 Scanning frequency: 1 oct/min 3 axes, 5 cycles for each axis
IEC 60068-2-6-2007
Shock test Half-sine wave shock
Acceleration: 300 m/ s2 Shock duration: 11 ms 6 axes (±x, ±y, and ±z), 3 shocks for each axis
IEC 60068-2-27-2008
Collision test Half-sine wave with peak acceleration of 180 m/s2
Pulse duration: 6 ms 6 axes, 1000 shocks for each axis
IEC 60068-2-29-1987
Temperature shock
Low temperature: –30oC±2oC High temperature: +75oC±2oC Changeover time: < 30s Repetition times: 100
IEC 60068-2-14 Na
Damp heat cycling
High temperature: +55oC±2oC Low temperature: +25oC±2oC Humidity: (95±2)% Repetition times: 2 Test duration: 24 h + 24 h
IEC 60068-2-30 -1980
Low-temperature working
Temperature: –20±2oC Test duration: 24 h
IEC 60068-2-1-2007
Extended low-temperature working
Temperature: –30oC±2oC Test duration: 24 h
IEC 60068-2-1-2007
High-temperature working
Temperature: +70oC±2oC Test duration: 24 h
IEC 60068-2-2-2007
Extended high-temperature working
Temperature: +75oC±2oC Test duration: 24 h
IEC 60068-2-2-2007
Low-temperature storage
Temperature: -40oC±2oC Test duration: 24 h
IEC 60068-2-1-2007
High-temperature storage
Temperature: +85oC±2oC Test duration: 24 h
IEC 60068-2-2-2007
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Item Test Condition Standard
Temperature cycling
Test temperature: –20oC to +70oC Repetition times: 12
IEC 60068-2-14 Nb
Dew test Expose the wireless module to the temperature of –40oC for 2 h.
Expose the wireless module to the normal temperature of 25oC for 5 min and then perform the function test.
Perform the function test for six times.
IEC 60068-2-1-2007
Salt fog test Temperature: 35°C Density of the NaCl solution: 5%±1%Spraying duration: 8 h PH:6.5~7.2 Duration of drying the wireless module: 16 h
IEC 60068-2-11-1981
Dust test Dust density: 2 Kg/m3 Talc powder granularity: < 75 μm Test duration: 8 h
IEC 60068-2-68-1994
Solar radiation test
Solar radiation strength: 1120 W/m2 Duration: 24 h (20-hour exposure duration and 4-hour exposure-free duration) Repetition times: 3
IEC 60068-2-9-2007
Drop test Six faces and two cycles Bumps on level granite plates High: 0.3m Face: 6 Cycle:10 High: 0.8m Face: 6 Cycle:2
IEC 60068-2-32-1975
2.3 Temperature Table 2-3 Operating and storage temperature
Description Minimum Maximum Unit
Operating temperature –20 70 °C
Operating temperature (reduced RF performance)
-30 75 °C
Storage temperature –40 85 °C
Relative storage humidity 5% 95%
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3 Electrical Specifications
3.1 BTB Connector Pin Definition Device operations comply with USB 2.0 full speed specifications.
Table 3-1 lists the BTB connector pins of MU203.
Table 3-1 Definition of BTB interface pins
Definition of MU203 Family BTB Interface Pins
Pin No. Pin Description Typ
e Additional Description Direction to Module
1 VBAT P Input of the external power supply Input
2 GND - Ground -
3 VBAT P Input of the external power supply Input
4 GND - Ground -
5 VBAT P Input of the external power supply Input
6 GND - Ground -
7 VBAT P Input of the external power supply Input
8 GND - Ground -
9 VBAT P Input of the external power supply Input
10 GND - Ground -
11 MODE_LED A Mode indication Output
12 VCOIN P RTC power supply retaining
Input /Output
13 STATUS_LED A Status indication Output
14 VREG_MSMP P 2.6 V voltage output Output
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Definition of MU203 Family BTB Interface Pins
Pin No. Pin Description Typ
e Additional Description Direction to Module
15 NC - If unused keep pin open -
16 NC - If unused keep pin open -
17 NC - If unused keep pin open -
18 POWER_ON_OFF D System power-on or power-off Input
19 NC - If unused keep pin open -
20 UART_RTS D Permission to send data through the serial interface Output
21 NC - If unused keep pin open -
22 UART_RING D Call display Output
23 UART_RD D DTE data sending through the serial interface Input
24 UART_DSR D Device ready Output
25 NC - If unused keep pin open -
26 UART_CTS D Request for DTE data sending through the serial interface
Input
27 UART_TD D DTE data receiving through the serial interface Output
28 UART_DTR D DTE ready Input
29 NC - If unused keep pin open -
30 UART_DCD D Data carrier detect of the serial interface Output
31 NC - If unused keep pin open -
32 FOTA_N D FOTA status indication Output
33 NC - If unused keep pin open -
34 WAKEUP_SLEEP_IN D Module sleep or wakeup
request Input
35 NC - If unused keep pin open -
36 USB_D- D Negative pole of the USB data signal
Input /Output
37 NC - If unused keep pin open -
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Definition of MU203 Family BTB Interface Pins
Pin No. Pin Description Typ
e Additional Description Direction to Module
38 USB_D+ D Positive pole of the USB data signal
Input /Output
39 NC - If unused keep pin open -
40 WAKEUP_SLEEP_OUT D Module sleep or wakeup
status indication Output
41 NC - If unused keep pin open -
42 USIM_CLK D Clock signal of the FOMA card Output
43 NC - If unused keep pin open -
44 VREG_USIM P Power supply of the FOMA card Output
45 NC - If unused keep pin open -
46 USIM_IO D Data input and output of the FOMA card
Input /Output
47 EAR1_N A Negative pole of the output of audio interface 1 Output
48 USIM_RST D FOMA card reset Output
49 EAR1_P A Positive pole of the output of audio interface 1 Output
50 NC - If unused keep pin open -
51 MIC1_N A Negative pole of the input of audio interface 1 Input
52 GND - Ground -
53 MIC1_P A Positive pole of the input of audio interface 1 Input
54 SPKR_OUT_N A Negative pole of the output of audio interface 2 Output
55 GND - Ground -
56 SPKR_OUT_P A Positive pole of the output of audio interface 2 Output
57 NC - If unused keep pin open -
58 MIC2_N A Negative pole of the input of audio interface 1 Input
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Definition of MU203 Family BTB Interface Pins
Pin No. Pin Description Typ
e Additional Description Direction to Module
59 NC - If unused keep pin open -
60 MIC2_P A Negative pole of the input of audio interface 1 Input
Notes:
1. Pin type is P = power; A = analog; D = digital.
2. For details about the description, functions and usage methods of each pin listed in Table 3-1, see the related chapters.
