Post on 19-Dec-2015
1
Student Hands On Training I (2009)
Command & Data Handling
PCB Build Procedure
Command & Data Handling
PCB Build Procedure
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Student Hands On Training I (2009)
What Are We Building?
What Are We Building?
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SHOT 1 2009
The C&DH PCB 1:
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The C&DH PCB 2:
AVR Board
Data Board
Z-Accel. Board
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Organization:
The boards may seem like an array of confusing electronics, but one can easily break the board into smaller subsystems of related components.
This build is organized by different sub systems integral to the board.
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Integral Systems:
-ATMega32 Microprocessor
-2 MB Flash Memory
-0-15 PSI Pressure Sensor
-3-Axis Acceleration
-Temperature Sensor
-In-System-Programming
-Power Regulation
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Student Hands On Training I (2009)
Safety and BackgroundSafety and
Background
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SHOT 1 2009
Board Safety:
Caution:
Many of the components used in this workshop are sensitive to electrostatic discharge (ESD). Please ensure that you are wearing your protective wrist strap at all times. There will be a warning slide when components are ESD and heat sensitive.
Clipping leads can sometimes cause them to separate in a rapid manner that could cause injury. Please take caution when clipping leads. Wear your safety glasses at ALL TIMES!
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Reading a Resistor:
The resistors in this workshop have already been organized by value.
In the event that your resistors get mixed, please refer to the chart at the left to classify your resistors, or use your multimeter.
If you are unsure, don’t hesitate to raise your hand and ask for assistance.
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Student Hands On Training I (2009)
Verifying Kit Contents
Verifying Kit Contents
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Kit Contents—PCBs:
PCBs:
- One Main Board
- One Data Board
- One Z Accelerometer Board
- One XY Accelerometer Board
Note: All boards were tested in-house and are currently in working order.
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Kit Contents—Resistors:
Resistors:
- Two 1 KΩ Resistors
- R8, R9
- Eight 10 KΩ Resistors
- R1, R2 R3, R4, R5, R6, R10, R11
- One 3.3 KΩ Resistors
- Indicator
- One 100 KΩ Resistor
- R7
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Kit Contents—Capacitors:
Capacitors:
- Eleven .1 μF Capacitors
- C2, C3, C4, C5, C6, C7, C8, C9, CX, CY, CZ
- One 1 μF Capacitor
- C10
- One 10 μF Capacitors
- C1
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Kit Contents - Connectors:
Connectors:
- One ISP Cable
- Ten 2X1 Headers
- One 3X1 Header
- One 4X1 Header
- Three 3X2 Right Angle Headers
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Kit Contents—LEDs:
LEDs:
- Two Red LEDs
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Kit Contents—Sockets/ICs/Pressure Sensors:
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Sockets/ICs/Press. Sens.:
- One AVR Socket
- One AVR
- One Level Shifter (LS)
- One LS Socket
- One Pressure Sensor
- One DB9 Connector
LS DIP
AVR
AVR DIP
LS
Press. Sens
DB9 Conn.
Kit Contents—Sockets/ICs/Pressure Sensors:
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Kit Contents—Miscellaneous 1:
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Kit Contents—Miscellaneous 2:
Miscellaneous:
- One Red LED
- One Green LED
- One Switch
- One Jumper
- One Z-Accelerometer Connector
Green LED
Red LED
Jumper
Z-Acc. Conn.
Switch
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Kit Contents—Miscellaneous 3:
Miscellaneous:
- Wires:
-Three Blue
-Three Red
-Two Black
Bla
ck
Red
Blu
e
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Kit Contents—Transistors:
Transistors:
- One PNP Transistor
- T1
- One NPN Transistor
- T2
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Kit Contents—VREGS:
VREGS:
- One 5V VREG
- One 3.3 VREG
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Kit Contents—Diodes:
Diodes:
- Three Diodes
-D1, D2, D3
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Board Check:
- Check to ensure that your boards have: flash memory (1), a level shifter (2), and four accelerometers (3).
- Please raise your hand if any components are missing.
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3
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Board Schematic:
- Check to ensure that your boards have: flash memory (1), a level shifter (2), and four accelerometers (3).
- Please raise your hand if any components are missing.
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Schematic Overview – Part Highlighting:
- Blue highlights mean parts will be added to the board in the current step.
- Green highlights indicate components already on the board but relevant to the current step.
- Red highlights show access points on the PCB where wires can be soldered.
Part added previously
Access points
Part to be added
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Schematic Overview – Coordinates (A1):
- All schematic close-ups include coordinates so they can be easily located in your schematic printout.
- The coordinates correspond to the letters across the side of the schematic and the numbers across the top.
