Post on 18-Dec-2015
Dr Androula Nassiopoulou Dr Androula Nassiopoulou
DirectorDirector
Institute of MicroelectronicsInstitute of MicroelectronicsNCSR DemokritosNCSR Demokritos
ORGANIZATIONAL STRUCTURE OFORGANIZATIONAL STRUCTURE OFNCSR DEMOKRITOSNCSR DEMOKRITOS
Ministry of Development
General Secretariat for Research and Technology
NCSR DEMOKRITOSNCSR DEMOKRITOS
Technology ParkDepartment for Technical Support
Secretariat of Special Accounts
Liaison OfficeCentral administration
Institute of Chemistry
Institute of Radioisotopes & Radiodiagnostic
Products
Institute of Microelectronics
(IMEL)
Institute of Informatics and
Telecommunications
Institute of Biology
Institute of Nuclear
Technology
Institute of MaterialsScience
Institute of Nuclear Physics
ACADEMIC AND TECHNOLOGICAL ACADEMIC AND TECHNOLOGICAL EXCELLENCE AT IMELEXCELLENCE AT IMEL
20 years of research and technology developmentIMEL:IMEL:
AchievementsAchievements::
Infrastructure and research facilities for Micro and Nanotechnology unique in Greece
• Fully equipped silicon processing laboratory• E-beam lithography equipment• Micromachining and Sensor laboratory• Fully equipped laboratory for characterization of
materials, devices and structures Important know-how Experienced personnel An Intellectual property portfolio, which continues to
expand
Infrastructure and research facilities for Micro and Nanotechnology unique in Greece
• Fully equipped silicon processing laboratory• E-beam lithography equipment• Micromachining and Sensor laboratory• Fully equipped laboratory for characterization of
materials, devices and structures Important know-how Experienced personnel An Intellectual property portfolio, which continues to
expand
International Scientific Advisory CommitteeInstitute Administration and
Technical Support
Central facilities for Silicon Processing
Institute Advisory Board
Institute Director
Services in Micro, Nanotechnologies and
Microsystems
Program I: Micro and Nanotechnologies
Program III: Micro and Nano-Systems Program II: Micro
and Nanoelectronics
Secretariat
Managerial office - provisions
Group of technicians for technical support
Education and training
IMELIMEL
PATTERNING TECHNOLOGIESPATTERNING TECHNOLOGIESLithography and Plasma EtchingLithography and Plasma Etching
FOCUS OF RESEARCH
Development of novel materials, processes
and process simulation methods for micro
and nanofabrication
Key Researchers: M. Hatzakis, IBM fellow and ex-director of IMEL
E. Gogolides
P. Argitis
N. Glezos
• Develop new resists: aliphatic to fluorinated or Silicon containing polymers
• Develop new environmentally friendly and biocompatible photoresists
• Add etch resistance compounds in resist formulation• Understand and Simulate Line Edge Roughness using Fractal Theory
• Develop lithography and plasma etching simulators• Develop new etching processes for MEMS and Nanotechnology
Frontiers in Lithography (193 / 157nm, EUV, e-beam), Frontiers in Lithography (193 / 157nm, EUV, e-beam), Nano-patterning, MEMS and BioMEMS patterningNano-patterning, MEMS and BioMEMS patterning
• Smaller Devices Smaller λ in optical lithography:193, 157nm, EUV, e-beam
• Bio Mems Patterning•Need to develop new resists and processes
• Thick (0.4μm) to Ultra thin (0.15μm) resist films•Need to increase plasma resistance of photoresists
• Critical dimension becomes less than 70nm•Need to Reduce Line Edge Roughness
The problems
The solutions
Frontiers in Optical Lithography (193 Frontiers in Optical Lithography (193 - - 157 nm)157 nm)
New resists for 193nm lithographySingle layer acrylate. Positive, 93nm lines, Negative 150nm lines; P. Argitis et al. Greek PatentC. Diakouakos et al. Microelec. Engng. 2001
Bilayer resist for 157nm based on Siloxanes. 70nm linesA. Tserepi et al., J. Vac. Sci. Technol. Nov. 2000,Microelec. Engng. 2001
Novel etch resistance compounds synthesized for use as resist additives
UV UV UV UVDERIVATIVES DERIVATIVES
O
O
NH
O
O
O
O
O
OO
SUBLSOL ETCHRATE193 nm 248 nm
SUBLSOL ETCHRATE
NOVEL MIXED NOVEL MIXED
0.05 ** 1600C 2600
0.26 ** 1300C 2800
0.17 ** 1600C 3100
27000.20 * 1600C
(XI)
(XII)
(XIII)
(XIV)
O.N. R.P. O.N. R.P.