The Figure 3-1 lists the Pin order of BTB connector. Please define the counterpart on user board according to the pin sequence of MU203 module.
Figure 3-1 The order of BTB interface pins
3.2 Pin Descriptions 3.2.1 Digital Signal DC Characteristics
HUAWEI MU203 WCDMA M2M Module recommends the application condition as following table.
Table 3-2 Digital signal DC characteristics
Parameter
Description Minimum Value
Maximum Value
Unit
VIH High-level input voltage
0.65*VDD_PX VDD_PX +0.3 V
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VIL Low-level input voltage
–0.3 0.35* VDD_PX V
Ileak Input leakage current
–0.2 0.2 uA
VOH High-level output voltage
VDD_PX –0.45
VDD_PX V
VOL Low-level output voltage
0 0.45 V
IOH High-level output current
1.5 mA
IOL Low-level output current
–1.5 mA
Notes:
VDD_PX is 1.8 V for the 1.8 V USIM card (class C) and 2.85 V for the 3 V USIM card (class B). For other digital I/O interfaces, VDD_PX is 2.6 V.
3.2.2 Power Sources and Grounds Input Power Supply For the MU203, the input voltage range is 3.3~4.2 V, which is supplied from the BTB connector.
Table 3-3 Power and ground specifications
Name Pins Minimum Type Maximum
VBAT 1,3,5,7 and 9 3.3 V 3.8 V 4.2 V
GND 2,4,6,8,10,52 and 55 0 V
Notes:
1. The interface on the wireless module must not be powered on before the wireless module is powered on. Otherwise, the wireless module may be abnormal or damaged.
2. If the external power supply voltage drops below 3.5 V, the connection between the external power supply and the wireless module must be as short as possible. The input end of the power supply must use a capacitor of more than 1000 uF to regulate the voltage. Otherwise, the voltage that is actually input to the wireless module may be lower than 3.3 V, resulting in the degradation of RF performance, or even the instable operation of the wireless module.
3. The power supply of the wireless module must be stable and within the specified range. Ensure that no instantaneous disconnection occurs. Design a protection mechanism for the external circuit to prevent the possible power failure or instantaneous disconnection.
After VBAT has been applied and is stable, the module will generate an on board power on reset signal and will remain in reset condition until RST is de-asserted.
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After de-assertion of RST, the module will boot up. USB D+ becomes high when booting is completed, simultaneously the module starts to communicate with host via USB or UART. Figure 3-2 shows power up timing.
During it’s better to keep VBAT available to avoid startup delays occurred when power down the module.
Figure 3-2 Power on timing
Table 3-4 Power on timing
Parameter Comments Time(Nominal values)
Units
TPD+ POWER_ON_OFF Valid to USB D+ high
5.2 sec
TPW POWER_ON_OFF Valid to WAKEUP_SLEEP_OUT high
2.4 sec
TPD POWER_ON_OFF Valid to UART_DCD high
2.4 sec
TPRI POWER_ON_OFF Valid to UART_RING high
2.4 sec
TPRT POWER_ON_OFF Valid to UART_RTS de-assert
7.0 sec
If PC need to detect the PID/VID of module during the BIOS phase, the detect time should exceed the TPD+ time.
Figure 3-3 Power off timing
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Table 3-5 Power off timing
Parameter Comments Time(Nominal values)
Units
TPD+ POWER_ON_OFF Valid to USB D+ high
4.1 sec
TPW POWER_ON_OFF Valid to WAKEUP_SLEEP_OUT high
4.0 sec
TPD POWER_ON_OFF Valid to UART_DCD high
3.8 sec
TPRI POWER_ON_OFF Valid to UART_RING high
3.5 sec
TPRT POWER_ON_OFF Valid to UART_RTS de-assert
4.3 sec
Output Power Supply The wireless module provides two pins for the output power supply. Table 3-66 lists the power output specifications of the wireless module.
Table 3-6 Power output specifications of the wireless module
Parameter Pins Minimum Value
Typical Value
Maximum Value
Maximum output current
Remarks
VREG_MSMP
14 2.54 V 2.6 V 2.65 V 50 mA —
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1.76 V 1.8 V 1.84 V 150 mA Class C VREG_USIM
44
2.79 V 2.85 V 2.91 V 150 mA Class B
Notes:
If the external device of the wireless module uses the preceding power supplies, ensure that the load current does not exceed the maximum output current. Otherwise, the performance of the power supply degrades.
3.2.3 VCOIN Power source VCOIN pin of MU203 is used as an analog input from the 3V coin cell for SMPL (sudden momentary power loss), RTC and crystal oscillator keep-alive power. A capacitor (rather than a coin cell) can be used if only SMPL is supported (not RTC or XTAL). VCOIN pin is used as an analog output for coin cell or capacitor charging also.
Table 3-7 VCOIN specifications
Name Pins Minimum Type Maximum
VCOIN 12 1.5 V 3.0 V 3.25 V
Notes:
1. The VCOIN power source is not required. In applications that do not use SMPL or RTC, the VCOIN pin can be left unconnected.
Sudden momentary power loss The SMPL feature initiates a power-on sequence without software intervention if the monitored VBAT drops out-of-range (< 2.55 V nominal) then returns in-range within a programmable interval of between 0.5 and 2.0 seconds. SMPL achieves immediate and automatic recovery from momentary power loss. A valid voltage on VCOIN is required to run the SMPL timer. If a capacitor is used instead of a coin, it must be connected between VCOIN and ground. The capacitor must be charged to operate properly as the SMPL power source. The capacitor value depends on the SMPL timer setting.
Table 3-8 Keep-alive capacitor values vs. SMPL timer settings
SMPL timer setting Capacitor value Capacitor package (X5R)
0.5 sec 1.5 uF 0805
1.0 sec 3.3 uF 0805
1.5 sec 4.7 uF 0805
2.0 sec 6.8 uF 1206
If the SMPL counter expires without VBAT returning to its valid range the MU203 must undergo the normal power-on sequence whenever the VBAT detected.
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Real-time clock If RTC is used, a manganese-lithium rechargeable battery is suggested, for example, the SII Micro Parts HB-414 and the ML-series of Panasonic. Two sets of coin cell specifications are compared in Table 3-79. When the MU203 is off, the crystal oscillator and RTC continue to run off the coin cell attached to VCOIN.
Table 3-9 Coin cell characteristics
Specifications Parameter
HB-414 ML-series
Nominal voltage 3 V 3 V
Nominal capacity 0.3 mAh 3.4 mAh
Continuous standard load 5 mA 10 mA
Operating temperature -20 to +60 -20 to +60
Diameter 4.8 mm 6.8 mm
Height 1.4 mm 1.45 mm
Weight 0.07 g 0.17 g
An interrupt is generated if the coin cell voltage drops too low (and the main battery is not present). If this interrupt occurs, the RTC might be corrupted. A different interrupt is generated if the crystal oscillator stops; this signifies that handset timing is no longer accurate. Again, the RTC is corrupted.