Coordinates given here
Numbers across top
Letters along side
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Student Hands On Training I (2009)
Let’s Begin!Let’s Begin!
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Current Sub System:
Power Subsystem:Activation
Power Regulation
Sensor Subsystem:Temperature Sensor
Pressure SensorX & Y Axis Accelerometers
Z Axis Accelerometers
Command and Data Handling:AVR, Memory, & In-System Serial Programming (ISP)
Data Retrieval
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SHOT 1 2009
Activation Schematic 1 (D2):
- This circuitry allows power to the board to be switched on when the rocket launches.
Turns on when system is arm
ed
Power from batteries
Power to re
st of s
ystem
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Activation Schematic 2 (D2):
- The acceleration of launch closes the G-switch.
- If the G-switch is closed while the RBF Pin header is shorted, the system turns on.
- T2 keeps T1 on even after the G-switch is released.
- Everything stays on until the battery is removed.
T2 Keeps T1 on after launch
T1 Controls power to the board
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On LED Schematic (C2):
- The ON LED indicates that the system is receiving power.
- It will not turn on until after the next section (Power Regulation).
- R9 prevents the LED from drawing too much power.
Will be added later
5V Power Bus
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RBF/G-Switch Headers:
- Solder two (2) of the 2X1 headers into the footprints labeled RBF Pin and G-Switch.
- As always, ensure they are flush with the board.
G-Switch
RBF Pin
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On and RDY Headers:
- Solder two more (2) of the 2X1 headers into the footprints labeled On and RDY.
- These headers will be used for indicator LEDs.
On
RD
Y
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Power Header 1:
- Solder one (1) of the 2X1 headers into the footprint labeled Power.
- This is the primary power header.
Power
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Power Header 2:
- There is a secondary power header on the opposite side of the board. DO NOT install this header.
Power
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Pre-Bending:
Pre-Bending 101:
- Pre-bending is a technique that allows components to be easily inserted into a PCB.
- Pre-bending also allows components to lay more flush with the board.
- Bending components to the correct bend radius takes practice, but mastering the technique will reap rewarding benefits!
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Pre-Bending:
Pre-Bending 101:
- Start with the bending and prodding tool in the position shown in the top picture.
- Choose a location along the length of the tool that will yield the appropriate bend radius.
- Use your thumb to bend the lead such that the component and lead are orthogonal.
90°
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Diodes:
- Take three (3) diodes from your supplies and use the supplied bending and prodding tool to bend the leads at 90 degrees as shown above.
Right: Bent diode ready for installation.
Left: Diode as it comes in the kit.
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Diodes (D1-D3):
- Solder one (1) of the bent diodes into the footprint labeled D1 on the board.
- Note: Diodes are polarized and the black line on the diode must overlay the while line on the footprint.
D1
D2 D3
Black and white overlay
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Diodes (D1-D3):
- Solder one (1) of the bent diodes into the footprint labeled D2.
- Check polarity.
D1
D2 D3
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Diodes (D1-D3):
- Solder one (1) of the bent diodes into the footprint labeled D3.
- Check polarity.
D1
D2 D3
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ESD/Heat Concern:
ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist
strap.
When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off.
ESD
Q
WARNING:
The following components are extremely ESD and
heat sensitive!
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Transistors:
- Take the power transistor, T1, and the NPN transistor, T2, from the kit and use the bending and prodding tool to bend the leads as shown above.
- Note: Advance to the next slide/page to place these transistors in their footprints to determine the bend location and radius.
Bent power transistor, T1 Bent NPN transistor, T2
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Transistors (T1):
- Solder the power transistor, T1, into its footprint and ensure that the bend allows it to lay flush with its heat sink.
- Ensure that T1 is flush with the heat sink BEFORE soldering it into its footprint.
- DO NOT solder T1 to the heat sink.
T1
Use open end of
bending tool to bend
outside leads then the
point for middle lead
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Transistors (T2):
- Place and solder the bent NPN transistor, T2, into its footprint and ensure that the bend allows it to lay flush with the board.
T2
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Resistors:
- The next several steps install the resistors for the power sub system. There are four (4) different types of resistors for this sub system: 10K, 100K, 1K, and 3.3K.
- The resistors will lay more flush with the board if the bending and prodding tool is used first to bend the resistors are shown above.
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Resistors (10K):
R2
R3
R4
R10
- Bend four (4) of the 10K resistors in the kit as indicated previously and solder them into footprints R2, R3, R4, and R10.
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Resistors (1K):
- Bend one (1) of the 1K resistors in the kit as indicated previously and solder it into footprint R8.
R8
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Resistors (1K):
- Bend one (1) of the 1K resistors in the kit as indicated previously and solder it into footprint R9.
R9
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Resistors (100K):
- Bend one (1) of the 100K resistors in the kit as indicated previously and solder it into footprint R7.
