2019 Interim Results - ASM Pacific€¦ · Since 2016 SMT SOLUTIONS 2018 Worldwide SMT Market...

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24 July 2019

2019 Interim

Results

Announcement

2

The information contained in this presentation is provided for informational

purpose only, and should not be relied upon for the purpose of making any

investment or for any other purpose.

Some of the information used in preparing this presentation was obtained

from third parties or public sources. The information contained in this

presentation has not been independently verified. No representation or

warranty, expressed or implied, is made as to, and no reliance should be

placed on, the fairness, reasonableness, accuracy, completeness or

correctness of such information or opinions contained herein. It is not the

intention to provide, and you may not rely on this presentation as providing,

a complete or comprehensive analysis of our financial or trading position or

prospects. The information and opinions contained in this presentation are

provided as at the date of this presentation and are subject to change

without notice and will not be updated to reflect any developments which

may occur after the date of this presentation.

All statements, other than statements of historical facts included in this

presentation, are or may be forward-looking statements. Forward-looking

statements include, but are not limited to, those using words such as

“seek”, “expect”, “anticipate”, “estimate”, “believe”, “intend”, “project”,

“plan”, “strategy”, “forecast” and similar expressions or future or conditional

verbs such as “will”, “would”, “should”, “could”, “may” and “might”.

Disclaimer

These forward-looking statements reflect the Company’s current expectations,

beliefs, hopes, intentions or strategies regarding the future and assumptions in

light of currently available information. Such forward-looking statements are

not guarantees of future performance or events and involve known or

unknown risks and uncertainties. Accordingly, actual results may differ

materially from information contained in the forward-looking statements as a

result of a number of factors. You should not place undue reliance on such

forward-looking statements, and the Company does not undertake any

obligation to update publicly or revise any forward-looking statements. No

statement in this presentation is intended to be or may be construed as a profit

forecast.

We also do not undertake any obligation to provide you with access to any

additional information or to update this presentation or any additional

information or to correct any inaccuracies in this presentation or any additional

information which may become apparent.

This presentation does not constitute an offer or invitation to purchase or

subscribe for any shares and no part of it shall form the basis of or be relied

upon in connection with any contract, commitment or investment decision in

relation thereto.

3

The Only Back-end Equipment Supplier

Being Recognized

Top 100 Global Technology Leaders

The Top 100 Global

Technology Leaders are the

organizations poised to propel

the future of technology

Brian Scanlon, Chief Strategy Officer

Thomson Reuters, 2018

“Recognised alongside:

O V E R V I E W

Microsoft

Intel

Cisco

IBM

Alphabet

Apple

TSMC

SAP

Texas Instruments

Accenture

3

4

Q2 2019 Group Revenue:

USD 461m(CAGR 2009 - Q2 2019 LTM 13.8%)

SMT Solutions

42.9%

Back-End Equipment

44.7%

Materials

12.4%

O V E R V I E W

The World’s

Technology &

Market Leader

5

Regensburg

Boston

Weymouth

Porto

Chengdu

Singapore

Johor

Hong Kong

Taoyuan

Beuningen

Munich

Shenzhen

Huizhou

ASMPT

Global Presence>1,400Patents on key

leading edge

technologies

10 R&D centres

worldwide

>2,000Global R&D

staff

12Manufacturing

facilities

5

O V E R V I E W

Sales Offices

Business Centre / R&D /

Manufacturing Site

6

ASMPT’SMajor FacilitiesAround The World

Hong Kong

Beuningen

O V E R V I E W

Boston

Porto

Munich

Regensburg Huizhou (惠州)

Taoyuan

Chengdu (成都)

Fuyong (福永)

Singapore

Longgang (龙岗)

Johor

(Expansion)Johor

Weymouth

Sales Offices

Business Centre / R&D /

Manufacturing Site

7

#1 in SMT

Equipment Market

Since 2016

SMT SOLUTIONS

2018 Worldwide

SMT Market Share:

~23%

#3 in Leadframe

MarketSince 2018

MATERIALS

2018 Worldwide

Leadframe Market Share:

~9%

2018 Worldwide

PAE Market Share:

#1 in Assembly

& Packaging Equipment Market

BACK-END EQUIPMENT

Since 2002

~25%

Three Business Segments With

Leading Market Positions

Sources: Market share for Back-end Equipment is based on information on packaging and assembly equipment market by VLSI,

leadframe market by SEMI, and SMT market by ASMPT SIPLACE Market Intelligence |

O V E R V I E W

2019 Q2

Highlights

Q 2 H I G H L I G H T S

9

QoQ Bookings Rebound Across the Board

USD QoQ

Group 602m +30.8%

Back-end Equipment

Segment247m +10.9%

Materials Segment 59m +28.5%

SMT Solutions Segment 296m +54.4%

SMT: Bookings surged 54.4% QoQ to

a near record

CIS: Momentum continued to be

strong

Advanced Packaging: Good

momentum continuing

Materials: Consecutive two quarters

of QoQ bookings growth

Near record Backlog of US$795m

Q 2 H I G H L I G H T S

10

Q2 Bookings – Business Segments

296

0

50

100

150

200

250

300

350

Q1 16 Q4 16 Q3 17 Q2 18 Q1 19

SMT (USD'M)

QoQ Growth:

+54.4%

59

0

10

20

30

40

50

60

70

80

90

100

Q1 16 Q4 16 Q3 17 Q2 18 Q1 19

Materials (USD'M)

QoQ Growth:

+28.5%

247

0

50

100

150

200

250

300

350

400

450

Q1 16 Q4 16 Q3 17 Q2 18 Q1 19

Back-end Equipment (USD'M)

QoQ Growth:

+10.9%

Q 2 H I G H L I G H T S

11

Q2 Billing Highlights

USD QoQ

Group 461m -1.2%

Back-end Equipment Segment 206m +5.2%

Materials Segment 57m +13.2%

SMT Solutions Segment 198m -10.3%

Back-end Equipment bounced back

Double-digit QoQ growth from

Materials

SMT revenue declined due to weak

booking in previous quarter

Strong Q2 orders to translate into good

Q3 Billings

Q 2 H I G H L I G H T S

12

Q2 Billings – Business Segments

206

-

50

100

150

200

250

300

350

400

Q113

Q313

Q114

Q314

Q115

Q315

Q116

Q316

Q117

Q317

Q118

Q318

Q119

Back-End Equipment (USD’M)

198

-

50

100

150

200

250

300

350

Q113

Q313

Q114

Q314

Q115

Q315

Q116

Q316

Q117

Q317

Q118

Q318

Q119

SMT (USD’M)

57

-

20

40

60

80

Q113

Q313

Q114

Q314

Q115

Q315

Q116

Q316

Q117

Q317

Q118

Q318

Q119

Materials (USD’M)

QoQ Growth:

-10.3%

QoQ Growth:

+13.2%

QoQ Growth:

+5.2%

Q 2 H I G H L I G H T S

13

Q2 GM Improvement Across All Three Segments

QoQ

Group 35.7% +185 bps

Back-end Equipment

Segment40.8% +153 bps

Materials Segment 11.4% +103 bps

SMT Solutions Segment 37.5% +301 bps

Across the board cost reduction

initiatives taking effect

Favourable product mix due to

contribution from Advanced Packaging

and CIS

Group headcount reduced YoY by

~2,400 contributed mainly by

manufacturing

Q2 Group OPEX reduced by 5.6%

YoY (excluding acquisition effect:

14.5% YoY)

Q 2 H I G H L I G H T S

14

QoQ Bookings Growth:

+10.9%

Key Highlights:

Back-end Equipment Segment

CIS

Driven by folded lenses and multiple cameras

More cameras per phone offsetting smartphone shipment

rate decline

Advanced Packaging

Contributed close to 20% of Back-end Equipment

More revenue recognition expected to take place 2H19

Automated Optical Inspection

Strong growth

Revenue for 1H19 > FY2018

Traditional die/wire bonders demand remained weak

Overall market recovery pushed back by trade war tensions

Q 2 H I G H L I G H T S

Key Highlights:

SMT Segment

Benefited from 5G infrastructure build-up

Strong demand from China market

Continued demand from Automotive, Industrial

and Consumer Applications

296

0

50

100

150

200

250

300

350

Q1 16 Q4 16 Q3 17 Q2 18 Q1 19

Quarterly SMT Bookings (USD'M)

QoQ Growth:

+54.4%

15

Q 2 H I G H L I G H T S

59

0

10

20

30

40

50

60

70

80

90

100

Q1 16 Q4 16 Q3 17 Q2 18 Q1 19

Quarterly Materials Bookings (USD'M)

QoQ Growth:

+28.5%

16

Key Highlights:

Materials Segment

Consecutive two quarters of QoQ Bookings

growth

Leadframe market has bottomed out

Likely signaling market recovery; pace?

Q 2 H I G H L I G H T S

17

1H 2019 Revenue Breakdown by Application Markets

Top 5 Customers Revenue

Contribution

More Resilient in a Downturn with Multiple Application

Markets Strategy

Q 2 H I G H L I G H T S

18

Sustainable and Gradually Increasing Dividends

1.00

0.40

0.80

1.101.20

1.30 1.301.40

1.30

295%

0%

50%

100%

150%

200%

250%

300%

350%

400%

1H15 2H15 1H16 2H16 1H17 2H17 1H18 2H18 1H19

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

Dividends Per Share (HKD) & Dividend Payout Ratio

DPS Dividend Payout Ratio

Q 2 H I G H L I G H T S

19

1H 2019 R&D

expenditure

US$ 106 million

12.9% of

Equipment Sales

Laser dicing & grooving SMT

0

50

100

150

200

250

2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 1H 2019

US

D m

illi

on

R&D expenses

USD1,529 million invested in R&D

Package Interconnection Optics precision engineering Vibration control

12.9%

R&D Commitment Makes Us a Preferred Partner of ChoiceQ 2 H I G H L I G H T S

20

1H 2019 Geographical Distribution of Revenue

An Extensive Customer Base

No single customer accounted for more than 10%

of Group revenue

Top 5 customers accounted for 15% of Group’s

1H 2019 revenue

Top 20 customers include:

World’s leading IDMs

Tier 1 OSATs, major OSATs in China

Key LED players

Major camera module makers

Top EMS providers

Leading automotive component suppliers

Among Top 20 customers of Group:

7 from SMT Solutions segment

3 from both Back-End Equipment & SMT

Solutions segment

China, 44.8%

Europe, 18.3%

Americas, 8.0%

Malaysia, 6.4%

Vietnam, 6.1%

Taiwan, 4.7%

Thailand, 2.9%

Korea, 2.9%

Philippines, 2.6%

Japan, 1.2%

India, 0.9%

Others, 1.2%

Q 2 H I G H L I G H T S

Endless Opportunities

for ASMPT in the Digital

World

22

Data-Centric Era will spur

Semiconductor Demand

Collect Transmit Analyse VisualiseStore

Camera, 3D Sensing,

Industry IoT, Sensor,

LIDAR

5G, WiFi, LiFi Big Data Centre,

Cloud Computing,

Memory

AI, TPU, Data

Analytics, HPC

AR, VR, Micro

LED, Mini LED

T R E N D S

• CMOS Imaging

Sensors

• Active Alignment

• Precision Die Attach

• Silicon Photonics

• RF Filters

• Wire Bonding

• SAW Filters

• BAW Filters

• SMT Solutions

• PVD

• Silicon Photonics

• TCB

• Wire Bonding

• PLFO

• Laser Dicing

• WLFO

• PLFO

• Pick & Place

• Laser Grooving

• TCB

• PVD/ECD

• Precision Die Attach

• Heterogeneous Integration

• High Precision Die Attach

• Mini/Micro LED Displays

AS

MP

T’s

En

ab

lin

g

So

luti

on

s

23

Data Traffic To Continue

‘Exploding In Waves’ Over The Next Years

2005 - 2017A 2018A 2019F 2020F 2021F 2022F

87x

222x

0.02

1.461.87

2.41

3.05

3.83

4.75

Global Data Traffic Facts (in Zettabytes)

23Source: Cisco Visual Networking Index: Forecast and Trends, 2017–2022 White Paper (Updated February 2019) |