When the VBAT power supply of the MU203 is normal, the coin cell charging is powered from VBAT. The MU203 reads the coin cell voltage and monitors the charging. During normal operation, the VCOIN pin voltage will stay above 2.2V, even when the coin cell charger is turned off.
Figure 3-44 shows the reference RTC circuit.
Figure 3-4 Reference RTC circuit
Notes:
Do not connect a non-rechargeable battery to the VCOIN pin. Otherwise, accidents such as faults or fires may occur.
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3.2.4 USB Signals The MU203 is compliant with USB 2.0 full speed specification.
Table 3-10 USB pins
Name Pins Description Direction to Module
USB D- 36 USB data signal D- Input/Output
USB D+ 38 USB data signal D+ Input/Output
Notes:
The USB interface is powered directly from the 3.3 V supply. The USB input/output lines are compatible with the USB 2.0 3.3 V signal specifications.
Table 3-11 USB signal DC characteristics
VOHmin VOLmax VIHmin VILmax
2.8V 0.3V 2V 0.8V
3.2.5 USIM Signals The USIM is a smart card for UMTS/GSM cellular applications. The USIM provides the required subscription information to allow the mobile equipment to attach to a GSM or UMTS network. The USIM also provides the subscriber's verification procedures as well as authentication methods for network authentication during the attach procedures.
Table 3-12 USIM pins
Name Pins Description Direction to Module
VREG_USIM 44 Power source for the external UIM/SIM.
Output
USIM_IO 46 External UIM/SIM data signal. Input/Output
USIM_CLK 42 External UIM/SIM clock signal. Output
USIM_RST 48 External UIM/SIM reset signal. Output
Notes:
It is recommended that the SIM card is inserted only after the power of the module is disconnected, otherwise the SIM card can be destroyed.
USIM interface schematic reference
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There is no SIM card interface circuit in MU203, and users need to add the USIM interface circuit. Figure 3-55 shows the definition of interface signals and the typical USIM interface schematic.
Figure 3-5 USIM interface schematic on user side
Figure 3-6 Pin definition of SIM Socket
pin1:VREG_USIM
pin2:USIM_RST
pin3:USIM_CLK
pin4:GND
pin5:NULL
pin6:USIM_IO
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Design guide The USIM signals are connected to the BTB connector (the card edge connector) and pass through an EMI filtering and ESD protection circuit on MU203 board before entering MU203 processor. There is also an EMI filtering and ESD protection circuit between SIM card interface and BTB interface on the user’s board.
1. Power supply
The SIM interface is powered by an internal LDO regulator of MU203. The default value of this regulator is 2.85 V. The power of the regulator is programmable in the range of 1.5 V to 3.05 V and is expected to be set to 3.0 V or 1.8 V.
2. Modem signals
After a power-on or reset, the USIM signals are activated to detect if a SIM card is present and to initialize it if it exists. Once a card has been detected and initialized, the interface is always on. However, the clock signal is only activated when data is actually being transferred. The USIM signals from the module are connected to the level translators and then to the host connector.
UIM_DETECT pin is optional, according to whether need this function. UIM_DATA needn’t add pull-up resistance, it has been pulled up to UIM_PWR by
a 15 kΩ resistor on the module, as the standard ISO/IEC 7816-3 recommends. UIM_PWR need add additional decoupling capacitors (range 1uF-
10μF,typevalue 4.7uF ),which place near the SIM slot, also 10pF capacitor are placed on the signals UIM_RST, UIM_CLK and UIM_DATA each.
These levels exceed those required in ISO/IEC 7816-3.
3. SIM signals
The following data is taken from ETSI standard Specification of the 3 Volt Subscriber
Identity Module - Mobile Equipment (SIM-ME) interface (GSM 11.12 version 4.3.1).
Table 3-13 SIM RST requirements
RST Minimum Maximum
VIL 0 0.2Vcc
VIH 0.7Vcc Vcc
Table 3-14 SIM CLK requirements
CLK Minimum Maximum
VIL 0 0.2Vcc
VIH 0.7Vcc Vcc
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Table 3-15 SIM IO requirements
IO Minimum Maximum
VIL 0 0.4
VIH 0.7Vcc Vcc
VOL –0.3 0.2 Vcc
VOH 0.7 Vcc Vcc+0.3
Notes:
The VOLmax of 0.45 V for the outputs is specified at an output current of 3 mA whereas the VILmax of 0.4 V for the SIM IO input is specified at an input current of 1 mA. With the smaller current drive, the output voltage would be driven lower than the stated maximum value.
4. ESD protection
Since the SIM is a CMOS device, ESD protection devices should be placed near to the SIM connector to provide protection before connecting to the module. In addition, all the SIM interface signals should be bypassed with a 10 pF capacitor.
The used ESD device (PESD3V3L5UY, NXP) in reference schematic is a low capacitance 5-fold ESD protection diode arrays in SOT363 package.
5. Clock frequency
The SIM must support clock frequencies between 1 MHz and 4 MHz. (The MU203 can be programmed to generate a clock of 1.625 MHz, 2.6 MHz, or 3.25 MHz).
6. Routing recommendations
The SIM interface signals consist of four signals that are UIM_PWR, UIM_RST, UIM_CLK, and UIM_DATA ( UIM_Vpp isn’t connected also not used in many applications). Due to the relatively low clock frequencies involved, the concern is not the degradation of the SIM signals themselves. The main concern is routing of the SIM interface signals through areas considered to be of high risk for RF noise coupling (crosstalk and RF contamination) which can desensitize the radio circuitry. The general guidelines that should be followed are listed as follows:
It is recommended that these signals should be routed over a contiguous ground plane.
SIM interface signals should not be routed near high transient signals (power supply chokes and DC/DC switching FETs).
Avoid routing of these signals near output connectors. Keep SIM interface signals isolated from other signals. 2x width spacing (1.5x
min) between SIM interface signals and all other signal routing is recommended.
Certification test Using test equipment simulates a (U)SIM card to test U(SIM) protocol in GCF or PTCRB test, Some strange issues may be encountered during SIM/USIM test, please contact with Huawei for more details.
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3.2.6 UART Interface Signals The MU203 module has an nine-wire serial port mode with the flow control function. The nine-wire serial port (UART) supports data services, that is, users can set up the PPP dial-up connection for data services through UART.
The UART interfaces support programmable data width, data stop bit, and parity check (or no parity). UART supports a maximum baud rate of 230.4Kbps and a default baud rate of 115.2Kbps.
