Post on 18-Jul-2020
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Electronics Final Finishes ENiPdAu
Advanced Surface Finish Chemistry Provided by MacDermid
June 2012
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MacDermid Electronic Solutions
We research, formulate, and deliver specialty chemicals and services that
enable the manufacture of electronic goods used in a wide
variety of end-use applications
Selective Plastics Metallization LED Lighting and Packaging Solderable & Bondable
Gold Alternatives
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Why MacDermid?
Well-Established Geographic Infrastructure
Customer-Specific Applications Know How
High Investment in Innovation - Track Record of Success
Customer-Focused
High Quality, Technically Superior Products
Financially Stable Company with Long-Term
Management
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• Smooth inter-face
• Uniform Nickel Deposit
• No Thickness Variation at Knee
CROSS SECTIONS OF THRU-HOLES
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Planar Ultra 46 - ENEPIG
• Excellent solderability
• Excellent wire bondability
• Superior contact characteristics
– comparable to Nickel/Hard gold
• Elimination of Black line nickel
• Superior tarnish/corrosion
resistance
Electroless nickel/electroless palladium/immersion gold
process from MacDermid.
Designed to deliver:
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Electroless Palladium
• Electroless palladium
added between the
nickel and gold
eliminates any concerns
for black line nickel
– No additional chemical
activation
– No lead in the Pd
formulation
• Palladium offers an
excellent wire bondable
surface
PALLADIUM
NICKEL
GOLD
ACTIVATION
MICROETCH
CLEANER
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Wirebond data
• Testing was conducted at a third party facility
– Pull was taken at mid span of the wire
– 1 mil diameter gold wire
• Varying palladium thickness were tested for
comparison
– 0.3, 0.5 and 1 micron Pd thickness
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Wire Bond Pull
0.3 micron 0.5 micron
1.0 micron
• All pull strengths above 9gf
– 0.3 = 9.84
– 0.5 = 9.28
– 1.0 = 9.12
– All std dev below 0.5gf
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Ball Shear Testing
• Test is conducted using a BGA design with metal and soldermask defined pads.
• Solder spheres are manually placed after required preconditioning on to the pasted BGA
• Ball shear conducted on Xyztec bond tester
• Metal defined pads have higher shear strengths due to the collapse of the solder around the pad
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Leaded Solder
Panel A – Lead Solder – AsIs
0
2
4
6
8
10
12
14
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7
Force (kgm)
Fre
qu
en
cy
Metal Defined Soldermask Defined
Panel B – Lead Solder – AsIs
0
2
4
6
8
10
12
14
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7
Force (kgm)
Fre
qu
en
cy
Metal Defined Soldermask Defined
Panel A – Lead Solder – 4X Reflow
0
2
4
6
8
10
12
14
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7
Force (kgm)
Fre
qu
en
cy
Metal Defined Soldermask Defined
Panel B – Lead Solder – 4X Reflow
0
2
4
6
8
10
12
14
16
18
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7
Force (kgm)
Fre
qu
en
cy
Metal Defined Soldermask Defined
0.05 microns Pd 0.275 microns Pd
Very strong forces all above the required 1.5kgm
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Lead Free Solder 0.05 microns Pd 0.275 microns Pd
Very strong forces all above the required 1.5kgm
Panel A – Lead Free – AsIs
0
2
4
6
8
10
12
14
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7
Force (kgm)
Fre
qu
en
cy
Metal Defined Soldermask Defined
Panel A – Lead Free – 4X Reflow
0
2
4
6
8
10
12
14
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7
Force (kgm)
Fre
qu
en
cy
Metal Defined Soldermask Defined
Panel B – Lead Free – AsIs
0
2
4
6
8
10
12
14
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7
Force (kgm)
Fre
qu
en
cy
Metal Defined Soldermask Defined
Panel B – Lead Free – 4X Reflow
0
2
4
6
8
10
12
14
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7
Force (kgm)
Fre
qu
en
cy
Metal Defined Soldermask Defined
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Planar Ultra 46 Summary
• MacDermid’s ENEPIG process utilizes a low
temperature Electroless nickel
• One electroless palladium bath can
accommodate standard Pd thickness
requirements ranging from 2 to 12 microinches
as well military requirements over 30
microinches
• Planar Ultra 46 is OEM qualified.