R7
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Activation Schematic 1 (D2):
- This circuitry allows power to the board to be switched on when the rocket launches.
Turns on when system is arm
ed
Power from batteries
Power to re
st of s
ystem
Highlight your schematic
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SHOT 1 2009
Activation Schematic 2 (D2):
- The acceleration of launch closes the G-switch.
- If the G-switch is closed while the RBF Pin header is shorted, the system turns on.
- T2 keeps T1 on even after the G-switch is released.
- Everything stays on until the battery is removed.
T2 Keeps T1 on after launch
T1 Controls power to the board
Highlight your schematic
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On LED Schematic (C2):
- The ON LED indicates that the system is receiving power.
- It will not turn on until after the next section (Power Regulation).
- R9 prevents the LED from drawing too much power.
Will be added later
5V Power Bus
Highlight your schematic
55
Student Hands On Training I (2009)
Power System Test 1:
9V Supply, Flight Pin, RDY LED
Power System Test 1:
9V Supply, Flight Pin, RDY LED
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Power System Test 1:
- Take out the multimeter that was provided.
- Insert the red plug into the port labeled VΩHz.
- Insert the black plug into the port labeled COM.
COM VΩHz
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Power System Test 1:
- Turn on the multimeter.- Turn the dial to the 20V DC setting.- Place the red lead on the positive battery terminal.- Place the black lead on the negative battery terminal.- If you do not get a reading of above 9V, raise your hand.
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Power System Test 1:
+
-
- Set multimeter in continuity test mode.- Place red lead on the positive power terminal.- Place black lead on GND.- If a beep is heard, please raise your hand.
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Power System Test 1:
- Connect your battery to the circuit (red wire is positive).- Connect the red LED to the “RDY” header.- Connect the jumper to “RBF Pin.”- If the red LED does not light, please raise your hand.- Final Step - Disconnect the battery from the board!
Jumper
NOTE: Red wire from LED
connects to “+” on board
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SHOT 1 2009
Current Sub System:
Power Subsystem:Activation
Power Regulation
Sensor Subsystem:Temperature Sensor
Pressure SensorX & Y Axis Accelerometers
Z Axis Accelerometers
Command and Data Handling:AVR, Memory, & In-System Serial Programming (ISP)
Data Retrieval
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SHOT 1 2009
Power Regulation Schematic 1 (C1):
- Voltage regulators turn the 9 Volts provided by the battery into the 5 Volt and 3.3 Volt power supplies required by the digital components.
3.3V Output
5V O
utpu
t
9V Input
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SHOT 1 2009
Power Regulation Schematic 2 (A3):
- Capacitors can be used to filter power supplies by storing energy when the voltage is slightly too high and releasing it when the voltage is too low. There is a capacitor for each power supply (5V, 3.3V, and 9V) and also at the power input pins of every chip.
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SHOT 1 2009
ESD/Heat Concern:
ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist
strap.
When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off.
ESD
Q
WARNING:
The following components are extremely ESD and
heat sensitive!
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3.3V Voltage Regulator:
Take one (1) 3.3 VREG from the kit (L69B) and solder it to the board.
TIP: Place a large blob of solder (2 linear inches) onto the side of the soldering iron’s tip, and tack the large pad on first. Once the large pad is tacked, solder the remaining pads.
3.3 VREG
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5V Voltage Regulator:
Using the technique described on the previous slide, solder one (1) 5.0 VREG onto the board as shown above.
5.0 VREG
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Capacitors (C1):
Take one (1) 10μF capacitor from the kit and solder it into the footprint labeled C1.
Note: These capacitors are not polarized
10μF(C1)
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Capacitors (C2, C6, C7):
Take three (3) .1μF capacitors from the kit and solder them into the footprints labeled C2, C6, and C7.
.1μF(C2)
.1μF(C6) .1μF(C7)
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Power Regulation Schematic 1 (C1):
- Voltage regulators turn the 9 Volts provided by the battery into the 5 Volt and 3.3 Volt power supplies required by the digital components.
3.3V Output
5V O
utpu
t
9V Input
Highlight your schematic
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SHOT 1 2009
Power Regulation Schematic 2 (A3):
- Capacitors can be used to filter power supplies by storing energy when the voltage is slightly too high and releasing it when the voltage is too low. There is a capacitor for each power supply (5V, 3.3V, and 9V) and also at the power input pins of every chip.