The full EIA232 standard defines that, the equipment at the far end of the connection is named the DTE device (Data Terminal Equipment, usually a computer or terminal), has a male connector, equipment at the near end of the connection (the user board interface) is named the DCE device (Data Circuit-terminating Equipment, usually a modem), has a female connector. The cable linking DTE and DCE devices is a parallel straight-through cable with no cross-overs or self-connects in the connector hoods. Figure 3-7 shows the orientation and connector types for DTE and DCE devices:
Figure 3-7 DCE-DTE connections
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Figure 3-8 MU203 and Female DB 9 connections
Table 3-16 lists the definitions of the interface signals.
Table 3-16 UART interface signals
Pin Name Description Feature Direction to Module
27 UART_TD Data sending on the wireless module
The DTE receives serial data.
Output
23 UART_RD Data receive end of the module
The DTE transmits serial data.
Input
22 UART_RING
Ringing indication on the wireless module
The DTE is notified of a remote call.
Output
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20 UART_RTS Data sending request on the wireless module
The DTE notifies the DCE of sending requests.
Output
28 UART_DTR Data terminal ready on the wireless module
The DTE is ready.
Input
26 UART_CTS Clearing to send on the wireless module
The DCE switches to the receiving mode.
Input
30 UART_DCD Data carrier detection on the wireless module
Data links are connected.
Output
24 UART_DSR Data ready on the wireless module
The DCE is ready.
Output
Connect the MU203 to a standard RS-232-C interface through an RS-232 chip. When a three-wire serial port is used, you are recommended to adopt a MAX3232 chip. Through the MAX3232 chip, the UART_TD signal of the MU203 module is converted and then sent to the RXD pin of the DTE while the RXD signal of the DTE is converted and then sent to the UART_RD pin of the MU203 module.
Figure 3-9 Electrical connection diagram of a two-wire serial port
When an nine-wire serial port is used, you are recommended to adopt a MAX3232, a SP3238 chip, or a MAX3238 chip.
Figure 3-10 Electrical connection diagram of an nine-wire serial port with the flow control function
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3.2.7 Analog Audio Signals The MU203 provides two audio I/O channels. Table 3-177 lists the signals on the audio interface.
Table 3-17 Signals on the audio interface
Pins Name Description
51 MIC1_N Negative pole of the audio input signal of the first channel
53 MIC1_P Positive pole of the audio input signal of the first channel
47 EAR1_N Negative pole of the audio output signal of the first channel
49 EAR1_P Positive pole of the audio output signal of the first channel
58 MIC2_N Negative pole of the audio input signal of the second channel
60 MIC2_P Positive pole of the audio input signal of the second channel
54 SPKR_OUT_N Negative pole of the audio output signal of the second channel
56 SPKR_OUT_P Positive pole of the audio output signal of the second channel
The first audio I/O channel is fully differential and thus has good performance of resisting RF interferences. This channel can be used for the handset audio input and output without requiring any audio amplifier.
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Because audio signals are in differential pairs, the routes on the printed circuit board (PCB) should be placed in parallel with each other and should be short. The filter circuit on the two sides should be symmetric. The differential signals should be close to each other, and the grounding is required. The audio output signals in differential pairs and the audio input signals in differential pairs should be separated effectively through ground. In addition, the audio signals should be away from the circuits of the power supply, RF, and antenna.
Differentiate and separate functional modules during the PCB design of the DEMO of MU203.
Figure 3-11 Circuit diagram of the interface of the first audio channel
Differential signals are transmitted though the first audio channel. By reserving a place for the resistor in the loop, you can adjust the quality and volume of the voice. It is recommended that a TVS is used on the related interface, to prevent electrostatic discharge and protect integrated circuit (IC) components.
The second audio channel output can drive a 8-ohm Speaker directly.
Figure 3-12 The connection between HUAWEI MU203 and 8 Ohm speaker
3.2.8 Status Indication Signals The MU203 has two LEDs, a mode LED and a status LED. The mode LED functions as the network mode indicator and the status LED function as the signal strength indicator. The LEDs are controlled by a sink current source. The high voltage is the voltage of VBAT (with the typical value of 3.8 V).
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Table3-18 lists the LED status pin.
Table 3-18 Definitions of network mode signals and status indication signals
Pins Name Description Additional Description
Direction to Module
11 MODE_LED Mode indicator SINK current source Driver current: 10 mA
L: Light on H: Light off
Output
13 STATUS_LED Status indicator SINK current source Driver current: 10 mA
L: Light on H: Light off
Output
The following table lists the output statuses of the MODE_LED and STATUS_LED.
Table 3-19 Description of the output statuses of the network mode and status indication signals
No. Operating Status STATUS_LED MODE_LED
1 The 3G network is successfully registered.
The indicator blinks once each time.
Light off
2 The dial-up connection is set up for accessing 3G data services.
Light on Light off
3 3G PS service connected in a packet data connection but actively transferring data.
The indicator blinks fast.
Light off
4 The software is being downloaded or upgraded.
Light off The indicator blinks fast.
5 The network is being searched for or no network is detected.
Light off The indicator blinks twice each time.
6 The 2G network is successfully registered.
Light off The indicator blinks once each time.
7 The dial-up connection is set up for accessing 2G data services.
Light off Light on
Blinking Once Each Time
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Figure 3-13 Status when the indictor blinks once each time
Blinking Fast
Figure 3-14 Status when the indictor blinks fast
Blinking Twice Each Time
Figure 3-15 Status when the indictor blinks twice each time
External Circuits
Figure 3-16 shows the recommended circuits of the MODE_LED and STATUS_LED pins. According to LED feature, you can adjust the LED brightness by adjusting the impedance of resistor R.
Figure 3-16 Recommended circuits of the LED pins
For resistance of R placed on user board, choose the value such that it satisfies the following equation:
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IF*R+VF = VBAT
VF: Forward Voltage
IF: Forward current
Take the LED 19-213/GVC-AMNB/3T as an example (Its manufacturer is Everlight Electronics., Ltd. and the website is http://www.everlight.com). Figure3-17 shows its IF-VF curves. If VBAT is 3.8V and the desired current through the LED IF is 3mA, then the voltage of the LED VF is 1.5V according to IF-VF curves, the corresponding value for resistance of R is (3.8-1.5)/0.003=767 Ω.
The brightness of the LED depends on the current value, and for most of the indicator lights the current from 2mA to 5mA is already enough.
Figure 3-17 LED Typical Electro-Optical Characteristics Curves
3.2.9 WAKEUP_SLEEP_IN Signal The DTE controls the sleep and wakeup modes of the wireless module through the WAKEUP_SLEEP_IN signal.
If there is no external WAKEUP_SLEEP_IN signal, the wireless module stays in wakeup state by default. After receiving the WAKEUP_SLEEP_IN signal, the wireless module determines whether to enter the sleep mode according to the level status of the WAKEUP_SLEEP_IN signal.
