NFX Best Practice

Evaluation of Junction Temperature of a

Semiconductor System Used in Telecommunications

Powerful, Fast, Affordable FEA | www.midasNFX.com

Overview

Predict junction temperature of the system under the condition of forced air cooling by fans.Improve system design according to analysis results.

General flow analysisFluid-solid coupled heat transfer CFD analysis

Modeling: 3D solid elementsAnalysis Condition:Inlet: fan (pressure-flux curve)Outlet: fan (pressure-flux curve)Surface: non-dimensional wall distance, chip heat generationLoading condition: Forced displacement of 4 times material thickness on y direction

Results

Temperature distribution on whole system Temperature distribution on cross section

Temperature evaluation of PCB – chip –heat sink system

Temperature evaluation

Authors

Apoorv SharmaCAE Consultant at Midas IT

Cyprien RusuCAE Mechanical Engineer

Piotr StepienSenior Application Engineer

Have a try of the powerful,

fast, affordablee FEA ?

Try Free for 30 days

Try Free for 30 days

Have a try of the powerful,

fast, affordablee FEA ?

More Resources formidas NFX

• Webinar Schedule

• FEA for All Blog

• Youtube Channel

FEA for all

Click Here to Know More:

www.midasNFX.com

Powerful, Fast, Affordable FEA

FEA for all