Highlight your schematic
70
Student Hands On Training I (2009)
Power System Test 2:
ON LED, 3.3 V Supply, 5.0 V
Supply
Power System Test 2:
ON LED, 3.3 V Supply, 5.0 V
Supply
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ON LED Test:
Switch
ON LED
9 V Batt.
RDY LED
Jumper
Connections:
- Connect the LEDs:-Red to RDY-Green to ON
- Connect the Switch- Connect the jumper to RBF Pin
- Connect the battery
NOTE: Red wires from LEDs
connect to “+” on board
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ON LED Test 2:
G-Switch
ON LED
9 V Batt.
RDY LED
Jumper
Expected Results:
- The red LED should be illuminated, but not the green LED
- Click the Switch
- The green LED should illuminate
- Raise your hand if you do not see these results
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3.3 VREG Test:
Connections:- Place the multimeter in 20V mode.- Touch the black terminal to the large pad of the 3.3 VREG
(Ground)- Touch the red terminal to pin closes to the label Vreg3.3
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3.3 VREG Test:
Expected Results:- The multimeter should read 3.3 ± 0.1 Volts.
- If you do not see these results, please raise your hand.
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5.0 VREG Test:
Connections:- Place the multimeter in 20V mode.- Touch the black terminal to the large pad of the 5.0 VREG
(Ground)- Touch the red terminal to pin closes to the label Vreg5.0
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5.0 VREG Test:
Expected Results:- The multimeter should read 5.0 ± 0.1 Volts.
- If you do not see these results, please raise your hand.
Final Step - Disconnect the battery
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SHOT 1 2009
Current Sub System:
Power Subsystem:Activation
Power Regulation
Sensor Subsystem:Temperature Sensor
Pressure SensorX & Y Axis Accelerometers
Z Axis Accelerometers
Command and Data Handling:AVR, Memory, & In-System Serial Programming (ISP)
Data Retrieval
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SHOT 1 2009
Temperature Sensor Schematic (C5):
- The temperature sensor outputs an analog voltage which is proportional to the temperature. A filter capacitor on the power supply reduces the noise in the output signal.
Filter capacitor
Analog O
utput
Temp. Sensor
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SHOT 1 2009
ESD/Heat Concern:
ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist
strap.
When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off.
ESD
Q
WARNING:
The following components are extremely ESD and
heat sensitive!
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SHOT 1 2009
Temperature Sensor:
Temp. Sens.
- The assistants will now give you a temperature sensor.- Use a similar technique used on the Vregs to solder the
temperature sensor to its pads
- TIP: Have one of your partners hold it in place with the provided tweezers while a pin is tacked in place.
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Capacitor (C8):
Take one (1) .1μF capacitor from the kit, and solder the capacitor into the footprint labeled C8.
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Temperature Sensor Schematic (C5):
- The temperature sensor outputs an analog voltage which is proportional to the temperature. A filter capacitor on the power supply reduces the noise in the output signal.
Filter capacitor
Analog O
utput
Highlight your schematic
83
Student Hands On Training I (2009)
Temperature Sensor Test
Temperature Sensor Test
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SHOT 1 2009
Temperature Sensor Test 1:
Connections:
- Connect the LEDs:-Red to RDY-Green to ON
- Connect the Switch- Connect the jumper to RBF Pin- Connect the battery
- Activate the Switch
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Temperature Sensor Test 2:
Connections 2:
- Place the multimeter in 2V mode.- Place the black terminal on the
large temperature sensor pad.- Place the red terminal on the pin
nearest “p” in Temp.
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Temperature Sensor Test 2:
Expected Results:
- If the multimeter does not display a voltage of 0.7 ± 0.1 Volts, please raise your hand.
- Ensure that your partner has his/her ESD band on and have him/her place his/her finger on the sensor.
- If you do not see an increase in voltage, raise your hand.
Final Step - Disconnect the battery
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SHOT 1 2009
Current Sub System:
Power Subsystem:Activation
Power Regulation
Sensor Subsystem:Temperature Sensor
Pressure SensorX & Y Axis Accelerometers
Z Axis Accelerometers
Command and Data Handling:AVR, Memory, & In-System Serial Programming (ISP)
Data Retrieval
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SHOT 1 2009
Development Area Introduction:
- The development area gives access to all the microcontroller input and output (I/O) pins as well as 3.3V, 5V, and 9V power.
- The development area, also known as the breadboard, allows additional components to be added to the board. It makes the board more reusable and versatile.
I/O Access points
Power Access points
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Development Area Schematic:
Power access
Power access
I/O Access
I/O Access
I/O Access
I/O Access
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Development Area Tips:
- When using the breadboard, keep in mind that other parts will use it later, so make sure that the wires crossing the breadboard are not so tight that the area underneath them is unusable.
- For wires, use the convention that red is power, black is ground, and blue and white are data.
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SHOT 1 2009
ESD/Heat Concern:
ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist
strap.
When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off.
ESD
Q
WARNING:
The following components are extremely ESD and
heat sensitive!