Please refer to the following table.
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Table 3-20 Definition of the WAKEUP_SLEEP_IN signal
Pin Name Description Direction to Module
34 WAKEUP_SLEEP_IN H: DTE wakeup module. L: DTE set module to sleep mode.
Input
3.2.10 WAKEUP_SLEEP_OUT Signal The wireless module uses the WAKEUP_SLEEP_OUT signal to indicate the sleep and wakeup modes of itself.
Please refer to the following table.
Table 3-21 WAKE_NB_N signal
Pin Name Description Direction to Module
40 WAKEUP_SLEEP_OUT H: Module is in wakeup mode and module serial/USB is available. L: Module is in sleep mode and serial/USB is not available.
Output
3.2.11 POWER_ON_OFF Signal The POWER_ON_OFF signal is provided to allow users to power on or power off the module.
Table 3-22 POWER_ON_OFF signal
Pin Name Description Direction to Module
18 POWER_ON_OFF power on or power off the module.
Input
When the wireless module is powered off and the VBAT power supply reaches the standard power supply range for more than 3s, the wireless module is powered on if the power-on key (POWER_ON_OFF pin) is pulled down for more than 0.3s and then released.
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Figure 3-18 Power-on process of the wireless module
When the wireless module is working, the wireless module is powered off if the power-on key is pulled down for more than 0.5s and then released.
To ensure the normal power-off of the wireless module, you must ensure that the power-on key is pulled down for more than 0.5s and then released to the OPEN state.
Figure 3-19 Power-off process of the wireless module
Notes:
When powering on or powering off the wireless module, do not pull down the power-on key constantly. Otherwise, the wireless module may start abnormally or fail to be powered off normally.
3.2.12 NC Pins You can leave those pins open if you don’t use them.
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3.3 Power Supply and Consumption 3.3.1 Power Supply
MU203 is supplied by 3.8 V power source or a battery. The detailed requirements are listed in Table 3-233.
Table 3-23 Power requirements
Parameter Minimum Value
Typical Value
Maximum Value
Ripple Unit
VBAT 3.3 3.8 4.2 < 50 mVp-p (0 Hz to 2.5 GHz)
V
VCOIN 1.5 3.0 3.25 < 30 mVpp V
If the application design requires an adapter cable between power source and the module, use a flex cable as short as possible in order to minimize power losses.
In burst transmit mode of GSM/GPRS/EDGE, the instantaneous current of the module generate, which will pull down the power voltage transitorily and perhaps result in the reset of the module or host.
Ensure that the voltage drop during transmit burst should not exceed 400mV. In order to avoid this case, you can add a large bulk capacitor beside the module on the host side (at least two 1000uF capacitors).
Figure 3-20 Power supply with a 2.2mF capacitor during GSM transmit burst
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Figure 3-21 Power supply without any capacitor during GSM transmit burst
3.3.2 Power Consumption The power consumptions of MU203 in different scenarios are respectively listed in Table 3-244, Table 3-255 and 06. The power supply is 3.8V.
Table 3-24 DC power consumption (WCDMA)
Test Value2 Description Band
MU203 MU203-b Units Tx Power
242 241 1 dBm
352 277 10 dBm Band I (IMT2100)
553 534
mA
All 13
/ 234 1 dBm
/ 340 10 dBm Band VIII (PCS 900)
/ 551
mA
All 13
238 / 1 dBm
335 / 10 dBm
WCDMA
Band V (850M)
505 /
mA
All 13
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Test Value2 Description Band
MU203 MU203-b Units Tx Power
235 / 1 dBm
322 / 10 dBm Band VI (800M)
464 /
mA
All 13
Table 3-25 DC power consumption (GSM/GPRS/EDGE)
Test Value2 Description
MU203 MU203-b Units PCL Configuration
315 342 1 Up/1 Down
467 498 2 Up/1 Down
/ 716
mA 3
4 Up/1 Down
174 182 1 Up/1 Down
223 268 2 Up/1 Down
GPRS850
/ 424
mA 15
4 Up/1 Down
319 319 1 Up/1 Down
487 464 2 Up/1 Down
/ 673
mA 3
4 Up/1 Down
173 175 1 Up/1 Down
222 257 2 Up/1 Down
GPRS900
/ 402
mA 15
4 Up/1 Down
246 205 1 Up/1 Down
347 280 2 Up/1 Down
/ 383
mA 0
4 Up/1 Down
163 133 1 Up/1 Down
201 170 2 Up/1 Down
GPRS1800
/ 217
mA 10
4 Up/1 Down
227 209 1 Up/1 Down
311 293 2 Up/1 Down
/ 403
mA 0
4 Up/1 Down
GPRS1900
160 134 mA 10 1 Up/1 Down
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Test Value2 Description
MU203 MU203-b Units PCL Configuration
196 172 2 Up/1 Down
/ 224 4 Up/1 Down
/ 201 1 Up/1 Down
/ 309 2 Up/1 Down
/ 427
mA 8
4 Up/1 Down
/ 148 1 Up/1 Down
/ 199 2 Up/1 Down
EDGE850
/ 281
mA 15
4 Up/1 Down
/ 208 1 Up/1 Down
/ 309 2 Up/1 Down
/ 397
mA 8
4 Up/1 Down
/ 143 1 Up/1 Down
/ 191 2 Up/1 Down
EDGE900
/ 267
mA 15
4 Up/1 Down
/ 169 1 Up/1 Down
/ 229 2 Up/1 Down
/ 287
mA 2
4 Up/1 Down
/ 130 1 Up/1 Down
/ 162 2 Up/1 Down
EDGE1800
/ 205
mA 10
4 Up/1 Down
/ 174 1 Up/1 Down
/ 237 2 Up/1 Down
/ 301
mA 2
4 Up/1 Down
/ 129 1 Up/1 Down
/ 164 2 Up/1 Down
EDGE1900
/ 209
mA 10
4 Up/1 Down
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Table 3-26 DC power consumption(Idle and Suspend)
Scenario Module Idle1 Suspend Unit
MU203 43 <3 WCDMA 2100MHz
DRX = 8 (2.56 s) MU203-b 40 <3 mA
MU203 50 <3 GSM 900MHz
MFRM = 5 (1.18 s) MU203-b 46 <3 mA
Notes:
1 In idle mode, the module is registered to the network, USB bus is active, no voice or data call connection is ongoing.
2 The above values are the average of some test samples.
3 All 1 is the setup of test instrument, that means the maximal power transmit.
3.4 ESD Features 3.4.1 Overview
When the MU203 module is used, the ESD protection should be considered. The ESD performance of the MU203 module has been tested according to the EN61000-4-2 standard. The Table 3-27 lists the test results.