0.36
0.86
0.45
0.52
2.25 0.78
0.882.08
2.50
2.39 0.72
0.69
193 nm 248 nm
Si and SiOSi and SiO22 Etching in Fluorocarbon Plasmas Etching in Fluorocarbon Plasmas
Dielectric Etching, Optoelectronics and MEMS etchingDielectric Etching, Optoelectronics and MEMS etching
• Fluorocarbon plasma and HDP reactors used
• Both Experimental and Theoretical Work
• Many problems (RIE lag, etch stop, Inverse RIE lag, roughness)
• New processes needed in ICP tools, with reduced roughness,
for both MEMS and Nanotechnology
• Detailed models for etching in fluorocarbon plasmas
• Prediction of ASPECT RATIO dependent phenomena
SEMICONDUCTOR NANOSTRUCTURES. SEMICONDUCTOR NANOSTRUCTURES. Materials, Processes, Properties and Materials, Processes, Properties and
Nanoelectronic DevicesNanoelectronic Devices
FOCUS OF RESEARCH
Nanopatterning (nanostructuring using the “top-down” approach)
Silicon nanocrystal growth and characterization Si/SiO2 multilayers and superlattices Si/CaF2 multilayers and superlattices Silicon and Germanium nanocrystals in SiO2 by
different techniques Nanoelectronic devices for memory, light emitting
and other applications Theoretical work, process and device modeling
Key Researchers: A.G. Nassiopoulou D. Tsoukalas P. Normand
Si-Nanocrystal MOS Memory Devices Obtained Si-Nanocrystal MOS Memory Devices Obtained by Low-Energy Ion-Beam-Synthesisby Low-Energy Ion-Beam-Synthesis
Candidates for Non-Volatile Dynamic Memory Applications
Candidates for Non-Volatile Dynamic Memory Applications
ESSDERC’2000, Appl. Phys. Lett. 2000ESSDERC’2000, Appl. Phys. Lett. 2000
SILICON SENSORS AND MICROSYSTEMSSILICON SENSORS AND MICROSYSTEMS
FOCUS OF RESEARCH
Silicon micromachining techniques and processes
Silicon sensor devices and microsystems
Modeling, characterization and testing of sensors
Microsystem design, fabrication and
characterization
Development of read-out electronics and
packaging
NOVEL PROCESS FOR THE NOVEL PROCESS FOR THE FABRICATION OF SUSPENDED FABRICATION OF SUSPENDED
MEMBRANES FOR THERMAL SENSORSMEMBRANES FOR THERMAL SENSORS
100μm
The process is based on the isotropic etching of silicon using High Density Plasma etching.
High lateral etch rates can be achieved (6-7μm/min).
The process is CMOS compatible.
Oxide/nitride membranes with dimensions 100x100μm2, can be easily fabricated.
The process is based on the isotropic etching of silicon using High Density Plasma etching.
High lateral etch rates can be achieved (6-7μm/min).
The process is CMOS compatible.
Oxide/nitride membranes with dimensions 100x100μm2, can be easily fabricated.
WAFER BONDING USED IN WAFER BONDING USED IN SENSOR TECHNOLOGYSENSOR TECHNOLOGY
Apply wafer bonding
technique
Pressure sensors
Dry release processes and vapour sensing A technology to combine
heterogeneous functions
3D View of pressure Sensor
SEM cross section images
COMBINING DRY RELEASED CANTILEVERS COMBINING DRY RELEASED CANTILEVERS WITH POLYMERS TO MEASURE HUMIDITYWITH POLYMERS TO MEASURE HUMIDITY
Stress effect
Parallel beam to substrate
INTEGRATED SILICON OPTICAL BIOSENSORSINTEGRATED SILICON OPTICAL BIOSENSORS
Monolithically Integrated Silicon Light Emitters, Optical Fibers and Detectors.
Optical Coupling Efficiency 40%.
High Stable and Repeatable Measurements of the Detector Photocurrent.