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SHOT 1 2009
Pressure Sensor 1:
- Remove one (1) pressure sensor from the kit.
- Find the notched pin (shown above) that will be connected to 5 Volts DC.
Notched PWR Pin
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Pressure Sensor 2:
- Carefully insert the pressure sensor into the breadboard. - The row of NC pins should be in column 8.
- The notched power pin should be in row 4, column 2.
NC
Power
Data
Ground
NC
NC
NC
NC
Power Goes Here.
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Pressure Sensor 3:
- Now turn the board over and solder all 8 pins.
- Note: DO NOT KEEP THE IRON ON ANY PIN LONGER THAN 2-3 SECONDS WITHOUT ALLOWING 10 SECONDS OF COOLING TIME.
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SHOT 1 2009
Bridging 1:
Bridging 101:- Building in a bread board section usually calls for a technique called “bridging.”- If you are unfamiliar with bridging, it is used to make electrical connection between components when pre-printed traces do not already exits.
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SHOT 1 2009
Bridging 2:
Bridging 101:- To bridge, a good technique calls for bending leads and wire over each other before clipping them.- Once leads and/or wires are in contact, apply a generous amount of solder to create a solder bead between the leads of interest. See the pictures above.
Good Bridge
Cross-Over
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Pressure Sensor 4:
- Strip both ends of one (1) 1.5 inch red wire.- Insert one end of the wire into a 5V source.- Insert the other end into row 4, column 1 (next to power pin).- Bridge the red wire to the power pin on the pressure sensor.
PWR Bridge
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Pressure Sensor 5:
GND Bridge
- Strip both ends of one (1) 1.5 inch black wire.- Insert one end of the wire into GND.- Insert the other end into row 2, column 1 (next to ground pin).- Bridge the black wire to the ground pin on the pressure sensor.
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SHOT 1 2009
Pressure Sensor 6:
Data Bridge
- Strip both ends of one (1) 1.5 inch blue wire.- Insert one end of the wire into A7.- Insert the other end into row 3, column 1 (next to data pin).- Bridge the blue wire to the data pin on the pressure sensor.
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SHOT 1 2009
Development Area Schematic:
Power access
Power access
I/O Access
I/O Access
I/O Access
I/O Access
Highlight your schematic
101
Student Hands On Training I (2009)
Pressure Sensor Test
Pressure Sensor Test
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SHOT 1 2009
Pressure Sensor Test:
Connections 1:
- Connect the LEDs:-Red to RDY-Green to ON
- Connect the Switch- Connect the jumper to RBF Pin- Connect the battery
- Activate the Switch
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Pressure Sensor Test:
Connections 2:
- Place the multimeter in 20V mode.- Place the black terminal on GND.- Place the red terminal at A7 (blue
wire).
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SHOT 1 2009
Pressure Sensor Test:
Expected Results:
- Your multimeter should read between 4.3 to 4.5 Volts (sea level).
- If you do not see these results, please raise your hand for assistance.
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SHOT 1 2009
Pressure Sensor Test:
Expected Results:
- You should also find a red coffee stirring straw in your kit.
- Place one end over the pressure sensor and suck on the other end.<DO NOT BLOW>
- You should see the voltage drop.
- If your results vary, please raise your hand.
Straw
Final Step - Disconnect the battery
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SHOT 1 2009
Current Sub System:
Power Subsystem:Activation
Power Regulation
Sensor Subsystem:Temperature Sensor
Pressure SensorX & Y Axis Accelerometers
Z Axis Accelerometers
Command and Data Handling:AVR, Memory, & In-System Serial Programming (ISP)
Data Retrieval
107
SHOT 1 2009
X & Y Axis Accelerometer Socket Schematic (A6):
- The accelerometers output analog voltages proportional to the acceleration they feel in a particular axis.
- Low range accelerometers have much higher precision than high range accelerometers, but will saturate if the acceleration is too great.
Low Range Accel
High Range Accel
108
SHOT 1 2009
X & Y Axis Accelerometers Schematic (B5):
- The accelerometers are very sensitive and difficult to solder, so they have been provided on a socket which can be soldered to the board.
- To reduce noise there are capacitors on the power supply and analog outputs of the accelerometers.
Output filter capacitors
Input filter capacitor
Accelerometer socket
109
SHOT 1 2009
X & Y Accelerometers 1:
- Take out four (4) of the 2X1 headers from the kit. Share pliers with your neighbors, and break one (1) 2X1 header into two 1X1 headers.
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SHOT 1 2009
X & Y Accelerometers 2:
- Place and solder the three (3) 2X1 headers into the 2X1 holes in the ACC footprint.
- Place and solder the one (1) 1X1 header into the 1X1 hole in the ACC footprint.