Table 3-27 ESD performance
Atmospheric discharge: ± 8000 V USIM card interface
Contact discharge: ± 4000 V
Atmospheric discharge: ± 8000 V USB Interface
Contact discharge: ± 4000 V
Notes:
The other ports of MU203 are not accessible to the user of the final product (since they are installed within the device) and therefore, are only protected according to the “Human Body Model” requirements.
The following sections describe the recommended circuits of the antenna interface and the USIM card interface.
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3.4.2 ESD Protection of the Antenna Interface The antenna interface of the MU203 module is sensitive to ESD. Poor ESD protection can cause permanent damage to internal RF components. Figure 3-2222 shows the recommended ESD-protection circuit of the antenna interface.
Figure 3-22 Recommended ESD-protection circuit of the antenna interface
3.4.3 ESD Protection of the USIM Card Interface Figure 3-2323 shows the recommended ESD-protection circuit of the USIM card interface on the MU203 module. The transient voltage suppressor (TVS) diode should be placed as close to the USIM card connector as possible.
Figure 3-23 Recommended ESD-protection circuit of the USIM card interface
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4 RF Specifications
4.1 Operating Frequencies Table 4-1 shows the RF bands supported by MU203 family.
Table 4-1 RF bands
Operating Band Tx Rx
UMTS 2100 (Band I) 1920–1980 MHz 2110–2170 MHz
UMTS 1900 (Band II) 1850–1910 MHz 1930–1990 MHz
UMTS 850 (Band V) 824–849 MHz 869–894 MHz
UMTS 900 (Band VIII) 880–915 MHz 925–960 MHz
UMTS 800 (Band VI) 830–840 MHz 875–885 MHz
GSM 850 824–849 MHz 869–894 MHz
GSM 900 880–915 MHz 925–960 MHz
GSM 1800(DCS) 1710–1785 MHz 1805–1880 MHz
GSM 1900(PCS) 1850–1910 MHz 1930–1990 MHz
4.2 Conducted RF Measurement 4.2.1 Test Environment
Test instrument:
R&S CMU200
Power supply:
KEITHLEY 2306
RF cable for testing:
L08-C014-350 of DRAKA COMTEQ or Rosenberger
Cable length: 29 cm
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Compensation for WCDMA 850 MHz or WCDMA 900 MHz: 0.6 dB
Compensation for WCDMA 2100 MHz or WCDMA 1900 MHz: 0.8 dB
Notes:
The compensation for different frequency bands relates to the cable and the test environment. The instrument compensation needs to be set according to the actual cable conditions.
4.2.2 Test Standards Huawei modules meet all 3GPP test standards relating to both 2G and 3G. Each module passes strict tests in factory; and thus the quality of the modules is guaranteed.
4.3 Conducted Rx Sensitivity and Tx Power 4.3.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver performance of MU203. The conducted receive sensitivity means the weakest signal that the module at the antenna port can receive. The BER must meet the 3GPP protocol requirements in the case of the minimum signal.
The 3GPP Protocol Claim column in Table 4-2 lists the required minimum values, and the Test Value column lists the tested values of MU203.
Table 4-2 MU203 conducted Rx sensitivity (Unit: dBm)
Test Value2 Item 3GPP Protocol
Claim MU203 MU203-b
GSM850 (2.43%1) <–102 -109 -109
GSM900 (2.43%) <–102 -110 -109
GSM1800(2.43%) <–102 -108.5 -109
GSM1900(2.43%) <–102 -109 -109
W2100 (0.1%) <–106.7 -110 -110
W900 (0.1%) <–103.7 / -110
W850 (0.1%) <–104.7 -110 /
W800 (0.1%) <–106.7 -110 /
Notes:
1 % = Bit Error Rate or Block Error Rate.
2 The test values are the average of some test samples.
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4.3.2 Conducted Transmit Power The conducted transmit power is another indicator that measures the performance of MU203. The conducted transmit power means the maximum power that the module tested at the antenna port can transmit. According to the 3GPP protocol, the required transmit power varies with the power class.
Table 4-3 lists the required ranges of the conducted transmit power of MU203. The tested values listed in the Test Value column must range from the minimum power to the maximum power.
Table 4-3 MU203 conducted Tx power (Unit: dBm)
Test Value2
Item
Minimum Power Required in the 3GPP Protocol
Maximum Power Required in the 3GPP Protocol
MU203 MU203-b
GSM850 31 35 32 33
EDGE850 24 30 / 26.5
GSM900 31 35 32 33
EDGE900 24 30 / 26.5
GSM1800 28 32 29.5 30
EDGE1800 23 29 / 26
GSM1900 28 32 29.5 30
EDGE1900 23 29 / 26
W2100 21 25 23 23
W900 21 25 / 23
W850 21 25 22.5 /
W800 21 25 22.5 /
4.4 Antenna Design Requirements 4.4.1 Antenna Design Indicators
Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna. The radiated power of an antenna is always lower than the input power due to the following antenna losses: return loss, material loss, and coupling loss. The efficiency of an antenna relates to its electrical dimensions. To be specific, the antenna efficiency increases with the electrical dimensions. In addition, the transmission cable from the antenna port of MU203 to the antenna is also part of the
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antenna. The cable loss increases with the cable length and the frequency. It is recommended that the cable loss should be as low as possible, for example, U.FL-LP-088 made by HRS.
The following antenna efficiency (free space) is recommended for MU203 to ensure high radio performance of the module:
Efficiency of the master antenna > 40% (–4 dB)
S11 or VSWR S11 (return loss) indicates the degree to which the input impedance of an antenna matches the reference impedance (50 ohm). S11 shows the resonance feature and impedance bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector analyzer.
The following S11 values are recommended for the antenna of MU203:
S11 of the master antenna < –6 dB
Polarization The polarization of an antenna is the orientation of the electric field vector that rotates with time in the direction of maximum radiation.
The linear polarization is recommended for the antenna of MU203.
Radiation Pattern The radiation pattern of an antenna reflects the radiation features of the antenna in the remote field region. The radiation pattern of an antenna commonly describes the power or field strength of the radiated electromagnetic waves in various directions from the antenna. The power or field strength varies with the angular coordinates (θ and φ), but is independent of the radial coordinates.
The radiation pattern of half wave dipole antennas is the best to wireless terminals. The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal plane, and the incident waves of base stations are often in the horizontal plane. For this reason, the receiving performance is optimal.
The following radiation patterns is recommended for the antenna of MU203:
Master antenna: omnidirectional
Gain and Directivity The radiation pattern of an antenna represents the field strength of the radiated electromagnetic waves in all directions, but not the power density that the antenna radiates in the specific direction. The directivity of an antenna, however, measures the power density that the antenna radiates.
