Post on 08-Jan-2016
description
1
CSCE 932, Spring 2007Fault Tolerance: Testing
and Testable Design
Course Overview
2
About Myself
Professor in CSE/UNL since 1970Teach (among others):
VLSI Testing (932)VLSI Design (434/834) Senior Design (488-489)
Computer Organization (230),
3
CLK
L1L2
DTS(2)
Double-Tree ScanVLSI Testing
• Imperfect chip manufacturing• Coverage metrics for high-volume
manufacutring• Complexity of defects and algorithms
My Current Research
Handwriting Recognition• A new general paradigm for
recognizing difficult-to-segment patterns without requiring training
GIS• Conflation: Combining information from
different sources• High-resolution satellite image analysis
of urban images for planning growth, etc.
4
Outline
Fault Tolerance Technological Trends Course Topics and Organization
5
Fault Tolerance
Ability of a system to function in the event of a failureSources of Failure
Permanent (hard) component failures causing system malfunctionTransient failures due to internal or external causes
Unreliable componentsBuggy softwareRadiation, Noise, Crosstalk...
6
Fault Tolerance Methods
Redundancy TechniquesComponent (HW or SW) LevelInformation Level
Frequent Testing and Possible Repair
Online testingOffline testing
This course will focus on fault tolerance through testing of digital components
7
Types of Testing
During Design & ManufacturingDesign Verification (Validation)Process CharacterizationSilicon DebugProduction (Go/No-Go)
Beyond ManufacturingAcceptancePower-onField test and repair
We will focus on design & manufacturing testing
8
Technological Trends
(See ITRS 2005 for details)
9
Trends of Interest to Us
Embedded systems and chip or core multiprocessors (CMPs)Importance of low power in high-volume and high-performance devices and systemsFeature Size Reduction Design productivity and time-to-marketWiring delays dominate gate delays
10
Number of Processors Sold by Computing Applications
Desktops and Servers market is relatively flat, Embeddedgrowing quickly. The trend is likely to continue.
11
Sales of Microprocessors by Instruction Set Architecture
ARM is a RISC processor commonly used as a core. IA-32 and IA-64are very competitive in desktops and notebooks. “Other” areapplication-specific or custom designs
12
IC Types and Requirements Determined by Portable/Consumer
Market
Three major types (as identified by ITRS 2005)
SOCLow-power paramountNeed SOC integration (DSP, MPU, I/O Cores, NoC, etc.)
Analog/Mixed SignalMigrating on-chip for voice processing, A/D sampling, and some RF transceiver functions
MPUSpecialized cores to optimize performance for low-power use.
13
Feature Size (From ITRS 2005)
MPU Printed Gate Length nm (Near Term)
MPU Printed Gate Length nm (Long Term)
07 08 09 10 11 12 13
42 38 34 30 27 24 21
14 15 16 17 18 19 20
19 17 15 13 12 11 9
14
Typical Production Ramp-Up Curve (ITRS-2005)
15
Power-Efficient SOC Requirements (ITRS-2005)
16
Design Productivity Trends for Power-Efficient SOCs.
To solve the challenging productivity improvement requirement, ITRS-2005 recommends:
1. Design abstraction level must be raised2. Level of automation in design verification and
implementation must be increased3. Design overhead of reuse must be targeted for reduction
– it is not enough to increase the design reuse.
2005 2010 2016 2020Trend: SOC total logic size
(normalized to 2005) 1.00 3.42 13.77 34.15
Requirement % of reused design 30% 50% 74% 90%
Requirement productivity for new designs (normalized to 2005) 1.00 3.02 10.2 22.1
Requirement productivity of reused designs (normalized to productivity for new designs at 2005) 2.00 6.04 20.4 44.2
17
Course Topics and Organization
Background in VLSI Testing (first half of the course – by me)
BasicsFault ModelingCoverage AnalysisTest GenerationDesign for Testability
Current topics (presentations and discussions by all) (second half of the course)Individual Research Projects (second half of the course)