2X1
2X1
1X1
2X1
111
SHOT 1 2009
X & Y Accelerometers 3:
- Place and solder the provided X&Y accelerometer board onto the headers added in the previous step.
- Caution: When clipping these leads, ensure that you have your safety glasses on. Hold the leads while clipping them.
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SHOT 1 2009
Capacitors (C5, CX, CY):
- Solder three (3) of the .1μF capacitors into the footprints labeled CX, CY, and C5.
- Note: These capacitors are located near the accelerometers that were just mounted.
CY
CX
C5
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SHOT 1 2009
X & Y Axis Accelerometer Socket Schematic (A6):
- The accelerometers output analog voltages proportional to the acceleration they feel in a particular axis.
- Low range accelerometers have much higher precision than high range accelerometers, but will saturate if the acceleration is too great.
Low Range Accel
High Range Accel
Highlight your schematic
114
SHOT 1 2009
X & Y Axis Accelerometers Schematic (B5):
- The accelerometers are very sensitive and difficult to solder, so they have been provided on a socket which can be soldered to the board.
- To reduce noise there are capacitors on the power supply and analog outputs of the accelerometers.
Output filter capacitors
Input filter capacitor
Accelerometer socket
Highlight your schematic
115
SHOT 1 2009
Current Sub System:
Power Subsystem:Activation
Power Regulation
Sensor Subsystem:Temperature Sensor
Pressure SensorX & Y Axis Accelerometers
Z Axis Accelerometers
Command and Data Handling:AVR, Memory, & In-System Serial Programming (ISP)
Data Retrieval
116
SHOT 1 2009
Z Axis Accelerometer Schematic (C6):
- There is one high range and one low range Z axis accelerometer.
- Since the Z axis accelerometers must be mounted vertically, they are on a separate board, which connects to the main board with four wires.
- As before, power supply and output filter capacitors reduce noise in the data.
High Range Accel
Low Range Accel
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SHOT 1 2009
Z Accelerometer Header:
- Solder one (1) 4X1 header into the footprint next to the pressure sensor.
- Note: This header will connect the Z accelerometer board to the main board.
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SHOT 1 2009
Z Accelerometer Cable:
- Strip and solder the four (4) wire Z Accelerometer Connector into the Z Accelerometer board.
- White goes to “L”, Black to “-”, Red to “+”, and Blue to “H”.
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SHOT 1 2009
Z Accelerometer Cable:
- Now that the wire have been soldered in, make sure that the leads are clipped as close to the board as possible to prevent shorting on the structural mount that will be added later.
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SHOT 1 2009
Capacitors (CZ and C9):
Solder two (2) .1μF capacitors into the footprints labeled C9 and CZ on the Z accelerometer board.
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SHOT 1 2009
Capacitors (CZ and C9):
- Now that the capacitors have been soldered in, make sure that the leads are clipped as close to the board as possible to prevent shorting on the structural mount that will be added later.
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SHOT 1 2009
Z Axis Accelerometer Schematic (C6):
- There is one high range and one low range Z axis accelerometer.
- Since the Z axis accelerometer must be mounted vertically, it is on a separate board, which connects to the main board with four wires.
- As before, power supply and output filter capacitors reduce noise in the data.
High Range Accel
Low Range Accel
Highlight your schematic
123
Student Hands On Training I (2009)
Accelerometer Test:
X, Y, and Z Axis
Accelerometer Test:
X, Y, and Z Axis
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SHOT 1 2009
A Summary:
At this point, you should be able to match the picture below. To complete the accelerometer tests, make the following connections.
Connections 1:- Connect the LEDs:
-Red to RDY-Green to ON
- Connect the Switch- Connect the jumper to RBF Pin- Connect z-axis accel. board
Blue wire to “H”, red to “+”- Connect the battery- Activate the Switch
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SHOT 1 2009
Accelerometer Test 1:
Connections 2:
- Place the multimeter in 20V mode.- Place the black terminal on GND
or the 3.3 VREG’s largest pad.- Place the red terminal in A0.
Expected Results:
- You should read 2.5 ± 0.2 Volts.- Raise your hand if you do not get
these results.
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SHOT 1 2009
Accelerometer Test 2:
Connections 3:- Ensure that one partner has an
ESD strap on.- Have this partner hold the Z
Accelerometer board flat against the static mat.
- Keep black terminal on GND- Move red terminal from A0
through A5.
Expected Results:
- If you do not read 2.5 ± 0.2 Volts on all pins, please raise your hand.
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SHOT 1 2009
Accelerometer Test 3:
Pin Summary:A0: X-Low RangeA1: Y-Low RangeA2: Z-Low RangeA3: X-High RangeA4: Y-High RangeA5: Z-High Range
Sanity Check:- Have your ESD safe partner
reorient the Z Accelerometer board and main board.
