Post on 16-Jan-2016
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Advance Nano Device Lab. 1
Fundamentals of Modern VLSI Devices 2nd EditionYuan Taur and Tak H.Ning
Ch9. Memory Devices
Advance Nano Device Lab. 2
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Ch9.1 Static Random-Access Memory
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CMOS SRAM Cell
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CMOS SRAM Cell
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CMOS SRAM Cell
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Basic Operation of a CMOS SRAM Cell
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Basic Operation of a CMOS SRAM Cell
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Static Noise Margin of a CMOS SRAM Cell
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Static Noise Margin of a CMOS SRAM Cell
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Other Bistable MOSFET SRAM Cell
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Other Bistable MOSFET SRAM Cell
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Bipolar SRAM Cell
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Operation of a Bipolar Inverter
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Operation of a Bipolar Inverter
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Operation of a Bipolar Inverter
(9.1)
(9.2)
(9.3)
(9.4 )
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Operation of a Bipolar Inverter
(9.5)
(9.6 )
(9.7 )
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Operation of a Bipolar Inverter
(9.8)
(9.9)
(9.10)
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Operation of a Bipolar Inverter
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Operation of a Bipolar Inverter
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Ch9.2 Dynamic Random-Access Memory
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Basic DRAM Cell and Its Operation
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Basic DRAM Cell and Its Operation
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Basic DRAM Cell and Its Operation
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Basic DRAM Cell and Its Operation
(9.11)
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Ch9.3 Nonvolatile Memory
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MOSFET Nonvolatile Memory Devices
(9.12)
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Charge Injection
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Charge Injection
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Charge Injection
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Charge Storage
(9.13)
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Charge Storage
(9.14 )
(9.15)
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Charge Erasure
(9.16 )
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Write, Read and Erase Operations
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NOR and NAND Architecture
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Endurance
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UV-Erasable Floating-Gate Devices
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Stacked-Gate Devices
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Devices using Source-Side Injection
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Split- and Stacked-Gate Devices
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MNOS Device Using Channel Hot Electron Injection
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MNOS Device Storing Two Bits per Cell