A Highly Integrated and Comprehensive

SiP Solutions for IoT

Teck Lee Senior Technical Manager, ASE Group, Taiwan.

Introduction

IoT Segmentation

Source: Yole, 2016/10

SiP Heterogeneous Integration

Miniaturization by SiP core technologies

Heterogeneous integration with different technologies

Design / Performance Optimization

Lower cost alternative than SoC

Fast-turn-tailor-made changes

Higher quality, production efficiency and re-configurable

Die/Package, Components System-in-Package (SiP)

Die1

28nm/Fab1

Digital

Die2

40nm/Fab2

Analog +

Die3

20nm/Fab3

Memory +

Die4

14nm/Fab4

Power SA

W

Filte

r MEMS Sensor

+ + +

+ + +

Die1

28nm/Fab1

Digital Die3

20nm/Fab3

Memory

Die2

40nm/Fab2

Analog

Die4

14nm/Fab4

Power

SA

W

Filte

r

MEMS Sensor

ASE SiP Key Milestone

Hybrid WB+FC w/ MUF

WiFi Module

WiFi+BT Combo Module

Sputter Conformal Shielding

Glass Integrated Passive Device (IPD)

Ap

plic

atio

ns

Enab

ling

Tech

no

logi

es

Cu Pillar w/ MUF

WiFi+BT+GPS+FM 4 in 1 Module

3G+WiMax Module Biometric Sensor Module

LTE Modem Module

Compartment Shielding

2005 2007 2010 2011 2013 2014 2015

M.2 SSD Module

Antenna on Package (AoP)

a-EASI (Embedded Die in LF)

SESUB (Embedded Die in SUB)

Double Sided Module

2016

HyPas Platform

Cap bank

SW Passive SAW/BAW PA

SiP Module and

System Integration Solution

Wireless Connectivity - BLE

Application: Bluetooth Low Energy (BLE) for wearable products

Challenge: Size reduction; conventional module size and antenna size

occupy large area making wearable products less attractive

Service provided: Module design, manufacturing, system-level testing

& firmware co-qualification

Technology: Antenna on Package (AoP)

Conformal Shielding

Improvement: 82% module XY size reduction

Before: Single Sided Module with Chip Antenna Module Size : 15.0 x 15.0 x 2.0 mm

Solution : AoP Module Size : 6.5 x 6.5 x 1.2 mm (82% XY reduction)

BLE 4.0 (2.4 GHz) Single Chip RF Passive 20 Pcs Substrate : 4 layer , 0.3 mm Metal Lid , 0201

Wireless Connectivity - WLAN

Application: WiFi 802.11 a/b/g/n 2x2 for smartphone & wearable products

Challenge: size reduction, especially on XY dimension

Service provided: Module design & manufacturing

Technology: Double side SMT

Double side molding & exposed molding

Conformal shielding

Improvement: 30% module XY size reduction

Before: Single Sided Module Module Size: 10.0 x 6.6 x 1.1 mm

Solution: Double Sided Molding Module Module Size: 7.75 x 5.4 x 1.3 mm (30 % XY reduction)

SI SI

Substrate

802.11 a/b/g/n 2x2 + BT 4.0 Dual Band (2.4 & 5 GHz) RF Passive 50 Pcs Substrate : 2+2+2 , 0.3 mm MUF, C/S , 01005, 100um SMT clearance

Sensor Integrated SiP: Sensor + AFE/MCU

Application: Smart Handheld (Ambient Light / Proximity / Gesture), Body

Motion & Physiological Sign Sensing

Challenge: Product mechanical constraint, especially on XY dimension

Service provided: Design, materials, assembly & manufacturing,

system-level testing & firmware co-qualification

Technologies:

Stacked die & WB

High density SMT

Embedded die substrate

Improvement: 80% module XY size reduction

Before: Double-sided module

Module Size: PCB-27 x 10 x 3 mm; Sensor-15x10mm

Solution: Embedded die substrate

Module Size : 8 x 8 x 1.2 mm (~80 % XY size reduction)

Top View Bottom View

Features:

1. Security Lock/Unlock: Accelerator, BLE Beacon

2. Fitness Monitor: HRM/SpO2 Sensor

3. Turn Lighting: Gesture Sensor

4. UV, Front/Rear Lighting: UV/ALS Sensor

1

3

2

4 4

BLE+MCU+Sensors for Smart Bike

HyPas Platform Solutions

HyPas Platform

What is HyPas?

High Performance Passives and Package Hybrid Solution

3D Inductor and Highly Integrated SiP Module

Features:

With or Without Glass

High-Q 3D tall pillar inductor

Functional passive form by integrated L+C

Embedded active/passive ability

Compatible with Fan-out process

Low profile and compact form factor

Compatible to traditional SMT & FC process

WB tuning mechanism

EMI shielding

Cap bank

SW Passive SAW/BAW PA

Cap bank RFIC

Glass

3D Solution: HyPas vs. TGV

HyPas with Tall Pillar (TP)

- No TGV

- Embedded IPD cap bank

- Top 2RDL/ Bottom 2 RDL

- Tall Pillar Diameter < 30um , > 120um Pillar High

- 3D Inductor

- RFIC with 70um Cu pillar

- FC with MUF assembly

- Pre-solder

RFIC (Si)

Cap bank 150um

< 2x2mm RF Module

50um

Total: 400um

IPD with TGV

RFIC (Si)

TGV MIM-Cap.

280um

2.4x2.4mm RF Module

- Glass with TGV

- Glass IPD cap

- Top 1RDL/ Bottom 1 RDL

- TGV Diameter 60um/ Depth 250um

- 3D Inductor

- RFIC with 70um Cu pillar

- FC with MUF assembly

- WLCSP assembly with 250um ball

100um

Total: 900um

Summary

Summary

ASE offers variety of technology solution for SiP requirements

HyPas Platform is a High performance Passives/ Packaging solution

Highly integrated SiP solution is especially suited for IOT End Devices