Post on 07-Mar-2021
AMOLED Manufacturing Process Report
2018
SAMPLE
AMOLED Manufacturing Process Report
· The report analyzes the structure and manufacturing process by dividing AMOLED into small &
medium-sized rigid OLED, small & medium-sized flexible OLED and large-area rigid OLED with * 6chapters. In addition, by describing the latest processes of Samsung Display and LG Display, itaims to help our customers to understand the latest process and analyze future developmentdirection.
*1) AMOLED Structure2) AMOLED Panel Manufacturing Process3) Inspection Process for Small and Medium sized AMOLED Panel4) Samsung Display’s 9 mask LTPS TFT Manufacturing process5) Samsung Display’s 13 mask LTPS TFT Manufacturing process6) LG Display’s Oxide TFT Manufacturing process
· For further details of the supply chain, emitting materials and market track, it is recommendable to refer to the reports ** mentioned below.
**1) Supply Chain Analysis 2) Emitting Material Industry 3) Material & Component Industry4) Manufacturing and Inspection Equipment Industry5) Market Track
2@ 2018. UBI Research. All rights reserved.
Table of Contents
3@ 2018. UBI Research. All rights reserved.
1. AMOLED Structure 04
2. AMOLED Panel Manufacturing Process 20
3. Inspection Process for Small and Medium sized AMOLED Panel 88
4. Samsung Display’s 9 mask LTPS TFT Manufacturing process 99
1.1 Substrate1.2 TFT1.3 Color Filter1.4 OLED Pixel1.5 Encapsulation1.6 Touch Screen Panel1.7 Module1.8 General
2.1 Substrate2.2 TFT2.3 OLED Pixel2.4 Encapsulation2.5 Cell2.6 Module
3.1 Substrate3.2 TFT3.3 Fine Metal Mask3.4 OLED Pixel3.5 Thin Film Encapsulation3.6 Hybrid Encapsulation3.7 Laser Lift Off3.8 Cell Cutting3.9 Main OLED inspection and measuring equipment
4.1 Buffer Layer and Active Layer4.2 Gate Insulator 14.3 Gate Electrode 1 4.4 Gate Insulator 24.5 Gate Electrode 24.6 Interlayer4.7 Source / Drain Electrode4.8 Planarization layer4.9 Pixel Electrode4.10Pixel Define Layer4.11 General
Table of Contents
4@ 2018. UBI Research. All rights reserved.
6. LG Display’s Oxide TFT Manufacturing process 151
5. Samsung Display’s 13 mask LTPS TFT Manufacturing process 1215.1 Buffer Layer and Active Layer5.2 Gate Electrode 15.3 Gate Electrode 2 5.4 Interlayer 15.5 Deep hole 15.6 Source / Drain Electrode 15.7 Interlayer 25.8 Deep hole 25.9 Source / Drain Electrode 25.10 Passivation layer5.11 Planarization layer5.12 Pixel Electrode5.13 Pixel Define Layer5.14 General
6.1 Light Shield Layer6.2 Buffer Layer and Active Layer6.3 Gate Insulator6.4 Gate Electrode 6.5 Interlayer6.6 Source / Drain Electrode6.7 Planarization layer and Color filter6.8 Pixel Electrode6.9 Pixel Define Layer6.10General
1. AMOLED Structure
· Glass substrates are used for rigid OLED substrates.
· For flexible OLED, polyimide (PI) with high heat resistance and low thermal expansion coefficient is used since TFT is formed by high-temperature physical and chemical process on top of the substrate.
· The PI substrate is a structure in which PI and SiNx are stacked twice and SiOx is formed onthe upper side of SiNx.
Glass substrate for Rigid OLED and PI substrate for flexible OLED
5@ 2018. UBI Research. All rights reserved.
1.1 Substrate
(a) Glass substrate for Rigid OLED
(b) PI substrate for flexible OLED
Glass substrate
SiOx
SiNxPolyimide
SiNxPolyimide
1. AMOLED Structure
TSP classification· There are two types of TSP structure: One is * add-on structure in which a film-type touch
screen is attached on the encapsulation. The other is * On-cell structure directly formed onthe encapsulation.
· The touch screen of the add-on structure and the on-cell structure has an insulator betweenthe touch electrode formed in the x-axis and the y-axis. The add-on method requires aseparate base film such as PET.
· On-cell structure is applied to Rigid OLED. For flexible OLED, add-on structure or on-cellstructure is applied.
· LG Display is developing new structured TSP to flexible OLED with touch electrode formedon the gas barrier film of hybrid encapsulation.
6@ 2018. UBI Research. All rights reserved.
1.6 Touch Screen Panel
TSP(touch screen panel) classification
(b) Rigid OLED - TFE - On-cell type(a) Rigid OLED - Frit glass encapsulation- On-cell type
(d) Flexible OLED - TFE - add-on type (c) Flexible OLED - TFE - On-cell type
(e) Flexible OLED - Hybrid encapsulation- LG Display’s TSP structure
Encapsulation glass
Glass substrate Glass substrate
Overcoat
InsulatorTSP
Carrier glass
Structure Process
Substrate
PI coating
PI curing
SiNx deposition
SiOx deposition
7@ 2018. UBI Research. All rights reserved.
Manufacturing process of substrate for flexible OLED
* Substrate structure may vary by panel makers.
