Post on 28-Oct-2021
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
Broadcom AFEM-8200 PAMiD in the Apple iPhone 12 SeriesDeep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.SPR21606 - RF report by Stéphane ELISABETH
Laboratory analysis by Peggy LE GALLOIS & Nicolas RADUFEFebruary 2021 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 2
Table of ContentsOverview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Broadcom
o Filter technologies
o Apple iPhone 12 Pro Max Teardown
Market Analysis 24
o RF Components Market Forecast
o Supply Chain
Physical Analysis 29
o Summary of the Physical Analysis 30
o Module 32
✓ Package Views & Dimensions
✓ Package Opening:
Power amplifier, Switch, RF IC, Filters
✓ Bloc Diagram Estimation
✓ Package Cross-Section:
Overview, CT Scan, Dimensions, Substrate, Internal & External Shielding
✓ Summary of physical data
o Power Amplifier, Switch, LNA 68
✓ Die Views & Dimensions
✓ Die Cross-Section
✓ Die Process Characteristics
o Filter Dies 108
✓ High/Mid band repartition
✓ Dies Views, Dimensions & Opening
✓ Dies Overview: Cap, Substrate, Cells
✓ Die Cross-Section:
Sealing Frame, Anchor, TSV, Holes, FBAR Structure
✓ Die Physical Data Summary
Comparison with previous Mid/High band FEM from Broadcom 143
o Package Evolution with Technology Enabler
o Package Cross-Section
o Package Integration Evolution:
Die Number, Die Distribution, EMI Shielding, Die Area, Die Cost
o Supplier Evolution: Power Amplifier, Switches
Manufacturing Process 155
o Global Overview
o Switch & matching RFIC Die Front-End Process
o Filter Die Front-End Process & Fabrication Unit
o Filter Die Front-End Process Flow
o Packaging Process & Fabrication Unit
o Packaging Process Flow
Cost Analysis 185
o Summary of the cost analysis
o Yields Explanation & Hypotheses
o PA die
✓ Die Front-End Cost
✓ Die front Cost per process steps
✓ Die Wafer & Die Cost
o Switch & LNA Die
✓ Die Front-End Cost
✓ Die Wafer & Die Cost
o Filter die
✓ Die Front-End Cost
✓ Die front Cost per process steps
✓ Die Wafer & Die Cost
o Packaged Component
✓ Packaging Cost
✓ Packaging Cost per process steps
✓ Component Cost
Front-End Module Estimated Price 218
Feedbacks 222
Company services 224
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data,manufacturing cost and selling price of the Broadcom AFEM-8200.
In 2020, Broadcom remains the only supplier of the same module for several versions of the latestApple iPhone series: 12, 12 Mini, 12 Pro and 12 Pro Max. Like its predecessor, the AFEM-8100, theAFEM-8200 is a Mid- and High-Band (MB and HB) Long Term Evolution (LTE) and 5G FEM. Itfeatures several dies: Power Amplifier (PA), Silicon-on-Insulator (SOI) Switch and Film Bulk AcousticResonator (FBAR) Filters. The filters are still using Avago’s Microcap bonded wafer Chip-ScalePackaging (CSP) technology with Through-Silicon Vias (TSVs) enabling Electrical contacts andScandium Doped Aluminum Nitride (AlScN) as a piezoelectric material.
For this special version, Broadcom innovates on several points. Thanks to the dual side moldingBGA technology, the density of the packaging has growth and the critical dies (master switches,Power management IC (PMIC) and Low-Noise Amplifier (LNA)) has been completely isolated fromthe filtering part. On the EMI management, a novel compartmental shielding using silver wire bondhas allowed a huge reduction in the packaging cost. Finally, with the latest GaAs PA technologyusing Flip-Chip configuration, only two PA remains in the module. Thanks to all these innovations,Broadcom managed to deliver a miniaturized package despite the complexity added with 5G.
The report contains a complete analysis of the FEM SiP, including a detailed analysis of the PA, theswitches, the LNA, the filtering dies, and the internal/external EMI shielding. The report alsofeatures a cost analysis and a price estimation of the component. Finally, it also integrates acomparison with the AFEM-8072, MB/HB LTE FEM in the Apple iPhone X, the AFEM-8092, MB/HBLTE FEM in the Apple iPhone Xs and the AFEM-8100, MB/HB LTE FEM in the Apple 11 series.