- Measure voltages on A0-A5- If you do not see voltages other
than 2.5 Volts, raise your hand.
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SHOT 1 2009
ESD/Heat Concern:
ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist
strap.
When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off.
ESD
Q
WARNING:
The following components are extremely ESD and
heat sensitive!
129
SHOT 1 2009
Accelerometer Test 4:
Tilt Test 1:- You will notice that the XY accelerometer
board has an axis definition on it.
- Have your ESD safe partner rotate the board so that the X axis points to the ceiling.
- Now check the voltages on pins A0 and A3.
-You should see an increase in voltage (above 2.5 Volts) on both, but the change will be smaller on A3.
Axis
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SHOT 1 2009
Accelerometer Test 5:
Tilt Test 2:- You will notice that the XY accelerometer
board has an axis definition on it.
- Have your ESD safe partner rotate the board so that the Y axis points to the ceiling.
- Now check the voltages on pins A1 and A4.
-You should see an increase in voltage (above 2.5 Volts) on both, but the change will be smaller on A4.
Axis
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SHOT 1 2009
Accelerometer Test 6:
Tilt Test 3:- You will notice that the Z accelerometer
board has an axis definition on it.
- Have your ESD safe partner rotate the board so that the Z axis points to the ceiling.
- Now check the voltages on pins A2 and A5.
-You should see an increase in voltage (above 2.5 Volts) on both, but the change will be smaller on A5.
Axis
Final Step - Disconnect the battery
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SHOT 1 2009
Current Sub System:
Power Subsystem:Activation
Power Regulation
Sensor Subsystem:Temperature Sensor
Pressure SensorX & Y Axis Accelerometers
Z Axis Accelerometers
Command and Data Handling:AVR, Memory, & In-System Serial Programming (ISP)
Data Retrieval
133
SHOT 1 2009
AVR Microcontroller Schematic 1 (B3):
- The AVR is the computer that controls the system.
- PA0 through PA7 are analog inputs, used to sample the sensors.
- PD6 will be used to control an LED
Analog Inputs
Filter capacitor
PD6
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SHOT 1 2009
AVR Microcontroller Schematic 2 (B3):
- PB4 through PB7 are a data bus used to talk to the flash memory.
- PD0 and PD1 are a Universal Asynchronous Receiver / Transmitter (UART) which can send data to a computer.
Flash interface
UART
135
SHOT 1 2009
Flash Memory Schematic (A1):
- The flash memory holds two megabytes of data.
- A level shifter allows the AVR, which runs on 5V, to communicate with the 3.3V flash memory.
Flash Memory
5V to 3.3V Level Shifter
Filter capacitor
136
SHOT 1 2009
In-System Programming Schematic (B2):
- Using the ISP header with an AVRISP, which will be introduced later, allows the AVR to be programmed without removing it from the circuit.
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SHOT 1 2009
AVR Socket:
- Solder one (1) AVR DIP into the “AVR” footprint.- Warning: Make sure that the notches are aligned as indicated
above and socket is flush with the board. - Tip: It works well to tack two corners on the back side to
ensure it is mounted correctly before soldering all 40 pins.
Notches
138
SHOT 1 2009
Capacitors (C3 and C4):
- Solder two (2) .1μF capacitors into the footprints labeled C3 and C4.
- Note: The footprints are located directly below the AVR Dip that was installed in the previous step.
C3 C4
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SHOT 1 2009
Resistors (R1, R5, R6):
- Solder three (3) 10K resistors from the kit and solder them into the footprints labeled R1, R5, and R6.
R1
R6
R5
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SHOT 1 2009
ISP Header:
- Solder one (1) right angle header into the footprints labeled ISP.
- The bent pins should be the ones that are soldered. - Caution: When clipping these leads, ensure that you are
wearing your eye protection and holding the leads.
ISP
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SHOT 1 2009
Indicator LED 1:
- Solder one (1) 3.3K resistor into bread board section as indicated above.
- The right most lead of the resistor should be in row 1, column 15.
- The left most lead of the resistor should be in row 1, column 19.
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SHOT 1 2009
Indicator LED 2:
- Solder one (1) red LED into bread board section as indicated above.
- Make sure that the flat side of the LED is adjacent to the resistor.
- The left lead will go in row 1, column 20. - The right lead will go in row 1, column 21. - Turn the board over and bridge the flat side lead to the resistor.
Bridge
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SHOT 1 2009
Indicator LED 3:
Bri
dg
e
- Strip both ends of one (1) 1.5 inch blue wire.- Solder one end of the wire into row 1, column 14 adjacent to
the resistor.- Solder the other end into D6.- Bridge the blue wire and resistor on the backside of the board
as indicated above.