Gain, as another important parameter of antennas, correlates closely to the directivity. The gain of an antenna takes both the directivity and the efficiency of the antenna into account. The appropriate antenna gain prolongs the service life of relevant batteries.
The following antenna gain is recommended for MU203-b:
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Gain of the master antenna ≤ 2.1 dBi
Notes:
1 The antenna consists of the antenna body and the relevant RF transmission cable. Take the RF transmission cable into account when measuring any of the preceding antenna indicators.
2 Huawei cooperates with various famous antenna suppliers who are able to make suggestions on antenna design, for example, Amphenol, Skycross, Pulse etc.
4.4.2 Interference Besides the antenna performance, the interference on the user board also affects the radio performance (especially the TIS) of the module. To guarantee high performance of the module, the interference sources on the user board must be properly controlled.
On the user board, there are various interference sources, such as the LCD, CPU, audio circuits, and power supply. All the interference sources emit interference signals that affect the normal operation of the module. For example, the module sensitivity can be decreased due to interference signals. Therefore, during the design, you need to consider how to lessen the effects of interference sources on the module. You can take the following measures: Use an LCD with optimized performance; shield the LCD interference signals; shield the signal cable of the board; or design filter circuits.
Huawei is able to make technical suggestions on radio performance improvement of the module.
4.4.3 Radio Test Environment The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP), and TIS can be tested in a microwave testing chamber.
Huawei has a complete set of OTA test environment (SATIMO microwave testing chambers and ETS microwave testing chambers). The testing chambers are certificated by professional organizations and are applicable to testing at frequencies ranging from 380 MHz to 6 GHz. The test items are described as follows:
Passive Tests Antenna efficiency Gain Pattern shape Envelope correlation coefficient
Active Tests TRP: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems TIS: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems
Figure 4-1 shows the SATIMO microwave testing chamber.
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Figure 4-1 SATIMO microwave testing chamber
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5 Test and Certification
Product Certifications
Table 5-1 Product Certifications
Certification MU203 MU203-b CE √ √ FCC √ √ SRRC&CCC&CTA
NCC
A-TICK √ Jate&Telec √
IC
EU RoHS √ √ JGPSSI
SGS RoHS
PVC-Free
GCF √ √ PTCRB
SUPL 1.0
REACH √
Nameplate Take the MU203-b for example:
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1: CE mark and notified body number
2: Product model
3: FCC ID
4: EU's RoHS mark
5: IMEI number
6: WEEE compliance mark
7: Serial number
8: Part number
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6 Technical Reference
6.1 Layer 1 Specifications (Physical) Examples of Channel Coding and Multiplexing TR 25.944 Physical Layer–General Description TS 25.201 Physical Channels and Mapping of Transport Channels onto Physical Channels
(FDD) TS 25.211 Multiplexing and Channel Coding (FDD) TS 25.212 Spreading and Modulation (FDD) TS 25.213 Physical Layer–Procedures (FDD) TS 25.214 Physical Layer–Measurements (FDD) TS 25.215 3GPP HSDPA overall description 25.308 3GPP HSUPA overall description 25.309 3GPP UE radio access capabilities 25.306
6.2 Layer 2 Specifications (MAC/RLC) MAC Protocol Specification TS 25.321 RLC Protocol Specification TS 25.322
6.3 Layer 3 Specifications (RRC) UE Interlayer Procedures in Connected Mode TS 25.303 UE Procedures in Idle Mode TS 25.304 RRC Protocol Specification TS 25.331
6.4 Layer 3 NAS/Core Network (MM/CM) Architectural Requirements for Release 1999 TS 23.121 NAS Functions Relevant to Mobile Station (MS) in Idle Mode TS 23.122 Mobile Radio Interface Signaling Layer 3–General Aspects TS 24.007
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Mobile Radio Interface Layer 3 Specification–Core Network TS 24.008 PP SMS Support on Mobile Radio Interface TS24.011
6.5 GSM Protocol Specifications Mobile Radio Interface Layer 3 Specification, Radio Resource Control Protocol
TS 04.18 Mobile Station–Base Station System (MS–BSS) interface; Data Link (DL) Layer
Specification TS 04.06 Digital Cellular Telecommunications System (Phase 2+); Multiplexing and
Multiple Access on the Radio Path TS 05.02 Technical Specification Group GERAN; Channel coding TS 05.03 Digital Cellular Telecommunications System (Phase 2+); Radio Subsystem Link
Control TS 05.08 Digital Cellular Telecommunications System (Phase 2+); Radio Subsystem
Synchronization TS 05.10
6.6 GPRS Protocol Specifications Overall Description of the GPRS Radio Interface; stage 2 TS 3.64 Mobile Radio Interface Layer 3 Specification TS 04.08 Mobile Radio Interface Layer 3 Specification: Radio Resource Control Protocol
TS 04.18 General Packet Radio Service (GPRS): Mobile Station (MS)–Base Station
System (BSS) interface; Radio Link Control/Medium Access Control (RLC/MAC) protocol TS 04.60
Mobile Station–Serving GPRS Support Node (MS–SGSN) Logical Link Control (LLC) Layer Specification TS 04.64
Mobile Station–Serving GPRS Support Node (MS–SGSN); Subnetwork Dependent Convergence Protocol (SNDCP) TS 04.65
Multiplexing and Multiple Access on the Radio Path TS 05.02 Channel Coding TS 05.03 Modulation TS 05.04 Radio Transmission and Reception TS 05.05 General Packet Radio Service (GPRS); Stage 1 TS 22.060 Mobile Execution Environment (MexE) TS 23.057 General Packet Radio Service (GPRS) Service description; stage 2 TS 23.060
6.7 General Specifications UE Capability Requirements TR 21.904 UE Radio Access Capabilities TR 25.926 Vocabulary TR 25.990
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Radio Interface Protocol Architecture TS 25.301 Services Provided by the Physical Layer TS 25.302 Synchronization in UTRAN Stage 2 TS 25.402
6.8 Performance/Test Specifications UE Radio Transmission and Reception (FDD) TS 25.101 Common Test Environments for User Equipment (UE) TS 34.108 Special Conformance Testing Functions TS 34.109 Terminal Conformance Specification TS 34.121 User Equipment (UE) Conformance Specification; Part 1: Protocol Conformance
TS 34.123-1 User Equipment (UE) Conformance Specification; Part 2: Protocol Conformance
TS 34.123-2
6.9 SIM Specifications SIM and IC Card Requirements TS 21.111 3rd Gen. Partnership Proj Tech. Spec. Group Terminals; SIM App. Toolkit (USAT)
TS 31.111
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Acronyms and Abbreviations
3G Third Generation
3GPP 3rd Generation Partnership Project
AGPS Assisted GPS
APN Access Point Name
ARPU Average Revenue Per User
BSS Base Station Subsystem
CM Connection Management
CPU Central Processing Unit
CS domain Circuit Switched domain
DTM Digital Trunk Module
EDGE Enhanced Data Rates for GSM Evolution
FDD Frequency Division Duplex
GERAN GSM/EDGE Radio Access Network
GPRS General Packet Radio Service
GPS Global Position System
GSM Global System for Mobile Communications
HSDPA High Speed Downlink Packet Access
HSPA High Speed Packet Access
HSUPA High Speed Uplink Packet Access
IC Integrated Circuit
LCD Liquid Crystal Display
LED Light Emitting Diode
MAC Medium Access Control
MexE Mobile Execution Environment
MID Mobile Internet Device
Mini PCI Express Mini Peripheral Component Interconnect Express
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MM Mobility Management