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 4
Overview / Introduction
Company Profile & Supply Chain o Broadcomo In Smartphoneso Filter technologyo Apple iPhone 12 Pro Max
Teardown
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Apple Smartphone History and RF Front-End Major Players
Q1 2016 Q4 2016 Q4 2017 Q4 2018 Q4 2019 Q1 2020 Q4 2020
• Apple used to release a single high-end series of phone per year. This year, we have seen the release of the second generation oflow–end segment from Apple. This could become a rule. One high-end per year and one low-end every four years.
• For the supply chain, the company has relied on Broadcom(formerly Avago) and Skyworks since 2016. Since the iPhone 7, Qorvohas a role in the supply chain mainly for antenna tuner.
• Since the iPhone Xs, Murata integrate the supplier cercle mainly with diversity modules along with Skyworks.
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 5
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Package Views & Dimensions
Package Top View – Optical View©2020 by System Plus Consulting
Package Bottom View – Optical View©2020 by System Plus Consulting
Package Side View – Optical View©2020 by System Plus Consulting
• Package Type: xxx balls BGA
• Dimensions: xx mm² x xx mm(xxx x xxx x xxx mm)
• Pin Pitch: xxx mm
• Marking: <Logo Avago>
8200
KA031
NL091
xxx
mm
xxx
mm
xxx mm
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 6
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Module CT Scan
Apple iPhone 12 Pro Max – Main Board – CT Scan©2020 by System Plus Consulting
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 7
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Package Opening
Package Opened View – Optical View©2020 by System Plus Consulting
The opening reveals 24 dies in flipconfiguration, and 56 SMD components(Inductors, Resistors, Capacitors).
Additional wire bondings are placedaround the dies.
We assume that these wire bonding areplaced to avoid interferences.
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 8
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Package Overview – LNA Bank
Package Opened View – Optical View©2020 by System Plus Consulting
LNA Top View – Optical View©2020 by System Plus Consulting
• Die area: xxx mm²
(xxx x xxx mm)
• Die marking: 4HA8A 19 BRK0
• Die substrate: xxx
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 9
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Package Cross-Section – Dimensions
Package Cross-Section – SEM View©2020 by System Plus Consulting
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 10
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Power Amplifier – Die Overview
Power Amplifier Die View – Optical View©2020 by System Plus Consulting
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 11
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Power Amplifier – Die Cross-Section
Die Cross-Section – SEM View©2019 by System Plus Consulting
Die Cross-Section – SEM View©2020 by System Plus Consulting
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Switch – Die Delayering
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Switch – Die Process
Die Process – SEM View©2020 by System Plus Consulting
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Switch – Die Cross-Section
Die Cross-Section – SEM View©2020 by System Plus Consulting
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
LNA – Die Views & Dimensions
LNA Die View – Optical View©2020 by System Plus Consulting
• Die Area: xxxmm²(xxx x xxx mm)
• Nb of PGDW per 12-inch wafer: xxx
• Pad number: xxxx
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
LNA – Die Cross-Section
Die Cross-Section – SEM View©2020 by System Plus Consulting
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Filter – Die Overview – Tx – Cap
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Filters – Die Opening – Substrate
Die Opening – Optical View©2020 by System Plus Consulting
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis o Summaryo Package Assembly
o Views & Dimensionso Opening & Overviewo Bloc Diagramo Cross-Section
o Power Amplifier Analysiso Switch Analysiso LNA Analysiso Filter Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Filter – Die Cross-Section
Die Cross-Section – SEM View©2020 by System Plus Consulting
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 20
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparisono Evolutiono Die Number & Distributiono EMI Shieldingo Die Area and Costo Components Supply
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Package Opening – Die Cost
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 21
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Power Amplifier Front-End Process
HEMT Wafer Process:
o The manufacturing of the HEMT begins with the epitaxy and patterned.
o Ohmic contact is formed on the cap layer.
o Then, Conductive Seed layer is deposited and patterned.
o Gold Au #1 is electroplated then Silicon Nitride SiN #1 is deposited and patterned.
o Oxide layer and Conductive Seed layer are deposited and patterned.
o Gold Au #2 is electroplated then Silicon Nitride SiN #2 is deposited and patterned.
o Conductive Seed layer is deposited and patterned.
o Gold Au #3 is electroplated then Silicon Nitride SiN #3 is deposited and patterned.
o PBO #1 layer is deposited and patterned.