Five Mask Process with Standard IC Technology
PP + ++ +S iO S iO
B o ro n B o ro nS p a c e r S p a c e r
S i N F ib e r
L ig h t E m itte r D e tec to r
N S u b stra te
N +
Av alan ch e d iodel
2 2
3 4
MICROELECTRONIC DESIGN FOR MICROELECTRONIC DESIGN FOR FUTURE OE LINKSFUTURE OE LINKS
FOCUS OF RESEARCH
Develop innovative ICs for optoelectronic links Implement phenomenological models for
optoelectronic devices (photodiodes, VCSELs, etc.) in IC design environment
Develop a wafer-scale integration technology for high-density OE links
IMEL’s infrastructure 1IMEL’s infrastructure 1
Silicon processing equipmentSilicon processing equipment (unique in Greece) (unique in Greece)•Clean room area of 300 m2
•Laminal flow chemical benches•Thermal processing•Chemical Vapor Deposition•Thermal evaporation (sputtering, e- gun evaporation)•Ion implantation•Optical lithography systems•Electron beam lithography system•Plasma Processing (RIE, ICP)•Process Inspection equipment
IMEL’s infrastructure 2IMEL’s infrastructure 2
Characterization equipmentCharacterization equipment Electrical characterization equipment Probe stations Optical characterization Microscopy equipment, ellipsometry Sensor characterization (gas, flow, pressure)
Packaging equipment (Dicing saw, wire bonding, die bonder)Packaging equipment (Dicing saw, wire bonding, die bonder)Chemistry laboratoryChemistry laboratoryDesign and modeling / simulation toolsDesign and modeling / simulation tools
7 Workstations (2HP C160, 1HP 9000/785, 2 Sun Sparc 20, 2 Sun Sparc Ultra 1, 1HP 9000/720)
Design software (Mentor graphics: 4 seats, Cadence: 2 seats, synopsis: 2 seats, orcad for PCBs), MEMCAD 4.6, ANSYS and Silvaco softwares.
PERSONNELPERSONNEL
Research Scienctists 11
Research engineers 2
Post doctoral scientists 6
Phd students 11
Technicians 3
Administrative personnel 2
Personnel on contract: a) Scientific 6
b) Technicians 4
Total 45
IMEL COORDINATES AN EDUCATIONAL PROGRAMME (EPEAEK) ON MICROELECTRONICS FOR MASTER AND PhD DEGREES-IN COLLABORATION WITH THE UNIVERSITY OF ATHENS
Start-date :1/10/1998
Duration of the programme related to the MSc degree : 18 months
Duration of PhD cycle : 4 years
Number of students : 15 / year
•IMEL is partly engaged in two other MSc and PhD programs in collaboration with the National Technical University of Athens (New materials) and the University of Patras (System design) respectively.
IMEL organizes every year :
•Summer Schools on selected areas, addressed to graduate students.
•Training courses, addressed to research scientists, engineers and technicians.
•Conferences, workshops etc.
EDUCATION AND TRAININGEDUCATION AND TRAININGDEVELOPMENT OF HUMAN RESOURCESDEVELOPMENT OF HUMAN RESOURCES
YEARYEAR 2002 2002
A CENTER OF EXCELLENCE IN A CENTER OF EXCELLENCE IN MICRO, NANOTECHNOLOGIES AND MICRO, NANOTECHNOLOGIES AND
MICROSYSTEMS MICROSYSTEMS
AT IMEL/NCSR “DEMOKRITOS”AT IMEL/NCSR “DEMOKRITOS”
A Center of Excellence in Micro, Nanotechnologies and Microsystems has been established in the year 2002 at IMEL/NCSR “Demokritos”, supported by the Greek General Secretariat for Research and Technology in the Ministry of Development.
MAIN OBJECTIVESMAIN OBJECTIVES
To further promote long term research into understanding phenomena, mastering processes and developing research tools.
To promote development of fundamental knowledge To promote development of novel products and
production processesTo develop human potential by educational and
training activities To develop the access to services in advanced
processes and high technologyTo promote the transfer of technology to industry.To further promote cooperative research and
technological and educational activities
To further promote long term research into understanding phenomena, mastering processes and developing research tools.
To promote development of fundamental knowledge To promote development of novel products and
production processesTo develop human potential by educational and
training activities To develop the access to services in advanced
processes and high technologyTo promote the transfer of technology to industry.To further promote cooperative research and
technological and educational activities
RESEARCH ACTIVITIES IN THE ABOVE FIELDS RESEARCH ACTIVITIES IN THE ABOVE FIELDS
1. Micro and Nanofabrication Optical lithography and lithographic materials Electron beam lithography. Etching processes Thermal processes Thin film deposition techniques
2. Nanoelectronic devices for integrated circuits Single electron transistors, resonant tunneling devices, molecular
devices and interconnections of devices Optical and optoelectronic links Self-assembled building blocks for nanoscale ICs
3. New electronic materials Seniconductor nanocrystals and other low dimensional structures
in different isolating matrices Molecular materials
4. Microsystems and Sensors
MMN Greek Network on Microelectronics, MMN Greek Network on Microelectronics, Microsystems and NanotechnologyMicrosystems and Nanotechnology
MMN Greek Network on Microelectronics, MMN Greek Network on Microelectronics, Microsystems and NanotechnologyMicrosystems and Nanotechnology
To promote collaboration between all national organizations involved in Microelectronics, including research centers, universities and private sector.
To develop mechanisms to promote awareness of worldwide scientific and technological development
To develop cooperative educational and training activities, in order to increase the human potential of trained people in the above technologies
Main Main objectivesobjectives