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SHOT 1 2009
Indicator LED 4:
Bri
dg
e
5V PWR
- Strip both ends of one (1) 1.5 inch red wire.- Solder one end of the wire into row 1, column 22 adjacent to
the LED.- Solder the other end into a 5 Volt source.- Bridge the wire and LED on the backside of the board as
indicated above.
145
SHOT 1 2009
AVR Microcontroller Schematic 1 (B3):
- The AVR is the computer that controls the system.
- PA0 through PA7 are analog inputs, used to sample the sensors.
- PD6 will be used to control an LED
Analog Inputs
Filter capacitor
PD6
Highlight your schematic
146
SHOT 1 2009
AVR Microcontroller Schematic 2 (B3):
- PB4 through PB7 are a data bus used to talk to the flash memory.
- PD0 and PD1 are a Universal Asynchronous Receiver / Transmitter (UART) which can send data to a computer.
Flash interface
UART
Highlight your schematic
147
SHOT 1 2009
Flash Memory Schematic (A1):
- The flash memory holds two megabytes of data.
- A level shifter allows the AVR, which runs on 5V, to communicate with the 3.3V flash memory.
Flash Memory
5V to 3.3V Level Shifter
Filter capacitor
Highlight your schematic
148
SHOT 1 2009
In-System Programming Schematic (B2):
- Using the ISP header with an AVRISP, which will be introduced later, allows the AVR to be programmed without removing it from the circuit.
Highlight your schematic
149
SHOT 1 2009
Current Sub System:
Power Subsystem:Activation
Power Regulation
Sensor Subsystem:Temperature Sensor
Pressure SensorX & Y Axis Accelerometers
Z Axis AccelerometersGeiger Counter Interface
Command and Data Handling:AVR, Memory, & In-System Serial Programming (ISP)
Data Retrieval
150
SHOT 1 2009
Level Shifter Board Schematic (D4):
- The level shifter board allows the AVR, which runs on 5V, to communicate with a computer serial port, which uses +/- 12V.
To C
ompu
ter
To main board
151
SHOT 1 2009
Data Header:
- Solder one (1) right angle header into the footprints labeled Data on the Main Board.
- The bent pins should be the ones that are soldered. - Caution: When clipping these leads, ensure that you are
wearing your eye protection.
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SHOT 1 2009
Data Header 2:
Data
- Solder one (1) right angle header into the footprints labeled Data on the Data Board.
- The bent pins should be the ones that are soldered. - Caution: When clipping these leads, ensure that you are
wearing your eye protection.
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SHOT 1 2009
Level Shifter Socket:
- Solder one (1) level shifter socket into the footprint labeled Level Shifter.
- Tip: It works well to tack two corners on the back side to ensure it is mounted correctly before soldering all pins.
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SHOT 1 2009
DB9 Serial Connector:
- Solder one (1) DB9 serial connector into the data transfer board.
- Make sure that the connector is flush with the board and the prongs are securing the board before you begin soldering.
155
SHOT 1 2009
Resistors (R11):
- Solder one (1) 10k resistor into the footprint labeled R11.
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SHOT 1 2009
Capacitors (C10):
Solder one (1) 1μF capacitor into the footprint labeled C10.
C10
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SHOT 1 2009
Data LED:
- Solder one (1) red LED into the footprint labeled ON.
- Note: LEDs are polarized. The flat side of the LED is the negative side and should be placed in the footprint accordingly.
158
SHOT 1 2009
ESD/Heat Concern:
ESD is electrostatic discharge caused by built up charge on your person from not wearing your protective ESD wrist
strap.
When soldering heat sensitive components, use the guideline 2-3 on, 8-10 seconds off.
ESD
Q
WARNING:
The following components are extremely ESD and
heat sensitive!
159
SHOT 1 2009
Level Shifter Insertion:
LS
- Remove the level shifter from the ESD foam.
- Align the notch from the level shifter with the one on the level shifter dip on the board, and GENTLY work the level shifter into the socket.
- Take your time with this, bent leads are extremely difficult to straighten.
No
tch
No
tch
160
SHOT 1 2009
AVR Insertion:
- Remove the AVR from the ESD foam.
- Align the notch from the AVR with the one on the AVR socket on the board, and GENTLY work the AVR into the socket.
- Take your time with this, bent leads are extremely difficult to straighten.
AVR Notch
Notch
161
SHOT 1 2009
Final Products:
AVR Board
Data Board
Z-Accel. Board
162
Student Hands On Training I (2009)
Congratulations!
The board is now ready for additional SHOT Workshop
Modifications(Heater and Camera)
Congratulations!
The board is now ready for additional SHOT Workshop
Modifications(Heater and Camera)