X 2
PISiNx
SiNx
PICarrier glass
SiOx
SiNx
Carrier glassPI
Carrier glassPI
PI varnish
Carrier glass
2. AMOLED Panel Manufacturing Process
PI structure for flexible OLED· Substrate for flexible OLED is first coated with PI varnish on top of the carrier glass and
thermally cured.
· SiNx is deposited on the upper side of the cured PI film.
· OLED is a three stack structure of WOLED + color filter type.
· PI varnish coating, the thermal curing process, and the SiNx deposition process are repeatedon the SiNx/PI, and then the SiOx is deposited thereon to complete the substrateproduction.
2.1 Substrate
2. AMOLED Panel Manufacturing Process
8@ 2018. UBI Research. All rights reserved.
2.3 OLED PixelRGB OLED
RGB OLED pixel deposition process and equipment
Process EquipmentO2 or N2 plasma treat Plasma asher
HIL deposition Evaporator (open mask)
HTL deposition Evaporator (open mask)
Red OLED deposition Evaporator (FMM)
Green OLED deposition Evaporator (FMM)
Buffer layer
Plasma treatment
Open mask HIL
Open mask
FineMetal mask
HTL
Red
GreenFineMetal mask
9@ 2018. UBI Research. All rights reserved.
3. Inspection Process for Small and Medium sized AMOLED Panel
· During TFT process, α-step and ellipsometer are used to measure the thickness, AOIequipment to inspect the pattern, and laser CVD equipment to repair the TFT by detectingdefects of signal line, respectively.
3.2 TFT
If fa
il, re
work
If fa
il, re
work
Sub
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te
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ffer
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r
a-Si
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sula
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rlay
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<Buf
fer l
ayer
depo
sition
><a
-Si:H
dep
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on>
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y-Si
crys
talliz
ation
><P
oly-
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ttern
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<Gat
e ins
ulato
r dep
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on>
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trode
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on>
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trode
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>
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n><In
terla
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epos
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drain
elect
rode
depo
sition
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som
eter
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som
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som
eter
α-st
ep/e
llipso
met
erSh
eet r
esist
ance
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ICD
,TPLa
ser C
VD re
pair
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som
eter
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ep/e
llipso
met
erSh
eet r
esist
ance
AO
ICD
,TP
p+
or n
+ D
opin
g
If fa
il, re
work
ELA
inspe
ction
AOI
CD,TP
10@ 2018. UBI Research. All rights reserved.
3. Inspection Process for Small and Medium sized AMOLED Panel
· After completion of the TFT process, there are AOI equipment for pattern inspection, arraytester and DC tester for electrically checking the abnormality of the signal line, and laserCVD repair for repairing the signal line.
3.2 TFTIf
fail,
rewo
rk
If fa
il, re
work
If fa
il, re
work
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rlay
er
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sula
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drain
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rode
patte
rning
><P
lanar
izatio
n lay
er
coat
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<Plan
ariza
tion l
ayer
pa
ttern
ing>
<Pixe
l elec
trode
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posit
ion>
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l elec
trode
pa
ttern
ing>
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dep
ositi
on>
<PDL
pat
tern
ing&
anne
aling
>
AOI
CD,TP
Lase
r CVD
repa
irEll
ipso
met
erAO
ICD
,TPα
-step
/ellip
som
eter
Shee
t res
istan
ce
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CD,TP
Ellip
som
eter
AOI
Arra
y tes
ter
CD,TP
DC te
ster
Lase
r CVD
repa
ir
If fa
il, re
work
Process Materials Equipment
Exposure - Aligner
Hard baking - Oven
PRdeveloping TMAH Developer
Dry etching
Reactive gas(CF4, C4F4, CHF4)
Dry etcher
PRstripping
Triethanol-amine Stripper
· Deep hole 1 patterning (mask #2)
11@ 2018. UBI Research. All rights reserved.
4.2 Gate Insulator 1
4. Samsung Display’s 9 mask LTPS TFT Manufacturing process
LTPS TFT manufacturing process and equipment
Poly-SiBuffer layer
Carrier glass
Gate insulator 1PR
Poly-SiBuffer layer
Carrier glass
Gate insulator 1PR
Poly-SiBuffer layer
Carrier glass
Gate insulator 1PR
Poly-SiBuffer layer
Carrier glass
Gate insulator 1PR
Poly-SiBuffer layer
Carrier glass
Gate insulator 1
Process Materials Equipment
Exposure - Aligner
Hard baking - Oven
PRdeveloping TMAH Developer
Wet etching
Wet chemical
Wet etcher
PRstripping
N-Methyl Pyrroli-done(NMP)
Stripper
· Gate insulator patterning (mask #3)
12@ 2018. UBI Research. All rights reserved.
6.3 Gate Insulator
6. LG Display’s Oxide TFT Manufacturing process
Buffer layer
Substrate
IGZOGate insulator
PR
Buffer layer
Substrate
IGZOGate insulator
PR
Buffer layer
Substrate
IGZOGate insulator
PR
Buffer layer
Substrate
IGZOGate insulator
PR
Buffer layer
Substrate
IGZOGate insulator
Oxide TFT manufacturing process and equipment
Light shield
Light shield
Light shield
Light shield
Light shield
13@ 2018. UBI Research. All rights reserved.
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