Modem Modulator Demodulator
MS Mobile Station
MSC Mobile Switching Center
NAS Non-Access Stratum
NMEA National Marine Electronics Association
OS Operating System
OTA Over The Air
PCM Pulse Code Modulation
PIN Personal Identification Number
PnP Plug and Play
PP Point-to-Point
PS domain Packet Switched domain
PUK PIN Unblocking Key
RF Radio Frequency
RLC Radio Link Control
RRC Radio Resource Control
SGSN Serving GPRS Support Node
SIM Subscriber Identity Module
SMS Short Messaging Service
SNDCP Subnetwork Dependent Convergence Protocol
TBD To Be Determined
TIS Total Isotropic Sensitivity
TR Technical Report
TRP Total Radiated Power
TS Technical Specification
UE User Equipment
UMTS Universal Mobile Telecommunications System
USAT USIM Application Toolkit
USB Universal Serial Bus
USIM UMTS Subscriber Identity Module
USSD Unstructured Supplementary Service Data
UTRAN UMTS Terrestrial Radio Access Network
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WCDMA Wideband Code Division Multiple Access
WWAN Wireless Wide Area Network
PCIE CEM specification PCI Express Mini Card Electromechanical Specification
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Safety Information
Read the safety information carefully to ensure the correct and safe use of your wireless device. Applicable safety information must be observed.
Interference Power off your wireless device if using the device is prohibited. Do not use the wireless device when it causes danger or interference with electric devices.
Medical Device Power off your wireless device and follow the rules and regulations set forth by
the hospitals and health care facilities. Some wireless devices may affect the performance of the hearing aids. For any
such problems, consult your service provider. Pacemaker manufacturers recommend that a minimum distance of 15 cm be
maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker. If you are using an electronic medical device, consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device.
Area with Inflammables and Explosives To prevent explosions and fires in areas that are stored with inflammable and explosive devices, power off your wireless device and observe the rules. Areas stored with inflammables and explosives include but are not limited to the following:
Gas station Fuel depot (such as the bunk below the deck of a ship) Container/Vehicle for storing or transporting fuels or chemical products Area where the air contains chemical substances and particles (such as granule,
dust, or metal powder) Area indicated with the "Explosives" sign Area indicated with the "Power off bi-direction wireless equipment" sign Area where you are generally suggested to stop the engine of a vehicle
Traffic Security Observe local laws and regulations while using the wireless device. To prevent
accidents, do not use your wireless device while driving.
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RF signals may affect electronic systems of motor vehicles. For more information, consult the vehicle manufacturer.
In a motor vehicle, do not place the wireless device over the air bag or in the air bag deployment area. Otherwise, the wireless device may hurt you owing to the strong force when the air bag inflates.
Airline Security Observe the rules and regulations of airline companies. When boarding or approaching a plane, power off your wireless device. Otherwise, the radio signal of the wireless device may interfere with the plane control signals.
Safety of Children Do not allow children to use the wireless device without guidance. Small and sharp components of the wireless device may cause danger to children or cause suffocation if children swallow the components.
Environment Protection Observe the local regulations regarding the disposal of your packaging materials, used wireless device and accessories, and promote their recycling.
WEEE Approval The wireless device is in compliance with the essential requirements and other relevant provisions of the Waste Electrical and Electronic Equipment Directive 2002/96/EC (WEEE Directive).
RoHS Approval The wireless device is in compliance with the restriction of the use of certain hazardous substances in electrical and electronic equipment Directive 2002/95/EC (RoHS Directive).
Laws and Regulations Observance Observe laws and regulations when using your wireless device. Respect the privacy and legal rights of the others.
Care and Maintenance It is normal that your wireless device gets hot when you use or charge it. Before you clean or maintain the wireless device, stop all applications and power off the wireless device.
Use your wireless device and accessories with care and in clean environment. Keep the wireless device from a fire or a lit cigarette.
Protect your wireless device and accessories from water and vapour and keep them dry.
Do not drop, throw or bend your wireless device.
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Clean your wireless device with a piece of damp and soft antistatic cloth. Do not use any chemical agents (such as alcohol and benzene), chemical detergent, or powder to clean it.
Do not leave your wireless device and accessories in a place with a considerably low or high temperature.
Use only accessories of the wireless device approved by the manufacture. Contact the authorized service center for any abnormity of the wireless device or accessories.
Do not dismantle the wireless device or accessories. Otherwise, the wireless device and accessories are not covered by the warranty.
Emergency Call This wireless device functions through receiving and transmitting radio signals. Therefore, the connection cannot be guaranteed in all conditions. In an emergency, you should not rely solely on the wireless device for essential communications.
Specific Absorption Rate (SAR) Your wireless device is a radio transmitter and receiver. It is designed not to exceed the limits for exposure to radio waves recommended by international guidelines. These guidelines were developed by the independent scientific organization ICNIRP and include safety margins designed to assure the protection of all persons, regardless of age and health.
The guidelines use a unit of measurement known as the Specific Absorption Rate, or SAR. The SAR limit for wireless devices is 2.0 W/kg and the highest SAR value for this device when tested complied with this limit.
Regulatory Information The following approvals and notices apply in specific regions as noted.
CE Approval (European Union)
The wireless device is approved to be used in the member states of the EU. The wireless device is in compliance with the essential requirements and other relevant provisions of the Radio and Telecommunications Terminal Equipment Directive 1999/5/EC (R&TTE Directive).
Federal Communications Commission Notice (United States): Before a wireless device model is available for sale to the public, it must be tested and certified to the FCC that it does not exceed the limit established by the government-adopted requirement for safe exposure.
The SAR limit adopted by the USA and Canada is 1.6 watts/kilogram (W/kg) averaged over one gram of tissue. The highest SAR value reported to the FCC for this device type was compliant with this limit.
FCC Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
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The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons.
Warning: Changes or modifications made to this equipment not expressly approved by HUAWEI may void the FCC authorization to operate this equipment.
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Reference Schematic
TBD