T R E N D S

24

Smartphone Innovations

Continue to Drive CIS Business

A P P L I C A T I O N S

Under-Screen Camera (USC)(Super-thin, thread-less lens)

Multi-Camera Combo, Folded optics(WFOV -> 50x Super Zoom)

Biometrics3D sensing, Under-Display FPS

Super High Resolution(24MP -> 48MP -> 64MP -> 100MP)

2525

The Role Of The Camera In

The Data Era Redefined

Today Future

Still Images

Social Media

Content

Autonomous

Vehicles

Artificial

Intelligence

AR/VR

Industrial

Inspection

with Drones

Security:

Features

Recognition

Videos

Source: Youtube, Facebook, Instagram, IT World Canada, Nvidia, Precision Security

Australia, Cramer.com, Weibo, Netflix, Youku |

A P P L I C A T I O N S

26

Enhanced Technology That

Meets Critical Requirements

Of The Digital World

CRITICAL

REQUIREMENTS:

Greater Storage

No Latency

Lower Power

Higher Bandwidth

Advanced Packaging

5G Connectivity

Infrastructure

Heterogeneous

Integration

A P P L I C A T I O N S

27

Advanced Packaging: The Game Changer In Semiconductor Revolution

FIREBIRD

TCB

FLI

NUCLEUS

Pick and Place

Wafer and Panel

NEXX

PVD | ECD

Bumping,TSV

& RDL

SIPLACE CA

Die Attach & SMT

Wafers and SMT

Feeders

LASER 1205

Laser Separation

Wafer Dicing and

Grooving

HDI Substrate with

Embedded

Technology

Integrated

Passive Device,

IPD integration

2.5D Silicon

Interposer

X-PU

HBM /

Memory

27

End Applications:

AUTOMOTIVE

Sensors, Camera, Body

Electronics, Safety

Systems, Infotainment

DATACENTERS

for HPC, Machine

Learning

GPUfor VR/AR & AI

IOT ERA

Smart Wearables

& Smart Machines

(Factories)

A P P L I C A T I O N S

28Source: YOLE Development, PwC Strategy & analysis, IC Insights, JP Morgan |

Growth of Packaging Market Mainly Driven by

Advanced Packaging

Advanced

Packaging

Conventional

Packaging

0

14

28

42

56

70

84

2014 2023

Global Packaging Market (Billion $)

$53 B

$84 B

T R E N D S

~2X

Robots

Deep

learning

Language

processing

Vision

A.I. Share within Semi Industry Expected to Grow to >$100B in the Next Decade

29

Expanding TAM to include AOI

(Automated Optical Inspection)

▪ Demands High Quality

▪ Zero PPM Defects▪ Zero Foreign Particles

Applic

ation M

ark

ets

&

Industr

y R

equirem

ents

CIS Automotive

▪ 100%, on-line high

speed inspection

Advanced

Packaging

A P P L I C A T I O N S

ASMPT’s AOI Solutions

2D and 3D

All-in-one

Vision

System

1µm Particle

Inspection

Capability with

Auto Clean

Solution

Strategic Investment in

X-Ray Inspection for

Advanced Packaging

(100 times faster than current market solution)

30

MiniLED MicroLED

~ 66.1%Market Size CAGR(2019 – 2027)

Medium to Large

RGB / BLU Display

Small Gadget &

Transparent Display

~ 139.5%Market Size CAGR (2019 – 2027)

Future Growth Drivers for

OPTO Business

A P P L I C A T I O N S

SOGO Department Store, Causeway Bay, Hong Kong

Source: Yanoresearch, Apr 2019

31

Source: Yole, Apr 2019

Si Photonics-based Transceivers

Revenue CAGR (2018 – 2024)

~ 44.5 %

Data Center Interconnects

MedicalIndustrial Communication

Intra-car Interconnects

Defence & Aerospace

LIDAR & Sensors

Telecommunication

Booming Applications

In Photonics Market

A P P L I C A T I O N S

32

Entertainment

Platform

Power

Management

Sensors

How will ‘Smart Cars’

Drive ASMPT’s Growth?

