Fersht Inc. Electronics/Photonics Packaging

Post on 23-Jun-2015

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llows us to identify problems and see inside the package.

Transcript of Fersht Inc. Electronics/Photonics Packaging

Qualification Testing Reverse Engineering

BGA De-Layering

PCB De-Layering

BGA Cross Sectioning

Cross Sectioning -

Ceramic Package

Cross Sectioning Optical Lens

Cross Sectioning -

Bond Wires

Cross Sectioning-

Fiber Optics Connector

X-Ray&

De-Cap Die