o Seed layer are deposited and patterned.
o Next, PBO #2 layer is deposited and patterned. Gold Au #4 is electroplated.
drawing not to scale
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 22
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Power Amplifier – Process Flow (3/8)
GaAs Wafer
• Lithography #4
• Pattern & Etch
• Plasma Ashing
GaAs Wafer
•Ohmic ContactAu/Ti/Au Deposition
• Lithography #5
• Pattern & Etch
• Plasma Ashing
GaAs Wafer
• Ti Deposition
• Lithography #6
• Pattern & Etch
•Metal 1
•Au Deposition
• Plasma Ashing
• Ti Etching
drawing not to scale
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 23
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flowo Summaryo PA Fabrication Unito PA Process Flowo Switch, LNA, and RFIC Process &
Fabrication Unito Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Filters – Process Flow (6/8)
Silicon Wafer #1 & #2
•Au-Au thermo-compression bonding
Silicon Wafer #1 & #2
•Cap thinning
drawing not to scaledrawing not to scale
drawing not to scaledrawing not to scale
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 24
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
PA Front-End Cost
The front-end cost for the PA ranges from $xxxto $xxx according toyield variations.
The largest portion of the manufacturing cost is due to the xxx at xxx% and to the xxxx at xxxx%.
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 25
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
PA Front-End Cost per process steps (2/2)
M4 Gold Electroplating stepsrepresent the largest part ofwafer step costs.
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 26
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
LNA Wafer & Die Cost
By adding the probe test cost and the dicing, the LNA wafer cost ranges from $xxx to$xxx according to yield variations.
The number of good dies per wafer is estimated to ranges from xxx to xxxx accordingto yield variations, which results in a die cost ranging from $xxx to $xxx.
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 27
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Filter Front-End Cost
The front-end cost for the Filter ranges from $xxx to $xxx according toyield variations.
The largest portion of the manufacturing cost is due to the xxxx at xxxx%.
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 28
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Filter Front-End Cost per process steps (1/2)
Cleaning and the Gold contact steps represent the largest part of wafer step costs.
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 29
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso PA Wafer and Die Costo Switch Wafer and Die Costo LNA Wafer and Die Costo Filter Wafer and Die Costo Packaging Costo Component Cost
Selling Price Analysis
Feedbacks
Related Analyses
About System Plus
Component Cost
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 30
R E L A T E DA N A L Y S E SR E L A T E DA N A L Y S E S
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 31
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Pluso Company serviceso Contact
Related Analyses
RELATED TEARDOWN TRACKSRELATED REPORTS
By System Plus Consulting:• Broadcom AFEM-8100 System-
in-Package in the Apple iPhone 11 Series
• Skyworks’ FBAR-BAW Filter Technology in 2G/UHB PAMiDSKY78221
• RF Front-End Module Comparison 2020 – Volume 4
By Yole Développement:• 5G’s Impact on RF Front-End
and Connectivity for Cellphones 2020
• System-in-Package Technology and Market Trends 2020
By System Plus Consulting:• Consumer Track – Phone
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 32
COMPANYSERVICES
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 33
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Pluso Company serviceso Contact
A Structure, Process and Cost Analysis
Reverse Costing® consists in disassembling a device or a system, in orderto identify its technology and determine its manufacturing processes andcost, using in-house models and tools.
Our Core Activity : The Reverse Costing®
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 34
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Pluso Company serviceso Contact
Fields Of Expertise
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 35
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Pluso Company serviceso Contact
Business Model
Teardown Track
205+ teardowns per
year
Monitor1 per year quarterly updated
Custom Analysis150 custom analyses per
year
Report60+ per year
Costing Tools
5 process-based and 3 parametric
costing tools
Cost MethodsTrainingOn demand
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 36
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Pluso Company serviceso Contact
Worldwide presence
100+ collaborators in 8 different countries
Headquarters› Nantes – System Plus Consulting› Lyon – Yole Développement
Boise
CorneliusRaleighPhoenix
Austin
Singapore
Hsinchu
TokyoShenzhen
Seoul
Frankfurt
Nantes
Lyon
©2021 by System Plus Consulting | SPR21606 – Broadcom AFEM-8200 – 4G MB/HB PAMiD | Sample 37
Overview / Introduction
Company Profile & Supply Chain
Market Analysis
Physical Analysis
Physical & Cost Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Analyses
About System Pluso Company serviceso Contact
Contact
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