Battery Technology for thermal management

Thermal management (e.g. Ag

Sintering) will play important role

Television, Mobile devices,

VR/AR, Gaming, etc.

Frees up driver’s attention

on road for entertainment

Image, LIDAR, Radar

The eyes and ears to gather

information from the Road

Vehicle-to-X (Vehicle, Infrastructure,

Network, Devices) communications

Enable “V2X” communications

5G to Cloud Connectivity

Sensors

Entertainment Platform

Power Management

A P P L I C A T I O N S

Outlook

34

Outlook

Q3 Group Billing

Range of USD 550m to USD 600m

All three segments expected to deliver QoQ

growth

Q3 Group Booking

Expected ▼ QoQ due to seasonality

Back-end Equipment and Materials Likely ▲QoQ

Q3 Group Gross Margin

Expect slight improvement only, being

constrained by geographical mix for SMT

O U T L O O K

35

Industry Growth Forecast (2019)

2013 2014 2015 2016 2017 2018 2019F

VLSI Assembly & PackagingEquipment(Apr-19)

-22% 27% -18% 16% 24% 3% -18%

SEMI Assembly & PackagingEquipment

(Jul-19)-26% 33% -18% 20% 26% 1.9% -23%

-30%

-20%

-10%

0%

10%

20%

30%

40%

Semiconductor Industry Forecast Global Assembly & Packaging Equipment Market

2.6%

-3.0%

5.0%

1.6%

4.0%

-1.0%

2.6%

6.7%

Gartner, Jan-19

WSTS, Mar-19

Cowan LRA, Aug-18

IC Insights, Jan-19

IHS Markit, Jul-18

VLSI, Jan-19

Semiconductor

Without Memory

O U T L O O K

36

Recent Awards & Recognition

Technology Achievement Grand Award of HKIA 2017

(for the third time)

Federation of HK Industries

Hong Kong Outstanding Enterprises 2017-18

HK Economic Digest

Directors of the Year Awards 2017 (Collective Board)

Directors of the Year Awards 2018 (Individual Director) Hong Kong

Institute of Directors

2017 All Stars of the Semiconductor Industry

VLSI Research

HKMA Quality Award (2019)

It is conferred to ASMPT (Hong Kong Operations)

Award for business excellence and quality achievement

Recent Awards & Recognition

Latest

A W A R D S

37

VLSI Awards 2019Recent Awards & Recognition

Latest

A W A R D S

2019 Q2/1H

Financial Highlights

Q2/1H Group Bookings

Quarterly Group Bookings

(US$ m)

QoQ Growth:

+30.8%

602

0

100

200

300

400

500

600

700

800

Q1 14 Q4 14 Q3 15 Q2 16 Q1 17 Q4 17 Q3 18 Q2 19

39

Q2 2019 Bookings 1H 2019 Bookings

USD YoY QoQ USD YoY HoH

Group 602m -17.3% +30.8% 1,062m -28.3% -2.8%

Back-end

Equipment

Segment247m -30.3% +10.9% 470m -38.3% -5.4%

Materials

Segment59m -23.7% +28.5% 105m -30.4% +12.0%

SMT

Solutions

Segment296m -0.1% +54.4% 487m -14.5% -3.0%

F I N A N C I A L R E V I E W

Q2/1H Group Billings

Quarterly Group Billings

(US$ m)

QoQ Growth:

-1.2%

461

0

200

400

600

Q1 14 Q4 14 Q3 15 Q2 16 Q1 17 Q4 17 Q3 18 Q2 19

40

Q2 2019 Billings 1H 2019 Billings

USD YoY QoQ USD YoY HoH

Group 461m -31.4% -1.2% 927m -24.4% -26.8%

Back-end

Equipment

Segment206m -43.2% +5.2% 402m -37.6% -25.0%

Materials

Segment57m -25.0% +13.2% 108m -28.6% -21.3%

SMT Solutions

Segment198m -15.1% -10.3% 418m -3.0% -29.7%

F I N A N C I A L R E V I E W

41

Q2/1H Group Financial Highlights

Q2 2019Q2 2019

1H 20191H 2019

YoY QoQ YoY HoH

Bookings (USD) 602m -17.3% +30.8% 1,062m -28.3% -2.8%

Revenue (USD) 461m -31.4% -1.2% 927m -24.4% -26.8%

Gross Margin 35.7% -751 bps +185 bps 34.8% -588 bps -67 bps

EBIT (HKD) 221m -81.0% -16.3% 484m -74.5% -60.4%

Net Profit (HKD) 70m -91.0% -35.3% 178m -87.2% -78.1%

Net Profit Margin 1.9% -1,290 bps -102 bps 2.5% -1,208 bps -575 bps

F I N A N C I A L R E V I E W

42

Q2/1H Segment Results – Back-End Equipment Business

Q2 2019 1H 2019

Amount YoY QoQ Amount YoY HoH

Bookings (USD) 247m -30.3% +10.9% 470m -38.3% -5.4%

Billings (USD) 206m -43.2% +5.2% 402m -37.6% -25.0%

Gross Margin 40.8% -1,003 bps +153 bps 40.0% -794 bps -331 bps

Segment Profit (HKD) 67m -92.3% +25.9% 119m -91.2% -81.5%

Segment Profit Margin 4.1% -2,616 bps +68 bps 3.8% -2,319 bps -1,160 bps

F I N A N C I A L R E V I E W

43

Q2/1H Segment Results – Materials Business

Q2 2019 1H 2019

Amount YoY QoQ Amount YoY HoH

Bookings (USD) 59m -23.7% +28.5% 105m -30.4% +12.0%

Billings (USD) 57m -25.0% +13.2% 108m -28.6% -21.3%

Gross Margin 11.4% -182 bps +103 bps 11.0% -224 bps +144 bps

Segment Profit (HKD) 20m -55.9% +88.9% 30m -64.0% +2.1%

Segment Profit Margin 4.4% -310 bps +177 bps 3.6% -353 bps +82 bps

F I N A N C I A L R E V I E W

44

Q2/1H Segment Results – SMT Solutions Business

Q2 2019 1H 2019

Amount YoY QoQ Amount YoY HoH

Bookings (USD) 296m -0.1% +54.4% 487m -14.5% -3.0%

Billings (USD) 198m -15.1% -10.3% 418m -3.0% -29.7%

Gross Margin 37.5% -376 bps +301 bps 35.9% -347 bps +156 bps

Segment Profit (HKD) 209m -38.5% -2.1% 422m -21.8% -42.5%

Segment Profit Margin 13.5% -512 bps +112 bps 12.9% -311 bps -288 bps

F I N A N C I A L R E V I E W

45

Capital Investment

(US$ m)

437

806

1079

0

500

1,000

1,500

2,000

2013 2014 2015 2016 2017 2018 1H 2019

Free Cash Flow

(HK$ m)

57 72 5582

104

136

4763 74

0

25

50

75

100

125

150

175

200

_ 2014 . , 2015 ^ * 2016 - = 2017 + # 2018 2018B 12 1 1H 2019 2019B 2019ED&A

Free Cash Flow and Capital Investment

892626

136

F I N A N C I A L R E V I E W

46

0%

5%

10%

15%

20%

25%

30%

2014 2015 2016 2017 2018 1H 2019(Annualized)

Return on Equity (ROE)

0%

5%

10%

15%

20%

25%

30%

35%

40%

2014 2015 2016 2017 2018 1H 2019(Annualized)

Return on Invested Capital (ROIC)

Financial MetricsF I N A N C I A L R E V I E W

47

0

1,000

2,000

3,000

4,000

5,000

6,000

7,000

8,000

2014 2015 2016 2017 2018 1H 2019

HK

D m

illi

on

s

Inventory

0

2,000

4,000

6,000

8,000

10,000

12,000

2014 2015 2016 2017 2018 1H 2019

HK

D m

illi

on

s

Working Capital

Working Capital Management

0

50

100

150

200

250

300

350

2014 2015 2016 2017 2018 1H 2019

Cash Conversion Cycle (Days)

0

1,000

2,000

3,000

4,000

5,000

6,000

2014 2015 2016 2017 2018 1H 2019

HK

D m

illi

on

s

Accounts Receivable

F I N A N C I A L R E V I E W